Memory module

Abstract

The utility model provides a memory module, the memory module is arranged in a slot, the slot is provided with two first buckling parts which are respectively arranged at two sides of the slot, the memory module comprises a circuit board, a first radiating fin and a second radiating fin, the circuit board comprises a first surface, a second surface and a plurality of first chips, the plurality of first chips are arranged on the first surface, the first radiating fin is adjacent to the first surface of the circuit board and comprises a body, two ear parts and an accommodating through hole, the two ear parts are arranged on the two opposite side edges of the body so as to be respectively buckled on the corresponding first buckling parts, the accommodating through hole is formed in the body in a penetrating manner, and the first chip is arranged on the accommodating through hole. The first radiating fins are provided with accommodating through holes, the accommodating through holes correspond to the first chips in space, and the second radiating fins are clamped in the corresponding accommodating through holes of the first radiating fins so as to be attached to the corresponding first chips.

Description

Technical Field

[0001] The utility model relates to a memory module, in particular to a memory module with a heat sink. Background Art

[0002] Most memory modules today are connected to each other by inserting gold fingers into memory module slots, but it is easy for the memory modules to shift or fall off due to vibration. In addition, when memory modules are used in various special environments, the memory modules are exposed to high temperature, high pressure and poor ventilation, which can easily cause abnormalities in the computer during operation, resulting in data loss or component damage, making traditional memory modules less safe and with poorer yields. In addition, in actual applications, memory modules of different frequencies generate different amounts of heat. For example, the higher the frequency, the higher the heat, and the lower the frequency, the lower the heat. However, traditional memory modules use heat sinks of the same material fixed inside the memory module for heat dissipation at different frequencies, resulting in uneven heat dissipation capabilities.

[0003] Therefore, how to develop a memory module that overcomes the above disadvantages is an urgent need. Utility Model Content

[0004] The purpose of the present invention is to provide a memory module arranged in a slot, and the first heat sink uses two ears to buckle with the first buckle part of the slot, which means that the memory module of the present invention is not only arranged in the slot in an inserted manner, but also achieves a double fixing effect by buckling the two ears of the first heat sink in the first buckle part of the slot, so that when the entire electronic device vibrates, the memory module can be fixed in the slot and has a higher stability. In addition, the memory module of the present invention includes a first heat sink and a second heat sink, so that the two heat sinks are used for heat dissipation, thereby improving the safety and yield of the memory module of the present invention. In addition, the second heat sink of the memory module of the present invention is engaged in the corresponding accommodation perforation of the first heat sink to fit with the corresponding first chip, which means that the second heat sink of the present invention is not fixed but replaceable, so the second heat sink can be replaced according to its needs, for example, when the thermal energy of the memory module is high, the second heat sink with a higher heat dissipation coefficient can be selected, and when the thermal energy is low, the second heat sink with a lower heat dissipation coefficient can be selected to improve the heat dissipation capacity of the memory module of the present invention.

[0005] To achieve the above-mentioned purpose, a more general implementation of the present invention is to provide a memory module, which is arranged in a slot, and the slot has two first buckle parts, which are respectively located on both sides of the slot, and the memory module includes a circuit board, a first heat sink and at least one second heat sink. The circuit board includes a first surface, a second surface and a plurality of first chips, and the plurality of first chips are arranged on the first surface. The first heat sink is adjacent to the first surface of the circuit board, and includes a body, two ears and at least one accommodating through hole, the two ears are arranged on two opposite sides of the body to respectively buckle with the corresponding first buckle parts, at least one accommodating through hole is penetrated in the body, and at least one accommodating through hole corresponds to the plurality of first chips in space. At least one second heat sink is engaged in the corresponding at least one accommodating through hole of the first heat sink to fit with the corresponding first chip.

[0006] According to one embodiment of the present invention, the material and thickness of the at least one second heat sink are replaceable.

[0007] According to one embodiment of the present invention, the circuit board includes a plurality of second chips arranged on the second surface of the circuit board.

[0008] According to one embodiment of the present invention, the memory module further includes a third heat sink adjacent to the second surface of the circuit board to fit with the plurality of second chips.

[0009] According to one embodiment of the present invention, each ear portion includes a first extension portion, a second extension portion and a second snap-fit ​​portion, wherein the first extension portion is formed by extending from one side of the main body toward a direction perpendicular to the main body, the second extension portion is formed by extending from one end of the first extension portion toward a direction perpendicular to the first extension portion and away from the main body, and the second snap-fit ​​portion is formed by extending from one end of the second extension portion away from the main body toward a direction perpendicular to the second extension portion and away from the first extension portion.

