PCB with blind hole structure

Abstract

The utility model discloses a PCB (printed circuit board) with a blind hole structure, which relates to the technical field of PCBs and comprises a PCB body. The bottom end of the PCB body is fixedly connected with a heat dissipation plate; the side end of the heat dissipation plate is fixedly connected with a positioning plate; a heat dissipation cavity is formed in the heat dissipation plate; the inner side wall of the heat dissipation plate is fixedly connected with a plurality of groups of first heat dissipation sheets; a through groove is formed in the first cooling fin. Heat dissipation treatment on the heat dissipation plate can be improved through the heat dissipation cavity, heat dissipation treatment on the PCB body can also be improved, the first heat dissipation fins are made of heat absorption materials and have good heat absorption effects, heat of the PCB body can be absorbed through the first heat dissipation fins to be diffused, air flow in the heat dissipation cavity can flow through the through grooves after making contact with the first heat dissipation fins, and the heat dissipation effect of the PCB body is improved. And therefore, the heat dissipation effect of the PCB body is improved, and the situation that components of the PCB body are burnt out due to the fact that the temperature is too high is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a PCB board with a blind hole structure. Background Art

[0002] PCB makes circuits miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. PCB blind vias are conductive holes that connect the surface layer and the inner layer without penetrating the entire board. Blind vias are located on the top and bottom surfaces of printed circuit boards, have a certain depth, and are used to connect the surface circuits with the inner circuits below.

[0003] A Chinese patent with authorization announcement number CN211909288U discloses a PCB multilayer board with blind holes, including a PCB board body, a blind hole is opened on the top of the PCB board body, and a groove is provided on the outer wall of the PCB board body, a rubber ring is fixedly connected inside the groove, and the PCB board body includes a top layer, a power layer, a reinforcement layer and a bottom layer from top to bottom, a first adhesive layer is provided between the top layer and the power layer, a second adhesive layer is provided between the power layer and the reinforcement layer, and a third adhesive layer is provided between the reinforcement layer and the bottom layer; the blind hole increases the pressure release capacity and the compressive resistance of the PCB multilayer board in the vertical direction, and the groove and the rubber ring reduce the influence of external force on the side of the PCB multilayer board, that is, the compressive resistance of the PCB multilayer board in the horizontal direction is increased, that is, the compressive resistance of the PCB multilayer board in the vertical direction is increased.

[0004] The disadvantages of the above-mentioned prior art solution are that: the above-mentioned solution increases the pressure release capability through the blind hole, and increases the compressive resistance of the PCB multilayer board in the vertical direction, that is, increases the compressive resistance of the PCB multilayer board in the vertical direction, but the PCB board will generate a large amount of heat during operation. Especially in the hot environment in summer, the heat cannot be removed in time and will burn the components on the PCB board. Here we provide a PCB board with a blind hole structure. Utility Model Content

[0005] The utility model aims to provide a PCB board with a blind hole structure to solve the technical problem that a large amount of heat is generated in the working process of the PCB board in the prior art, especially in the hot environment of summer, the heat cannot be removed in time, and the components on the PCB board will be burned.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] A PCB board with a blind hole structure comprises a PCB body; a heat sink is fixedly connected to the bottom end of the PCB body; a positioning plate is fixedly connected to the side end of the heat sink; a heat sink cavity is provided inside the heat sink; a plurality of groups of first heat sinks are fixedly connected to the inner side wall of the heat sink; and a through groove is provided inside the first heat sink.

[0008] As a further solution of the utility model: a shell is provided on one side of the PCB board; a fan is installed inside the shell, and a heat dissipation cavity is provided on one side of the fan.

[0009] As a further solution of the utility model: a plurality of groups of heat collecting plates are fixedly connected to the top of the PCB body; a No. 2 heat sink is fixedly connected to the top of the heat collecting plate, and heat dissipation holes are opened inside the No. 2 heat sink.

[0010] As a further solution of the utility model: an air guide plate is installed at the side end of the PCB body, a fan is provided on one side of the air guide plate, and a heat dissipation cavity is provided below the air guide plate.

[0011] As a further solution of the utility model: a dust screen is installed on the side end of the heat dissipation plate; and a positioning magnet sheet is fixedly connected to the side end of the dust screen.

[0012] As a further solution of the utility model: a positioning plug plate is fixedly connected to the side end of the air guide plate; a positioning frame is fixedly connected to the inside of the PCB board body, and the positioning frame corresponds to the positioning plug plate.

