Liquid cooling heat dissipation device

By adopting L-shaped configuration of liquid-cooled discharge and pump-driven coolant circulating flow in the liquid-cooled heat dissipation device, combined with fan-assisted air-cooled heat dissipation, the problems of low heat dissipation efficiency and large space occupancy of existing liquid-cooled heat dissipation devices are solved. , achieving efficient heat dissipation and space saving effects.

CN222302267UActive Publication Date: 2025-01-03APALTEK CO LTD
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Patent Information

Application Number
CN202420815069.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-18
Publication Date
2025-01-03
Estimated Expiration
2034-04-18

AI Technical Summary

Technical Problem

The existing liquid-cooled heat dissipation devices are inefficient in handling high-heat chips and circuit boards, and in the context of lightweight electronic equipment, the installation space requirements for liquid-cooled discharge are difficult to meet.

Method used

A liquid-cooled heat dissipation device is designed. By installing the first liquid-cooled radiator and the second liquid-cooled radiator that are perpendicular to each other on both sides of the liquid-cooled head, an L-shaped configuration is formed, which increases the heat dissipation volume and saves space, and uses pump drive. The coolant flows circulates and combines the fan to assist air cooling and heat dissipation to improve the overall heat dissipation efficiency.

Benefits of technology

It effectively improves heat dissipation efficiency, saves the assembly space of liquid-cooled discharge, adapts to the lightweight and thin needs of electronic equipment, and ensures high-performance operation and long-term use.

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Abstract

The utility model relates to a liquid cooling heat dissipation device, which comprises a base, a pump and a liquid cooling row group, the base comprises a liquid cooling head and a mounting rack, the liquid cooling head is provided with a first side surface and a second side surface which are adjacent to each other, the mounting rack is configured corresponding to the liquid cooling head, and the pump is arranged in the liquid cooling head. The liquid cooling row group is fixed on the mounting frame and comprises a first liquid cooling row and a second liquid cooling row which are connected, the first liquid cooling row is configured corresponding to the first side surface, and the second liquid cooling row is configured corresponding to the second side surface; therefore, the overall heat dissipation efficiency of the liquid cooling heat dissipation device can be effectively improved, the occupied assembly space is saved, and planning and configuration of overall installation are facilitated.
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Description

Technical Field

[0001] The utility model relates to the field of heat dissipation, in particular to a liquid cooling heat dissipation device. Background Art

[0002] With the rapid development of technology, electronic devices and electronic equipment are gradually developing towards being thinner and more efficient to meet the diverse needs of users. Therefore, electronic devices and electronic equipment also need to have a good heat dissipation structure to dissipate heat when in use, so as to ensure that the electronic devices and electronic equipment can maintain high performance and maintain their service life. In recent years, liquid cooling has gradually been widely used in the field of heat dissipation. It mainly attaches the liquid cooling head to the heat source, absorbs the heat generated by the heat source through the coolant in the liquid cooling head, and transmits the coolant to the liquid cooling radiator through the infusion tube for heat dissipation.

[0003] However, as the performance of chips, circuit boards or motherboards improves, the heat energy generated by them also increases significantly, making it impossible for the liquid cooling radiator of conventional liquid cooling to quickly cool the heat source. In addition, as electronic devices and electronic equipment become thinner and lighter, the substrate (such as circuit boards, motherboards) with heat sources needs to be reduced in area while also retaining the location of chips, circuits or other electronic components as much as possible, so there is not enough space to reserve for the installation of liquid cooling radiators. Utility Model Content

[0004] The main purpose of the utility model is to improve the overall heat dissipation efficiency and save the occupied assembly space to facilitate the planning and configuration of the overall installation.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a liquid cooling heat dissipation device, including a base, a pump and a liquid cooling row group, the base includes a liquid cooling head and a mounting frame, the liquid cooling head has a first side surface and a second side surface adjacent to each other, the mounting frame is configured corresponding to the liquid cooling head, the pump is arranged in the liquid cooling head, the liquid cooling row group is fixed on the mounting frame and includes a first liquid cooling row and a second liquid cooling row connected to each other, the first liquid cooling row is configured corresponding to the first side surface, and the second liquid cooling row is configured corresponding to the second side surface.

