Junction box with ceramic bottom plate

Abstract

The utility model discloses a junction box with a ceramic bottom plate, which comprises a bottom plate, a beryllium oxide sheet is fixedly arranged at the top of the bottom plate, a transition sheet is fixedly arranged at the top of the beryllium oxide sheet, the ceramic bottom plate is further arranged on the bottom plate, and the beryllium oxide sheet and the transition sheet are both positioned in the ceramic bottom plate. A plurality of through matching holes are formed in one side of the ceramic bottom plate, leads are arranged in the matching holes, the ends, close to the transition piece, of the leads are located above the transition piece, conductive columns are arranged between the leads and the transition piece, and the conductive columns penetrate through the leads and are in contact with the transition piece. A lead is arranged on the ceramic bottom plate, a conductive column is arranged at one end of the lead, the conductive column is contacted with a transition sheet, the transition sheet is overlapped on a beryllium oxide sheet, the junction box of the ceramic bottom plate is compact in structure and simple in manufacturing process, the manufactured junction box is high in reliability, and accidents are not prone to happening in the using process.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronics, in particular to a junction box of a ceramic bottom plate. Background Art

[0002] The junction box is one of the essential devices in wiring work. The joints of the wires can be connected in the junction box, and the junction box can protect the wire joints. When making the existing junction box, holes are generally drilled on a metal shell, and epoxy or other organic sealants are poured into the holes to seal the leads and form an insulation layer, but the insulation performance is poor and it cannot withstand high temperatures.

[0003] In order to improve the heat resistance, glass microspheres are used for sealing, and then the glass microspheres are melted at high temperature to seal and insulate the lead wires. The manufacturing process of this junction box is relatively complicated, and the junction box is prone to glass breakage due to drastic temperature changes, making the sealing and insulation performance invalid, and the reliability is not high, which is prone to accidents during use. Utility Model Content

[0004] The utility model aims to provide a junction box of a ceramic base plate to solve the problems of poor reliability of glass microsphere sealing and low temperature resistance of organic glue sealing proposed in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A junction box for a ceramic base plate comprises a base plate, a beryllium oxide sheet is fixedly arranged on the top of the base plate, a transition sheet is fixedly arranged on the top of the beryllium oxide sheet, a ceramic base plate is also arranged on the base plate, the beryllium oxide sheet and the transition sheet are both located inside the ceramic base plate, a plurality of through matching holes are opened on one side of the ceramic base plate, leads are arranged in the plurality of matching holes, one end of the lead close to the transition sheet is located above the transition sheet, a conductive column is arranged on one end of the lead close to the transition sheet, and the conductive column is fixedly connected to the transition sheet.

[0007] Further preferably, the ceramic base plate is a rectangular frame structure, and a sealing ring is provided on the top of the ceramic base plate.

[0008] Further preferably, a sealing ring is provided at the junction of the lead wire and the ceramic base plate.

[0009] Further preferably, three leads are provided, and an identification hole is provided at one end of the middle lead close to the transition piece.

[0010] Further preferably, the beryllium oxide sheet and the transition sheet have the same area.

[0011] Further preferably, a circular hole is opened on the bottom plate, and the circular hole is located on one side of the ceramic bottom plate.

[0012] Further preferably, the lead wire passes through the conductive column.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The utility model arranges leads on the ceramic bottom plate, improves insulation performance, corrosion resistance and temperature resistance, and ensures that the junction box can be used in many special environments, such as high temperature environments such as engines, and corrosive environments such as seawater.

[0015] A conductive column is arranged at one end of the lead wire of the utility model, and the conductive column provides a wiring terminal for electrical connection of equipment in the junction box, and the connection is fixed purely mechanically to ensure connection reliability.

[0016] The junction box of the ceramic base plate involved in the utility model has a compact structure and is easy to install. It can be fixed and installed directly through the round holes, and other components to be sealed can be directly pasted and installed through the conductive columns. The use process is simple. Due to its high temperature resistance, corrosion resistance and good insulation performance, the junction box has high reliability and is not prone to accidents during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a top view of a junction box of a ceramic base plate of the utility model;

[0018] Figure 2 for Figure 1 A cross-sectional view of

[0019] Figure 3 for Figure 1 Right view of;

[0020] In the figure: 1. base plate; 2. beryllium oxide sheet; 3. transition sheet; 4. ceramic base plate; 5. matching hole; 6. lead wire; 7. conductive column; 8. sealing ring; 9. sealing ring; 10. identification hole; 11. round hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example 1: Junction box of ceramic base plate

[0023] See also Figure 1-Figure 3, the utility model provides a technical solution:

[0024] A junction box for a ceramic base plate comprises a base plate 1, a beryllium oxide sheet 2 is fixedly arranged on the top of the base plate 1, a transition sheet 3 is fixedly arranged on the top of the beryllium oxide sheet 2, a ceramic base plate 4 is also arranged on the base plate 1, the beryllium oxide sheet 2 and the transition sheet 3 are both located inside the ceramic base plate 4, a plurality of through matching holes 5 are opened on one side of the ceramic base plate 4, a plurality of matching holes 5 are arranged with leads 6, one end of the lead 6 close to the transition sheet 3 is located above the transition sheet 3, a conductive column 7 is arranged on one end of the lead 6 close to the transition sheet 3, the lead 6 passes through the conductive column 7 and is fixed, and the conductive column 7 and the transition sheet 3 are relatively fixedly connected.

[0025] The ceramic bottom plate 4 is a rectangular frame structure, and a sealing ring 8 is provided on the top of the ceramic bottom plate 4 .

[0026] A sealing ring 9 is provided at the junction of the lead wire 6 and the ceramic base plate 4 .

