Chip detection equipment
By using high reflectivity materials and optimized housing structure in LED chip detection equipment, combined with light shielding and rotary driving devices, the problem of light leakage interference in traditional equipment is solved, and higher precision LED chip detection is achieved.
Patent Information
- Application Number
- CN202421003506.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-09
AI Technical Summary
Traditional LED chip detection equipment has insufficient design in suppressing light leakage, resulting in the accuracy of measurement data being affected by external light and invisible light from sensors, which cannot meet the current high-precision and high-stability measurement needs.
The inner wall of the integral ball is made of materials with higher reflectivity, optimize the shell structure, such as adding a light hood and adjusting the sensor position, effectively blocking the light emitted by the photoelectric sensor through the first and second light shading parts, moving light shading parts and other structures, combining rotation and Drive device to ensure that the chip is detected in a natural light environment.
It significantly reduces the interference of light on measurement, improves detection accuracy and accuracy, and ensures the reliability of the performance evaluation results of LED chips.
Smart Images
Figure CN222318402U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip manufacturing, in particular to a chip detection device. Background Art
[0002] With the rapid development of semiconductor technology, the application of LED chips is becoming more and more extensive, from home lighting to display screens to car headlights. Its high efficiency, energy saving and long life are very popular in the market. However, as customers' requirements for LED performance increase, higher requirements are also placed on the accuracy of LED chip measurement data. In the performance evaluation of LED chips, the measurement of luminous flux is crucial because it is directly related to the luminous efficiency and lighting effect of LED chips.
[0003] In traditional LED chip test systems, integrating spheres are commonly used as measurement tools to determine the luminous flux of LEDs by capturing and measuring the light emitted by them. However, in practical applications, the influence of external light and invisible light from the sensor often interferes with the accuracy of the measured data. This interference may come from stray light in the test environment or from the optical properties of the sensor itself. These factors may cause the measurement results to deviate from the true value, thus affecting the performance evaluation of LED chips.
[0004] Although there are many LED chip detection devices on the market, the shell design of these devices is often insufficient in suppressing light leakage. With the continuous development of the field of semiconductor chip detection, the requirements for detection equipment are also increasing. The traditional shell design can no longer meet the current high-precision and high-stability measurement needs. Therefore, there is an urgent need for a new type of LED chip detection equipment, whose shell design can more effectively suppress light leakage, thereby improving the accuracy of measurement data.
[0005] To address this problem, researchers can develop new detection equipment with better light-shielding effects by conducting in-depth research in the fields of optical principles, sensor technology, and material science. For example, the inner wall of the integrating sphere can be made of a material with a higher reflectivity to reduce the reflection loss of light in the sphere; at the same time, by optimizing the outer shell structure, such as adding a light shield and adjusting the sensor position, the interference of external light on the measurement can be further reduced.
[0006] Therefore, a chip detection device with better light shielding effect and higher detection accuracy is needed. Utility Model Content
[0007] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a chip detection device, which can effectively reduce the interference of light on measurement and detect the chip more accurately.
[0008] According to the chip detection device of the first embodiment of the utility model, the chip detection device includes: a shell, the shell is provided with a accommodating cavity, the shell is used to block the light outside the accommodating cavity; a wafer stage, the wafer stage is arranged in the accommodating cavity, the wafer stage is used to place the chip; a lifting device, the lifting device is arranged in the accommodating cavity, the lifting device is used to drive the chip to move in the vertical direction, the wafer stage is fixedly arranged at the movable end of the lifting device, the movable end of the lifting device is provided with a first trigger piece, the fixed end of the lifting device is provided with a first photoelectric sensor, the first trigger piece is used to trigger the first photoelectric sensor; a first light shielding member, the first light shielding member is provided with a first cavity, the first photoelectric sensor is arranged in the first cavity, the first light shielding member is used to block the light emitted by the first photoelectric sensor, and the first light shielding member is provided with a first through hole in the direction of the first trigger piece for the first trigger piece to enter and exit the first cavity; a movable light shielding member, the movable light shielding member is fixedly connected to the side of the first trigger piece away from the first photoelectric sensor, the movable light shielding member is used to block the light emitted from the first through hole.
