Wafer developing device

Abstract

The utility model discloses a wafer developing device which comprises a spraying assembly, and a nozzle of the spraying assembly is vertically arranged upwards. The spraying assembly is connected with a developing solution supply unit and a fixing solution supply unit; a developing solution recovery unit and a fixing solution recovery unit are arranged below the spraying assembly; the developing solution recovery unit is connected with the developing solution supply unit, and the fixing solution recovery unit is connected with the fixing solution supply unit. The spraying assembly with the vertically upward nozzle, the developing solution supply unit connected with the spraying assembly and the fixing solution supply unit are used for developing and fixing the wafer, the spraying assembly directly sprays the developing solution or the fixing solution to the surface of the wafer located above the spraying assembly, the wafer does not need to rotate, the wafer is prevented from being polluted, and in addition, the spraying efficiency is improved. And the redundant developing solution or fixing solution falls back to the developing solution recycling unit or the fixing solution recycling unit below the spraying assembly under the action of gravity, so that secondary recycling of the developing solution and the fixing solution is effectively realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors and relates to a wafer developing device. Background Art

[0002] In the existing photolithography process of semiconductor processing, the coating equipment, photolithography equipment and developing equipment respectively complete the photoresist coating process and the developing process. Among them, the developer used in the developing process is the only raw material that cannot remain on the surface of the wafer. The developer is a chemical solvent that dissolves the soluble area of ​​the photoresist caused by exposure. The function of the fixing solution is to fix the image obtained by development and remove the unexposed silver halide. The mainstream developing method of the prior art is mainly the traditional rotary immersion development method, which is to drop the developer on the center of the wafer and then rotate the wafer at high speed so that the developer is spread all over the wafer surface under the action of centrifugal force. However, during the rotation process, it is easy for the solution to splash under the action of centrifugal force, contaminating the wafer. At the same time, the developer thrown out will be discharged with the waste liquid, and after being discharged, the developer and the fixing solution are mixed, and it is impossible to effectively reuse them, resulting in a waste of raw materials. At the same time, the stability of the development products of the prior art is poor.

[0003] Patent CN116954040A discloses a developer spraying device and a developer spraying method, which forms a developer inner film between the developer nozzles. This method must control the gap width between the developer nozzle and the wafer within a certain range, and the developer nozzle must move linearly from the center to the edge of the wafer at a certain rate and the wafer must rotate, so that the developer forms a liquid film between the wafer and the nozzle. Although it reduces the splashing of the liquid and saves the developer to a certain extent, due to the limitation on the distance between the nozzle and the wafer, there are certain requirements for the thickness of the wafer. Too thick or too thin wafers or wafer bonding pairs may make it difficult to form a liquid film, which is converted into the situation of traditional rotary immersion development, and there is a certain probability of splashing the liquid and contaminating the wafer. Utility Model Content

[0004] In view of the problems existing in the prior art, the utility model provides a wafer developing device, thereby solving the technical problems in the prior art that during the development process, the rotation of the wafer causes the developer to splash and contaminate the wafer, and the discharged developer mixes with the fixing solution and cannot be effectively reused.

[0005] The utility model is realized by the following technical solutions:

[0006] A wafer developing device comprises a spraying assembly, wherein a spraying nozzle of the spraying assembly is vertically arranged upward;

[0007] The spraying assembly is connected to a developer supply unit and a fixer supply unit; a developer recovery unit and a fixer recovery unit are provided below the spraying assembly;

[0008] The developer recovery unit is connected to the developer supply unit, and the fixer recovery unit is connected to the fixer supply unit.

[0009] Preferably, the developer liquid recovery unit includes a developer liquid recovery chamber and a developer waste liquid recovery device, and the developer liquid recovery chamber, the developer waste liquid recovery device and the developer liquid supply unit can all be connected and disconnected; the fixer liquid recovery unit includes a fixer liquid recovery chamber and a fixer waste liquid recovery device, and the fixer liquid recovery chamber, the fixer waste liquid recovery device and the fixer liquid supply unit are all connected and disconnected.

