Chip thickness detection equipment

Abstract

The utility model belongs to the technical field of chip thickness detection, and particularly relates to chip thickness detection equipment, which comprises a base, a foot stool is mounted on the base, a material guide table is mounted on the foot stool, a material guide groove is formed in the top side of the material guide table, a groove is formed in the middle of the material guide table, and the material guide table is provided with a material guide groove. The first gear and the second gear are sleeved with a transmission chain, the first rotating shaft and the second rotating shaft are fixedly sleeved with a first connecting rod and a second connecting rod correspondingly, the other end of the first connecting rod and the other end of the second connecting rod are rotationally connected with a moving rod, and multiple sets of material pushing rods are installed on the moving rod. The material pushing rod is driven by the moving rod to reciprocate in the vertical direction and the horizontal direction until the chip is pushed to the position below the infrared generator and the infrared receiver to be detected, after detection is completed, the material pushing rod is driven by the moving rod to push the chip to continue to move, and finally the chip slides into the collecting box along the material guiding plate. According to the structure, the chips can be continuously and rapidly fed and discharged, and the detection efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip thickness detection, in particular to a chip thickness detection device. Background Art

[0002] The inherent reliability of the chip depends on the reliability design of the product. Therefore, before the chip is produced and shipped out of the factory or installed on the PCB board, the chip must be tested through the corresponding testing process to eliminate chips with problems as much as possible. In the process of testing the chip thickness, thickness testing equipment is required.

[0003] A Chinese patent with publication number CN112833946A discloses a chip rapid detection device and a rapid detection method, including a box body and an opening, a hydraulic cylinder is fixedly installed on the top of the box body, the output end of the hydraulic cylinder is fixedly connected to the lower pressure plate by a telescopic rod, a support rod is fixedly provided on the bottom surface of the lower pressure plate, and a detection device is installed on the downwardly extending end of the support rod, a first product collection box, a second product collection box, a finished product collection box and a third product collection box are provided at the bottom of the box body, a sorting and transmission device, a second sorting and transmission device, a detection thickness block and a second detection thickness block are provided in the box body, and a cleaning device is installed inside the box body. The present invention can uniformly press down to detect the compressive strength of the chip through the detection device, and will not cause accidental damage due to uneven force. In addition, the thickness of the chips can be detected in batches, thereby improving the efficiency of chip production and reducing the workload of the staff.

[0004] During the process of chip thickness detection, the existing thickness detection equipment cannot continuously and quickly load and unload the chips, resulting in low detection efficiency. Therefore, a chip thickness detection equipment is proposed to address the above problem. Utility Model Content

[0005] In order to make up for the deficiencies of the prior art and solve the problems existing in the prior art, the utility model provides a chip thickness detection device.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a chip thickness detection device described in the utility model comprises a base, a tripod is installed on the base, a material guide table is installed on the tripod, a material guide groove is provided on the top side of the material guide table, a groove is provided in the middle of the material guide table, a fixing plate is installed on the bottom wall of the material guide table, a motor is installed on the fixing plate through a machine base, a first rotating shaft and a second rotating shaft are rotatably installed on the fixing plate, the output shaft of the motor is connected to the first rotating shaft, a first gear and a second gear are fixedly sleeved on the first rotating shaft and the second rotating shaft respectively, a transmission chain is sleeved on the first gear and the second gear, and a first rotating shaft and a second rotating shaft are fixedly sleeved on the first rotating shaft and the second rotating shaft respectively. A first connecting rod and a second connecting rod, the other ends of which are rotatably connected to a moving rod, and multiple groups of push rods are installed on the moving rod. The moving rod performs vertical and horizontal movements synchronously during the rotation process. When the moving rod drives the push rod to move horizontally, the leftmost push rod pushes out the bottom chip in the loading barrel, and the chip moves horizontally on the guide groove. The moving rod drives the push rod to reciprocate in the vertical and horizontal directions until the chip is pushed under the infrared generator and the infrared receiver for detection. After the detection is completed, the moving rod drives the push rod to push the chip to continue moving, and finally the chip slides along the guide plate into the collection box. This structure can continuously and quickly load and unload chips, which is beneficial to improving detection efficiency.