[0006] More preferably, the first liquid-cooling row and the second liquid-cooling row are perpendicular to each other and form an L shape.

[0007] Further preferably, the base further comprises a support frame, the support frame is fixed to the liquid cooling head, and the mounting frame is fixed to the support frame.

[0008] Further preferably, the mounting frame includes a base plate, a first mounting portion and a second mounting portion, the base plate is fixed to the support frame, the first mounting portion and the second mounting portion are respectively connected to the base plate, the first liquid cooling row is fixed to the first mounting portion, and the second liquid cooling row is fixed to the second mounting portion.

[0009] Further preferably, the first liquid cooling radiator has a first liquid inlet diverter chamber, a plurality of first liquid inlet heat dissipation structures, a first liquid inlet converging chamber, a first liquid outlet diverter chamber, a plurality of first liquid outlet heat dissipation structures and a first liquid outlet converging chamber, the first liquid inlet diverter chamber is adjacent to the first liquid outlet converging chamber, the first liquid inlet converging chamber is adjacent to the first liquid outlet diverter chamber, the first liquid inlet heat dissipation structures are parallel to each other and connected to the first liquid inlet diverter chamber and the first liquid inlet converging chamber, and the first liquid outlet heat dissipation structures are parallel to each other and connected to the first liquid outlet diverter chamber and the first liquid outlet converging chamber.

[0010] Further preferably, the second liquid cooling radiator has a second liquid inlet diverter chamber, a plurality of second liquid inlet heat dissipation structures, a water tank, a plurality of second liquid outlet heat dissipation structures and a second liquid outlet converging chamber, the second liquid inlet diverter chamber and the second liquid outlet converging chamber are adjacently arranged, each second liquid inlet heat dissipation structure is parallel to each other and connected to the second liquid inlet diverter chamber and the water tank, and each second liquid outlet heat dissipation structure is parallel to each other and connected to the water tank and the second liquid outlet converging chamber.

[0011] Further preferably, the liquid cooling row group further includes a pair of connecting tubes, wherein one connecting tube connects the first liquid inlet confluence cavity and the second liquid inlet diversion cavity, and the other connecting tube connects the second liquid outlet confluence cavity and the first liquid outlet diversion cavity.

[0012] Further preferably, it also includes a first fan and a second fan, the first fan is arranged on the first liquid cooling row and corresponds to each first liquid inlet heat dissipation structure and each first liquid outlet heat dissipation structure, and the second fan is arranged on the second liquid cooling row and corresponds to each second liquid inlet heat dissipation structure and each second liquid outlet heat dissipation structure.

[0013] Further preferably, it also includes a pair of infusion tubes, the first liquid inlet diversion cavity has a liquid inlet, the first liquid outlet confluence cavity has a liquid outlet, one infusion tube connects the liquid inlet and the liquid cooling head, and the other infusion tube connects the liquid outlet and the liquid cooling head.

[0014] More preferably, it further includes a first fan and a second fan, and the first fan and the second fan are arranged in the liquid cooling row group.

[0015] Further preferably, by configuring a first liquid-cooling radiator and a second liquid-cooling radiator on two adjacent sides of the liquid-cooling head, not only can the heat dissipation volume be increased by the first liquid-cooling radiator and the second liquid-cooling radiator to improve the heat dissipation efficiency, but the assembly space occupied by the first liquid-cooling radiator and the second liquid-cooling radiator can also be effectively saved, which is beneficial to the planning and configuration of the overall installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following will explain the preferred implementation mode in a clear and understandable manner with reference to the accompanying drawings, and further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of a liquid cooling heat dissipation device.

[0017] Figure 1 It is a three-dimensional appearance diagram of the utility model.

[0018] Figure 2 It is a three-dimensional exploded view of the utility model.

[0019] Figure 3 It is a cross-sectional top view of the utility model.

[0020] Figure 4 It is a sectional side view of the utility model.

[0021] Figure 5 It is a cross-sectional view of the liquid cooling row group of the utility model.

[0022] Figure 6 It is a cross-sectional view of the liquid cooling row group of the utility model from another perspective.

