Chuck structure for wafer polishing

Abstract

The utility model provides a chuck structure for wafer polishing, which comprises a silica gel film, a limiting mechanism, a rotary cleaning mechanism and a chuck body, a soft magnetic ring is fixedly connected below the silica gel film, a groove is arranged on the annular side surface of the chuck body, magnetic rings are symmetrically sleeved on the annular side surface of the chuck body, a chassis is mounted on the lower side of the chuck body, and a mounting ring is fixedly connected on the upper side of the chassis. A plurality of round holes are formed in the annular side face of the installation ring in a penetrating mode, a sliding groove is formed in the upper portion of the square block, the sliding block is slidably installed in the sliding groove, the annular side face of the limiting column is sleeved with a round piece, and a spring is installed on the left side of the round piece. Compared with the prior art, the polishing device solves the problems that a worker needs to additionally use a tool for cleaning, and the convenience is not high, is reasonable in structure and good in practicability, enhances the stability of a silica gel film through the arrangement of a limiting mechanism, enables the silica gel film to be not prone to falling off, facilitates cleaning of polishing chippings, and has high portability.

Description

Technical Field

[0001] The utility model discloses a chuck structure for wafer polishing, belonging to the technical field of wafer processing equipment. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. The original material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the surface of the earth's crust.

[0003] Chinese patent number: CN217942962U, mentions a wafer polishing chuck structure, which is provided with a disk body with a silicone film, and uses the deformation of the silicone film to produce an adsorption effect during the adsorption and fixing operation, so as to avoid the polishing liquid and its polishing debris from inevitably remaining on the wafer adsorption chuck and crystallizing to contaminate the chuck, thereby avoiding imprint defects and improving wafer quality. However, this device has a general fastening effect on the silicone film, and when the polishing debris falls on the silicone film, the staff needs to use additional tools to clean it, which is not very convenient. Now there is an urgent need for a wafer polishing chuck structure to solve the above-mentioned problems. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a chuck structure for wafer polishing to solve the problems raised in the above-mentioned background technology. The utility model has a reasonable structure and good practicality. By setting a limiting mechanism, the stability of the silicone film is enhanced, making it less likely to fall off, and it is convenient to clean the polishing debris, and has high portability.

[0005] In order to achieve the above-mentioned purpose, the utility model is realized through the following technical scheme: a chuck structure for wafer polishing, including a silicone film, a limiting mechanism, a rotating cleaning mechanism and a disk body, a soft magnetic ring is fixedly connected to the lower side of the silicone film, a plurality of first limiting holes are penetrated through the annular side surface of the soft magnetic ring, a groove is provided on the annular side surface of the disk body, a magnetic ring is symmetrically sleeved on the annular side surface of the disk body, a chassis is installed on the lower side of the disk body, a mounting ring is fixedly connected to the upper side of the chassis, a plurality of circular holes are penetrated through the annular side surface of the mounting ring, the limiting mechanism includes a square block, a limiting column and a slider, a slide groove is provided on the upper side of the square block, the slider is slidably installed in the slide groove, the limiting column is telescopically installed on the right end of the square block, a disc is sleeved on the annular side surface of the limiting column, a spring is installed on the left side of the disc, and the rotating cleaning mechanism includes an arc block, a roller bearing and an air pump.

[0006] Furthermore, an L-shaped plate is installed above the slider, the lower end of the L-shaped plate is fixedly connected to the disc, a handle is installed above the L-shaped plate, a mounting plate is installed at the left end of the square block, and there are multiple limiting mechanisms, and the multiple limiting mechanisms are respectively installed on the annular side of the mounting ring, and the multiple limiting columns pass through the circular holes respectively.

[0007] Furthermore, a mounting groove is provided above the arc surface block, the roller bearing is installed inside the mounting groove, an adjusting shaft is installed on the inner ring of the roller bearing, a through pipe is installed at the output end of the air pump, a metal hose is installed above the through pipe, and the rotating cleaning mechanism is installed on the annular side of the mounting ring through the arc surface block.

[0008] Furthermore, the magnetism of the two magnetic rings is opposite to that of the soft magnetic ring.

[0009] Furthermore, the chassis and the disc body are connected by bolts.

[0010] Furthermore, a ventilation pipe is embedded through the middle of the disk body.