[0007] Preferably, a loading cylinder is installed on the material guide table, and the loading cylinder is located above the material guide trough. Multiple groups of chips are placed inside the loading cylinder, and a material guide plate is welded on the side wall of the material guide table, and a collecting box is placed below the material guide plate, and the collecting box is located on the base. A supporting frame is installed on the material guide table, and an infrared generator and an infrared receiver are installed on the supporting frame. A control panel is installed on the material guide table, and the control panel is connected to the infrared generator and the infrared receiver through an internal circuit. An alarm light is installed on the support frame, and the alarm light is connected to the control panel through an internal circuit. The distance difference is obtained through the control panel according to the distance between the material guide trough and the infrared generator and the distance between the chip and the infrared generator, which is the thickness value of the chip. A standard chip thickness value is input inside the control panel. If the chip thickness value is different from the standard value, it means that the chip is unqualified, then the control panel will control the alarm light to turn on, thereby realizing accurate detection of the chip thickness value, which is beneficial to improving the accuracy of detection.

[0008] The utility model is beneficial in that:

[0009] 1. The utility model realizes vertical and horizontal movement synchronously during the rotation of the moving rod. When the moving rod drives the push rod to move horizontally, the leftmost push rod pushes out the lowest chip in the loading barrel, and the chip moves horizontally on the guide groove. The moving rod drives the push rod to move back and forth in the vertical and horizontal directions until the chip is pushed under the infrared generator and the infrared receiver for detection. After the detection is completed, the moving rod drives the push rod to push the chip to continue moving, and finally the chip slides along the guide plate into the collection box. This structure can continuously and quickly load and unload the chips, which is beneficial to improving the detection efficiency.

[0010] 2. The utility model obtains the distance difference, which is the thickness value of the chip, based on the distance between the material guide trough and the infrared generator and the distance between the chip and the infrared generator through the control panel. The standard chip thickness value is input into the control panel. If the chip thickness value is different from the standard value, indicating that the chip is unqualified, the control panel will control the alarm light to turn on, thereby realizing accurate detection of the chip thickness value, which is beneficial to improving the accuracy of detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0012] Figure 1 It is a schematic diagram of a three-dimensional structure from a first-person perspective;

[0013] Figure 2 It is a schematic diagram of the three-dimensional structure of the material guide table;

[0014] Figure 3 It is a schematic diagram of the three-dimensional structure of the push rod;

[0015] Figure 4 It is a schematic diagram of the three-dimensional structure of the detection component.