[0010] According to one embodiment of the present invention, the connection between the first extension portion and the second extension portion of each ear portion is an elastic structure.

[0011] According to one embodiment of the present invention, the second buckle portion of each ear has a reverse hook structure.

[0012] According to one embodiment of the present invention, each ear portion is buckled with the corresponding first buckle portion of the slot via the second buckle portion.

[0013] According to one embodiment of the present invention, the circuit board has a gold finger disposed on one side of the circuit board, wherein the gold finger contacts a conductive end in the slot when the circuit board is disposed in the slot.

[0014] The beneficial effect of the present invention is that the memory module of the present invention is arranged in the slot, and the first heat sink utilizes two ears to buckle with the first buckle part of the slot, which means that the memory module of the present invention is not only arranged in the slot in an inserted manner, but also achieves a double fixing effect by buckling the two ears of the first heat sink in the first buckle part of the slot. Therefore, when the entire electronic device vibrates, the memory module can be fixed in the slot and has higher stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the memory module of the utility model being arranged in a slot;

[0016] Figure 2 for Figure 1 A schematic diagram of the structure of the memory module shown;

[0017] Figure 3 for Figure 1 The exploded structural diagram of the memory module shown;

[0018] Figure 4 for Figure 1 An exploded structural diagram of the memory module shown in another perspective; and

[0019] Figure 5A and Figure 5B They are Figure 1 FIG. 1 is an assembly flow chart showing the assembly of a memory module into a socket.

[0020] The reference numerals are as follows:

[0021] 1: Memory module

[0022] 2: Slot

[0023] 21: First buckle part

[0024] 3: Circuit board

[0025] 31: Side 1

[0026] 32: Side 2

[0027] 33: First Chip

[0028] 34: Second chip

[0029] 35: Gold Finger

[0030] 4: First heat sink

[0031] 41: Ontology

[0032] 411: First side

[0033] 412: Second side

[0034] 413: Third side

[0035] 414: The fourth side

[0036] 42: Ear

[0037] 421: First extension

[0038] 421a: Protrusion

[0039] 422: Second extension

[0040] 423: Second buckle part

[0041] 43: Accommodate perforation

[0042] 5: Second heat sink

[0043] 6: The third heat sink DETAILED DESCRIPTION

[0044] Some typical embodiments that embody the features and advantages of the utility model will be described in detail in the following description. It should be understood that the utility model can have various changes in different ways without departing from the scope of the utility model, and the description and drawings therein are essentially used for illustration rather than for limiting the utility model.

[0045] See also Figures 1 to 4 ,in Figure 1 is a schematic diagram of the structure of the memory module of the utility model being arranged in a slot, Figure 2 for Figure 1 The structural diagram of the memory module shown in FIG. Figure 3 for Figure 1 The exploded structural diagram of the memory module shown in FIG. Figure 4 for Figure 1 The exploded structural diagram of the memory module from another perspective is shown in FIG. Figure 1 As shown, the memory module 1 of the present invention is disposed in a slot 2 of an electronic device (not shown) to receive a signal transmitted by the electronic device through the slot 2 or to transmit a signal to the slot 2 of the electronic device. The slot 2 has two first buckle portions 21, which are respectively located on the left and right sides of the slot 2. For example, each first buckle portion 21 has a hole or a hook portion for engagement or hooking.

[0046] like Figures 2 to 4As shown, the memory module 1 includes a circuit board 3, a first heat sink 4, two second heat sinks 5 and a third heat sink 6. The circuit board 3 includes a first surface 31, a second surface 32, a plurality of first chips 33, a plurality of second chips 34 and a gold finger 35. The first surface 31 and the second surface 32 of the circuit board 3 are arranged opposite to each other, and the plurality of first chips 33 are arranged in sequence on the first surface 31 of the circuit board 3, as shown in FIG. Figure 2 As shown, the plurality of first chips 33 are divided into two regions, such as a first region and a second region, and the number of first chips 33 in each region is four, and there is a gap between the first chips 33 in the two regions. The plurality of second chips 34 are arranged in sequence on the second surface 32 of the circuit board 3, and the positions of the plurality of second chips 34 arranged on the second surface 32 of the circuit board 3 correspond to the positions of the plurality of first chips 33 arranged on the first surface 31 of the circuit board 3 in space at least in part. The gold fingers 35 are arranged on one side of the circuit board, and part of the gold fingers 35 are located on the first surface 31 of the circuit board 3 and parallel to the arrangement direction of the plurality of first chips 33, and another part of the gold fingers 35 are located on the second surface 32 of the circuit board 3 and parallel to the arrangement direction of the plurality of second chips 34, wherein when the memory module 1 is arranged in the slot 2, the gold fingers 35 contact the conductive end (not shown) in the slot 2, so that the memory module 1 receives the signal transmitted by the electronic device 2 or transmits the signal to the electronic device 2 through the gold fingers 35.