[0010] Preferably, the developer recovery chamber is sleeved on the outside of the fixer recovery chamber; and a gap layer is provided between the developer recovery chamber and the fixer recovery chamber.

[0011] Preferably, the developer recovery chamber includes a developer recovery chamber door and a developer recovery chamber; the fixer recovery chamber includes a fixer recovery chamber door and a fixer recovery chamber.

[0012] Preferably, the wafer developing device further comprises a control system, and the control system is electrically connected to both the developer recovery chamber door and the fixer recovery chamber door.

[0013] Preferably, the developer recovery chamber door and the fixer recovery chamber door are located directly below the wafer to be developed, and the orthographic projection of the wafer to be developed on the developer recovery chamber door and the fixer recovery chamber door is located inside the developer recovery chamber door and the fixer recovery chamber door.

[0014] Preferably, the developer recovery chamber door and the fixer recovery chamber door are arc surfaces, and the developer recovery chamber and the fixer recovery chamber are both located outside the arc surfaces.

[0015] Preferably, a developer recovery pipe is provided at the bottom of the developer recovery chamber, and the developer recovery pipe includes a first main recovery pipe, a first branch recovery pipe and a second branch recovery pipe which are both connectable and disconnectable with the first main recovery pipe, the free end of the first branch recovery pipe is connected to the developer supply unit, and the free end of the second branch recovery pipe is connected to the developer waste liquid recovery device;

[0016] A fixing liquid recovery pipe is provided at the bottom of the fixing liquid recovery chamber, and the fixing liquid recovery pipe includes a second main recovery pipe, a third branch recovery pipe and a fourth branch recovery pipe which are both connected to the second main recovery pipe. The free end of the third branch recovery pipe is connected to the fixing liquid supply unit, and the free end of the fourth branch recovery pipe is connected to the fixing waste liquid recovery device.

[0017] Preferably, the first main recovery pipe is provided with a developer separation component, and the first branch recovery pipe and the second branch recovery pipe are both connected to the developer separation component; the second main recovery pipe is provided with a fixer separation component, and the third branch recovery pipe and the fourth branch recovery pipe are both connected to the fixer separation component.

[0018] Preferably, the spraying assembly is a two-fluid spray head.

[0019] Compared with the prior art, the utility model has the following beneficial technical effects:

[0020] The utility model discloses a wafer developing device, which utilizes a spraying assembly with a nozzle vertically arranged upwards and a developer supply unit and a fixer supply unit connected thereto to develop and fix the wafer. During the development and fixing process, the spraying assembly directly sprays the developer or the fixer onto the wafer surface located above it. During use, the wafer surface is inverted and the wafer does not need to be rotated, thereby avoiding splashing of the developer caused by the rotation of the wafer and contaminating the wafer. In addition, the excess developer or the fixer falls back to the developer recovery unit or the fixer recovery unit located below the spraying assembly due to gravity, thereby effectively realizing the secondary recovery and utilization of the developer and the fixer.

[0021] Furthermore, the developer recovery chamber is sleeved on the outside of the fixer recovery chamber, which saves space and facilitates the effective recovery of the developer or fixer when developing or fixing the wafer at the same position.

[0022] Furthermore, the wafer developing device also includes a control system, which is electrically connected to the developer recovery chamber door and the fixer recovery chamber door. The control system effectively realizes automatic control of the developer recovery chamber door and the fixer recovery chamber door, making the operation more convenient.

[0023] Furthermore, the developer recovery chamber door and the fixer recovery chamber door are located directly below the wafer to be developed, and the orthographic projection of the wafer to be developed on the developer recovery chamber door and the fixer recovery chamber door is located inside the developer recovery chamber door and the fixer recovery chamber door, so that excess developer or fixer can fully fall into the developer recovery chamber or the fixer recovery chamber, thereby achieving full recovery of the developer or fixer.

