5G combiner for reflow soldering process

Abstract

The utility model relates to a reflow soldering technology 5G combiner in the combiner field, a port 1 and a port 2 are uniformly arranged on one side of a cavity, the other side of the cavity is provided with an output end, a low pass sheet is arranged in the cavity, the cavity is connected with the low pass sheet through an upper dielectric block and a lower dielectric block, the lower dielectric block is fixedly arranged on the cavity, and the output end is arranged on the other side of the cavity. The low-pass piece penetrates the lower dielectric block, the upper dielectric block is matched with the lower dielectric block to fix the low-pass piece, the two ends of the low-pass piece are arranged between the first port and the output end, a first zero-point single cavity, a first zero point and a second zero point are arranged between the second port and the output end, and the first zero point comprises a second zero-point single cavity, a third zero-point single cavity and a fourth zero-point single cavity. And the second zero point comprises a zero point single cavity V, a zero point single cavity VI and a zero point single cavity VII. According to the 5G combiner for the reflow soldering process, by arranging the first zero-point single cavity, the first zero point and the second zero point, multi-frequency and broadband coverage is achieved, the product structure is simplified, and product miniaturization is achieved.

Description

Technical Field

[0001] The utility model relates to the field of combiners, and in particular to a 5G combiner using a reflow soldering process. Background Art

[0002] With the country's support for intelligent manufacturing and the transformation of traditional domestic industries, it is an opportunity as well as a challenge for our manufacturing industry. Therefore, we can only improve the competitiveness of our products and meet the conditions of intelligent manufacturing through innovation, and strive to keep up with the country's call;

[0003] At present, the country has invested heavily in the construction of 5G, and the competition in the industry is also fierce. At present, the models and technologies of similar products remain in the traditional way. Therefore, the industry urgently needs innovation to break through the current difficulties and break out of the internal circulation; With the increasingly fierce competition in the current industry, we have also put forward higher requirements on the volume, weight, electrical indicators, cost, etc. of the products, and the combiner is an important component in the construction of 5G indoor distribution, and the corresponding indicators and requirements for the products will also increase accordingly.

[0004] The existing combiners still have the following problems: currently, the design of combiners on the market is mostly implemented in the form of conventional coaxial cavities, and the structural design of conventional coaxial cavities makes the combiners larger in size and higher in cost. Utility Model Content

[0005] The purpose of the utility model is to solve the above defects and provide a 5G combiner with a reflow soldering process.

[0006] The purpose of the utility model is achieved in the following way: a 5G combiner of a reflow soldering process, comprising a cavity, a port one and a port two, the port one and the port two are evenly arranged on one side of the cavity, an output end is arranged on the other side of the cavity, a low-pass sheet is arranged in the cavity, the cavity and the low-pass sheet are connected by an upper dielectric block and a lower dielectric block, the lower dielectric block is fixedly arranged on the cavity, the low-pass sheet passes through the lower dielectric block, the upper dielectric block cooperates with the lower dielectric block to fix the low-pass sheet, two ends of the low-pass sheet are arranged between port one and the output end, a zero point single cavity one, a first zero point and a second zero point are arranged between port two and the output end, the first zero point includes zero point single cavity two, zero point single cavity three and zero point single cavity four, the second zero point includes zero point single cavity five, zero point single cavity six and zero point single cavity seven.

[0007] In the above description, as a further solution, a cover plate is provided on the top surface of the cavity, and the cover plate and the cavity are sealed by high-temperature melting of solder paste.

[0008] In the above description, as a further solution, a prefabricated adjusting screw is provided on the cover plate.

[0009] In the above description, as a further solution, the cover plate and the cavity are connected by fastening nails.

[0010] In the above description, as a further solution, the upper surface of the cover plate is provided with an adjusting screw hole, and there are a plurality of adjusting screw holes.

[0011] In the above description, as a further solution, the port one, the port two and the output end are all provided with an N-type connector, and the N-type connector is connected to the cavity by screws.

[0012] In the above description, as a further solution, the lower dielectric block includes a bottom cylinder and a top cylinder, the top cylinder is arranged in the cavity, the bottom cylinder is arranged between the top cylinder and the cavity, the diameter of the bottom cylinder is larger than the diameter of the top cylinder, the low-pass sheet is provided with a through hole, the through hole passes through the top cylinder, the upper dielectric block is composed of a cylindrical block, the cylindrical block is provided with a positioning hole, and the positioning hole cooperates with the top cylinder to press the low-pass sheet.