[0023] Description of Figure Numbers:

[0024] 10: base, 11: liquid cooling head, 111: first side, 112: second side, 12: mounting frame, 121: bottom plate, 122: first mounting portion, 123: second mounting portion, 13: support frame, 20: pump, 30: liquid cooling row assembly, 31: first liquid cooling row, 311: first liquid inlet diversion chamber, 3111: liquid inlet, 312: first liquid inlet heat dissipation structure, 313: first liquid inlet confluence chamber, 314: first A liquid outlet diversion chamber, 315: a first liquid outlet heat dissipation structure, 316: a first liquid outlet converging chamber, 3161: a liquid outlet, 32: a second liquid cooling row, 321: a second liquid inlet diversion chamber, 322: a second liquid inlet heat dissipation structure, 323: a water tank, 324: a second liquid outlet heat dissipation structure, 325: a second liquid outlet converging chamber, 33: a connecting pipe, 40: a liquid infusion pipe, 50: a first fan, 60: a second fan, A: a substrate, B: a heat source. DETAILED DESCRIPTION

[0025] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0026] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections.

[0027] In order to simplify the drawings, only the parts related to the utility model are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0028] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0029] In the description of the present invention, it needs to be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" describe various elements, components, regions, layers, and / or portions, which should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, terms such as "first," "second," "third," "fourth," and "fifth" as used herein do not imply a sequence or order.

[0031] The detailed description and technical contents of the present invention will be described below with reference to the accompanying drawings. However, the accompanying drawings are only for illustrative purposes and are not intended to limit the present invention.

[0032] The utility model provides a liquid cooling device for cooling a heat source B disposed on a substrate A. Figures 1 to 6 As shown, the liquid cooling device of the present invention mainly includes a base 10 , a pump 20 and a liquid cooling row assembly 30 .

[0033] The base 10 is disposed on the substrate A, and the base 10 mainly includes a liquid cooling head 11 and a mounting frame 12. The liquid cooling head 11 in the present embodiment is generally a rectangular block, but the present invention is not limited thereto. The liquid cooling head 11 is attached to the heat source B, and the liquid cooling head 11 has a first side surface 111 and a second side surface 112 adjacent to each other. The mounting frame 12 is configured corresponding to the liquid cooling head 11. Specifically, the base 10 in the present embodiment also includes a support frame 13, the support frame 13 is fixed to the liquid cooling head 11 to facilitate the liquid cooling head 11 to be attached to the heat source B, and the mounting frame 12 is fixed to the support frame 13, but the present invention is not limited thereto, for example, the mounting frame 12 can also be directly fixed to the liquid cooling head 11 or the substrate A.

[0034] The pump 20 in this embodiment is disposed in the liquid cooling head 11, so as to drive a cooling liquid (not shown) to flow in the liquid cooling head 11. The liquid cooling head 11 and the pump 20 are well known to people with common knowledge in the art, so the specific structures of the liquid cooling head 11 and the pump 20 are not particularly described in detail here. Of course, the pump 20 can also be disposed in the first liquid cooling row 31 or the second liquid cooling row 32 in the liquid cooling row group 30 described later, or the pump 20 is disposed in the liquid cooling head 11, the first liquid cooling row 31 and the second liquid cooling row 32.

[0035] The liquid cooling row group 30 is fixed on the mounting frame 12, and the liquid cooling row group 30 includes a first liquid cooling row 31 and a second liquid cooling row 32 which are connected to each other. Specifically, the mounting frame 12 includes a bottom plate 121, a first mounting portion 122 and a second mounting portion 123. In this embodiment, the bottom plate 121 is fixed on the support frame 13, and the first mounting portion 122 and the second mounting portion 123 are respectively vertically connected to different sides of the bottom plate 121, but the utility model is not limited thereto. For example, the first mounting portion 122 and the second mounting portion 123 can also be obliquely connected to the bottom plate 121 or connected to the center of the bottom plate 121. The first liquid cooling row 31 is fixed to the first mounting portion 122 and is configured corresponding to the first side surface 111. The second liquid cooling row 32 is fixed to the second mounting portion 123 and is configured corresponding to the second side surface 112.