[0009] The chip detection device according to the first embodiment of the utility model has at least the following beneficial effects: in order to detect whether the distance driven by the lifting device when driving the wafer stage to adjust its height is in place, a photoelectric sensor needs to be set to sense its position, that is, a first photoelectric sensor. In order to prevent the light emitted by the first photoelectric sensor from affecting the accuracy of chip measurement, a first shading member is set to block the light emitted by the first photoelectric sensor, thereby effectively blocking the light emitted by the first photoelectric sensor. The first photoelectric sensor needs to be triggered by the first trigger sheet, so the first through hole for the first trigger sheet to pass through needs to be set on the first shading member. The first through hole will emit a large amount of light, thereby affecting the shading effect of the first shading member, so a movable shading member is set to block the light emitted from the first through hole, thereby greatly reducing the influence of light on chip detection and improving the accuracy of chip detection.
[0010] According to some embodiments of the present invention, when the first triggering sheet triggers the first photoelectric sensor, the movable light shielding member is attached to the first through hole, so that the first cavity is a sealed cavity.
[0011] According to some embodiments of the present utility model, the movable shading member is arranged on a side of the wafer stage close to the first photoelectric sensor.
[0012] According to some embodiments of the utility model, the chip detection equipment also includes a rotating device, the fixed end of the rotating device is arranged on the movable end of the lifting device, the wafer table is arranged at the movable end of the rotating device, the rotating device is used to drive the wafer table to rotate, the fixed end of the rotating device is provided with a second photoelectric sensor, the movable end of the rotating device is provided with a second trigger plate, and the second trigger plate is used to trigger the second photoelectric sensor; the chip detection equipment also includes a second light-shielding member, the second light-shielding member is arranged between the second photoelectric sensor and the chip, and the second light-shielding member is used to block the light emitted by the second photoelectric sensor.
[0013] According to some embodiments of the utility model, the chip detection equipment also includes an X-drive device, which is used to drive the wafer stage to move along the X direction, and a third photoelectric sensor is provided at the fixed end of the X-drive device, and a third light-shielding member for shielding the third photoelectric sensor is provided on the third photoelectric sensor, and the X direction is perpendicular to the vertical direction.
[0014] According to some embodiments of the utility model, the chip detection equipment also includes a Y drive device, which is used to drive the wafer stage to move along the Y direction, and a fourth photoelectric sensor is provided at the fixed end of the Y drive device, and a fourth light-shielding member for shielding the fourth photoelectric sensor is provided on the fourth photoelectric sensor, and the Y direction is perpendicular to the vertical direction, and the Y direction is perpendicular to the X direction.
[0015] According to some embodiments of the utility model, a window is provided on the shell, a door panel is rotatably provided on the shell, and a sealing strip is provided on the door panel; when the door panel is closed, the door panel seals the window, and the sealing strip on the door panel abuts against the shell.
[0016] According to some embodiments of the utility model, the door panel includes a left side panel and a right side panel, one end of the left side panel away from the right side panel is rotatably connected to the shell, and one end of the right side panel away from the left side panel is rotatably connected to the shell; when the door panel is closed, the sealing strip on the right side panel abuts against the shell, the sealing strip on the left side panel abuts against the shell, a sealing strip is arranged between the left side panel and the right side panel, and the sealing strip between the left side panel and the right side panel abuts against the left side panel and the right side panel.
[0017] According to some embodiments of the utility model, a wire inlet is provided on the shell, and the wire inlet is used to allow the data line to pass through. A fifth light-shielding member is arranged on the outside of the shell, and the fifth light-shielding member includes a side surface and a bottom surface. The side surface is arranged on the outside of the wire inlet, and the bottom surface is arranged at one end of the side surface away from the shell. A second through hole is provided on the side surface or the bottom surface, and the second through hole is used to allow the data line to pass through.