[0024] Furthermore, the developer liquid recovery chamber door and the fixer liquid recovery chamber door are curved surfaces, and the developer liquid recovery chamber and the fixer liquid recovery chamber are both located on the outside of the curved surface. The design of the developer liquid recovery chamber door and the fixer liquid recovery chamber door with the curved surface structure makes it easier for the fallen developer liquid and fixer liquid to flow into the developer liquid recovery chamber or the fixer liquid recovery chamber.

[0025] Furthermore, the arrangement of the developer separation component and the fixer separation component can effectively separate different components in the recovered developer and fixer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a structural schematic diagram of a wafer developing device in the utility model;

[0028] Figure 2 It is a top view of the developer recovery chamber and the fixer recovery chamber in the utility model;

[0029] Figure 3 It is a side view of a developer recovery chamber door and a fixer recovery chamber door in a preferred embodiment of the utility model;

[0030] Figure 4 It is a structural schematic diagram of the developer solution factory service recovery system and the fixer solution factory service recovery system in the utility model;

[0031] Figure 5 This is a schematic diagram of the working of a spraying assembly in one embodiment of the utility model;

[0032] Figure 6 It is a schematic diagram of fixing the wafer to be developed in the utility model;

[0033] Figure 7 The utility model is provided with two kinds of spraying components of the work flow chart;

[0034] Figure 8 The utility model is a schematic diagram of the arrangement structure of each valve on the developer recovery unit and the fixer recovery unit.

[0035] Wherein: 1. Wafer to be developed, 2. Spraying assembly, 3. Developer recovery chamber, 31. Developer recovery chamber door, 32. Developer recovery chamber, 33. Developer recovery pipe, 331. First main recovery pipe, 332. First branch recovery pipe, 333. Second branch recovery pipe, 4. Fixer recovery chamber, 41. Fixer recovery chamber door, 42. Fixer recovery chamber, 43. Fixer recovery pipe, 431. Second main recovery pipe, 432. Third branch recovery pipe, 433. Fourth branch recovery pipe, 5. Developer supply Pump, 6. Fixing liquid supply pump, 7. Developer separation assembly, 8. Fixing liquid separation assembly, 9. Robotic arm, 10. Wafer claw, 11. Developer supply device, 12. Fixing liquid supply device, 13. Developer waste liquid recovery device, 14. Fixing waste liquid recovery device, 15. Developer factory recovery system, 16. Fixing liquid factory recovery system, 171. Developer recovery device recovery valve, 172. Developer recovery device waste valve, 181. Fixing liquid recovery device recovery valve, 182. Fixing liquid recovery device waste valve. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] In the description of the embodiments of the present utility model, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use, it is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0040] In addition, if the term "horizontal" appears, it does not mean that the component must be absolutely horizontal, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", which does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0041] In the description of the embodiments of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0042] The utility model is further described in detail below with reference to the accompanying drawings:

[0043] like Figure 1 As shown, the utility model discloses a wafer developing device, comprising a spraying assembly 2; a developer supply unit and a fixer supply unit are connected to the spraying assembly 2; a developer recovery unit and a fixer recovery unit are provided below the spraying assembly 2; the developer recovery unit is connected to the developer supply unit, and the fixer recovery unit is connected to the fixer supply unit. When the device is used, the wafer 1 to be developed is placed in an inverted state above the spraying assembly 2 to perform the developing and fixing processes.

[0044] In a preferred embodiment, the developer liquid recovery unit includes a developer liquid recovery chamber 3 and a developer waste liquid recovery device 13, and the developer liquid recovery chamber 3 is connected to the developer waste liquid recovery device 13 and the developer liquid supply unit; the fixing liquid recovery unit includes a fixing liquid recovery chamber 4 and a fixing waste liquid recovery device 14, and the fixing liquid recovery chamber 4 is connected to the fixing waste liquid recovery device 14 and the fixing liquid supply unit.