[0011] The beneficial effects of the utility model: the utility model is a chuck structure for wafer polishing. Because the utility model adds roller bearings, air pumps, metal hoses, springs, square blocks, magnetic rings and soft magnetic circles, our design improvements and actual use have shown that the device has a reasonable structure and good practicality. By setting a limiting mechanism, the stability of the silicone film is enhanced, making it less likely to fall off, and it is convenient to clean up polishing debris, and has high portability. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0013] Figure 1 It is a three-dimensional schematic diagram of the overall structure of a wafer polishing chuck structure of the utility model;

[0014] Figure 2 It is a three-dimensional schematic diagram of a silicone film installation structure of a wafer polishing chuck structure of the utility model;

[0015] Figure 3 This is a three-dimensional schematic diagram of the first angle structure of a chuck structure for wafer polishing of the utility model;

[0016] Figure 4 It is a schematic diagram of the second angle structure of the chuck body of the utility model for wafer polishing;

[0017] Figure 5 It is a three-dimensional schematic diagram of the limiting mechanism structure of a chuck structure for wafer polishing of the utility model;

[0018] Figure 6 It is a three-dimensional schematic diagram of a mounting ring structure of a wafer polishing chuck structure of the utility model;

[0019] Figure 7 It is a three-dimensional schematic diagram of the structure of a rotating cleaning mechanism of a wafer polishing chuck structure of the utility model;

[0020] In the figure: 1-silicone film, 2-mounting ring, 3-limiting mechanism, 4-rotating cleaning mechanism, 5-soft magnetic circle, 6-first limiting hole, 7-chassis, 8-disc, 9-ventilation pipe, 10-groove, 11-magnetic ring, 12-circular hole, 30-square block, 31-mounting plate, 32-slide groove, 33-slider, 34-handle, 35-limiting column, 36-L-type plate, 37-spring, 38-disc, 40-arc block, 41-mounting groove, 42-roller bearing, 43-air pump, 44-adjusting shaft, 45-through pipe, 46-metal hose. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] See also Figure 1-Figure 7 The utility model provides a technical solution: a chuck structure for wafer polishing, including a silicone film 1, a limiting mechanism 3, a rotating cleaning mechanism 4 and a disk body 8, a soft magnetic ring 5 is fixedly connected below the silicone film 1, a plurality of first limiting holes 6 are opened through the annular side of the soft magnetic ring 5, a groove 10 is opened on the annular side of the disk body 8, a magnetic ring 11 is symmetrically sleeved on the annular side of the disk body 8, a bottom plate 7 is installed on the side below the disk body 8, a mounting ring 2 is fixedly connected to the upper side of the bottom plate 7, a plurality of circular holes 12 are opened through the annular side of the mounting ring 2, and the limiting mechanism 3 includes a square block 3 0, a limit column 35 and a slider 33, a slide groove 32 is provided above the square block 30, the slider 33 is slidably installed in the slide groove 32, the limit column 35 is telescopically installed at the right end of the square block 30, a disc 38 is sleeved on the annular side of the limit column 35, and a spring 37 is installed on the left side of the disc 38. The rotating cleaning mechanism 4 includes an arc block 40, a roller bearing 42 and an air pump 43. This design solves the problem that the original device has a general fastening effect on the silicone film, and when polishing debris falls on the silicone film, the staff needs to use additional tools to clean it, which is not very convenient.

[0023] As the first embodiment of the utility model: an L-shaped plate 36 is installed above the slider 33, the lower end of the L-shaped plate 36 is fixedly connected to the disc 38, a handle 34 is installed above the L-shaped plate 36, a mounting plate 31 is installed at the left end of the square block 30, and a plurality of limiting mechanisms 3 are provided, and the plurality of limiting mechanisms 3 are respectively installed on the annular side surface of the mounting ring 2, and a plurality of limiting columns 35 respectively pass through the circular holes 12. By respectively installing the plurality of limiting mechanisms 3 on the annular side surface of the mounting ring 2, it is convenient to limit the soft magnetic ring 5.

[0024] A mounting groove 41 is provided above the arc surface block 40, a roller bearing 42 is installed inside the mounting groove 41, an adjusting shaft 44 is installed on the inner ring of the roller bearing 42, a through pipe 45 is installed at the output end of the air pump 43, a metal hose 46 is connected and installed above the through pipe 45, and the rotating cleaning mechanism 4 is installed on the annular side of the mounting ring 2 through the arc surface block 40. By setting the adjusting shaft 44, it is convenient to adjust the angle of the air pump 43, and then adjust the position of the metal hose 46. The magnetism of the two magnetic rings 11 is opposite to that of the soft magnetic ring 5. By setting the magnetism of the two magnetic rings 11 to be opposite to that of the soft magnetic ring 5, it is convenient to make the two magnetic rings 11 and the soft magnetic ring 5 magnetically attract each other. The connection mode of the chassis 7 and the disk body 8 is bolt connection. By setting the connection mode of the chassis 7 and the disk body 8 to be bolt connection, it is convenient to disassemble and assemble the chassis 7 and the disk body 8. A ventilation pipe 9 is embedded in the middle of the disk body 8. By embedding the ventilation pipe 9 in the middle of the disk body 8, it is convenient to install external exhaust equipment.