[0036] In the present embodiment, the bottom plate 121 of the mounting frame 12 is generally L-shaped, so the first mounting portion 122 and the second mounting portion 123 are perpendicular to each other and are L-shaped, so that the first liquid-cooling row 31 and the second liquid-cooling row 32 are also perpendicular to each other and are L-shaped, but the present invention is not limited thereto. The angle formed between the first mounting portion 122 and the second mounting portion 123 can be between 60° and 140°, so that the angle formed between the first liquid-cooling row 31 and the second liquid-cooling row 32 is also between 60° and 140°. Thus, since the angle between the first liquid-cooling row 31 and the second liquid-cooling row 32 is between 60° and 140°, the first liquid-cooling row 31 and the second liquid-cooling row 32 can be arranged on the adjacent two sides of the liquid-cooling head 11, which can not only increase the heat dissipation volume through the first liquid-cooling row 31 and the second liquid-cooling row 32 to improve the heat dissipation efficiency, but also effectively save the assembly space occupied by the first liquid-cooling row 31 and the second liquid-cooling row 32, which is beneficial to the overall installation space configuration and the use planning of the substrate A.

[0037] For further instructions, see Figures 3 to 5 As shown, the first liquid cooling row 31 has a first liquid inlet flow diversion chamber 311, a plurality of first liquid inlet heat dissipation structures 312, a first liquid inlet confluence chamber 313, a first liquid outlet flow diversion chamber 314, a plurality of first liquid outlet heat dissipation structures 315 and a first liquid outlet confluence chamber 316. The first liquid inlet flow diversion chamber 311 and the first liquid outlet confluence chamber 316 are adjacently arranged on one side of the first liquid cooling row 31, and the first liquid inlet confluence chamber 313 and the first liquid outlet flow diversion chamber 314 are adjacently arranged on the other side of the first liquid cooling row 31. Each of the first liquid inlet heat dissipation structures 312 is a finned pipeline parallel to each other and communicates with the first liquid inlet flow diversion chamber 311 and the first liquid inlet confluence chamber 313, that is, each of the first liquid inlet heat dissipation structures 312 is connected between the first liquid inlet flow diversion chamber 311 and the first liquid inlet confluence chamber 313. Each first liquid outlet heat dissipation structure 315 is a finned pipe parallel to each other and communicates with the first liquid outlet diversion cavity 314 and the first liquid outlet confluence cavity 316 , that is, each first liquid outlet heat dissipation structure 315 is connected between the first liquid outlet diversion cavity 314 and the first liquid outlet confluence cavity 316 .

[0038] Please read next Figure 3 and Figure 6As shown, the second liquid cooling row 32 has a second liquid inlet flow diversion chamber 321, a plurality of second liquid inlet heat dissipation structures 322, a water tank 323, a plurality of second liquid outlet heat dissipation structures 324 and a second liquid outlet confluence chamber 325. The second liquid inlet flow diversion chamber 321 and the second liquid outlet confluence chamber 325 are adjacently arranged on one side of the second liquid cooling row 32, and the water tank 323 is arranged on the other side of the second liquid cooling row 32. Each second liquid inlet heat dissipation structure 322 is a finned pipe parallel to each other and connects the second liquid inlet flow diversion chamber 321 and the water tank 323, that is, each second liquid inlet heat dissipation structure 322 is connected between the second liquid inlet flow diversion chamber 321 and the water tank 323. Each second liquid outlet heat dissipation structure 324 is a finned pipe parallel to each other and connects the water tank 323 and the second liquid outlet confluence chamber 325, that is, each second liquid outlet heat dissipation structure 324 is connected between the water tank 323 and the second liquid outlet confluence chamber 325.