[0045] At the same time, if Figures 1-2As shown, in another more preferred embodiment, the developer recovery chamber 3 is sleeved on the outside of the fixer recovery chamber 4; a gap layer is provided between the developer recovery chamber 3 and the fixer recovery chamber 4. When the device is used, the recovered developer falls into the gap layer, and the recovered fixer falls into the inside of the fixer recovery chamber 4, so as to separate the recovered developer from the fixer. Here, the developer recovery chamber 3 and the fixer recovery chamber 4 can be a truncated cone structure.

[0046] In addition, the developer recovery chamber 3 includes a developer recovery chamber door 31 and a developer recovery chamber 32; the fixer recovery chamber 4 includes a fixer recovery chamber door 41 and a fixer recovery chamber 42. Here, the developer recovery chamber door 31 and the fixer recovery chamber door 41 realize the independent recovery of the two recovery liquids.

[0047] Furthermore, the wafer developing device also includes a control system, which is electrically connected to the developer recovery chamber door 31 and the fixer recovery chamber door 41. The control system is a Siemens control system, and its program content is a predetermined design, which can be directly installed and used. By turning on and off the developer recovery chamber door 31 and the fixer recovery chamber door 41 through the program system, the operation convenience of the device is effectively improved, making it more automated.

[0048] In addition, in the present invention, preferably, the developer recovery chamber door 31 and the fixer recovery chamber door 41 are located directly below the wafer 1 to be developed, and the orthographic projection of the wafer 1 to be developed on the developer recovery chamber door 31 and the fixer recovery chamber door 41 is located inside the developer recovery chamber door 31 and the fixer recovery chamber door 41, so that the excess developer or fixer can fully fall back into the developer recovery chamber 3 or the fixer recovery chamber 4. More preferably, as Figure 3 As shown, the developer recovery chamber door 31 and the fixer recovery chamber door 41 are arc surfaces, and the developer recovery chamber 32 and the fixer recovery chamber 42 are both located on the outside of the arc surface, so that excess developer or fixer can fall back into the developer recovery chamber 32 or the fixer recovery chamber 42.

[0049] In a preferred embodiment, a developer recovery pipe 33 is provided at the bottom of the developer recovery chamber 32, and the developer recovery pipe 33 includes a first main recovery pipe 331, a first branch recovery pipe 332 and a second branch recovery pipe 333 both of which are connected to the first main recovery pipe 331, a free end of the first branch recovery pipe 332 is connected to the developer supply unit, and a free end of the second branch recovery pipe 333 is connected to the developer waste liquid recovery device 13;

[0050] A fixing liquid recovery pipe 43 is provided at the bottom of the fixing liquid recovery chamber 42, and the fixing liquid recovery pipe 43 includes a second main recovery pipe 431, a third branch recovery pipe 432 and a fourth branch recovery pipe 433 which are both connected to the second main recovery pipe 431, the free end of the third branch recovery pipe 432 is connected to the fixing liquid supply unit, and the free end of the fourth branch recovery pipe 433 is connected to the fixing waste liquid recovery device 14.

[0051] Meanwhile, the first main recovery pipe 331 is provided with a developer separation assembly 7, and the first branch recovery pipe 332 and the second branch recovery pipe 333 are both connected to the developer separation assembly 7; the second main recovery pipe 431 is provided with a fixer separation assembly 8, and the third branch recovery pipe 432 and the fourth branch recovery pipe 433 are both connected to the fixer separation assembly 8. In addition, the developer supply unit includes a developer supply device 11, a first supply pipe is provided between the developer supply device 11 and the spray assembly 2, and a developer supply pump 5 is provided on the first supply pipe; the fixer supply unit includes a fixer supply device 12, a second supply pipe is provided between the developer supply device 12 and the spray assembly 2, and a fixer supply pump 6 is provided on the second supply pipe.

