Line laser transceiving module

Abstract

The utility model discloses a line laser transceiving module, which comprises a circuit board, an expansion lens and an optical transceiving assembly, and is characterized in that the optical transceiving assembly comprises a transmitting lens assembly, a receiving lens assembly and a lens bracket; the transmitting lens assembly, the receiving lens assembly and the lens support are integrally formed through injection molding. The expansion lens is arranged at the front end of the emission lens assembly. According to the integrated line laser receiving and transmitting module, the linear laser optical lens is adopted, the excitation emission lens, the laser receiving lens and the support for installing the lens are integrally formed to form the optical receiving and transmitting assembly through the in-mold injection molding technology, then the optical receiving and transmitting assembly is fixedly connected with the circuit board, and therefore the integrated optical receiving and transmitting module is formed. The defects caused by frequent debugging and installation of a plurality of elements can be avoided, so that the debugging cost, the installation cost and the labor cost are greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of laser radar, and more specifically, to a linear laser transceiver module. Background Art

[0002] In the field of linear laser radar, line laser is used for ranging, obstacle avoidance, and cruise mapping, and is particularly widely used. Low cost and reliability have always been the demands for the promotion and application of linear laser radar.

[0003] The straight-line laser radars currently on the market generally use one or more linear laser emitting modules to emit lasers and one or more lens modules to receive lasers. These laser emitting modules and laser receiving modules are installed on the bracket through assembly and debugging. Since both the laser emitting module and the laser lens module are small and complex components, the material cost and process cost are particularly high. In addition, these components are already modules assembled from multiple parts. When they are assembled and installed on the bracket to form a laser radar, it is necessary to assemble parts multiple times, resulting in multiple processes, low efficiency, and low reliability.

[0004] How to design a line laser transceiver module with simple manufacturing process, high precision requirements and flexible design is a problem to be solved. Utility Model Content

[0005] Based on this, it is necessary to provide a line laser transceiver module to address the existing problems.

[0006] The embodiment of the present application provides a line laser transceiver module, including a circuit board, an expansion lens and an optical transceiver assembly, wherein the optical transceiver assembly includes a transmitting lens assembly, a receiving lens assembly and a lens bracket;

[0007] The transmitting lens assembly, the receiving lens assembly and the lens bracket are integrally formed by injection molding;

[0008] The expansion lens is arranged at the front end of the emitting lens assembly.

[0009] Preferably, the circuit board is a PCBA circuit board, the optical axis of the transmitting lens assembly intersects the PCBA circuit board vertically or obliquely, and the optical axis of the receiving lens assembly intersects the PCBA circuit board obliquely.

[0010] Preferably, the PCBA circuit board includes a laser transmitter and a laser receiving chip.

[0011] Preferably, the laser receiving chip is fixed on the PCBA circuit board through SMT or COB.

[0012] Preferably, the laser emitter is conductively connected to the circuit board.

[0013] Preferably, the emitting lens assembly collimates the laser light emitted by the laser transmitter, and the collimated laser light passes through the expansion lens to generate a line laser.

[0014] Preferably, the transmitting lens assembly and the receiving lens assembly are arranged vertically.

[0015] Preferably, the receiving lens assembly comprises one or more receiving lenses.

[0016] Preferably, the plurality of receiving lenses are arranged horizontally, and the optical axes of the plurality of receiving lenses are arranged at angles to each other.

[0017] Preferably, the lens bracket comprises two inclined surfaces, the tops of the two inclined surfaces intersect to form an angle, and the receiving lens is injection-molded on the inclined surfaces.

[0018] Preferably, a mounting hole for mounting the laser transmitter is provided behind the transmitting lens assembly.

[0019] Compared with the prior art, the integrated line laser transceiver module of the utility model first emits laser through a laser transmitter, and the light beam is collimated by the laser emission lens assembly, and then passes through an expansion lens to form a straight line laser, and then is emitted to the target object and reflected back, and is received by the laser receiving lens assembly and focused onto the receiving chip, and finally the laser signal processing circuit processes the electrical signal into a digital signal output. The utility model adopts an optical lens of a straight line laser, and the excitation lens, the laser receiving lens and the bracket for mounting the lens are integrally formed into an optical transceiver assembly through in-mold injection molding technology, and then the optical transceiver assembly is fixedly connected to the circuit board to form an integrated optical transceiver module, which can avoid the disadvantages of frequent debugging and installation of multiple components, thereby greatly reducing the debugging cost, installation cost and labor cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] A more complete understanding of exemplary embodiments of the present invention may be obtained by reference to the following drawings.

[0021] The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0022] Figure 1 This is a structural schematic diagram of a line laser transceiver module provided according to the first embodiment of the present application;

[0023] Figure 2 It is a cross-sectional view of a line laser transceiver module provided according to the first embodiment of the present application.