[0018] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:
[0020] Figure 1 This is a schematic diagram of the appearance of a chip detection device in one embodiment of the utility model;
[0021] Figure 2 It is a cross-sectional schematic diagram of a housing in one embodiment of the utility model;
[0022] Figure 3 for Figure 2 A magnified schematic diagram of the middle A area;
[0023] Figure 4 for Figure 2 A magnified schematic diagram of the middle B area;
[0024] Figure 5 This is a schematic diagram of a structure in which the first photoelectric sensor and the second photoelectric sensor are not shielded from light in one embodiment of the utility model;
[0025] Figure 6 This is a schematic diagram of a structure for shielding a first photoelectric sensor and a second photoelectric sensor in one embodiment of the utility model;
[0026] Figure 7 This is a schematic diagram of a structure in which the third photoelectric sensor and the fourth photoelectric sensor are not shielded from light in one embodiment of the utility model;
[0027] Figure 8 It is a schematic diagram of the structure for shielding the third photoelectric sensor and the fourth photoelectric sensor in some embodiments of the utility model.
[0028] Reference numerals:
[0029] 1. Shell; 11. Accommodating cavity; 12. Wire inlet; 2. Plate carrier; 3. Lifting device; 31. First light shielding member; 32. Movable light shielding member; 33. First photoelectric sensor; 34. First triggering piece; 35. First through hole; 4. Rotating device; 41. Second photoelectric sensor; 42. Second light shielding member; 43. Second triggering piece; 5. X-driving device; 51. Third photoelectric sensor; 52. Third light shielding member; 6. Y-driving device; 61. Fourth photoelectric sensor; 62. Fourth light shielding member; 7. Door panel; 71. Left side panel; 72. Right side panel; 8. Sealing strip. DETAILED DESCRIPTION
[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0031] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0032] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0034] Reference Figure 1 , Figure 5 and Figure 6The chip detection device of the first embodiment of the utility model comprises: a housing 1, a wafer table 2, a lifting device 3, a first light shielding member 31 and a movable light shielding member 32. The housing 1 is provided with a receiving cavity 11, and the housing 1 is used to shield the light outside the receiving cavity 11; the wafer table 2 is arranged in the receiving cavity 11, and the wafer table 2 is used to place the chip; the lifting device 3 is arranged in the receiving cavity 11, and the lifting device 3 is used to drive the chip to move in the vertical direction. The wafer table 2 is fixedly arranged at the movable end of the lifting device 3, and the movable end of the lifting device 3 is provided with a first triggering piece 34. The fixed end of the lifting device 3 is provided with a first photoelectric sensor 33, and the first triggering piece 34 is used to trigger the first photoelectric sensor 33. By arranging the wafer table 2 in the receiving cavity 11, the chip on the wafer table 2 is shielded from light, so that the chip on the wafer table 2 is placed in an environment without natural light and the chip is detected. In the process of measuring the chip, the height of the chip needs to be adjusted by the lifting device 3 so as to measure the chip. In order to ensure that the chip is adjusted to a specified height position, the height of the lifting device 3 needs to be measured by the first photoelectric sensor 33. That is, when the chip is adjusted to a specified height by the lifting device 3 , the first trigger piece 34 enters into the first photoelectric sensor 33 to block the light path of the first photoelectric sensor 33 , thereby triggering the first photoelectric sensor 33 .
[0035] The measurement of the chip includes measuring the optical response of the chip using an integrating sphere, so the integrating sphere is required to provide a uniform lighting environment so that the optical response of the chip can be accurately measured. However, the light outside the integrating sphere will affect the accuracy of the measurement of the optical response of the chip. Therefore, the measurement accuracy is ensured by isolating the light outside the housing 1.