[0016] In the figure: 1. base; 2. tripod; 3. material guide table; 4. material guide trough; 5. groove; 6. fixed plate; 7. motor; 8. first rotating shaft; 9. second rotating shaft; 10. first gear; 11. second gear; 12. transmission chain; 13. first connecting rod; 14. second connecting rod; 15. moving rod; 16. pushing rod; 17. loading barrel; 18. chip; 19. material guide plate; 20. collection box; 21. support frame; 22. infrared generator; 23. infrared receiver; 24. control panel; 25. alarm light. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-4As shown, a chip thickness detection device includes a base 1, a tripod 2 is installed on the base 1, a material guide table 3 is installed on the tripod 2, a material guide groove 4 is opened on the top side of the material guide table 3, a groove 5 is opened in the middle of the material guide table 3, a fixing plate 6 is installed on the bottom wall of the material guide table 3, a motor 7 is installed on the fixing plate 6 through a machine base, a first rotating shaft 8 and a second rotating shaft 9 are rotatably installed on the fixing plate 6, an output shaft of the motor 7 is connected to the first rotating shaft 8, a first gear 10 and a second gear 11 are fixedly sleeved on the first rotating shaft 8 and the second rotating shaft 9, a transmission chain 12 is sleeved on the first gear 10 and the second gear 11, and a first connecting rod 13 and a second connecting rod 14 are fixedly sleeved on the first rotating shaft 8 and the second rotating shaft 9, respectively. The other ends of the first connecting rod 13 and the second connecting rod 14 are rotatably connected to a moving rod 15, on which a plurality of pushing rods 16 are installed, a loading cylinder 17 is installed on the material guide table 3, the loading cylinder 17 is located above the material guide slot 4, and a plurality of chips 18 are placed inside the loading cylinder 17, a material guide plate 19 is welded on the side wall of the material guide table 3, a collecting box 20 is placed below the material guide plate 19, and the collecting box 20 is located on the base 1, a supporting frame 21 is installed on the material guide table 3, an infrared generator 22 and an infrared receiver 23 are installed on the supporting frame 21, a control panel 24 is installed on the material guide table 3, the control panel 24 is connected to the infrared generator 22 and the infrared receiver 23 through an internal circuit, an alarm light 25 is installed on the supporting frame 21, and an alarm lamp 25 is installed on the supporting frame 21. The warning light 25 is connected to the control panel 24 through an internal circuit; when working, the existing thickness detection equipment cannot continuously and quickly load and unload the chip 18 during the thickness detection of the chip 18, resulting in low detection efficiency. By placing the chip 18 in the loading barrel 17, the motor 7 is operated to drive the first rotating shaft 8 to rotate in a circle, the first rotating shaft 8 drives the first gear 10 to rotate, the first gear 10 drives the transmission chain 12 to rotate, the transmission chain 12 drives the second gear 11 to rotate, and the second gear 11 drives the second rotating shaft 9 to rotate, that is, the first rotating shaft 8 and the second rotating shaft 9 rotate synchronously in a circle, and the first rotating shaft 8 and the second rotating shaft 9 drive the first connecting rod 13 and the second connecting rod 14 to rotate synchronously in a circle The first connecting rod 13 and the second connecting rod 14 drive the moving rod 15 thereon to rotate, that is, the moving rod 15, the first connecting rod 13, the second connecting rod 14 and the transmission chain 12 are always in a parallelogram structure, and the moving rod 15 performs vertical and horizontal movements synchronously during the rotation process. When the moving rod 15 drives the pushing rod 16 to move horizontally, the leftmost pushing rod 16 pushes out the lowest chip 18 in the loading barrel 17, and the chip 18 moves horizontally on the guide groove 4. After that, the moving rod 15 drives the pushing rod 16 to move downward and then move upward and horizontally again. The moving rod 15 drives the pushing rod 16 to reciprocate in the vertical and horizontal directions until the chip 18 is pushed below the infrared generator 22 and the infrared receiver 23;

[0019] An infrared beam is sent vertically downward through the infrared generator 22. The infrared beam is reflected after encountering the chip 18. The reflected infrared beam is received by the infrared receiver 23. The infrared receiver 23 sends an electrical signal to the control panel 24. The control panel 24 obtains the time interval from the emission of the infrared beam to the reception of the infrared beam. The control panel 24 calculates the distance between the chip 18 and the infrared generator 22 according to the propagation speed of the infrared beam in the air and the time interval from the emission of the infrared beam to the reception of the infrared beam. The control panel 24 obtains the distance difference according to the distance between the guide trough 4 and the infrared generator 22 and the distance between the chip 18 and the infrared generator 22, which is the thickness value of the chip 18. The control panel 24 has a standard chip thickness value input. If the thickness value of the chip 18 is different from the standard value, it means that the chip 18 is unqualified, and the control panel 24 will control the alarm light 25 to turn on;

[0020] After the detection is completed, the moving rod 15 drives the pushing rod 16 to push the chip 18 to continue moving, and finally the chip 18 slides along the guide plate 19 into the collection box 20. This structure can continuously and quickly load and unload the chip 18, which is conducive to improving the detection efficiency.

