Automatic chip pressing device

Abstract

The utility model relates to the field of chip mounting, in particular to an automatic chip pressing device which comprises a workbench and a pressing assembly, one end of the workbench is provided with a workbench panel, the pressing assembly is arranged above the workbench panel, the workbench panel is provided with an electromagnetic part, the pressing assembly and the electromagnetic part are matched in a magnetic attraction mode, and the electromagnetic part is arranged above the workbench panel. A fixing piece and an elastic pressing structure are arranged at the position, corresponding to the workbench panel, of the pressing assembly, and the fixing piece and the elastic pressing structure are arranged in a staggered mode relative to the workbench panel. The problems of chip displacement and surface scratch caused by manual participation are solved, and the precision and yield of chip mounting are improved.

Description

[Technical field]

[0001] The utility model relates to the technical field of chip mounting, in particular to an automatic chip pressing device. [Background technology]

[0002] In the existing chip mounting process, the pressing process of the chip after mounting usually requires manual participation. Since the carrier with the chip mounted usually has a gap in the carrier, the carrier may be offset or vibrated during manual operation, resulting in the displacement of the chip relative to the carrier, reducing the accuracy of chip mounting; or the chip and the pressing member are not aligned, so that the pressing member presses on the area on the chip that is not allowed to be pressed, causing damage to the chip, thereby reducing the yield rate of chip mounting. [Contents of the utility model]

[0003] In order to solve the problems of low chip mounting accuracy and yield rate caused by existing manual pressing, the utility model provides an automatic chip pressing device.

[0004] The solution of the utility model to solve the technical problem is to provide an automatic chip pressing device, including a workbench and a pressing assembly, a workbench panel is provided at one end of the workbench, the pressing assembly is arranged above the workbench panel, an electromagnetic component is provided on the workbench panel, the pressing assembly and the electromagnetic component are magnetically matched, the pressing assembly is provided with a fixing component and an elastic pressing structure corresponding to the position of the workbench panel, and the fixing component and the elastic pressing structure are staggered relative to the workbench panel.

[0005] Preferably, the pressing assembly comprises a pressing strip, and a plurality of elastic pressing structures are provided on the pressing strip.

[0006] Preferably, the elastic pressing structure comprises a first elastic member and a pressing block, and two ends of the first elastic member are respectively connected to the pressing strip and the pressing block.

[0007] Preferably, a carrier plate is provided inside the workbench panel, and a placement groove is provided on the carrier plate.

[0008] Preferably, a guide pin is provided on the carrier plate, and a matching hole is provided on the pressure strip corresponding to the guide pin.

[0009] Preferably, the end surface of the electromagnetic component close to the pressing assembly is higher than the carrier plate.

[0010] Preferably, the pressing assembly comprises a cover plate, the cover plate is arranged at one end of the pressure strip away from the workbench panel, and the fixing member is arranged on the cover plate.

[0011] Preferably, a second elastic member is provided at one end of the cover plate close to the pressure strip.

[0012] Preferably, a driving component is provided on the workbench, and the driving component is connected to the electromagnetic component.

[0013] Preferably, a vacuum component is provided on the workbench near the workbench panel.

[0014] Compared with the prior art, the chip automatic pressing device of the utility model has the following advantages:

[0015] 1. An automatic chip pressing device of the utility model includes a workbench and a pressing assembly. A workbench panel is provided at one end of the workbench. The pressing assembly is arranged above the workbench panel. An electromagnetic component is provided on the workbench panel. The pressing assembly and the electromagnetic component are magnetically matched. A fixing component and an elastic pressing structure are provided at the position of the pressing assembly corresponding to the workbench panel. The fixing component and the elastic pressing structure are staggered relative to the workbench panel.

[0016] This embodiment uses the adsorption force generated by the electromagnetic component when it is energized to automatically adsorb the pressing component, so that the pressing component maintains a state of pressing the chip, realizes automatic pressing of the chip, and improves work efficiency; and the chip pressing achieved by the electromagnetic component does not require human intervention, avoiding human-caused displacement or damage of the chip, thereby ensuring the accuracy and yield rate of chip mounting.

[0017] 2. The pressing assembly of the utility model includes a pressure strip, on which a plurality of elastic pressing structures are arranged.

[0018] The elastic pressing structure of this embodiment corresponds to the mounting position of the chip, and multiple elastic pressing structures are used to press each chip individually, ensuring that each chip can be pressed and the chip position does not shift during subsequent transportation and reflow soldering, thereby improving the yield and accuracy of chip mounting; in addition, the pressing of the elastic pressing structure and the chip is not limited by the differences in chip size, thickness, shape, etc., that is, multiple types of chips can be pressed at the same time, with high compatibility and high market competitiveness.

