Inductor facilitating heat dissipation of DrMOS element

Abstract

The utility model discloses an inductor beneficial to heat dissipation of a DrMOS element. The inductor is an integrally-packaged molded body with a metal cell. A groove is formed in the bottom of the inductor, the groove is suitable for being compatible with any DrMOS element connected to the PCB, the inductor is connected to the PCB and stacked on the DrMOS element, the DrMOS element and the groove are connected together through heat-conducting glue, and the surface of the inductor with the superficial area increased by multiple times assists in heat dissipation. By applying the inductor structure, heat generated by the DrMOS element is quickly dissipated through the inductor, so that effective temperature control is achieved, and the improvement of the conversion efficiency of a DC-DC step-down transformer circuit is facilitated.

Description

Technical Field

[0001] The utility model relates to an inductor device, in particular to an inductor which is helpful for heat dissipation of a DrMOS element and a mounting structure thereof facing a PCB board, belonging to the technical field of basic electronic components. Background Art

[0002] Inductors are the most commonly used components in electronic devices and are widely used in various circuits to achieve the functions of filtering, energy storage, matching, and resonance. As electronic products become increasingly miniaturized and portable, and components are assembled with high density, inductor components have developed rapidly; and in consideration of electromagnetic compatibility, the ability of electronic products to resist electromagnetic interference has become a basic design requirement, which has increased the demand and application of inductors.

[0003] The three-in-one packaged DrMOS component has a quarter of the area of ​​a discrete MOSFET and three times the power density of a discrete MOSFET, increasing the potential for overvoltage and overclocking. Motherboards using DrMOS components can have features such as energy saving, high-efficiency overclocking, and low temperature. It can achieve higher power efficiency and reduce energy waste when the motherboard is operating at high load, thereby achieving power saving. In addition, when the system is operating at high load, the heat generated by the DrMOS component is low, and the temperature is about half lower than the temperature of the MOSFET in the traditional power supply part. However, the temperature of the DrMOS component when it is working is still maintained above 65°C, which will not be conducive to more stable working efficiency. Summary of the invention

[0004] In view of the above-mentioned defects in the prior art, the purpose of the utility model is to provide an inductor that helps to dissipate heat of a DrMOS component, and is dedicated to improving the conversion efficiency of a DC voltage drop circuit.

[0005] The technical solution for achieving the above-mentioned purpose of the utility model is: an inductor that helps to dissipate heat of a DrMOS component, which is an integrated packaged body with a metal core, characterized in that: a groove is set at the bottom of the inductor, and the groove is suitable for any DrMOS component connected to a PCB board to be compatible therein, the inductor is connected to the PCB board and stacked on the DrMOS component, and the DrMOS component and the groove are connected together by a thermally conductive adhesive.

[0006] Furthermore, the metal core in the inductor is an inverted U-shaped coil formed by bending a flat cable, and two ends of the inverted U-shaped coil are downwardly formed as electrode pins.

[0007] Furthermore, the metal core in the inductor is a closed-loop coil formed by winding a round wire, and two ends of the closed-loop coil are bent and extended in the same direction to form electrode pins.

[0008] Furthermore, the inductor is provided with a rectangular packaging shell outside the metal core which is solidified by cold pressing or hot pressing and baking.

[0009] Furthermore, the inductor is provided with a rectangular packaging shell outside the metal core that has been sintered and annealed at high temperature.

[0010] Furthermore, the molding die of the package shell is provided with a boss for molding the groove between the electrode pins corresponding to the inductor.

[0011] Furthermore, the DrMOS element is a plastic packaged chip or core including a switch MOS and a driver chip.

[0012] Compared with the prior art, the advantages of using the inductor of the utility model are reflected in: the inductor and the DrMOS component on the PCB board are stacked up and down, and the surfaces of the two are connected into one by thermal conductive glue, so that the heat of the DrMOS component can be quickly dissipated through the inductor. This temperature control structure is more conducive to improving the conversion efficiency of the DC-DC step-down transformer circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The utility model is a schematic diagram of the assembly structure of an inductor which helps to dissipate heat of a DrMOS component. DETAILED DESCRIPTION

[0014] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0015] like Figure 1As shown, the inductor of the utility model that helps the heat dissipation of the DrMOS element is an integrated packaged body with a metal core 3, which inherits the functions realized by the assembly and integration of various inductors on the PCB board. The difference in the internal structure design and functional parameters of various inductors is not the focus of the protection requested by this application, so only the basic structure of the inductor is generally described. Since the surface area of ​​the integrated packaged inductor is often much larger than the surface area of ​​various DrMOS element microchips 2 (also referred to as DrMOS elements) integrated on demand on the PCB board 1. Therefore, for the purpose of protecting such microchips and quickly dissipating heat, the present application proposes a structural improvement on the appearance of the inductor. In summary: a groove 6 is set at the bottom of the inductor, and the groove is suitable for any DrMOS element connected to the PCB board 1. The inductor is also connected to the PCB board as a whole and stacked on the DrMOS element, and the DrMOS element and the groove are connected together by a thermal conductive adhesive (not shown). Among them, the DrMOS element is a plastic-encapsulated chip or core containing a switch MOS and a driver chip.