[0047] The first heat sink 4 is adjacent to and attached to the first surface 31 of the circuit board 3, and includes a body 41, two ears 42 and two receiving holes 43. Figure 1As shown, the body 41 includes a first side 411, a second side 412, a third side 413 and a fourth side 414, wherein the first side 411 and the second side 412 of the body 41 are disposed oppositely, and the third side 413 and the fourth side 414 of the body 41 are disposed oppositely and located between the first side 411 and the second side 412. Two ears 42 are disposed on two opposite sides of the body 41, namely, the third side 413 and the fourth side 414 of the body 41, respectively, and each ear 42 includes a first extension portion 421, a second extension portion 422 and a second buckle portion 423. The first extension portion 421 is formed by the third side 413 of the body 41 extending in a direction perpendicular to the body 41, and in this embodiment, the first extension portion 421 has a protrusion 421a, each protrusion 421a is formed by the first extension portion 421 extending from one end away from the body 41 toward the other protrusion 421a, wherein the circuit board 3 is located between the two first extension portions 421 of the two ears 42 of the first heat sink 4, and between the body 41 of the first heat sink 4 and the corresponding protrusion 421a, which means that the first heat sink 4 uses the structure of the protrusion 421a of the two first extension portions 421 to set the circuit board 3 between the two first extension portions 421. The second extension portion 422 is formed by the first extension portion 421 extending from one end away from the first side 411 in a direction perpendicular to the first extension portion 421 and away from the body 41, wherein the connection between the second extension portion 422 and the first extension portion 421 is an elastic structure. The second snap portion 423 is formed by an end of the second extension portion 422 away from the main body 41 extending in a direction perpendicular to the second extension portion 422 and away from the first extension portion 421, wherein the second snap portion 423 has a hook structure. When the second snap portion 423 receives external force and drives the connection between the second extension portion 422 and the first extension portion 421 to also receive external force, the angle between the second extension portion 422 and the first extension portion 421 can be changed.

[0048] Two accommodating through holes 43 are respectively provided through the body 41, one of which is adjacent to the second side 412 and the third side 413 of the body 41, and corresponds in space to the four first chips 33 in the first area of ​​the circuit board 3, that is, when the first heat sink 4 is adjacent to and attached to the first surface 31 of the circuit board 3, the four first chips 33 in the first area of ​​the circuit board 3 are located in the accommodating through holes 43 corresponding to the first heat sink 4. The other accommodating through hole 43 is adjacent to the second side 412 and the fourth side 414 of the body 41, and corresponds in space to the four first chips 33 in the second area of ​​the circuit board 3, that is, when the first heat sink 4 is adjacent to and attached to the first surface 31 of the circuit board 3, the four first chips 33 in the second area of ​​the circuit board 3 are located in the accommodating through holes 43 corresponding to the first heat sink 4.

[0049] The two second heat sinks 5 are respectively engaged in the corresponding accommodation holes 43 of the first heat sink 4 to respectively fit with the corresponding first chips 33 located in the corresponding accommodation holes 43, so that the first chips 33 are cooled through the corresponding second heat sinks 5. In this embodiment, since the second heat sink 5 is not directly fixed in the corresponding accommodation holes 43 of the first heat sink 4, but is arranged in the corresponding accommodation holes 43 of the first heat sink 4 in an engaging manner, it means that the second heat sink 5 can be replaced according to its needs. In other words, the material and thickness of the second heat sink are both replaceable.

[0050] The third heat sink 6 is adjacent to and attached to the second surface 32 of the circuit board 3, so as to be attached to the plurality of second chips 34 located on the second surface 32 of the circuit board 3, so that the second chips 34 can dissipate heat through the third heat sink 6, wherein the third heat sink 6 is located between the two first extensions 421 of the two ears 42 of the first heat sink 4, and between the body 41 of the first heat sink 4 and the corresponding protrusion 421a, which means that the third heat sink 6 uses the structure of the protrusions 421a of the two first extensions 421 to set the circuit board 3 between the two first extensions 421. In this embodiment, the third heat sink 6, the circuit board 3 and the first heat sink 4 are arranged in parallel in sequence, and the two protrusions 421a of the two first extensions 421 of the first heat sink 4 buckle the third heat sink 6 and the circuit board 3, so that the first heat sink 4 is adjacent to and attached to the first surface 31 of the circuit board 3, and the third heat sink 6 is adjacent to and attached to the second surface 32 of the circuit board 3.

