Tabletting structure for semiconductor packaging

Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to a tabletting structure for semiconductor packaging, which comprises a substrate, a fixed column is fixedly mounted on the upper surface of the substrate, an upper mold is movably mounted on the side wall of the fixed column, a bearing frame is fixedly mounted on the upper mold, a guide plate is connected to the upper surface of the bearing frame in a penetrating manner, and the guide plate is movably mounted on the fixed column. A fixing rod is fixedly installed at one end of the guide plate, one end of the fixing rod is connected into the upper mold in a penetrating mode, a pressing piece is fixedly installed at one end of the fixing rod, the pressing piece is connected with the inner top of the mold cavity in an attached mode, and a pushing assembly is fixedly installed on the upper surface of the bearing frame. According to the utility model, when the chip is placed in the die cavity and is wrapped by resin, the guide plate drives the pressing sheet to extrude the resin, so that the strength of the resin can be enhanced through pressure, the resin is more uniform, and the situation that the brittleness of a finished product is large due to cracks generated by the resin is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a tablet pressing structure for semiconductor packaging. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resins are used to connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate to form the required circuit.

[0003] Publication (Announcement) No.: CN204792754U, discloses a semiconductor packaging structure. According to an embodiment of the utility model, the semiconductor packaging structure includes: a chip, having a front side with an electronic circuit and a back side opposite to the front side; pins, connected to the chip by leads; a plastic package shell, shielding the chip, pins and leads from above; wherein the back side of the chip and the back side of the pins are exposed to the lower surface of the plastic package shell, and the back side of the chip is recessed in the semiconductor packaging structure. The semiconductor packaging structure of the utility model does not have a base layer of a lead frame, thereby reducing the thickness of the semiconductor packaging structure; and since one side of the chip is exposed outside the semiconductor packaging structure, the heat dissipation performance of the semiconductor packaging structure is improved.

[0004] The problem with the prior art is that current semiconductors need to be covered with resin for preservation during the production process, but when the resin is filled, cracks are easily generated in the resin during the processing, resulting in high brittleness of the finished product, and it is not convenient to limit the semiconductor when transporting it. Therefore, we propose a tableting structure for semiconductor packaging. Utility Model Content

[0005] The purpose of the utility model is to provide a pressing sheet structure for semiconductor packaging, so as to solve the problem that the current semiconductor needs to be covered with resin for preservation during the production process, but when the resin is filled, cracks are easily generated in the resin during the processing, resulting in high brittleness of the finished product, and it is inconvenient to limit the semiconductor when transporting the semiconductor.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The utility model is achieved in this way: a tablet pressing structure for semiconductor packaging comprises a substrate, a lower mold is fixedly installed on the upper surface of the substrate, a feeding tube is installed on the side wall of the lower mold, a fixing column is fixedly installed on the upper surface of the substrate, an upper mold is movably installed on the side wall of the fixing column, a carrying frame is fixedly installed on the upper mold, a guide plate is inserted and connected on the upper surface of the carrying frame, a fixing rod is fixedly installed on one end of the guide plate, one end of the fixing rod is inserted and connected in the upper mold, a tablet is fixedly installed on one end of the fixing rod, and the tablet is fit-connected with the top of the mold cavity, a pushing component is fixedly installed on the upper surface of the carrying frame, one end of the pushing component is fixedly installed on the guide plate, a baffle is fixedly installed on the side wall of the substrate, a conveyor belt is fixedly installed on the inner wall of the baffle, a limiting plate is movably installed on the inner wall of the baffle, the limiting plate is fit-connected with the conveyor belt, a fixing frame is movably installed on the upper surface of the baffle, and a clamping component is fixedly installed on one end of the fixing frame.

[0008] As a further solution of the utility model: the pushing assembly includes a first electric slide, the first electric slide is fixedly installed on the upper surface of the carrier frame, a rotating shaft is rotatably installed on the first electric slide, a pushing rod is fixedly installed on the rotating shaft, a rotating seat is fixedly installed on the guide plate, and one end of the pushing rod is rotatably installed on the rotating seat.

[0009] As a further solution of the utility model: an electric push rod is embedded in the inner wall of the baffle, and the side wall of the limit plate is fixedly installed on the electric push rod.

[0010] As a further solution of the utility model: the side wall of the fixed column is fixedly mounted with a second electric slide, and the side wall of the upper mold is fixedly mounted on the working slide of the second electric slide.

[0011] As a further solution of the utility model: a third electric slide is fixedly mounted on the upper surface of the baffle, and a lower surface of the fixing frame is fixedly mounted on a working slide of the third electric slide.