[0024] Figure 3 It is a structural schematic diagram of an optical transceiver assembly provided according to Embodiment 1 of the present application;

[0025] Figure 4 A cross-sectional view of a line laser transceiver module provided according to the second embodiment of the present application;

[0026] Figure 5 It is a schematic diagram of the structure of an optical transceiver assembly provided according to the second embodiment of the present application.

[0027] Reference numerals

[0028] 1-circuit board, 2-optical transceiver assembly, 3-extension lens, 11-laser transmitter, 12-laser receiving chip, 21-transmitting lens assembly, 22-receiving lens assembly, 23-lens bracket, 24-transmitting laser mounting hole. DETAILED DESCRIPTION

[0029] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0030] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] Embodiment 1

[0034] The line laser transceiver module provided by the utility model is described below in conjunction with the accompanying drawings.

[0035] Reference Figure 1 The linear laser transceiver module includes a circuit board 1, an optical transceiver component 2 and an expansion lens 3.

[0036] In this embodiment, the circuit board 1 is a laser transceiver integrated PCBA, including a laser transmitter 11 and a laser receiving chip 12. The PCBA is responsible for the photoelectric conversion processing of the laser signal. In actual use, the laser emits a laser signal from the laser transmitter 11, which is collimated and shaped by the laser emission lens 21 on the integrated module, and then incident on the expansion lens 3 (the expansion lens is a special reflector that uses a reflection wall to reflect the waves, thereby realizing the control and regulation of the waves. When the wave encounters the reflection wall, according to the nature of the wave, the wave will be reflected and propagated in the direction where the incident angle is equal to the reflection angle. In the expansion lens, due to the existence of the reflection wall, the wave will be emitted by the reflection wall multiple times and form a series of parallel waves), the expansion lens 3 converts the light beam into a straight line laser, which is then emitted to the target object, and then reflected back by the target object and focused on the laser receiving chip 12 by the laser receiving lens 22. The signal processing circuit board then converts the received laser signal into a distance signal and outputs it to the outside.

[0037] The optical transceiver assembly 2 includes a transmitting lens assembly 21, a receiving lens assembly 22 and a lens bracket 23. The optical transceiver assembly is integrally formed by mold injection. In this embodiment, the transmitting lens assembly 21 may include one or more transmitting lenses, and the receiving lens assembly 22 may include one or more receiving lenses.

[0038] Specifically, the optical axis of the transmitting lens assembly 21 intersects the PCBA circuit board vertically or obliquely, and the optical axis of the receiving lens assembly 22 intersects the PCBA circuit board obliquely. The lens bracket 23 includes two inclined surfaces, the tops of the two inclined surfaces intersect to form an angle, and the receiving lens 22 is injection molded on the inclined surface.

[0039] In this embodiment, the expansion lens 3 includes a wave mirror, a cylindrical lens, a cylindrical microlens array, and a DOE (beam expander). The function of the expansion lens 3 is to expand the collimated parallel light to obtain a line laser.

[0040] In this embodiment, when the transmitting lens assembly 21 or the receiving lens assembly 22 includes two or more lenses, the lens arrangement can be designed to be inclined. Taking two laser receiving lenses as an example, the receiving end of the optical transceiver assembly 2 is provided with two inclined surfaces, and the inclined direction thereof corresponds to the direction of the line, so that the laser light converged by the two laser receiving lenses falls on the same laser receiving chip 12 or different laser receiving chips 12. When falling on the same laser receiving chip 12, the photosensitive area is divided for the laser receiving chip (such as CMOS), so that the lenses arranged in different directions can focus light on different areas of the photosensitive chip, thereby ensuring the range of the detection FOV angle, saving components, and reducing the difficulty of debugging and assembly.

[0041] Specifically, the emitting lens assembly 21 of the present application includes one or more laser emitting lenses, and the expansion lens 3 is installed at the front end of the emitting lens assembly 21 to ensure that the emitted light beam is shaped into a straight line laser; specifically, the edge of the expansion lens 3 fits tightly with the emitting lens, and there is a gap between the middle light-transmitting part and the emitting lens.

[0042] Specifically, the transmitting lens assembly 21 and the receiving lens assembly 22 are arranged in an up-and-down structure. Among them, the receiving lens assembly 22 includes one or more receiving lenses, referring to Figure 2 The multiple receiving lenses are formed into one body, and there is an angle between the optical axes of the multiple receiving lenses. The interaction of the multiple receiving lenses can receive the laser reflected light within a larger angle range. In a preferred embodiment, the multiple receiving lenses can also be independently arranged units.