[0016] It is understandable that, by applying the improved structure of the inductor of the present application, in the circuit design of the PCB board, the butt welding point of the inductor can be reserved around the soldering position of the DrMOS component, and a certain thickness of thermal conductive glue can be applied on the surface of the DrMOS component after the DrMOS component is installed, and then the inductor is welded on the PCB board in position, and the groove surface of the inductor is in full contact with the thermal conductive glue in the overlapping area. Therefore, when the entire circuit board and all the electronic components integrated therein are running and implementing functions, the heat generated by the DrMOS component can be quickly transferred to the outer wall of the inductor, and a larger surface area can be used for external heat exchange.

[0017] As can be seen from the figure, the metal core 3 in the inductor of the preferred embodiment is an inverted U-shaped coil formed by bending a flat cable, and the two ends of the inverted U-shaped coil are downwardly formed as electrode pins 5. Of course, depending on the type of inductor, its metal core can also be a closed-loop coil formed by winding a round wire, and the two ends of the closed-loop coil can also be bent and extended in the same direction to form electrode pins (omitted from the figure).

[0018] On the other hand, the inductor is provided with a packaging shell 4 outside the metal core. From the perspective of the optional molding process, the packaging shell can be a mixture of one or more of iron powder / FeSi / FeSiCr / FeSiAl / FeNi / amorphous / nanocrystalline, which is cold pressed or hot pressed and baked in a prefabricated mold to form a rectangular shape. The molding pressure is between 8-10T / cm², and the curing is baked at 160-180℃ for 2-4 hours; it can also be a mixture of one or more of FeSi / FeNi / FeSiAl / amorphous / nanocrystalline, combined with silicone resin or silicone resin for high temperature sintering, and then annealed at 250-850℃ for 1-2 hours under nitrogen protection. Of course, the molding mold of the packaging shell is provided with a boss for molding a groove between the electrode pins of the corresponding inductor.

[0019] From the above detailed description of the preferred embodiment of the inductor of the utility model that helps to dissipate heat of the DrMOS component, it can be seen that compared with the prior art, this solution has substantial characteristics and progress, and its technical effect is manifested as follows: the inductor is stacked up and down with the DrMOS component on the PCB board, and the surfaces of the two are connected into one by thermal conductive glue, so that the heat of the DrMOS component can be quickly dissipated through the inductor. The temperature control structure is more conducive to improving the conversion efficiency of the DC-DC step-down transformer circuit, and it is suitable for promotion and application in equipment scenarios such as servers and data centers.

[0020] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. An inductor that helps dissipate heat from a DrMOS device, which is an integrally packaged body having a metal core, and is characterized by: A groove is arranged at the bottom of the inductor, and the groove is suitable for any DrMOS component connected to the PCB board to fit therein. The inductor is connected to the PCB board and stacked on the DrMOS component, and the DrMOS component and the groove are connected together by heat conductive adhesive.

2. The inductor for dissipating heat from a DrMOS device according to claim 1, characterized in that: The metal core in the inductor is an inverted U-shaped coil formed by bending a flat cable, and two ends of the inverted U-shaped coil are downwardly formed as electrode pins.

3. The inductor according to claim 1 that helps dissipate heat from a DrMOS device, characterized in that: The metal core in the inductor is a closed-loop coil formed by winding a round wire, and two ends of the closed-loop coil are bent and extended in the same direction to form electrode pins.

4. The inductor according to claim 1 that helps dissipate heat from a DrMOS device, characterized in that: The inductor is provided with a rectangular packaging shell outside the metal core which is cold pressed or hot pressed and baked and solidified.

5. The inductor according to claim 1 that helps dissipate heat of a DrMOS device, characterized in that: The inductor is provided with a rectangular packaging shell which is sintered and annealed at high temperature outside the metal core.

6. The inductor for facilitating heat dissipation of a DrMOS device according to claim 4 or 5, characterized in that: The molding die of the package shell is provided with a boss for molding the groove between the electrode pins corresponding to the inductor.

7. The inductor according to claim 1 that helps dissipate heat from a DrMOS device, characterized in that: The DrMOS element is a plastic package chip or core including a switch MOS and a driver chip.

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