[0013] The beneficial effects of the utility model are as follows: the heat dissipation treatment of the heat sink can be improved through the heat dissipation cavity, and the heat dissipation treatment of the PCB board body can also be improved. The No. 1 heat sink is made of heat-absorbing material and has a good heat absorption effect. The heat of the PCB board body can be absorbed and diffused through the No. 1 heat sink. When the airflow inside the heat dissipation cavity contacts the No. 1 heat sink, it flows through the through groove, thereby performing heat dissipation treatment on the No. 1 heat sink, thereby improving the heat dissipation effect of the PCB board body, and reducing the possibility of components of the PCB board body being burned out due to excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the heat dissipation plate structure in the utility model;

[0017] Figure 3 This is a schematic diagram of the heat dissipation cavity structure in the utility model;

[0018] In the figure: 1. PCB board; 2. heat sink; 3. positioning plate; 4. heat dissipation cavity; 5. No. 1 heat sink; 6. through slot; 7. heat collecting plate; 8. No. 2 heat sink; 9. dust screen; 10. positioning magnet sheet; 11. air guide plate; 12. positioning plug-in plate; 13. positioning frame; 14. housing; 15. fan. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] like Figure 1-Figure 3 As shown, a PCB board with a blind hole structure includes a PCB body 1; a heat sink 2 is fixedly connected to the bottom end of the PCB body 1; a positioning plate 3 is fixedly connected to the side end of the heat sink 2; a heat sink cavity 4 is provided inside the heat sink 2; a plurality of groups of No. 1 heat sinks 5 are fixedly connected to the inner side wall of the heat sink 2; a through groove 6 is provided inside the No. 1 heat sink 5.

[0021] The heat of the PCB body 1 can be diffused and transferred up and down, and the airflow can flow in the heat dissipation cavity 4 inside the heat dissipation plate 2. The heat dissipation treatment of the heat dissipation plate 2 can be improved through the heat dissipation cavity 4, and the heat dissipation treatment of the PCB body 1 can also be improved. The No. 1 heat sink 5 is made of heat-absorbing material and has a good heat absorption effect. The No. 1 heat sink 5 can absorb the heat of the PCB body 1 and diffuse it. When the airflow inside the heat dissipation cavity 4 contacts the No. 1 heat sink 5, it will flow through the through groove 6, thereby performing heat dissipation treatment on the No. 1 heat sink 5, and then improving the heat dissipation effect of the PCB body 1.

[0022] A housing 14 is provided on one side of the PCB body 1; a fan 15 is installed inside the housing 14, and a heat dissipation cavity 4 is provided on one side of the fan 15.

[0023] Before work, the housing 14 and the fan 15 are installed to one side of the PCB body 1 and the heat sink 2, and the fan 15 is started to generate wind force, so as to quickly dissipate the heat of the PCB body 1 and the heat sink 2 to avoid damage to the PCB body 1 due to high temperature.

[0024] A plurality of heat collecting plates 7 are fixedly connected to the top of the PCB body 1; a second heat sink 8 is fixedly connected to the top of the heat collecting plate 7, and heat dissipation holes are provided inside the second heat sink 8.

[0025] The heat collecting plate 7 is made of a good heat absorbing material. The heat collecting plate 7 can absorb the heat of the PCB board body 1 and transfer it to the second heat sink 8. A plurality of heat dissipation holes are arranged inside the second heat sink 8. The fan 15 is arranged on one side of the second heat sink 8. The airflow generated by the fan 15 will flow toward the second heat sink 8. The airflow flows in the heat dissipation holes inside the second heat sink 8, thereby improving the heat dissipation effect of the PCB board body 1.

[0026] An air guide plate 11 is installed at the side end of the PCB body 1, a fan 15 is provided on one side of the air guide plate 11, and a heat dissipation cavity 4 is provided below the air guide plate 11.

[0027] The airflow generated by the operation of the fan 15 can flow toward the PCB body 1 , and the air guide plate 11 can guide the airflow generated by the fan 15 into the heat dissipation cavity 4 , thereby improving the flow of the airflow inside the heat dissipation cavity 4 , and further improving the heat dissipation treatment of the bottom end of the PCB body 1 .

[0028] A dust screen 9 is installed at the side end of the heat dissipation plate 2 ; a positioning magnet sheet 10 is fixedly connected to the side end of the dust screen 9 .

[0029] The air flow can flow inside the heat dissipation cavity 4, thereby dissipating the heat of the PCB board 1. The dust shield 9 can be installed and fixed to the heat dissipation plate 2 by positioning the magnet sheet 10. The dust shield 9 can prevent dust from entering the heat dissipation cavity 4, reducing the accumulation of dust inside the heat dissipation cavity 4, thereby ensuring the heat dissipation effect of the heat dissipation cavity 4.

