Large-size ceramic matrix composite carrier plate

Abstract

A large-size ceramic matrix composite carrier plate is characterized in that a groove is formed in the front face of the carrier plate, and the depth of the groove ranges from 5mm to 25mm; reinforcing ribs are arranged on the back face of the carrier plate, the reinforcing ribs are staggered in the warp direction and the weft direction, the distance between every two adjacent reinforcing ribs ranges from 200 mm to 600 mm, the distance between every two adjacent reinforcing ribs in the weft direction ranges from 200 mm to 600 mm, the thickness of each reinforcing rib ranges from 2 mm to 15 mm, and the width of each reinforcing rib ranges from 20 mm to 50 mm. The carrier plate fiber structure is composed of a front face structure, a bottom face structure and a puncture structure. The front surface structure is a complete fiber cloth layer, the bottom surface structure is a fiber cloth layer and is folded to form a reinforcing rib fiber cloth structure, and the puncture structure is a structure for connecting the upper and lower fiber cloth layers of the carrier plate.

Description

Technical Field

[0001] The utility model relates to the technical field of composite materials, in particular to a large-size ceramic-based composite material carrier plate. Background Art

[0002] The carrier is one of the main consumable parts of silicon wafer coating equipment. Its working principle is to place the silicon wafer to be coated flatly on the carrier station, transport it to the plasma chamber in the PECVD coating equipment via a conveyor belt, and then perform PECVD coating under certain process conditions. With the rapid development of the solar photovoltaic industry, the market demand for the output and production capacity of silicon wafer coating is constantly increasing. As an auxiliary part, the carrier has become a consumable item due to the harsh environment of the plasma chamber coating process and the limited tolerance of graphite materials and carbon-carbon materials.

[0003] Ceramic-based composites have excellent high-temperature resistance and can remain stable in extremely high-temperature environments. When applied to coating technology, this material can maintain its physical and chemical properties under high-temperature conditions and is not prone to decomposition or deformation. This feature makes ceramic-based composites perform well in coating processes that require high-temperature treatment.

[0004] In order to improve the coating efficiency, it is necessary to develop a large-sized ceramic-based composite substrate. However, as the size increases, the wall thickness of the substrate will increase accordingly in order to maintain the original strength, and its thermal conductivity will be greatly reduced as the wall thickness increases. This application proposes a large-sized ceramic-based composite substrate, which increases the size of the substrate without increasing the thickness of the substrate, thereby solving the problem of thermal conductivity. Summary of the invention

[0005] The utility model describes a large-size ceramic-based composite material carrier plate, characterized in that: the carrier plate has a thickness of 20mm-40mm;

[0006] Furthermore, the front side of the carrier plate has n grooves, n is a positive integer, and the groove depth is 5mm-10mm;

[0007] Furthermore, the bottom of the groove is a flat structure.

[0008] Furthermore, the groove is a rectangular parallelepiped.

[0009] Preferably, the back of the carrier plate has reinforcing ribs, the direction of the reinforcing ribs perpendicular to the carrier plate is the width, and the direction of the reinforcing ribs parallel to the carrier plate is the length or thickness;

[0010] Furthermore, the reinforcing ribs are staggered in warp and weft directions;

[0011] Furthermore, the distance between adjacent reinforcing ribs in the warp direction is 200 mm to 600 mm;

[0012] Furthermore, the distance between the latitudinal reinforcing ribs is 200mm-600mm;

[0013] Furthermore, the thickness of the reinforcing rib is 2mm-15mm;

[0014] Furthermore, the height of the reinforcing rib is 20mm-50mm.

[0015] Preferably, the carrier plate is a ceramic-based composite material;

[0016] Furthermore, the carrier fiber structure is as follows Figure 3 As shown, Figure 3 for Figure 2 The planed surface structure diagram of the carrier board placed in this way, area A is the front structure, area B is the back structure, and area C is the puncture structure;

[0017] Furthermore, the fiber structure of the carrier plate is composed of a front structure, a bottom structure, and a puncture structure; the front structure is 40-150 layers of complete fiber cloth plies; the bottom structure is 20-60 layers of fiber cloth plies, folded into a 20mm-50mm reinforcing rib fiber cloth structure; the bottom structure reinforcing rib fiber cloth and the bottom structure bottom fiber cloth are continuous fibers; the puncture structure is a structure connecting the upper and lower fiber cloth plies of the carrier plate.