[0019] 3. The elastic pressing structure of the utility model comprises a first elastic member and a pressing block, and the two ends of the first elastic member are respectively connected to the pressing strip and the pressing block.

[0020] It should be noted that the elastic pressing structure specifically consists of a first elastic member and a pressure block that are connected to each other, wherein one end of the first elastic member is connected to the pressure block, and the other end is connected to the pressure strip. The electromagnetic member is energized to adsorb the pressure strip and bring it close to the carrier, so that the pressure block abuts against the chip and elastically compresses the chip under the action of the first elastic member, preventing the pressure block from excessively squeezing the chip and causing damage to the chip.

[0021] 4. A loading tray is provided inside the workbench panel of the utility model, and a placement slot is provided on the loading tray.

[0022] It can be understood that multiple chips are mounted on a carrier by vacuum adsorption to form pre-welding, and then the carrier with chips is placed on a carrier to wait for compaction. According to actual needs, one or more carriers can be placed on the carrier, so as to compact the chips on multiple carriers in one batch and improve production efficiency.

[0023] 5. The carrier plate of the utility model is provided with guide pins, and the pressure strip is provided with matching holes corresponding to the guide pins.

[0024] In this embodiment, guide pins are provided on the carrier to guide the movement of the pressure strip. After the pressure strip cooperates with the guide pins, the chip is pressed in the direction indicated by the guide pins, thereby ensuring that no lateral force is generated on the chip when the pressing assembly is pressed down. At the same time, no lateral movement is generated during the subsequent tightening of the cover plate, thereby ensuring the high-precision requirements of the chip mounting position.

[0025] 6. The end surface of the electromagnetic component of the utility model close to the pressing assembly is higher than the carrier plate.

[0026] It should be noted that there is a height difference between the electromagnetic component and the carrier, and the height difference is extremely small, so that when the electromagnetic component adsorbs and presses the assembly and when the electromagnetic component is powered off and moves downward, the pressing block can maintain the state of pressing the chip.

[0027] 7. The pressing assembly of the utility model includes a cover plate, which is arranged at one end of the pressure strip away from the workbench panel, and the fixing part is arranged on the cover plate.

[0028] It can be understood that the cover plate is fixedly connected to the pressing assembly and the carrier through fixing parts, so that the cover plate, the pressing assembly and the carrier form a fixed whole, thereby ensuring that after the electromagnetic part is powered off and the carrier is removed from the workbench, the pressing assembly still keeps pressing the chip, ensuring that the chip does not shift in position relative to the carrier during subsequent transportation and reflow soldering.

[0029] 8. The cover plate of the utility model is provided with a second elastic member near one end of the pressure strip.

[0030] It is understandable that a second elastic member is provided at one end of the cover plate close to the pressure strip, so that during the process of fixing the cover plate to the carrier, the cover plate presses the pressing assembly by elastic compression to avoid damage to the chip due to excessive squeezing.

[0031] 9. A driving component is provided on the workbench of the utility model, and the driving component is connected to the electromagnetic component.

[0032] Specifically, a driving member connected to the electromagnetic member is provided on the workbench, and the electromagnetic member can be driven to approach or move away from the pressing assembly by controlling the operation of the driving member.

[0033] 10. A vacuum component is provided on the workbench of the utility model near the workbench panel.

[0034] It should be noted that after the carrier with the chip mounted on it is placed at the preset position on the carrier through visual calibration, the vacuum assembly on the workbench is started to adsorb the carrier, thereby fixing the carrier on the carrier to ensure that the position of the carrier no longer changes, so that the pressure block on the pressure strip can correspond one-to-one with the chip on the carrier.

Brief Description of the Drawings

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0036] Figure 1 It is a schematic diagram of the exploded structure of the automatic chip pressing device provided in the first embodiment of the utility model.

[0037] Figure 2 It is a cross-sectional view of the working state of the chip automatic pressing device provided by the first embodiment of the utility model.

[0038] Figure 3 It is a partial enlarged view of the automatic chip pressing device provided in the first embodiment of the utility model.

[0039] Figure 4 It is a structural schematic diagram of a pressing assembly of a chip automatic pressing device provided in the first embodiment of the utility model.

[0040] Figure 5 It is a schematic diagram of the exploded structure of the pressing strip and the elastic pressing structure of the chip automatic pressing device provided in the first embodiment of the utility model.

