Pressure reduction valve for semiconductor device
By adopting a multi-cavity and adjustment components in the pressure reduction valve, and using the limit structure of the stop and rubber head, the problem of insufficient adjustment of pressure in the prior art is solved, and more precise and convenient pressure adjustment is achieved .
Patent Information
- Application Number
- CN202421228892.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing pressure-down valves are difficult to fine-tune when adjusting pressure, and the adjustment is not accurate and inconvenient.
A pressure-reducing valve for semiconductor equipment is designed, and a adjusting member and an adjusting assembly including a first inner cavity and a second inner cavity are used to drive the first adjusting member to move, combining the limit of the stopper and the rubber head. The position structure enables accurate adjustment of pressure.
More precise pressure adjustment is achieved, and the adjustment process is simpler and more convenient, and the total pressure can be further reduced by fine-tuning the second cavity volume after the pressure is reduced to a minimum.
Smart Images
Figure CN222315967U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of valves, in particular to a pressure reducing valve used for semiconductor equipment. Background Art
[0002] As an automatic pressure regulating device, the pressure reducing valve can adjust the pressure in the pipeline and maintain the stability of the fluid pressure within a certain range. In the related technology, the existing pressure reducing valve usually reduces the pressure at a constant pressure during the pressure adjustment process. When fine-tuning the pressure is required, it is difficult to adjust more accurately and the adjustment is inconvenient. Utility Model Content
[0003] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one object of the utility model is to provide a pressure reducing valve for semiconductor equipment, comprising:
[0004] a valve body, the valve body having a first inner cavity;
[0005] a first adjusting member, the first adjusting member being movably disposed in the first inner cavity to adjust the inner cavity pressure of the first inner cavity, and the first adjusting member comprising a second inner cavity, the second inner cavity and the first inner cavity being connectable or closed to each other, and the volume of the first inner cavity being greater than the volume of the second inner cavity;
[0006] The regulating component is arranged in the valve body and connected to the second inner cavity to regulate the second inner cavity and the first inner cavity to be connected to each other or closed to each other.
[0007] Preferably, the valve body comprises a bottom shell and an upper shell, one end of the regulating assembly is arranged in the bottom shell, and the other end is arranged in the upper shell.
[0008] Preferably, the inner peripheral wall of the bottom shell has a stopper, and the stopper is located at the top of the first inner cavity, and is used to limit the moving position of the first adjusting member.
[0009] Preferably, the bottom of the first adjusting member has a through hole, and the through hole connects the first inner cavity and the second inner cavity to each other.
[0010] Preferably, the adjustment component comprises:
[0011] A driving member, wherein the driving member is disposed in the upper shell;
[0012] A second adjusting member, wherein one end of the second adjusting member is connected to the driving member, and the other end of the second adjusting member extends to be slidably connected to the second inner cavity.
[0013] Preferably, the second adjusting member comprises:
[0014] A connecting rod, one end of which is connected to the driving member;
[0015] A rubber head is arranged at the other end of the connecting rod, and the rubber head is interference fit with the second inner cavity.
[0016] Preferably, an operating member is provided on the top of the upper shell, and the operating member is connected to the second adjusting member and is used to drive the second adjusting member to move axially.
[0017] Preferably, a sealing ring is provided between the bottom shell and the upper shell, and the sealing ring is used to seal the gap between the bottom shell and the upper shell.
[0018] Preferably, an input channel is provided at the bottom of the bottom shell, and an output channel is provided at the side of the bottom shell, and the input channel and the output channel are connected to the first inner cavity together.
[0019] The above solution of the utility model includes at least the following beneficial effects:
[0020] The pressure reducing valve for semiconductor equipment provided by the utility model can drive the first adjusting member to move through the adjusting component when adjusting the pressure, so that the pressure of the first inner cavity can be reduced after the first adjusting member is adjusted. After the pressure of the first inner cavity is reduced to the minimum, the first adjusting member can be limited and the second inner cavity can be fine-tuned through the adjusting component, so that the pressure of the first inner cavity and the second inner cavity after being connected can be reduced together, so that the pressure reduction can be adjusted more accurately and the adjustment is simpler and more convenient.