[0012] As a further solution of the utility model: the clamping assembly includes a clamping seat, a clamping seat is fixedly installed on one end of the fixing frame, a square groove is opened on the clamping seat, threaded rods are rotatably installed on both ends of the inner wall of the square groove, two groups of the threaded rods are connected by a connecting block, the two groups of the threaded rods are arranged oppositely, a motor is fixedly installed on the side wall of the clamping seat, the output shaft of the motor is inserted and connected to the clamping seat, and the output shaft of the motor is fixedly connected to one end of the two groups of threaded rods.

[0013] As a further solution of the utility model: threaded sleeves are slidably installed on the two groups of threaded rods, and clamping plates are fixedly installed on the two groups of threaded sleeves.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] 1. In the utility model, the first electric slide is installed on the upper surface of the carrier, the first electric slide is rotatably connected to the push rod through the rotating shaft, one end of the push rod is rotatably installed on the rotating seat on the guide plate, the guide plate is inserted and connected to the carrier, one end of the guide plate is connected to the pressing sheet through the fixed rod, and the pressing sheet is slidably installed in the mold cavity of the upper mold and is closely connected with the top of the mold cavity, so that the sliding of the first electric slide is achieved, so that the push rod drives the guide plate to slide, and the movement of the guide plate drives the pressing sheet to move in the mold cavity of the upper mold, and the second electric The slide drives the upper mold and the lower mold to fit together, so that when the chip is placed in the mold cavity and wrapped with resin, the guide plate drives the pressing plate to squeeze the resin, so that the strength of the resin can be enhanced through pressure, making the resin more uniform, thereby reducing the cracks in the resin, which leads to high brittleness of the finished product. The electric push rod is embedded in the baffle and connected to the limit plate, and the limit plate is fit connected to the conveyor belt, so that when the conveyor belt transports the chip, the movement of the limit plate can limit the position of the chip, thereby facilitating the clamping of the clamping assembly.

[0016] 2. In the utility model, a fixing frame is installed on the third electric slide, and a clamping assembly is installed at one end of the fixing frame, so that one end of the fixing frame can drive the clamping assembly to move forward, and a fixing frame is installed on one end of the fixing frame through a clamping seat. Threaded rods are rotatably installed at both ends of the inner wall of the square groove on the clamping seat, and one end of the two groups of threaded rods are installed on the output shaft of the motor. The two groups of threaded rods are arranged oppositely. When the motor rotates, it drives the two groups of threaded rods to rotate in the opposite direction, so that the two groups of threaded sleeves sliding on the threaded rods drive the clamping plates to move inward or outward at the same time, so that when the conveyor belt conveys the chip, the two groups of clamping plates slide in the same direction, so that the chip can be clamped and fixed, and then placed in the lower mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the overall structure provided by an embodiment of the utility model;

[0018] Figure 2 It is a schematic diagram of the structure of the pushing assembly provided by an embodiment of the utility model;

[0019] Figure 3 It is a schematic diagram of the structure of the clamping assembly provided in an embodiment of the utility model.

[0020] In the figure: 1. base plate; 2. fixed column; 3. second electric slide; 4. baffle; 5. limit plate; 6. support frame; 7. electric push rod; 8. guide plate; 9. clamping assembly; 10. third electric slide; 11. pushing assembly; 12. conveyor belt; 13. fixed frame; 14. feed pipe; 15. fixed rod; 16. pressing sheet; 17. upper mold; 18. lower mold; 111. first electric slide; 112. rotating shaft; 113. pushing rod; 114. rotating seat; 901. clamping seat; 902. threaded rod; 903. connecting block; 904. motor; 905. threaded sleeve; 906. clamping plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figures 1 to 3 In the embodiment of the utility model, a pressing sheet structure for semiconductor packaging includes a substrate 1, a lower mold 18 is fixedly installed on the upper surface of the substrate 1, a feeding tube 14 is installed on the side wall of the lower mold 18, a fixing column 2 is fixedly installed on the upper surface of the substrate 1, an upper mold 17 is movably installed on the side wall of the fixing column 2, a carrier 6 is fixedly installed on the upper mold 17, a guide plate 8 is inserted and connected on the upper surface of the carrier 6, a fixing rod 15 is fixedly installed on one end of the guide plate 8, one end of the fixing rod 15 is inserted and connected in the upper mold 17, a pressing sheet 16 is fixedly installed on one end of the fixing rod 15, and the pressing sheet 16 is fitted and connected with the top of the mold cavity, a pushing component 11 is fixedly installed on the upper surface of the carrier 6, one end of the pushing component 11 is fixedly installed on the guide plate 8, a baffle 4 is fixedly installed on the side wall of the substrate 1, and a feeding plate 16 is fixedly installed on the inner wall of the baffle 4 A limiting plate 5 is movably installed on the inner wall of the baffle 4, and the limiting plate 5 is closely connected to the conveyor belt 12. A fixing frame 13 is movably installed on the upper surface of the baffle 4, and a clamping assembly 9 is fixedly installed on one end of the fixing frame 13. The pushing assembly 11 includes a first electric slide 111, and a first electric slide 111 is fixedly installed on the upper surface of the carrier frame 6. A rotating shaft 112 is rotatably installed on the first electric slide 111, and a pushing rod 113 is fixedly installed on the rotating shaft 112. A rotating seat 114 is fixedly installed on the guide plate 8, and one end of the pushing rod 113 is rotatably installed on the rotating seat 114. An electric push rod 7 is inlaid on the inner wall of the baffle 4, and the side wall of the limiting plate 5 is fixedly installed on the electric push rod 7. The side wall of the fixed column 2 is fixedly installed with a second electric slide 3, and the side wall of the upper mold 17 is fixedly installed on the working slide of the second electric slide 3.