[0052] In the utility model, the working principle of the developer recovery chamber 3 and the fixing liquid recovery chamber 4 is the same. During development, the fixing liquid recovery chamber door 41 is closed, the developer recovery chamber door 31 is opened, and it is closed after the development is completed; during fixing, the developer recovery chamber door 31 is closed, the fixing liquid recovery chamber door 41 is opened, and it is closed after the fixing is completed; wherein the developer recovery chamber 32 is connected to the developer waste liquid recovery device 13, which is convenient for the recovery of developer waste liquid; the fixing liquid recovery chamber 42 is connected to the fixing waste liquid recovery device 14, which is convenient for the recovery of fixing waste liquid; wherein the developer recovery chamber door 31 is located above the fixing liquid recovery chamber door 41, has a ring shape, and is made of a retractable material that is acid- and alkali-resistant, and can wrap the fixing liquid recovery chamber door 41 and fit completely with the fixing liquid recovery chamber door 41, so that the development and fixing do not interfere with each other, and the effect of separately recovering and reusing the medicine can be achieved, which is completely different from the traditional development method.

[0053] In addition, if Figure 4 As shown, in the present invention, the developer waste liquid recovery device 11 can be directly replaced by the developer liquid factory recovery system 15, and similarly, the fixer waste liquid recovery device 14 can be directly replaced by the fixer liquid factory recovery system 16 to directly realize the discharge treatment of the waste liquid.

[0054] Further preferably, Figure 5As shown, the spraying component 2 in the utility model is preferably a two-fluid nozzle, and the working principle of the two-fluid nozzle is: through a high-voltage electric field, the liquid two fluids, that is, gas, are decomposed into ions with positive and negative charges. Under the action of the electric field, these ions are attracted to the inside of the nozzle and are then accelerated by the electric field to form extremely fine particles. Since the extremely fine particles have a large surface area, they can fill the entire nozzle, thereby achieving a uniform atomization effect. The liquid outlet of the two-fluid nozzle is a needle-shaped aperture, and the liquid will be quickly atomized when it is discharged, and there is almost no residual liquid, and there is no need to set up a back-suction device. The developer sprayed by the two-fluid nozzle is in a mist and has a certain pressure, forming an atomized film, which can effectively atomize and develop the wafer surface. The nozzle has a shower-type structure and adopts a shower-type porous two-fluid nozzle. It has one nozzle and two fluids. The inner diameter of the nozzle can be determined according to the size of the wafer. The wafer-sized nozzle can be designed with a conical shape and embedded needle-shaped holes. The inner diameter of the needle can be 0.1-0.2mm. The spraying area can also be determined based on the position of the nozzle and the wafer to cover the wafer. The two-fluid nozzle can be directly customized according to wafer requirements.

[0055] Specifically, Figure 5 As shown in the figure, when the gas, such as high-purity nitrogen, flows through the developing tube at a high speed, a core area of ​​high-speed airflow will be formed in the developing tube. The faster the speed of this core area, the lower the pressure in the central area. At the same time, the developer injected at the nozzle inlet also begins to flow along the nozzle toward the wafer, and is gradually subdivided into many tiny developer droplets by the shear force from the high-speed core airflow and the impact force of the surrounding airflow. The particle size of the developer droplets depends on many factors such as the airflow velocity in the developing tube, the liquid injection velocity, and the surface tension. Under appropriate conditions, the smaller the droplets, the larger the surface area, and the better they can be suspended to form a uniform and fine mist structure. Directly atomized onto the wafer surface, a better, consistent, and uniform development effect is achieved. In particular, it can perfectly solve the problems of incomplete development, unclean development, and edge jaggedness of ultra-narrow spacing and ultra-fine line width. At the same time, due to the increase in the surface area of ​​the atomized droplets, the developer solution is greatly saved. The spraying assembly 2 in the utility model is a shower type, using a shower type porous nozzle, which is in the form of a cone-mounted porous two-fluid nozzle, and its effect is to form a developing atomized film during development. It provides a good solution for solving the development process of high-difficulty products such as fine line width and narrow spacing. The development ensures that the solution is sprayed evenly, ensures the consistency of the development, and effectively provides the yield.