[0021] Working principle: In the process of thickness detection of the chip 18, the existing thickness detection equipment cannot load and unload the chip 18 continuously and quickly, resulting in low detection efficiency. By placing the chip 18 in the loading barrel 17, the motor 7 is operated to drive the first rotating shaft 8 to rotate in a circle, the first rotating shaft 8 drives the first gear 10 to rotate, the first gear 10 drives the transmission chain 12 to rotate, the transmission chain 12 drives the second gear 11 to rotate, and the second gear 11 drives the second rotating shaft 9 to rotate, that is, the first rotating shaft 8 and the second rotating shaft 9 rotate synchronously in a circle, the first rotating shaft 8 and the second rotating shaft 9 drive the first connecting rod 13 and the first connecting rod 14 to rotate. The two connecting rods 14 rotate synchronously in a circle, and the first connecting rod 13 and the second connecting rod 14 drive the moving rod 15 thereon to rotate, that is, the moving rod 15, the first connecting rod 13, the second connecting rod 14 and the transmission chain 12 are always a parallelogram structure, and the moving rod 15 synchronously performs vertical and horizontal movements during the rotation process. When the moving rod 15 drives the pushing rod 16 to move horizontally, the leftmost pushing rod 16 pushes out the lowest chip 18 in the loading barrel 17, and the chip 18 moves horizontally on the guide groove 4, and then the moving rod 15 drives the pushing rod 16 to move downward and then move upward again and horizontally, and the moving rod 15 drives the pushing rod 16 to move vertically and horizontally. and horizontally until the chip 18 is pushed under the infrared generator 22 and the infrared receiver 23; the infrared generator 22 sends an infrared beam vertically downward, and the infrared beam is reflected after encountering the chip 18, and the reflected infrared beam is received by the infrared receiver 23, and the infrared receiver 23 sends an electrical signal to the control panel 24, and the control panel 24 obtains the time interval from the emission of the infrared beam to the reception of the infrared beam. The control panel 24 calculates the distance between the chip 18 and the infrared generator 22 according to the propagation speed of the infrared beam in the air and the time interval from the emission of the infrared beam to the reception of the infrared beam. The distance difference between the distance between the guide slot 4 and the infrared generator 22 and the distance between the chip 18 and the infrared generator 22 is obtained, which is the thickness value of the chip 18. The control panel 24 has a standard chip thickness value inputted therein. If the thickness value of the chip 18 is different from the standard value, it means that the chip 18 is unqualified, and the control panel 24 will control the alarm light 25 to turn on. After the detection is completed, the moving rod 15 drives the pushing rod 16 to push the chip 18 to continue moving, and finally the chip 18 slides along the guide plate 19 into the collection box 20. This structure can continuously and quickly load and unload the chip 18, which is conducive to improving the detection efficiency.

[0022] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A chip thickness detection device, characterized in that: The invention comprises a base (1), a tripod (2) is mounted on the base (1), a material guide platform (3) is mounted on the tripod (2), a material guide groove (4) is provided on the top side of the material guide platform (3), a groove (5) is provided in the middle of the material guide platform (3), a fixing plate (6) is mounted on the bottom wall of the material guide platform (3), a motor (7) is mounted on the fixing plate (6) through a machine base, a first rotating shaft (8) and a second rotating shaft (9) are rotatably mounted on the fixing plate (6), and an output shaft of the motor (7) is connected to the first rotating shaft (8). The first rotating shaft (8) and the second rotating shaft (9) are respectively fixedly provided with a first gear (10) and a second gear (11), the first gear (10) and the second gear (11) are respectively provided with a transmission chain (12), the first rotating shaft (8) and the second rotating shaft (9) are respectively fixedly provided with a first connecting rod (13) and a second connecting rod (14), the other ends of the first connecting rod (13) and the second connecting rod (14) are rotatably connected with a moving rod (15), and the moving rod (15) is provided with a plurality of groups of pushing rods (16).

2. A chip thickness detection device according to claim 1, characterized in that: A loading cylinder (17) is installed on the material guide platform (3), and the loading cylinder (17) is located above the material guide groove (4). Multiple groups of chips (18) are placed inside the loading cylinder (17).

3. A chip thickness detection device according to claim 1, characterized in that: A material guide plate (19) is welded on the side wall of the material guide platform (3), a collection box (20) is placed below the material guide plate (19), and the collection box (20) is located on the base (1).

4. The chip thickness detection device according to claim 1, characterized in that: A support frame (21) is installed on the material guiding platform (3), and an infrared generator (22) and an infrared receiver (23) are installed on the support frame (21).

5. The chip thickness detection device according to claim 1, characterized in that: A control panel (24) is installed on the material guiding platform (3), and the control panel (24) is connected to the infrared generator (22) and the infrared receiver (23) through an internal circuit.

6. The chip thickness detection device according to claim 4, characterized in that: An alarm light (25) is installed on the support frame (21), and the alarm light (25) is connected to the control panel (24) through an internal circuit.

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