[0036] The first shading member 31 is provided with a first cavity, the first photoelectric sensor 33 is provided in the first cavity, the first shading member 31 is used to block the light emitted by the first photoelectric sensor 33, and the first shading member 31 is provided with a first through hole 35 in the direction of the first triggering piece 34 for the first triggering piece 34 to enter and exit the first cavity; the movable shading member 32 is fixedly connected to the side of the first triggering piece 34 away from the first photoelectric sensor 33, and the movable shading member 32 is used to block the light emitted from the first through hole 35. Since the light outside the integrating sphere will affect the measurement accuracy of the chip, and the first photoelectric sensor 33 on the lifting device 3 will emit light and thus affect the measurement accuracy of the chip, the first shading member 31 and the movable shading member 32 are provided, and the first shading member 31 will wrap the outer side of the first photoelectric sensor 33, so that the light emitted by the first photoelectric sensor 33 is limited within the first shading member 31. Since the first triggering piece 34 needs to move to trigger the first photoelectric sensor 33, it is necessary to open a first through hole 35 on the first shading member 31 for the first triggering piece 34 to pass through. Therefore, part of the light emitted by the first photoelectric sensor 33 will leak out from the first through hole 35 and affect the accuracy of chip measurement. Therefore, a movable shading member 32 is provided to block the light. The movable shading member 32 is provided on the side of the first triggering piece 34 away from the first photoelectric sensor 33. When the first triggering piece 34 triggers the first photoelectric sensor 33, the movable shading member will stay on the outside of the first shading member 31 to block the light leaking from the first through hole 35, thereby further improving the accuracy of chip measurement.
[0037] Further, when the first triggering piece 34 triggers the first photoelectric sensor 33, the movable shading piece 32 is attached to the first through hole 35, so that the first cavity is a sealed cavity. At this time, the light emitted by the first photoelectric sensor 33 is completely restricted by the movable shading piece 32 within the first cavity, thereby improving the measurement density of the chip. At the same time, a sealing strip 8 can be set on the side of the movable shading piece 32 close to the first photoelectric sensor 33 to avoid a small amount of light leakage caused by a gap between the movable shading piece 32 and the first shading piece 31 when the movable shading piece 32 is attached to the first through hole 35. Further, a telescopic pipe can also be set, wherein one end of the telescopic pipe is set on the first shading piece 31, and the other end is set on the movable shading piece 32, so that the first triggering piece 34 moves in the telescopic pipe, which can better block the light emitted by the first photoelectric sensor 33. Further, the movable shading piece 32 is set on the side of the wafer stage 2 close to the first photoelectric sensor 33. Effectively reduce the influence of a small amount of leaked light on chip measurement.
[0038] The chip detection device also includes a rotating device 4, the fixed end of the rotating device 4 is arranged on the movable end of the lifting device 3, the wafer stage 2 is arranged at the movable end of the rotating device 4, the rotating device 4 is used to drive the wafer stage 2 to rotate, the fixed end of the rotating device 4 is provided with a second photoelectric sensor 41, and the movable end of the rotating device 4 is provided with a second triggering piece 43, and the second triggering piece 43 is used to trigger the second photoelectric sensor 41; by setting the rotating device 4 to control the rotation of the chip, the detection of the chip is more convenient. The second photoelectric sensor 41 is set to determine the position to which the rotating device 4 rotates. The chip detection device also includes a second light shielding member 42, the second light shielding member 42 is arranged between the second photoelectric sensor 41 and the chip, and the second light shielding member 42 is used to shield the light emitted by the second photoelectric sensor 41. In order to prevent the light emitted by the second photoelectric sensor 41 from affecting the measurement accuracy of the chip, the second light shielding member 42 is set between the chip and the second sensor to block the influence of the light emitted by the second photoelectric sensor 41 on the measurement of the chip. The second light shielding member 42 can be set in an arc shape or in a circular ring shape.