[0056] The utility model discloses a wafer developing device, which uses a wafer fixing device to fix a wafer 1 to be developed. Figure 6As shown, the wafer fixing device here can be a robot arm 9, through which the wafer 1 to be developed is placed directly above the wafer developing device of the utility model, and the wafer is developed and fixed by the spray assembly 2 arranged directly below the wafer 1 to be developed and the developer supply unit and the fixer supply unit connected thereto. During the development and fixing process, the spray assembly 2 directly sprays the developer or the fixer onto the wafer surface above it, and the wafer does not need to be rotated, thereby avoiding the developer splashing and contaminating the wafer due to the rotation of the wafer. In addition, the excess developer or the fixer falls back to the developer recovery unit or the fixer recovery unit located below the spray assembly due to gravity, thereby effectively realizing the secondary recycling of the developer and the fixer.

[0057] The developing process of the device of the utility model is as follows: the wafer 1 to be developed is transferred to the top of the spraying assembly 2 by the mechanical arm 9, such as Figure 6 As shown, the wafer is turned upside down, and the developer is transferred from the developer supply device 11 to the spray assembly 2 through the developer supply pump 5. Then the wafer 1 to be developed remains stationary, and the spray assembly 2 sprays the liquid. At the same time, the developer recovery chamber door 31 is opened to recover the residual developer sprayed, and the waste liquid is recovered and the reusable liquid is separated through the developer separation assembly 7. In this way, the remaining wafers can be developed in turn. More preferably, the spray assembly 2 here can also be set in a movable form to improve the convenience of using the equipment.

[0058] Similarly, the fixing process is as follows: the wafer 1 to be developed is transferred to the top of the spray assembly 2 by the robotic arm 9, and the wafer is turned upside down, the fixing liquid is transferred from the fixing liquid supply device 12 to the spray assembly by the fixing liquid supply pump 6, and then the wafer 1 to be developed remains stationary, the spray assembly 2 moves to spray the liquid, and at the same time the fixing liquid recovery chamber door 41 is opened to recover the residual fixing liquid sprayed, and the waste liquid is recovered and the reusable liquid is separated by the fixing liquid separation assembly 8, and the remaining wafers can be fixed in turn in this cycle.

[0059] The conveying process of the wafer 1 to be developed in the utility model is as follows: Figure 6As shown, the wafer 1 to be developed is transferred by a robot arm 9, and a wafer gripper 10 is provided on the robot arm 9. The wafer gripper 10 adopts an edge clamping method and is used to grasp the edge of the wafer within 1 to 2 mm. The gripper's clamping width can be set according to product requirements. The robot arm 9 adopts an AC servo motor for motion control. The rotation axis of the robot arm 9 has T (360-degree rotation), R (forward and backward), Z (up and down), and θ (the movement ability of the robot in parallel angle); after the robot arm 9 clamps the wafer 1 to be developed, it first goes to the pre-alignment unit for wafer pre-alignment. After the alignment is completed, the wafer 1 to be developed is transferred to the developing chamber, and the wafer 1 to be developed is turned face down and placed directly above the developing chamber. At this point, the wafer 1 to be developed is fixed, and the wafer 1 to be developed remains stationary during the development process. The wafer is fixed, which avoids the splashing of the liquid caused by the rotation of the wafer, thereby causing abnormal development phenomena such as unclean or incomplete development.