[0027] Three leads 6 are provided, and a marking hole 10 is provided at one end of the middle lead 6 close to the transition piece 3 .

[0028] The areas of the beryllium oxide sheet 2 and the transition sheet 3 are equal.

[0029] A circular hole 11 is formed on the bottom plate 1 , and the circular hole 11 is located on one side of the ceramic bottom plate 4 .

[0030] The lead wire 6 with the identification hole 10 is electrically connected to the beryllium oxide sheet 2 through the conductive column 7 .

[0031] Embodiment 2: Method for manufacturing a junction box of a ceramic base plate

[0032] Ceramic glass powder, adhesive PVB, toluene + ethanol, castor oil, dimethyl phthalate are mixed by mass ratio: 49kg of ceramic glass powder, 21kg of adhesive PVB B76, 4kg of toluene + 11kg of ethanol, 50g of dispersant castor oil, and 100g of plasticizer dimethyl phthalate, ball milled for 12 hours to prepare casting slurry, and then vacuum degassing treatment with a vacuum degree of 0.09-0.1Mpa for 20 minutes, and then casting, and drying to obtain a film tape. The temperature of the casting machine during casting is divided into four intervals, which are set to T1=35℃, T2=40℃, T3=45℃, T4=35℃ in turn, and the drying time is 25 minutes. The thickness of the obtained ceramic film tape is 100μm.

[0033] The ceramic glass powder is obtained by adding 25wt% LBSCA glass powder to nano-alumina and then ball-milling and drying.

[0034] The above ceramic film strip is cut into square pieces, and holes are punched according to the design size by a punching machine. After punching, the pieces are stacked. Rubber blocks are added to the punched gaps during stacking. The stacking pressure is 15MPa. After stacking, the rubber blocks are sealed together and pressed by warm water isostatic pressing. The isostatic pressing water temperature is 65°C and the isostatic pressing pressure is 20MPa. The heating curve and pressure rise curve refer to the instruction manual of the isostatic press. After isostatic pressing, the rubber blocks are taken out, the green body is cut into corresponding sizes, and the granulated ceramic glass powder is added around the upper and lower sides of the green body to maintain the sintering atmosphere and provide sintering pressure to solve the sintering deformation problem. The granulated ceramic glass powder is obtained by spray granulation of 5% PVA and ceramic glass powder.

[0035] According to the sintering curve, the temperature is increased to 500°C at 3°C / min, and after keeping warm for 20 minutes, the temperature is increased to 800°C at 10°C / min, and the temperature is increased to 850°C at 5°C / min. After keeping warm at the highest temperature of 850°C for 30 minutes, the temperature is lowered. After cooling down, the ceramic glass powder adhering to the surrounding area is removed and polished to make it smooth if necessary.

[0036] For the processed and sintered housing 1, 4J42 iron-nickel alloy is used as a sealing ring to seal the lead 6 to the side wall of the ceramic base plate.

[0037] A circular hole 11 is punched on the tungsten copper bottom plate 1, and a beryllium oxide sheet 2 is pasted on the bottom plate 1. The beryllium oxide sheet 2 has good thermal conductivity and provides good heat dissipation for the encapsulated electronic components. A molybdenum steel transition sheet 3 and a conductive column 7 are adhered to the beryllium oxide sheet 2, and a sealing ring 8 of an iron-nickel alloy is used to provide a connection carrier for sealing.

[0038] Finally, the ceramic base plate 4 is fixed to the base plate 1 by using glass powder or organic adhesive such as epoxy, and the lead wire 6 is reliably connected to the conductive column 7.

[0039] Example 3: Method for using the junction box of the ceramic base plate

[0040] When using the junction box of the ceramic base plate of Example 1, the electronic components to be packaged are fixed in the ceramic base plate 4, the ground wire of the electronic components is connected to the conductive column 7 connected to the lead 6 with the identification hole 10, and other output or input leads are connected to the other two conductive columns 7, and then the sealing layer is pasted or welded on the sealing ring 8. Finally, the round hole is fixed on the circuit board with screws and studs to complete the overall installation and use.

[0041] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A junction box with a ceramic base plate, characterized in that: It comprises a bottom plate (1), a beryllium oxide sheet (2) is fixedly arranged on the top of the bottom plate (1), a transition sheet (3) is fixedly arranged on the top of the beryllium oxide sheet (2), a ceramic bottom plate (4) is also arranged on the bottom plate (1), and the beryllium oxide sheet (2) and the transition sheet (3) are both located inside the ceramic bottom plate (4); A plurality of through-going matching holes (5) are provided on one side of the ceramic base plate (4), and leads (6) are provided in each of the plurality of matching holes (5). One end of the lead (6) close to the transition piece (3) is located above the transition piece (3), and one end of the lead (6) close to the transition piece (3) is provided with a conductive column (7), and the conductive column (7) is fixedly connected to the transition piece (3); Three lead wires (6) are provided, and a marking hole (10) is provided at one end of the middle lead wire (6) close to the transition piece (3); The beryllium oxide sheet (2) and the transition sheet (3) have the same area.

2. A junction box for a ceramic base plate according to claim 1, characterized in that: The ceramic bottom plate (4) is a rectangular frame structure, and a sealing ring (8) is provided on the top of the ceramic bottom plate (4).

3. The junction box of a ceramic base plate according to claim 1, characterized in that: A sealing ring (9) is provided at the junction of the lead wire (6) and the ceramic base plate (4).

4. The junction box of a ceramic base plate according to claim 1, characterized in that: The bottom plate (1) is provided with a circular hole (11), and the circular hole (11) is located on one side of the ceramic bottom plate (4).

5. The junction box of a ceramic base plate according to claim 1, characterized in that: The lead wire (6) passes through the conductive column (7).

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