[0023] Among them, the first electric slide 111 is installed on the upper surface of the carrier 6, the first electric slide 111 is rotatably connected with the push rod 113 through the rotating shaft 112, one end of the push rod 113 is rotatably installed on the rotating seat 114 on the guide plate 8, the guide plate 8 is inserted and connected to the carrier 6, one end of the guide plate 8 is connected to the pressing plate 16 through the fixing rod 15, and the pressing plate 16 is slidably installed in the mold cavity of the upper mold 17 and is closely connected with the top of the mold cavity, so that the sliding of the first electric slide 111 is achieved, so that the push rod 113 drives the guide plate 8 to slide, and the movement of the guide plate 8 drives the pressing plate 16 in the mold cavity of the upper mold 17 The second electric slide 3 drives the upper mold 17 and the lower mold 18 to fit together, so that when the chip is placed in the mold cavity and wrapped by the resin, the guide plate 8 drives the pressing sheet 16 to squeeze the resin, so that the strength of the resin can be enhanced by pressure, making the resin more uniform, thereby reducing the cracks in the resin, which leads to the brittleness of the finished product. The electric push rod 7 is embedded in the baffle 4 and connected to the limit plate 5, and the limit plate 5 is fitly connected to the conveyor belt 12, so that when the conveyor belt 12 transports the chip, the movement of the limit plate 5 can limit the position of the chip, thereby facilitating the clamping of the clamping assembly 9.

[0024] See also Figure 1 and Figure 3 A third electric slide 10 is fixedly installed on the upper surface of the baffle 4, and a lower surface of the fixed frame 13 is fixedly installed on the working slide of the third electric slide 10. The clamping assembly 9 includes a clamping seat 901, and a clamping seat 901 is fixedly installed on one end of the fixed frame 13. A square groove is opened on the clamping seat 901, and threaded rods 902 are rotatably installed at both ends of the inner wall of the square groove. The two groups of threaded rods 902 are connected by a connecting block 903, and the two groups of threaded rods 902 are oppositely arranged. A motor 904 is fixedly installed on the side wall of the clamping seat 901, and the output shaft of the motor 904 is inserted and connected to the clamping seat 901. The output shaft of the motor 904 is fixedly connected to one end of the two groups of threaded rods 902, and threaded sleeves 905 are slidably installed on the two groups of threaded rods 902, and clamping plates 906 are fixedly installed on the two groups of threaded sleeves 905.

[0025] Among them, it is installed on the third electric slide 10 through a fixed frame 13, and a clamping assembly 9 is installed at one end of the fixed frame 13, so that one end of the fixed frame 13 can drive the clamping assembly 9 to move forward, and is installed on one end of the fixed frame 13 through a clamping seat 901. Threaded rods 902 are rotatably installed at both ends of the inner wall of the square groove on the clamping seat 901, and one end of the two groups of threaded rods 902 are installed on the output shaft of the motor 904. The two groups of threaded rods 902 are arranged oppositely. The motor 904 rotates to drive the two groups of threaded rods 902 to rotate in the opposite direction, so that the two groups of threaded sleeves 905 sliding on the threaded rods 902 drive the clamping plates 906 to move inward or outward at the same time, so that when the conveyor belt 12 transports the chip, the two groups of clamping plates 906 slide in the same direction, so that the chip can be clamped and fixed, and then placed in the lower mold 18.