[0018] Further, the B area is the arrangement of the carrier bottom surface and the reinforcing rib fiber cloth, the reinforcing rib fiber cloth and the bottom surface fiber cloth are continuous fibers, and the reinforcing rib fiber cloth is formed by folding the bottom surface fibers;

[0019] Further, the fibers in region A are continuous fiber cloth;

[0020] Furthermore, C fibers are fibers that penetrate the upper and lower fiber cloth layers.

[0021] Preferably, the fiber cloth used for the carrier plate is carbon fiber cloth, and the C fiber is a thermal conductive fiber.

[0022] The carrier of this structure takes advantage of the low expansion and high stability of ceramic matrix composite materials. It can be reused in an environment of 1500-2000 degrees, greatly improving the life of the carrier and reducing production costs. The carrier is reinforced with ribs in the vertical direction to ensure the flatness of large-sized carriers. The rib fibers in the vertical direction of the carrier are continuous structures with the bottom fibers, which are integrated and have higher strength. The horizontal direction of the carrier is a complete flat fiber cloth with high stability in the horizontal direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a front structural diagram of a large-sized ceramic matrix composite substrate;

[0024] Figure 2This is a back structure diagram of a large-sized ceramic matrix composite substrate;

[0025] Figure 3 This is a plan view of a large-sized ceramic matrix composite substrate;

[0026] Figure 4 It is a large-sized ceramic-based composite material carrier bottom surface structure;

[0027] Figure 5 This is an expanded view of the structural fiber cloth on the bottom surface of a large-sized ceramic-based composite carrier. DETAILED DESCRIPTION

[0028] A large-sized ceramic-based composite material carrier plate has a size of 1600mm*1600mm and a thickness of 25mm.

[0029] Preform preparation process: Cut 1600mm*1600mmT300-3K carbon fiber cloth, stack it to 76 layers, the stacking thickness is 22mm, and prepare the front preform.

[0030] like Figure 5 10 pieces of T300-3K fiber cloth are cut into the shape of the first piece. The middle rectangle of the first piece is 397.3mm*397.3mm, and the length and width of the 8 small strips are both 397.3mm*27.3mm; the size of the second piece is 0.3mm larger than the first piece, that is, the middle rectangle is 397.6mm*397.6mm, and the length and width of the 8 small strips are 397.6*27.6; the size of the third piece is 0.3 larger than the second piece, and so on to prepare 10 pieces. The first batch to the tenth piece are stacked, and the tenth piece is used as the base for folding. Figure 4 The pattern of the small box; prepare 16 small boxes of this pattern, and plane-join 4*4 small boxes of this pattern to prepare a bottom preform.

[0031] The bottom preform is overlapped with the front preform, and the whole is needle-punched with heat-conducting fibers to combine the front and bottom surfaces.

[0032] The whole preform is impregnated and cracked multiple times to obtain a blank, which is then machined. 240 grooves with a depth of 18mm, a length of 100mm, and a width of 5mm are machined on the front side, and the sides and bottom of the grooves are polished smooth and flat for placing silicon wafers for coating.

[0033] The thickness of the reinforcing ribs on the back is 6mm and the width is 30mm.

Claims

1. A large-sized ceramic matrix composite material carrier, characterized in that: The thickness of the carrier plate is 20mm-40mm; there are n grooves on the front of the carrier plate, n is a positive integer, and the depth of the groove is 5mm-10mm; the groove is a rectangular parallelepiped; there are reinforcing ribs on the back of the carrier plate, the width is the direction of the reinforcing ribs perpendicular to the carrier plate, and the length or thickness is the direction of the reinforcing ribs parallel to the carrier plate; the reinforcing ribs are staggered in the warp and weft directions; the distance between adjacent reinforcing ribs in the warp direction is 200mm-600mm; the distance between the reinforcing ribs in the weft direction is 200mm-600mm; the thickness of the reinforcing ribs is 2mm-15mm; the width of the reinforcing ribs is 20mm-50mm; the fiber structure of the carrier plate consists of a front structure, a bottom structure, and a puncture structure; the front structure is a complete fiber cloth ply of 40-150 layers; the bottom structure is a fiber cloth ply of 20-60 layers, folded into a reinforcing rib fiber cloth structure of 20mm-50mm; The reinforcing fiber cloth of the bottom structure and the bottom fiber cloth of the bottom structure are continuous fibers; the puncture structure is a structure connecting the upper and lower fiber cloth layers of the carrier plate.

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