[0039] For further instructions, see Figure 3 and Figure 6 As shown, the liquid cooling row assembly 30 further includes a pair of connecting pipes 33. One connecting pipe 33 connects the first liquid inlet confluence chamber 313 and the second liquid inlet diversion chamber 321, and the other connecting pipe 33 connects the second liquid outlet confluence chamber 325 and the first liquid outlet diversion chamber 314. Figures 1 to 4 As shown, the liquid cooling device of the present invention further includes a pair of liquid infusion tubes 40. The first liquid inlet diversion chamber 311 of the first liquid cooling row 31 has a liquid inlet 3111, and the first liquid outlet confluence chamber 316 of the first liquid cooling row 31 has a liquid outlet 3161. One of the liquid infusion tubes 40 is connected to the liquid inlet 3111 and the liquid cooling head 11, and the other liquid infusion tube 40 is connected to the liquid outlet 3161 and the liquid cooling head 11. Thus, the cooling liquid pushed by the pump 20 in the liquid cooling head 11 can flow back to the liquid cooling head 11 in sequence through the liquid inlet 40, the liquid inlet 3111, the first liquid inlet diversion chamber 311, each first liquid inlet heat dissipation structure 312, the first liquid inlet confluence chamber 313, the connecting tube 33, the second liquid inlet diversion chamber 321, each second liquid inlet heat dissipation structure 322, the water tank 323, each second liquid outlet heat dissipation structure 324, the second liquid outlet confluence chamber 325, another connecting tube 33, the first liquid outlet diversion chamber 314, each first liquid outlet heat dissipation structure 315, the first liquid outlet confluence chamber 316, the liquid outlet 3161 and another liquid inlet tube 40 to form a circulation, so that the cooling liquid can bring the heat energy of the heat source B absorbed by the liquid cooling head 11 to the first liquid cooling row 31 and the second liquid cooling row 32 for heat dissipation.

[0040] See also Figures 1 to 3As shown, the liquid cooling device of the present invention further includes a first fan 50 and a second fan 60, and the first fan 50 and the second fan 60 are arranged on the liquid cooling row group 30. Specifically, the first fan 50 is arranged on the first liquid cooling row 31 and corresponds to each first liquid inlet heat dissipation structure 312 and each first liquid outlet heat dissipation structure 315, and the second fan 60 is arranged on the second liquid cooling row 32 and corresponds to each second liquid inlet heat dissipation structure 322 and each second liquid outlet heat dissipation structure 324. In this way, the first fan 50 can be used to perform air cooling and heat dissipation on each first liquid inlet heat dissipation structure 312 and each first liquid outlet heat dissipation structure 315 of the first liquid cooling row 31, and the second fan 60 can be used to perform air cooling and heat dissipation on each second liquid inlet heat dissipation structure 322 and each second liquid outlet heat dissipation structure 324 of the second liquid cooling row 32, thereby greatly improving the heat dissipation efficiency of the first liquid cooling row 31 and the second liquid cooling row 32. In addition, since the angle formed between the first liquid-cooling row 31 and the second liquid-cooling row 32 is between 60° and 140°, and the first liquid-cooling row 31 in the present embodiment is perpendicular to the second liquid-cooling row 32 and is L-shaped, the first fan 50 and the second fan 60 can provide a good air-cooling heat dissipation effect and avoid the airflows generated by the first fan 50 and the second fan 60 from interfering with each other.

[0041] The liquid-cooled heat dissipation device of the present invention is configured on two adjacent sides of the liquid cooling head 11 by configuring the first liquid cooling row 31 and the second liquid cooling row 32. Not only can the heat dissipation volume be increased by the first liquid cooling row 31 and the second liquid cooling row 32 to improve the heat dissipation efficiency, but also the assembly space occupied by the first liquid cooling row 31 and the second liquid cooling row 32 can be effectively saved, which is beneficial to the overall installation space configuration and the use planning of the substrate A.

[0042] In summary, the above disclosure of the utility model is to enable people with common knowledge in the field to clearly understand the technical content of the utility model and implement it accordingly, and is not intended to limit the scope of patent protection of the utility model. In addition, the utility model can of course have other unlisted embodiments. Without departing from the spirit and essence of the utility model, technicians familiar with the field should be able to evolve various corresponding changes and deformations based on the utility model, but these corresponding changes and deformations should all fall within the scope of protection of the patent applied for the utility model.

Claims

1. A liquid cooling device, characterized in that: include: A base (10) comprises a liquid cooling head (11) and a mounting frame (12), wherein the liquid cooling head (11) has a first side surface (111) and a second side surface (112) adjacent to each other, and the mounting frame (12) is arranged corresponding to the liquid cooling head (11); a pump (20) disposed in the liquid cooling head (11); and A liquid cooling row group (30) is fixed on the mounting frame (12) and comprises a first liquid cooling row (31) and a second liquid cooling row (32) connected to each other, wherein the first liquid cooling row (31) is arranged corresponding to the first side surface (111), and the second liquid cooling row (32) is arranged corresponding to the second side surface (112).