[0026] The working principle of this utility model:

[0027] When in use, the first electric slide 111 is installed on the upper surface of the carrier 6, the first electric slide 111 is rotatably connected to the push rod 113 through the rotating shaft 112, one end of the push rod 113 is rotatably installed on the rotating seat 114 on the guide plate 8, the guide plate 8 is inserted and connected to the carrier 6, one end of the guide plate 8 is connected to the pressing plate 16 through the fixing rod 15, and the pressing plate 16 is slidably installed in the mold cavity of the upper mold 17 and is closely connected to the top of the mold cavity, so that the sliding of the first electric slide 111 is achieved, so that the push rod 113 drives the guide plate 8 to slide, and the movement of the guide plate 8 drives the pressing plate 16 to move in the mold cavity of the upper mold 17. The upper mold 17 and the lower mold 18 are connected in a close connection with each other, so that when the chip is placed in the mold cavity and wrapped with resin, the guide plate 8 drives the pressing sheet 16 to squeeze the resin, so that the strength of the resin can be enhanced by pressure, making the resin more uniform, thereby reducing the cracks in the resin, which leads to the brittleness of the finished product. The electric push rod 7 is embedded in the baffle 4 and connected to the limit plate 5, and the limit plate 5 is connected to the conveyor belt 12, so that when the conveyor belt 12 transports the chip, the movement of the limit plate 5 can limit the position of the chip, thereby facilitating the clamping of the clamping assembly 9.

[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A pressed sheet structure for semiconductor packaging, comprising a substrate (1), characterized in that: A lower mold (18) is fixedly mounted on the upper surface of the base plate (1), a feeding tube (14) is mounted on the side wall of the lower mold (18), a fixed column (2) is fixedly mounted on the upper surface of the base plate (1), an upper mold (17) is movably mounted on the side wall of the fixed column (2), a carrier frame (6) is fixedly mounted on the upper mold (17), a guide plate (8) is inserted and connected to the upper surface of the carrier frame (6), a fixed rod (15) is fixedly mounted on one end of the guide plate (8), one end of the fixed rod (15) is inserted and connected in the upper mold (17), and a pressing plate (17) is fixedly mounted on one end of the fixed rod (15). 16), and the pressing sheet (16) is closely connected to the top of the mold cavity, a pushing component (11) is fixedly mounted on the upper surface of the carrier frame (6), one end of the pushing component (11) is fixedly mounted on the guide plate (8), a baffle (4) is fixedly mounted on the side wall of the base plate (1), a conveyor belt (12) is fixedly mounted on the inner wall of the baffle (4), a limit plate (5) is movably mounted on the inner wall of the baffle (4), the limit plate (5) is closely connected to the conveyor belt (12), a fixing frame (13) is movably mounted on the upper surface of the baffle (4), and a clamping component (9) is fixedly mounted on one end of the fixing frame (13).

2. A semiconductor package pressing structure according to claim 1, characterized in that: The pushing assembly (11) comprises a first electric slide (111), the first electric slide (111) is fixedly mounted on the upper surface of the carrier frame (6), a rotating shaft (112) is rotatably mounted on the first electric slide (111), a pushing rod (113) is fixedly mounted on the rotating shaft (112), a rotating seat (114) is fixedly mounted on the guide plate (8), and one end of the pushing rod (113) is rotatably mounted on the rotating seat (114).

3. The semiconductor package pressing structure according to claim 1, characterized in that: An electric push rod (7) is inlaid on the inner wall of the baffle plate (4), and a side wall of the limit plate (5) is fixedly mounted on the electric push rod (7).

4. The semiconductor package pressing structure according to claim 1, characterized in that: A second electric slide (3) is fixedly mounted on the side wall of the fixed column (2), and a side wall of the upper mold (17) is fixedly mounted on the working slide of the second electric slide (3).

5. The semiconductor package pressing structure according to claim 1, characterized in that: A third electric slide (10) is fixedly mounted on the upper surface of the baffle (4), and a lower surface of the fixing frame (13) is fixedly mounted on the working slide of the third electric slide (10).

6. The semiconductor package pressing structure according to claim 5, characterized in that: The clamping assembly (9) comprises a clamping seat (901), one end of the fixing frame (13) is fixedly mounted with the clamping seat (901), a square groove is provided on the clamping seat (901), both ends of the inner wall of the square groove are rotatably mounted with threaded rods (902), two groups of the threaded rods (902) are connected by a connecting block (903), the two groups of the threaded rods (902) are arranged oppositely, a motor (904) is fixedly mounted on the side wall of the clamping seat (901), the output shaft of the motor (904) is inserted and connected to the clamping seat (901), and the output shaft of the motor (904) is fixedly connected to one end of the two groups of threaded rods (902).

7. A semiconductor package pressing structure according to claim 6, characterized in that: Threaded sleeves (905) are slidably mounted on the two groups of threaded rods (902), and clamping plates (906) are fixedly mounted on the two groups of threaded sleeves (905).

Images