[0043] Among them, the laser transmitter 11 or the laser receiving chip 12 is fixed on the PCBA circuit board through SMT or COB. Specifically, SMT is a surface mounting technology (Surface Mounting Technology, referred to as SMT), which is a new generation of electronic assembly technology. It compresses traditional electronic components into devices with a volume of only a few tens of times. It realizes high density, high reliability, miniaturization, low cost and automation of production of electronic product assembly. This miniaturized component is called: SMY device (or SMC, chip device). COB (Chip-on-Board), also known as chip direct mounting technology, refers to the process of directly sticking the bare chip on the printed circuit board, then wire bonding, and then encapsulating and protecting the chip and wires with organic glue. Compared with conventional processes, this process has high packaging density and simple procedures.

[0044] Embodiment 2

[0045] The line laser transceiver module provided by the utility model is described below in conjunction with the accompanying drawings.

[0046] Reference Figures 4 to 5, the line laser transceiver module includes a circuit board 1, an optical transceiver assembly 2 and an expansion lens 3. The structure of the present application is basically the same as that of the embodiment, except that, in the present embodiment, the structure of the optical transceiver assembly 2 is different, and a transmitting laser mounting hole 24 is provided on the optical transceiver assembly 2 for mounting the transmitting laser 11, making it a detachable structure. If one or some transmitting lasers are damaged, they can be removed or replaced in time, which is convenient to operate and simple in structure. The laser receiving chip 12 is fixed on the PCBA circuit board through SMT or COB.

[0047] Specifically, when the line laser transceiver module is working, the laser is first emitted through the laser transmitter. After the light beam is collimated by the laser emitting lens assembly 21, it passes through the expansion lens 3 to form a straight line laser. After being emitted to the target object, it is reflected back and received by the laser receiving lens assembly 22 and focused onto the receiving chip 12. Finally, the laser signal processing circuit processes the electrical signal into a digital signal output.

[0048] Compared with the prior art, the integrated line laser transceiver module of the utility model first emits laser through a laser transmitter, and after the light beam is collimated by the laser emission lens assembly 21, it passes through the expansion lens 3 to form a straight line laser, and then emits to the target object and reflects back, and is received by the laser receiving lens assembly 22 and focused onto the receiving chip 12, and finally the laser signal processing circuit processes the electrical signal into a digital signal output. The utility model adopts an optical lens of a straight line laser, and the excitation lens, the laser receiving lens and the bracket for mounting the lens are integrally formed into an optical transceiver assembly through in-mold injection molding technology, and then the optical transceiver assembly is fixedly connected to the circuit board to form an integrated optical transceiver module, which can avoid the disadvantages of frequent debugging and installation of multiple components, thereby greatly reducing the debugging cost, installation cost and labor cost.

[0049] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0050] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A line laser transceiver module, characterized in that: It includes a circuit board, an expansion lens and an optical transceiver assembly, wherein the optical transceiver assembly includes a transmitting lens assembly, a receiving lens assembly and a lens bracket; The transmitting lens assembly, the receiving lens assembly and the lens bracket are integrally formed by injection molding; The expansion lens is arranged at the front end of the emitting lens assembly.

2. A line laser transceiver module according to claim 1, characterized in that: The circuit board is a PCBA circuit board, the optical axis of the transmitting lens assembly intersects the PCBA circuit board vertically or obliquely, and the optical axis of the receiving lens assembly intersects the PCBA circuit board obliquely.

3. A line laser transceiver module according to claim 2, characterized in that: The PCBA circuit board includes a laser transmitter and a laser receiving chip.

4. A line laser transceiver module according to claim 3, characterized in that: The laser receiving chip is fixed on the PCBA circuit board through SMT or COB.

5. The line laser transceiver module according to claim 3, characterized in that: The laser emitter is electrically connected to the circuit board.

6. The line laser transceiver module according to claim 3, characterized in that: The emission lens assembly collimates the laser light emitted by the laser transmitter, and the collimated laser light passes through the expansion lens to generate a line laser.

7. The line laser transceiver module according to claim 1, characterized in that: The transmitting lens assembly and the receiving lens assembly are arranged vertically.

8. The line laser transceiver module according to claim 1, characterized in that: The receiving lens assembly includes one or more receiving lenses.

9. A line laser transceiver module according to claim 8, characterized in that: The multiple receiving lenses are arranged horizontally, and the optical axes of the multiple receiving lenses are arranged at angles to each other.

10. The line laser transceiver module according to claim 8, characterized in that: The lens bracket comprises two inclined surfaces, the tops of the two inclined surfaces intersect to form an angle, and the receiving lens is injection-molded on the inclined surfaces.

11. The line laser transceiver module according to claim 3, characterized in that: A mounting hole for mounting the laser transmitter is arranged behind the transmitting lens assembly.

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