[0039] Reference Figure 7 and Figure 8 The chip detection device also includes an X-drive device 5, which is used to drive the wafer stage 2 to move along the X direction. A third photoelectric sensor 51 is provided at the fixed end of the X-drive device 5. A third light shielding member 52 for shielding the third photoelectric sensor 51 is provided on the third photoelectric sensor 51. The X direction is perpendicular to the vertical direction. The chip detection device also includes a Y-drive device 6, which is used to drive the wafer stage 2 to move along the Y direction. A fourth photoelectric sensor 61 is provided at the fixed end of the Y-drive device 6. A fourth light shielding member 62 for shielding the fourth photoelectric sensor 61 is provided on the fourth photoelectric sensor 61. The Y direction is perpendicular to the vertical direction, and the Y direction is perpendicular to the X direction. The X-drive device 5 and the Y-drive device 6 are both for adjusting the position of the chip to make the measurement of the chip more convenient. Both of them have photoelectric sensors, so light shielding members need to be provided for light shielding.
[0040] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4A window is provided on the shell 1, a door panel 7 is rotatably provided on the shell 1, and a sealing strip 8 is provided on the door panel 7; when the door panel 7 is closed, the door panel 7 closes the window, and the sealing strip 8 on the door panel 7 abuts against the shell 1. In order to facilitate the placement of the chip, a door panel 7 that can be opened and closed is provided on the shell 1. The chip can be taken out and placed by opening the door panel 7, and the door panel 7 is closed when the chip is measured. Therefore, when the door panel 7 is closed, the light outside the accommodating cavity 11 needs to be blocked. In order to avoid a gap between the door panel 7 and the shell 1, a sealing strip 8 is provided, wherein the sealing strip 8 is an elastic member with good sealing ability, so that the gap between the door panel 7 and the shell 1 can be well eliminated to prevent external light from entering the accommodating cavity 11.
[0041] The door panel 7 includes a left side panel 71 and a right side panel 72. The end of the left side panel 71 away from the right side panel 72 is rotatably connected to the housing 1, and the end of the right side panel 72 away from the left side panel 71 is rotatably connected to the housing 1. When the door panel 7 is closed, the sealing strip 8 on the right side panel 72 abuts against the housing 1, the sealing strip 8 on the left side panel 71 abuts against the housing 1, a sealing strip 8 is provided between the left side panel 71 and the right side panel 72, and the sealing strip 8 between the left side panel 71 and the right side panel 72 abuts against the left side panel 71 and the right side panel 72. Since the housing 1, the left side panel 71 and the right side panel 72 are all devices with high hardness and poor deformation ability, it is easy to produce a gap at the abutment between any two of the three, so a sealing strip 8 is provided at the abutment position between any two of the three.
[0042] The shell 1 is provided with an inlet 12, and the inlet 12 is used for passing the data line. The outer side of the shell 1 is provided with a fifth shading member, and the fifth shading member includes a side surface and a bottom surface. The side surface is arranged outside the inlet 12, and the bottom surface is arranged at the end of the side surface away from the shell 1. A second through hole is provided on the side surface or the bottom surface, and the second through hole is used for passing the data line. The cooling fan, keyboard, mouse, digital display, tricolor light and other devices on the chip detection equipment need to be connected to the equipment outside the shell 1 through the data line, so the inlet 12 is required to allow the data line to pass through. In order to effectively reduce the leakage into the shell 1 through the inlet 12, the fifth shading member is provided. The light needs to enter the fifth shading member through the second through hole on the fifth shading member first, and then enter the accommodating cavity 11 through the inlet 12 to affect the measurement of the chip, thereby greatly reducing the impact on the chip measurement. Furthermore, the light passing through the fifth shading member can be further reduced by staggering the line inlet 12 and the second through hole, setting staggered light shielding plates in the fifth shading member, and bending the data line in the fifth shading member, thereby further improving the accuracy of chip measurement.