[0060] The utility model discloses a wafer developing device, wherein the wafer fixing device can be a mechanical arm 9, which is used to absorb and fix the wafer; the spraying component 2 is used to spray the developing solution or the fixing solution to the wafer, and has a developing solution back-sucking valve for absorbing the residual solution at the nozzle; of course, if Figure 7 As shown, in the present application, two spraying assemblies 2 can be provided, which are used to spray the developer and the fixer respectively, that is, the developer and the fixer can be different nozzles for distinguishing between the developer and the fixer; the developer supply device 11, which is connected to the spraying assembly 2; the fixer supply device 12, which is also connected to the spraying assembly 2; the developer supply pump 5, which is used to drive the developer in the developer supply device 11 to flow to the spraying assembly 2; the fixer supply pump 6, which is used to drive the fixer in the fixer supply device 12 to flow to the spraying assembly 2; the developer recovery chamber 3, which is used to carry and recover the developer. During development, the developer recovery chamber door 31 is opened, and the fixer recovery chamber door 41 is closed. After the development is completed, the developer recovery chamber door 31 is closed; the fixer recovery chamber 4 is used to carry and recover the fixer. During fixing, the fixing liquid recovery chamber door 41 is opened and the developer recovery chamber door 31 is closed. After fixing is completed, the fixing liquid recovery chamber door 41 is closed. The developer waste liquid recovery device 13 is used to collect the developer remaining after spraying. The developer separation component 7 separates the developer into reusable developer through the developer separation component 7, transmits it to the developer supply device 11, and discharges the waste liquid to be discharged to the developer waste liquid recovery device 13. The fixing waste liquid recovery device 14 is used to collect the fixing liquid remaining after spraying. The fixing liquid separation component 8 separates the fixing liquid into reusable fixing liquid through the fixing liquid separation component 8, transmits it to the fixing liquid supply device 12, and discharges the waste liquid to be discharged to the fixing waste liquid recovery device 14.

[0061] The developer separation component 7 and the fixer separation component 8 in the present invention can be existing components used in filtering processes, which are purchased from Cobite. Different types of separation components can be used according to different actual needs.

[0062] The above-mentioned developer separation and recovery process is that except for the developer sprayed onto the wafer surface during the development process, the rest of the developer sprayed out is collected in the developer waste liquid recovery device 13. The developing chamber integrates the developer recovery path and the fixer recovery path. Figure 8 As shown, when using developer, the developer recovery device recovery valve 171 is opened, the fixing solution recovery device recovery valve 181 is closed, and the developer recovery device waste valve 172 is opened to discharge the developer waste liquid into the developer recovery system 15 or the developer waste liquid recovery device 13; when using fixer, the fixer recovery device recovery valve 181 is opened, the developer recovery device separation valve is closed; and the fixer recovery device waste valve 182 is opened to discharge the fixer waste liquid into the fixer recovery system 16 or the fixer waste liquid recovery device 14. In this way, the developer supply device and the fixing solution supply device can be connected in a classified manner to achieve the effect of reuse. Various valves in the utility model can be electrically connected to the control system to achieve automatic control.

[0063] The utility model provides a method for spraying a developer, wherein after the wafer is adsorbed, the wafer is inverted face down, so that after the developer is sprayed and developed, it drips downward due to the effect of gravity and flows into a recovery device, and the recovery device is connected to a liquid supply device after filtering, and can be reused. The developer and fixing liquid are saved to the greatest extent. At the same time, the utility model provides a developing device, wherein the developing nozzle is a shower-type, and a shower-type porous nozzle is adopted, and its form is a cone-mounted porous two-fluid nozzle, and a developing atomized film is formed during development, which provides a good solution for solving the development process of high-difficulty products such as fine line width and narrow spacing. The development ensures that the solution is sprayed evenly, ensures the consistency of the development, and effectively provides the yield. The developing device provided by the utility model is that the wafer is stationary and does not need to be rotated at high speed, which reduces the splashing of the solution caused by the centrifugal force generated by the high-speed rotation of the wafer, resulting in unclean development or waste of developer, and other problems that cannot be solved by traditional processes. The developing device provided by the utility model is provided with a collecting and separating device for chemical liquid, and the developing liquid and fixing liquid generated in the developing operation process can be collected and recycled, thereby improving the utilization rate of the developing liquid and effectively saving costs in the mass production process.