[0013] The beneficial effects produced by the utility model are as follows: This 5G combiner with a reflow soldering process realizes multi-frequency and broadband coverage by setting a zero point single cavity, a first zero point and a second zero point, simplifies the product structure and realizes product miniaturization; the low-pass sheet can be stamped and formed, which reduces the cost of the product compared with the previous structure, and adopts a low-pass design to realize broadband and multi-frequency combining of the product. Compared with the previous structural design, this design is simpler and easier to produce, and realizes low loss, high power, multi-frequency and broadband coverage of the product. At the same time, the low-pass adopts a sheet structure design, which can be stamped and mass-produced to reduce costs and reduce volume accordingly, and realize low loss, high power, small volume, low cost, low intermodulation, multi-frequency and broadband coverage, and also realizes low energy consumption, intelligent manufacturing and other industrial transformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of a 5G combiner in a reflow soldering process of the utility model;

[0015] Figure 2 This is a bottom view of a 5G combiner with a reflow soldering process without a cover plate in the utility model;

[0016] Figure 3 This is an exploded view of a 5G combiner in a reflow soldering process of the utility model;

[0017] In the figure: 1-cavity, 2-port one, 3-port two, 4-output end, 5-low-pass film, A1-zero point single cavity one, A2-zero point single cavity two, A3-zero point single cavity three, A4-zero point single cavity four, A5-zero point single cavity five, A6-zero point single cavity six, A7-zero point single cavity seven, 6-cover plate, 7-prefabricated adjustment screw, 8-fastening nail, 9-adjustment screw hole, 10-N type connector, 11-bottom cylinder, 12-top cylinder, 13-perforation, 14-positioning hole, 15-upper dielectric block. DETAILED DESCRIPTION

[0018] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0019] The embodiments described with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and cannot be understood as limiting the present application. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meanings of "several" and "multiple" are two or more, unless otherwise clearly and specifically defined. In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a communication between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. In this application, unless otherwise clearly specified and limited, the first feature "above" or "below" the second feature can include the first and second features being in direct contact, or it can include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.

[0020] See also Figure 1-3A 5G combiner of a reflow soldering process is specifically implemented, comprising a cavity 1, a port 1 2 and a port 2 3, wherein the port 1 2 and the port 2 3 are evenly arranged on one side of the cavity 1, an output terminal 4 is arranged on the other side of the cavity 1, a low-pass sheet 5 is arranged in the cavity 1, the cavity 1 and the low-pass sheet 5 are connected through an upper dielectric block 15 and a lower dielectric block, the lower dielectric block is fixedly arranged on the cavity 1, the low-pass sheet 5 passes through the lower dielectric block, the upper dielectric block 15 cooperates with the lower dielectric block to fix the low-pass sheet 5, two ends of the low-pass sheet 5 are arranged between the port 1 2 and the output terminal 4, a zero point single cavity 1 A1, a first zero point and a second zero point are arranged between the port 2 3 and the output terminal 4, the first zero point comprises a zero point single cavity 2 A2, a zero point single cavity 3 A3 and a zero point single cavity 4 A4, the second zero point comprises a zero point single cavity 5 A5, a zero point single cavity 6 A6 and a zero point single cavity 7 A7.

[0021] The reflow soldering process 5G combiner is a special two-port combiner composed of two filters, mobile GSM&DCS&TDF&A&TD-E and mobile TDD (or mobile TD-LTE / NR2.6G). Port 1 2 and output end 4 are connected by a mobile GSM&DCS&TDF&A&TD-E broadband channel using a low-pass structure. The low-pass structure is a sheet structure, and the upper dielectric block 15 and the lower dielectric block are fixed in the cavity 1. The two ends are welded in the cavity 1 to connect port 1 2 and output end 4 to achieve signal transmission. The zero point single cavity one A1, the first zero point, the zero point single cavity two A2, the zero point single cavity three A3, the zero point single cavity four A4, the zero point single cavity five A5, the zero point single cavity six A6 and the zero point single cavity seven A7 in the port two 3 and the output end 4 form a coaxial cavity design, and are also combined with seven resonant cavities for mobile TDD (or mobile TD-LTE / NR2.6G), which is another structure with two zero points, of which the first zero point is a composite zero point, and the first zero point is composed of the zero point single cavity two A2, the zero point single cavity three A3 and the zero point single cavity four A4, of which the zero point single cavity one A1 and the zero point single cavity four A4 are inductive zero points, and the inductive zero point can adjust the zero point strength of the first zero point. The TDD port achieves the product index requirements through the above structure.

[0022] Specifically, a cover plate 6 is provided on the top surface of the cavity 1, and the cover plate 6 and the cavity 1 are sealed by high-temperature melting of solder paste. A prefabricated adjustment screw 7 is provided on the cover plate 6. The cover plate 6 and the cavity 1 are connected by a fastening nail 8. The upper surface of the cover plate 6 is provided with an adjustment screw hole 9, and a plurality of adjustment screw holes 9 are provided.

[0023] The connection is designed with a reflow soldering process, so the internal structure of the cavity 1 can reduce the wall thickness of the cavity 1, reduce the use of raw materials and thus reduce energy consumption; at the same time, solder paste sealing and other processes are used to meet the product sealing performance, thereby reducing the use of raw materials and correspondingly reducing energy consumption;

[0024] In the internal structure of the cavity 1, the redundant aluminum material is removed to make the structure more concise, and at the same time, the appearance structure is more beautiful, so that the product has no redundant materials and the space utilization of the product is more reasonable. In terms of product sealing, the reflow soldering process is optimized to use solder paste for high-temperature melting and sealing, so that the cover plate 6 and the cavity 1 are integrated, thereby reducing the leakage between signals and making the overall sealing effect more prominent. In addition, the use of screws is reduced, thereby achieving the effect of reducing costs; in terms of production efficiency, it is simpler than traditional processes, so it is easier to achieve automation.