[0030] A positioning plug plate 12 is fixedly connected to the side end of the air guide plate 11 ; a positioning frame 13 is fixedly connected to the inside of the PCB body 1 , and the positioning frame 13 corresponds to the positioning plug plate 12 .

[0031] Before work, install the air guide plate 11 on the PCB body 1, and insert the positioning plate 12 into the positioning frame 13. The positioning plate 12 and the positioning frame 13 are made of rubber material and have a certain elasticity. The positioning plate 12 is squeezed and fixed by the elasticity of the positioning frame 13, so that the air guide plate 11 is fixedly installed on the PCB body 1.

[0032] The working principle of the utility model is as follows: before work, the shell 14 and the fan 15 are installed to one side of the PCB board 1 and the heat sink 2, and the fan 15 is started to generate wind force, and the PCB board 1 and the heat sink 2 are quickly cooled by the wind force to avoid the damage of the PCB board 1 due to high temperature; the heat of the PCB board 1 can be diffused and transferred up and down, and the airflow can flow in the heat dissipation cavity 4 inside the heat sink 2, and the heat dissipation treatment of the heat sink 2 can be improved through the heat dissipation cavity 4, and the heat dissipation treatment of the PCB board 1 can also be improved. The first heat sink 5 is made of heat-absorbing material and has a good heat absorption effect. The heat of the PCB board 1 can be absorbed by the first heat sink 5 and diffused. When the airflow inside the heat dissipation cavity 4 contacts the first heat sink 5, it will flow through the through groove 6, so as to heat the first heat sink 5 and then improve the heat dissipation effect of the PCB board 1; before work, the air guide plate 11 is installed on the PCB board 1, and the positioning The plug plate 12 is inserted into the interior of the positioning frame 13. The positioning plug plate 12 and the positioning frame 13 are made of rubber material and have a certain elasticity. The positioning plug plate 12 is squeezed and fixed by the elasticity of the positioning frame 13, so that the air guide plate 11 is fixedly installed on the PCB board body 1; the airflow generated by the operation of the fan 15 can flow toward the PCB board body 1, and the air guide plate 11 can guide the airflow generated by the fan 15 into the heat dissipation cavity 4, thereby improving the flow of the airflow inside the heat dissipation cavity 4, and then improving the heat dissipation treatment of the bottom end of the PCB board body 1; the heat collecting plate 7 is made of a good heat-absorbing material, and the heat collecting plate 7 can absorb the heat of the PCB board body 1 and transfer it to the second heat sink 8. The second heat sink 8 is provided with a plurality of heat dissipation holes. The fan 15 is arranged on one side of the second heat sink 8. The airflow generated by the fan 15 will flow toward the second heat sink 8, and the airflow will flow in the heat dissipation holes inside the second heat sink 8, thereby improving the heat dissipation effect of the PCB board body 1.

[0033] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A PCB board with a blind hole structure, characterized in that: The invention comprises a PCB body (1); a heat sink (2) is fixedly connected to the bottom end of the PCB body (1); a positioning plate (3) is fixedly connected to the side end of the heat sink (2); a heat sink cavity (4) is provided inside the heat sink (2); a plurality of groups of first heat sinks (5) are fixedly connected to the inner side wall of the heat sink (2); and a through groove (6) is provided inside the first heat sink (5).

2. A PCB board with a blind hole structure according to claim 1, characterized in that: A housing (14) is provided on one side of the PCB body (1); a fan (15) is installed inside the housing (14), and a heat dissipation cavity (4) is provided on one side of the fan (15).

3. A PCB board with a blind hole structure according to claim 2, characterized in that: A plurality of groups of heat collecting plates (7) are fixedly connected to the top end of the PCB body (1); a second heat sink (8) is fixedly connected to the top end of the heat collecting plate (7); and heat dissipation holes are provided inside the second heat sink (8).

4. A PCB board with a blind hole structure according to claim 3, characterized in that: An air guide plate (11) is installed at the side end of the PCB body (1), a fan (15) is provided on one side of the air guide plate (11), and a heat dissipation cavity (4) is provided below the air guide plate (11).

5. A PCB board with a blind hole structure according to claim 4, characterized in that: A dust screen (9) is installed on the side end of the heat dissipation plate (2); and a positioning magnet sheet (10) is fixedly connected to the side end of the dust screen (9).

6. A PCB board with a blind hole structure according to claim 5, characterized in that: A positioning plug plate (12) is fixedly connected to the side end of the air guide plate (11); a positioning frame (13) is fixedly connected to the inside of the PCB body (1), and the positioning frame (13) corresponds to the positioning plug plate (12).

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