[0064] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer developing device, characterized in that: It comprises a spraying assembly (2), wherein the spraying assembly (2) has a nozzle arranged vertically upward; The spraying assembly (2) is connected to a developer supply unit and a fixer supply unit; a developer recovery unit and a fixer recovery unit are provided below the spraying assembly (2); The developer recovery unit is connected to the developer supply unit, and the fixer recovery unit is connected to the fixer supply unit.

2. A wafer developing device according to claim 1, characterized in that: The developer liquid recovery unit comprises a developer liquid recovery chamber (3) and a developer waste liquid recovery device (13), and the developer liquid recovery chamber (3), the developer waste liquid recovery device (13) and the developer liquid supply unit can all be connected and disconnected; the fixer liquid recovery unit comprises a fixer liquid recovery chamber (4) and a fixer waste liquid recovery device (14), and the fixer liquid recovery chamber (4), the fixer waste liquid recovery device (14) and the fixer liquid supply unit are all connected and disconnected.

3. A wafer developing device according to claim 2, characterized in that: The developer liquid recovery chamber (3) is sleeved on the outside of the fixer liquid recovery chamber (4); a gap layer is provided between the developer liquid recovery chamber (3) and the fixer liquid recovery chamber (4).

4. A wafer developing device according to claim 2, characterized in that: The developer recovery chamber (3) comprises a developer recovery chamber door (31) and a developer recovery chamber (32); the fixer recovery chamber (4) comprises a fixer recovery chamber door (41) and a fixer recovery chamber (42).

5. A wafer developing device according to claim 4, characterized in that: The wafer developing device also includes a control system, and the control system is electrically connected to the developer recovery chamber door (31) and the fixer recovery chamber door (41).

6. The wafer developing device according to claim 4, characterized in that: The developer recovery chamber door (31) and the fixer recovery chamber door (41) are located directly below the wafer to be developed (1), and the orthographic projection of the wafer to be developed (1) on the developer recovery chamber door (31) and the fixer recovery chamber door (41) is located inside the developer recovery chamber door (31) and the fixer recovery chamber door (41).

7. The wafer developing device according to claim 4, characterized in that: The developer recovery chamber door (31) and the fixer recovery chamber door (41) are arc surfaces, and the developer recovery chamber (32) and the fixer recovery chamber (42) are both located outside the arc surfaces.

8. The wafer developing device according to claim 4, characterized in that: The bottom of the developer recovery chamber (32) is connected to a developer recovery pipe (33), the developer recovery pipe (33) comprising a first main recovery pipe (331), a first branch recovery pipe (332) and a second branch recovery pipe (333) both of which can be connected and disconnected with the first main recovery pipe (331), the free end of the first branch recovery pipe (332) being connected to the developer supply unit, and the free end of the second branch recovery pipe (333) being connected to the developer waste liquid recovery device (13); A fixing liquid recovery pipe (43) is provided at the bottom of the fixing liquid recovery chamber (42), and the fixing liquid recovery pipe (43) includes a second main recovery pipe (431) and a third branch recovery pipe (432) and a fourth branch recovery pipe (433) both of which are connected to the second main recovery pipe (431). The free end of the third branch recovery pipe (432) is connected to the fixing liquid supply unit, and the free end of the fourth branch recovery pipe (433) is connected to the fixing waste liquid recovery device (14).

9. The wafer developing device according to claim 8, characterized in that: The first main recovery pipe (331) is provided with a developer separation component (7), and the first branch recovery pipe (332) and the second branch recovery pipe (333) are both connected to the developer separation component (7); the second main recovery pipe (431) is provided with a fixer separation component (8), and the third branch recovery pipe (432) and the fourth branch recovery pipe (433) are both connected to the fixer separation component (8).

10. The wafer developing device according to claim 1, characterized in that: The spraying component (2) is a two-fluid spray head.

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