[0021] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0023] Figure 1 It is a schematic structural diagram of a pressure reducing valve for semiconductor equipment provided in an embodiment of the utility model;
[0024] Figure 2 is a cross-sectional view of a pressure reducing valve for semiconductor equipment provided in an embodiment of the utility model;
[0025] Description of Figure Numbers:
[0026] 10. Valve body; 11. Bottom shell; 111. First inner cavity; 112. Stopper; 113. Input channel; 114. Output channel; 12. Upper shell; 13. Sealing ring; 20. First adjusting member; 201. Second inner cavity; 201. Through hole; 30. Adjusting assembly; 31. Driving member; 32. Second adjusting member; 321. Connecting rod; 322. Rubber head; 41. Operating member.
[0027] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0028] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.
[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0031] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0033] The pressure reducing valve for semiconductor equipment according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
[0034] Reference Figure 1 and Figure 2 As shown, the pressure reducing valve for semiconductor equipment provided in the embodiment of the utility model includes a valve body 10, a first adjusting member 20 and an adjusting assembly 30, the valve body 10 has a first inner cavity 111; the first adjusting member 20 is movably arranged in the first inner cavity 111 to adjust the inner cavity pressure of the first inner cavity 111, and the first adjusting member 20 includes a second inner cavity 201, the second inner cavity 201 and the first inner cavity 111 can be interconnected or closed to each other, and the volume of the first inner cavity 111 is greater than the volume of the second inner cavity 201; the adjusting assembly 30 is arranged in the valve body 10 and connected to the second inner cavity 201 to adjust the second inner cavity 201 and the first inner cavity 111 to be interconnected or closed to each other.
[0035] The pressure reducing valve for semiconductor equipment provided by the utility model can drive the first adjusting member 20 to move through the adjusting component 30 when adjusting the pressure, so that the pressure of the first inner cavity 111 can be reduced after the first adjusting member 20 is adjusted. After the pressure of the first inner cavity 111 is reduced to the minimum, the first adjusting member 20 can be limited and then the second inner cavity 201 can be fine-tuned through the adjusting component 30, so that the pressure of the first inner cavity 111 and the second inner cavity 201 after being connected can be reduced together, so that the adjustment can be more precise and the adjustment is simpler and more convenient.
[0036] Specifically, the valve body 10 includes a bottom shell 11 and an upper shell 12, one end of the adjusting assembly 30 is arranged in the bottom shell 11, and the other end is arranged in the upper shell 12; further, the inner peripheral wall of the bottom shell 11 has a stop portion 112, and the stop portion 112 is located at the top of the first inner cavity 111, which is used to limit the moving position of the first adjusting member 20.
[0037] In this embodiment, when the first adjusting member 20 is adjusted by the adjusting assembly 30 to abut against the stop portion 112, the inner cavity pressure of the first inner cavity 111 is minimum, so that the first adjusting member 20 can be limited and blocked, thereby continuing to move the adjusting assembly 30 upward, so that the second inner cavity 201 and the first inner cavity 111 are connected to each other, and the pressure of the first inner cavity 111 and the second inner cavity 201 can be gradually reduced. Since the volume of the second inner cavity 201 is smaller than that of the first inner cavity 111, when the second inner cavity 201 is adjusted, the pressure reduction process can be made smaller and the adjustment is more accurate.
[0038] Furthermore, the first adjusting member 20 has a through hole 201 at the bottom, and the through hole 201 connects the first inner cavity 111 and the second inner cavity 201. When the through hole 201 is closed, the first inner cavity 111 and the second inner cavity 201 are isolated from each other, so that when the first adjusting member 20 and the adjusting assembly 30 move together, the pressure of the first inner cavity 111 can be adjusted to decrease.
[0039] Specifically, the adjustment component 30 includes a driving member 31 and a second adjusting member 32, the driving member 31 is arranged in the upper shell 12; one end of the second adjusting member 32 is connected to the driving member 31, and the other end extends to be slidably connected to the second inner cavity 201; further, the second adjusting member 32 includes a connecting rod 321 and a rubber head 322, one end of the connecting rod 321 is connected to the driving member 31; the rubber head 322 is arranged at the other end of the connecting rod 321, and the rubber head 322 is interference fit with the second inner cavity 201.