[0025] As the second embodiment of the utility model: when in use, the device is installed on the external polishing equipment through multiple mounting plates 31 and external bolts, and then the external exhaust equipment is matched with the ventilation pipe 9, and then the silicone film 1 is covered on the top of the disk body 8, the soft magnetic ring 5 is adsorbed with the two magnetic rings 11, and then the handle 34 is pulled to drive the slider 33 to slide in the slide groove 32, so that the limit column 35 moves, the spring 37 contracts, and then the first limit hole 6 on the annular side of the soft magnetic ring 5 is aligned with the limit column 35. Then release the handle 34 to reset the limit column 35 and pass through the first limit hole 6 into the groove 10. The remaining limit mechanisms 3 can be operated in sequence according to the above steps to stabilize the soft magnetic ring 5 and thus improve the stability of the silicone film 1. Then place the wafer on top of the silicone film 1 and turn on the external exhaust device to adsorb the silicone film 1, thereby generating a negative pressure between the wafer and the wafer, thereby adsorbing the wafer. After polishing is completed, rotate the adjustment shaft 44 to adjust the angle of the through pipe 15 and then start the air pump 43 to clean the polishing debris on the surface of the silicone film 1. The metal hose 46 can adjust the cleaning direction for a second time and the polishing debris will fall onto the top of the chassis 7.

[0026] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0027] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer polishing chuck structure, comprising a silicone film (1), a limiting mechanism (3), a rotating cleaning mechanism (4) and a chuck body (8), characterized in that: A soft magnetic ring (5) is fixedly connected below the silicone membrane (1), a plurality of first limiting holes (6) are formed through the annular side surface of the soft magnetic ring (5), a groove (10) is formed through the annular side surface of the disk body (8), a magnetic ring (11) is symmetrically sleeved on the annular side surface of the disk body (8), a chassis (7) is installed on the lower side of the disk body (8), a mounting ring (2) is fixedly connected to the upper side surface of the chassis (7), and a plurality of circular holes (12) are formed through the annular side surface of the mounting ring (2); The limiting mechanism (3) comprises a square block (30), a limiting column (35) and a sliding block (33); a sliding groove (32) is provided on the top of the square block (30); the sliding block (33) is slidably installed in the sliding groove (32); the limiting column (35) is telescopically installed on the right end of the square block (30); a disc (38) is sleeved on the annular side surface of the limiting column (35); a spring (37) is installed on the left side of the disc (38); and the rotating cleaning mechanism (4) comprises an arc block (40), a roller bearing (42) and an air pump (43).

2. A wafer polishing chuck structure according to claim 1, characterized in that: An L-shaped plate (36) is installed above the slider (33), the lower end of the L-shaped plate (36) is fixedly connected to the round plate (38), a handle (34) is installed above the L-shaped plate (36), a mounting plate (31) is installed at the left end of the square block (30), a plurality of limiting mechanisms (3) are provided, the plurality of limiting mechanisms (3) are respectively installed on the annular side surface of the mounting ring (2), and a plurality of limiting columns (35) respectively pass through the circular holes (12).

3. The wafer polishing chuck structure according to claim 1, characterized in that: A mounting groove (41) is provided above the arc surface block (40), the roller bearing (42) is mounted inside the mounting groove (41), an adjusting shaft (44) is mounted on the inner ring of the roller bearing (42), a through pipe (45) is mounted at the output end of the air pump (43), a metal hose (46) is installed above the through pipe (45), and the rotating cleaning mechanism (4) is mounted on the annular side surface of the mounting ring (2) through the arc surface block (40).

4. The wafer polishing chuck structure according to claim 1, characterized in that: The magnetism of the two magnetic rings (11) is opposite to that of the soft magnetic ring (5).

5. The wafer polishing chuck structure according to claim 1, characterized in that: The chassis (7) and the chassis body (8) are connected by bolts.

6. The wafer polishing chuck structure according to claim 1, characterized in that: A ventilation pipe (9) is embedded and penetrated through the middle of the disk body (8).

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