[0043] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
Claims
1. Chip testing equipment, characterized in that: include: A housing, wherein the housing is provided with a receiving cavity, and the housing is used to shield light outside the receiving cavity; A wafer stage, which is arranged in the accommodating cavity and is used for placing a chip; A lifting device, the lifting device is arranged in the accommodating cavity, the lifting device is used to drive the chip to move in the vertical direction, the chip support table is fixedly arranged at the movable end of the lifting device, the movable end of the lifting device is provided with a first trigger piece, the fixed end of the lifting device is provided with a first photoelectric sensor, and the first trigger piece is used to trigger the first photoelectric sensor; a first light shielding member, wherein the first light shielding member is provided with a first cavity, the first photoelectric sensor is provided in the first cavity, the first light shielding member is used to shield the light emitted by the first photoelectric sensor, and the first light shielding member is provided with a first through hole in the direction of the first triggering piece so as to allow the first triggering piece to enter and exit the first cavity; A movable light shielding member is fixedly connected to a side of the first triggering piece away from the first photoelectric sensor, and is used for shielding light emitted from the first through hole.
2. The chip detection device according to claim 1, characterized in that: When the first triggering sheet triggers the first photoelectric sensor, the movable light shielding member is attached to the first through hole, so that the first cavity is a sealed cavity.
3. The chip detection device according to claim 1, characterized in that: The movable light shielding member is arranged on a side of the film stage close to the first photoelectric sensor.
4. The chip detection device according to claim 1, characterized in that: The chip detection device further comprises a rotating device, wherein a fixed end of the rotating device is arranged on a movable end of the lifting device, the wafer stage is arranged at the movable end of the rotating device, the rotating device is used to drive the wafer stage to rotate, a second photoelectric sensor is arranged at the fixed end of the rotating device, and a second triggering piece is arranged at the movable end of the rotating device, and the second triggering piece is used to trigger the second photoelectric sensor; The chip detection device further includes a second light shielding member, which is disposed between the second photoelectric sensor and the chip, and is used to shield the light emitted by the second photoelectric sensor.
5. The chip detection device according to claim 1, characterized in that: The chip detection equipment also includes an X-drive device, which is used to drive the wafer stage to move along the X direction. A third photoelectric sensor is provided at the fixed end of the X-drive device, and a third light-shielding member for shielding the third photoelectric sensor is provided on the third photoelectric sensor. The X direction is perpendicular to the vertical direction.
6. The chip detection device according to claim 5, characterized in that: The chip detection equipment also includes a Y drive device, which is used to drive the wafer stage to move along the Y direction. A fourth photoelectric sensor is arranged at the fixed end of the Y drive device, and a fourth light shielding member for shielding the fourth photoelectric sensor is arranged on the fourth photoelectric sensor. The Y direction is perpendicular to the vertical direction, and the Y direction is perpendicular to the X direction.
7. The chip detection device according to claim 1, characterized in that: A window is provided on the shell, a door panel is rotatably provided on the shell, and a sealing strip is provided on the door panel; when the door panel is closed, the window is sealed, and the sealing strip on the door panel abuts against the shell.
8. The chip detection device according to claim 7, characterized in that: The door panel includes a left side panel and a right side panel, wherein one end of the left side panel away from the right side panel is rotatably connected to the shell, and one end of the right side panel away from the left side panel is rotatably connected to the shell; when the door panel is closed, the sealing strip on the right side panel abuts against the shell, the sealing strip on the left side panel abuts against the shell, a sealing strip is provided between the left side panel and the right side panel, and the sealing strip between the left side panel and the right side panel abuts against the left side panel and the right side panel.
9. The chip detection device according to claim 1, characterized in that: The shell is provided with a wire inlet, the wire inlet is used for passing the data line, a fifth shading member is arranged on the outside of the shell, the fifth shading member includes a side surface and a bottom surface, the side surface is arranged around the outside of the wire inlet, the bottom surface is arranged at one end of the side surface away from the shell, a second through hole is provided on the side surface or the bottom surface, the second through hole is used for passing the data line.