[0051] See also Figure 5A and Figure 5B And cooperate Figure 1 ,in Figure 5A and Figure 5B They are Figure 1 The memory module is assembled into the slot in the assembly flow chart shown in FIG. Figure 5A As shown in FIG. 1 , the memory module 1 and the slot 2 are aligned with each other. Figure 5BAs shown, since the connection between the second extension portion 422 and the first extension portion 421 is an elastic structure, when the second buckle portion 423 receives an external force and drives the connection between the second extension portion 422 and the first extension portion 421 to also receive an external force, the second extension portion 422 rotates toward the direction of the first extension portion 421 and drives the second buckle portion 423 to rotate in a direction away from the body 41, even if the angle between the first extension portion 421 and the body 41 gradually decreases from 90 degrees, and the distance between the second buckle portion 423 and the body 41 gradually increases, wherein when the distance between the second buckle portion 423 and the body 41 is greater than the thickness of the first buckle portion 21 of the slot 2, so that the second buckle portion 423 can use its undercut structure to engage with the first buckle portion 21 of the slot 2, the memory module 1 can be buckled in the slot 2, as shown in FIG. Figure 1 As shown, at this time, the gold finger 35 contacts the conductive end in the slot 2 , so that the memory module 1 receives the signal transmitted by the electronic device 2 or transmits the signal to the electronic device 2 via the gold finger 35 .

[0052] In summary, the memory module of the utility model is arranged in the slot, and the first heat sink uses two ears to buckle with the first buckle part of the slot, which means that the memory module of the utility model is not only arranged in the slot in an inserted manner, but also achieves a double fixing effect by buckling the two ears of the first heat sink in the first buckle part of the slot, so when the entire electronic device vibrates, the memory module can be fixed in the slot and has a higher stability. In addition, the memory module of the utility model includes a first heat sink and a second heat sink, so that the two heat sinks are used for heat dissipation, thereby improving the safety and yield of the memory module of the utility model. In addition, the second heat sink of the memory module of the utility model is engaged in the corresponding accommodation through hole of the first heat sink to fit with the corresponding first chip, which means that the second heat sink of the utility model is not fixed but replaceable, so the second heat sink can be replaced according to its needs, for example, when the thermal energy of the memory module is high, the second heat sink with a higher heat dissipation coefficient can be selected, and when the thermal energy is low, the second heat sink with a lower heat dissipation coefficient can be selected to improve the heat dissipation capacity of the memory module of the utility model.

Claims

1. A memory module is arranged in a slot, the slot having two first buckle portions, respectively located on two sides of the slot, characterized in that: And the memory module includes: A circuit board comprises a first surface, a second surface and a plurality of first chips, wherein the plurality of first chips are arranged on the first surface; a first heat sink, adjacent to the first surface of the circuit board, and comprising a body, two ears and at least one accommodating through hole, wherein the two ears are disposed at two opposite sides of the body to be respectively buckled with the corresponding first buckle portions, and the at least one accommodating through hole is penetrated through the body, and the at least one accommodating through hole corresponds to the plurality of first chips in space; as well as At least one second heat sink is engaged in the at least one corresponding accommodating through hole of the first heat sink to fit with the corresponding first chip.

2. The memory module according to claim 1, wherein: The material and thickness of the at least one second heat sink are replaceable.

3. The memory module according to claim 1, wherein: The circuit board includes a plurality of second chips arranged on the second surface of the circuit board.

4. The memory module according to claim 3, wherein: The memory module also includes a third heat sink adjacent to the second surface of the circuit board to fit with the plurality of second chips.

5. The memory module according to claim 1, wherein: Each of the ears includes a first extension portion, a second extension portion and a second snap portion, wherein the first extension portion is formed by extending from one side of the main body toward a direction perpendicular to the main body, the second extension portion is formed by extending from one end of the first extension portion toward a direction perpendicular to the first extension portion and away from the main body, and the second snap portion is formed by extending from one end of the second extension portion away from the main body toward a direction perpendicular to the second extension portion and away from the first extension portion.

6. The memory module according to claim 5, wherein: The connection between the first extension part and the second extension part of each ear part is an elastic structure.

7. The memory module according to claim 5, wherein: The second buckle portion of each ear portion has a reverse hook structure.

8. The memory module according to claim 5, wherein: Each ear portion is buckled with the corresponding first buckle portion of the slot via the second buckle portion.

9. The memory module according to claim 5, wherein: The circuit board has a gold finger arranged on one side of the circuit board, wherein the gold finger contacts a conductive end in the slot when the circuit board is arranged in the slot.

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