[0040] In this embodiment, the interference fit between the rubber head 322 and the second inner cavity 201 can make the second adjusting member 32 move upward, drive the first adjusting member 20 to move together, and when the first adjusting member 20 is stopped and limited by the stopper 112, the first adjusting member 20 stops moving, and the second adjusting member 32 continues to move upward in the second inner cavity 201, thereby connecting the second inner cavity 201 with the first inner cavity 111, so as to jointly adjust the inner cavity pressure of the first inner cavity 111 and the second inner cavity 201; optionally, the second inner cavity 201 can be set A limiting wall engaged with the rubber head 322 is arranged, so that when the rubber head 322 drops to the lowest position, it can be locked with the second inner cavity 201 and close the through hole 201. When the first adjusting member 20 moves to abut against the stopper 112, the rubber head 322 can be deformed to break away from the limiting wall, and then move upward in the second inner cavity 201 to reduce the pressure in the first inner cavity 111 and the second inner cavity 201, making the adjustment simpler and more convenient. Among them, the driving member 31 can be a linear transmission mechanism such as a cylinder to drive the second adjusting member 32 to move.
[0041] As an optional embodiment, an operating member 41 is provided on the top of the upper shell 12, and the operating member 41 is connected to the second adjusting member 32 and is used to drive the second adjusting member 32 to move axially. The operating member 41 can be threadedly rotatably provided on the top of the upper shell 12, so that during the process of adjusting the pressure reduction, the operating member 41 can be manually rotated to make the second adjusting member 32 move axially.
[0042] Specifically, a sealing ring 13 is provided between the bottom shell 11 and the upper shell 12, and the sealing ring 13 is used to seal the gap between the bottom shell 11 and the upper shell 12. The sealing ring 13 can prevent foreign impurities from entering and affecting the internal operation of the valve body 10, thereby improving the overall safety and reliability.
[0043] Furthermore, an input channel 113 is provided at the bottom of the bottom shell 11, and an output channel 114 is provided at the side of the bottom shell 11, and the input channel 113 and the output channel 114 are connected to the first inner cavity 111. The input channel 113 can input a medium such as gas or liquid, and after the volume of the first inner cavity 111 and the second inner cavity 201 is adjusted to increase, the pressure of the gas or liquid output by the output channel 114 decreases accordingly, making the application scenarios more diverse.
[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0045] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.
Claims
1. A pressure reducing valve for semiconductor equipment, characterized in that: include: a valve body, the valve body having a first inner cavity; a first adjusting member, the first adjusting member being movably disposed in the first inner cavity to adjust the inner cavity pressure of the first inner cavity, and the first adjusting member comprising a second inner cavity, the second inner cavity and the first inner cavity being connectable or closed to each other, and the volume of the first inner cavity being greater than the volume of the second inner cavity; The regulating component is arranged in the valve body and connected to the second inner cavity to regulate whether the second inner cavity and the first inner cavity are connected to each other or closed to each other.
2. The pressure reducing valve for semiconductor equipment according to claim 1, characterized in that: The valve body comprises a bottom shell and an upper shell, one end of the regulating assembly is arranged in the bottom shell, and the other end is arranged in the upper shell.
3. The pressure reducing valve for semiconductor equipment according to claim 2, characterized in that: The inner peripheral wall of the bottom shell has a stopper, and the stopper is located at the top of the first inner cavity and is used to limit the moving position of the first adjusting member.
4. The pressure reducing valve for semiconductor equipment according to claim 2, characterized in that: The bottom of the first adjusting member has a through hole, and the through hole connects the first inner cavity and the second inner cavity to each other.
5. The pressure reducing valve for semiconductor equipment according to claim 2, characterized in that: The adjustment component comprises: A driving member, wherein the driving member is disposed in the upper shell; A second adjusting member, wherein one end of the second adjusting member is connected to the driving member, and the other end of the second adjusting member extends to be slidably connected to the second inner cavity.
6. The pressure reducing valve for semiconductor equipment according to claim 5, characterized in that: The second adjusting member comprises: A connecting rod, one end of which is connected to the driving member; A rubber head is arranged at the other end of the connecting rod, and the rubber head is interference fit with the second inner cavity.
7. The pressure reducing valve for semiconductor equipment according to claim 5, characterized in that: An operating member is provided on the top of the upper shell, and the operating member is connected to the second adjusting member and is used to drive the second adjusting member to move axially.
8. The pressure reducing valve for semiconductor equipment according to claim 2, characterized in that: A sealing ring is provided between the bottom shell and the upper shell, and the sealing ring is used to seal the gap between the bottom shell and the upper shell.
9. The pressure reducing valve for semiconductor equipment according to claim 2, characterized in that: An input channel is provided at the bottom of the bottom shell, and an output channel is provided at the side of the bottom shell. The input channel and the output channel are communicated with the first inner cavity.