2. The liquid cooling device according to claim 1, characterized in that: The first liquid cooling row (31) and the second liquid cooling row (32) are perpendicular to each other and are L-shaped.

3. The liquid cooling device according to claim 1, characterized in that: The base (10) further comprises a support frame (13), the support frame (13) is fixed to the liquid cooling head (11), and the mounting frame (12) is fixed to the support frame (13).

4. The liquid cooling device according to claim 3, characterized in that: The mounting frame (12) comprises a base plate (121), a first mounting portion (122) and a second mounting portion (123); the base plate (121) is fixed to the support frame (13); the first mounting portion (122) and the second mounting portion (123) are respectively connected to the base plate (121); the first liquid cooling row (31) is fixed to the first mounting portion (122); and the second liquid cooling row (32) is fixed to the second mounting portion (123).

5. The liquid cooling device according to claim 1, characterized in that: The first liquid cooling row (31) comprises a first liquid inlet diverter chamber (311), a plurality of first liquid inlet heat dissipation structures (312), a first liquid inlet converging chamber (313), a first liquid outlet diverter chamber (314), a plurality of first liquid outlet heat dissipation structures (315) and a first liquid outlet converging chamber (316); the first liquid inlet diverter chamber (311) and the first liquid outlet converging chamber (316) are arranged adjacent to each other; the first liquid inlet converging chamber (313) and the first liquid outlet diverter chamber (314) are arranged adjacent to each other; each of the first liquid inlet heat dissipation structures (312) are parallel to each other and connected to the first liquid inlet diverter chamber (311) and the first liquid inlet converging chamber (313); each of the first liquid outlet heat dissipation structures (315) are parallel to each other and connected to the first liquid outlet diverter chamber (314) and the first liquid outlet converging chamber (316).

6. The liquid cooling device according to claim 5, characterized in that: The second liquid cooling row (32) comprises a second liquid inlet diversion chamber (321), a plurality of second liquid inlet heat dissipation structures (322), a water trough (323), a plurality of second liquid outlet heat dissipation structures (324) and a second liquid outlet confluence chamber (325); the second liquid inlet diversion chamber (321) and the second liquid outlet confluence chamber (325) are arranged adjacent to each other, each of the second liquid inlet heat dissipation structures (322) are parallel to each other and connected to the second liquid inlet diversion chamber (321) and the water trough (323); each of the second liquid outlet heat dissipation structures (324) are parallel to each other and connected to the water trough (323) and the second liquid outlet confluence chamber (325).

7. The liquid cooling device according to claim 6, characterized in that: The liquid cooling row group (30) further includes a pair of connecting tubes (33), wherein one of the connecting tubes (33) connects the first liquid inlet confluence chamber (313) and the second liquid inlet diversion chamber (321), and the other connecting tube (33) connects the second liquid outlet confluence chamber (325) and the first liquid outlet diversion chamber (314).

8. The liquid cooling device according to claim 6, characterized in that: It also includes a first fan (50) and a second fan (60), wherein the first fan (50) is disposed on the first liquid cooling row (31) and corresponds to each of the first liquid inlet heat dissipation structures (312) and each of the first liquid outlet heat dissipation structures (315), and the second fan (60) is disposed on the second liquid cooling row (32) and corresponds to each of the second liquid inlet heat dissipation structures (322) and each of the second liquid outlet heat dissipation structures (324).

9. The liquid cooling device according to claim 5, characterized in that: It also includes a pair of infusion tubes (40), the first liquid inlet diversion chamber (311) has a liquid inlet (3111), the first liquid outlet confluence chamber (316) has a liquid outlet (3161), one of the infusion tubes (40) is connected to the liquid inlet (3111) and the liquid cooling head (11), and the other infusion tube (40) is connected to the liquid outlet (3161) and the liquid cooling head (11).

10. The liquid cooling device according to claim 1, characterized in that: It also includes a first fan (50) and a second fan (60), wherein the first fan (50) and the second fan (60) are arranged on the liquid cooling radiator assembly (30).

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