[0025] The cover plate 6 is used for signal shielding and frequency modulation, and is connected and fastened to the functional surface of the cavity 1 by screws. After the cover plate 6 is prefabricated with the adjustment screw 7, the functional surface of the cavity 1 is brushed with solder paste by a solder paste machine and then fixed to the functional surface of the cavity 1 by positioning screws, and then the solder paste is melted by reflow soldering at high temperature to achieve the fusion of the cover plate 6 and the cavity 1 to achieve the effect of sealing and signal shielding; in addition, there are multiple adjustment screw holes 9 on the upper surface of the cover plate 6, and the frequency modulation screws are assembled in the adjustment screw holes 9 to adjust the product frequency. After the adjustment is completed, the adjustment screws are fastened to the surface of the cover plate 6 with nuts.

[0026] In this embodiment, the port 1 2, port 2 3 and output port 4 are all provided with an N-type connector 10, and the N-type connector 10 is connected to the cavity 1 by screws. In addition, the connectors of this project are three N-type connectors 10, which are fixed on both sides of the cavity 1 by screws, respectively, where connectors 1 and 2 are input ports, and connector 3 is output port 4. In engineering applications, the input and output of the connectors are used to realize the signal input and output of the product;

[0027] In this embodiment, the lower dielectric block includes a bottom cylinder 11 and a top cylinder 12, the bottom cylinder 11 and the top cylinder 12 are integrated, the top cylinder 12 is arranged in the cavity 1, the bottom cylinder 11 is arranged between the top cylinder 12 and the cavity 1, the diameter of the bottom cylinder 11 is larger than the diameter of the top cylinder 12, the low-pass sheet 5 is provided with a through hole 13, the through hole 13 passes through the top cylinder 12, the upper dielectric block 15 is composed of a cylindrical block, the cylindrical block is provided with a positioning hole 14, the positioning hole 14 cooperates with the top cylinder 12 to press the low-pass sheet 5.

[0028] The process of installing the low-pass sheet 5 in this embodiment is as follows: align the through hole 13 with and pass through the top cylinder 12 , and then make the positioning hole 14 pass through the top cylinder 12 and press and fix the low-pass sheet 5 .

[0029] The above contents are further detailed descriptions of the present invention in combination with specific further embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as the protection scope of the present invention.

Claims

1. A 5G combiner with a reflow soldering process, comprising a cavity, a port 1 and a port 2, characterized in that: The port one and the port two are evenly arranged on one side of the cavity, and the output end is arranged on the other side of the cavity. A low-pass plate is arranged in the cavity, and the cavity and the low-pass plate are connected through an upper dielectric block and a lower dielectric block. The lower dielectric block is fixedly arranged on the cavity, and the low-pass plate passes through the lower dielectric block. The upper dielectric block cooperates with the lower dielectric block to fix the low-pass plate. The two ends of the low-pass plate are arranged between the port one and the output end. A zero point single cavity one, a first zero point and a second zero point are arranged between the port two and the output end. The first zero point includes a zero point single cavity two, a zero point single cavity three and a zero point single cavity four, and the second zero point includes a zero point single cavity five, a zero point single cavity six and a zero point single cavity seven.

2. According to the reflow process 5G combiner of claim 1, it is characterized in that: A cover plate is provided on the top surface of the cavity, and the cover plate and the cavity are sealed by high-temperature melting of solder paste.

3. According to the reflow process 5G combiner of claim 2, it is characterized in that: The cover plate is provided with a prefabricated adjusting screw.

4. A 5G combiner with a reflow process according to claim 2 or 3, characterized in that: The cover plate and the cavity are connected via fastening nails.

5. A 5G combiner with a reflow process according to claim 2 or 3, characterized in that: The upper surface of the cover plate is provided with a plurality of adjusting screw holes.

6. A 5G combiner with a reflow process according to claim 1 or 2, characterized in that: The port 1, the port 2 and the output end are all provided with an N-type connector, and the N-type connector is connected to the cavity by screws.

7. A 5G combiner with a reflow process according to claim 1 or 2, characterized in that: The lower dielectric block includes a bottom cylinder and a top cylinder, the top cylinder is arranged in the cavity, the bottom cylinder is arranged between the top cylinder and the cavity, the diameter of the bottom cylinder is larger than the diameter of the top cylinder, the low-pass sheet is provided with a through hole, the through hole passes through the top cylinder, the upper dielectric block is composed of a cylindrical block, a positioning hole is provided on the cylindrical block, and the positioning hole cooperates with the top cylinder to press the low-pass sheet.

Images