[0041] Figure 6 It is a structural schematic diagram of a carrier plate of a chip automatic pressing device provided in the first embodiment of the utility model.

[0042] Figure 7 It is a structural schematic diagram of a carrier of a chip automatic pressing device provided in the first embodiment of the utility model.

[0043] Description of the accompanying drawings:

[0044] 100. Automatic chip pressing device; 1. Workbench; 11. Workbench panel; 12. Electromagnetic component; 13. Driving component; 14. Vacuum component; 2. Pressing component; 21. Pressing strip; 211. Matching hole; 22. Elastic pressing structure; 221. First elastic component; 222. Pressing block; 23. Cover plate; 231. Fixing component; 232. Second elastic component; 4. Carrier; 41. Carrier; 42. Chip; 43. Guide pin. [Specific implementation method]

[0045] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0047] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0048] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0049] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0050] See also Figure 1 and Figure 2The first embodiment of the utility model provides an automatic chip pressing device 100, including a workbench 1 and a pressing assembly 2. A workbench panel 11 is provided at one end of the workbench 1. The pressing assembly 2 is arranged above the workbench panel 11. An electromagnetic component 12 is provided on the workbench panel 11. The pressing assembly 2 and the electromagnetic component 12 are magnetically matched. A fixing component 231 and an elastic pressing structure 22 are provided at a position corresponding to the workbench panel 11 of the pressing assembly 2. The fixing component 231 and the elastic pressing structure 22 are staggered, that is, the vertical projections of the fixing component 231 and the elastic pressing structure 22 on the workbench panel 11 do not overlap, so that the fixing component 231 and the elastic pressing structure 22 can work with their corresponding objects or structures at the same time.

[0051] Furthermore, a carrier plate 4 is provided inside the workbench panel 11, and a placement groove is provided on the carrier plate 4.

[0052] It should be noted that one or more placement grooves are provided on the carrier 4 , and the placement grooves are used to place the carrier 41 , and a plurality of chips 42 are mounted on the carrier 41 , and the elastic pressing structure 22 is arranged corresponding to the chip 42 .

[0053] It can be understood that the present embodiment utilizes the adsorption force generated by the electromagnetic component 12 being energized to automatically adsorb the pressing component 2, so that the pressing component 2 maintains a state of pressing the chip 42, thereby realizing automatic pressing of the chip 42 and improving work efficiency; and the pressing of the chip 42 realized by the electromagnetic component 12 does not require human intervention, and the magnetic force generated by the electromagnetic component 12 being energized is stable and controllable. Therefore, the pressing realized by the electromagnetic component 12 can avoid displacement or damage of the chip 42 caused by inadequate force control during manual operation, thereby ensuring the accuracy and yield rate of chip 42 mounting.

[0054] It should be noted that, according to actual production requirements, one or more carriers 41 with chips 42 mounted thereon may be placed in the carrier plate 4 .

[0055] In a feasible embodiment, the carrier 41 is first moved to the heating table, and then the chip 42 is moved and mounted on the preset position of the carrier 41 by vacuum adsorption, and is pre-welded on the carrier under the action of the heating table. It should be understood that the connection between the chip 42 and the carrier 41 is not firm at this time. Under the action of external force, the chip 42 is prone to position displacement relative to the carrier 41. Therefore, before the mounted chip is transferred to the next process, the chip 42 and the carrier 41 need to be pressed tightly to ensure the accuracy of the chip 42 mounting.

[0056] Understandably, please also refer to Figure 7 A plurality of chips 42 are mounted on the carrier 41, and a plurality of carriers 41 can be placed in a carrier. When the pressing assembly 2 and the electromagnetic member 12 are magnetically matched, a batch of multiple chips 42 can be pressed tightly, thereby improving work efficiency.

[0057] In a specific implementation, the carrier 41 is a copper block. According to actual needs, the carrier 41 can also be an iron block, an aluminum block or other objects used to mount the chip 42, and no further restrictions are made here.

[0058] Optionally, the electromagnetic member 12 is made of one or more of iron, cobalt, nickel, ferrite, aluminum nickel cobalt, samarium cobalt, neodymium iron, etc. or other magnetic materials.

[0059] In a feasible embodiment, the electromagnetic component 12 and the workbench 1 are slidably matched in a direction perpendicular to the workbench panel 11. When the electromagnetic component 12 is energized, it generates an adsorption force that can adsorb the pressing component 2 located above it, so that the elastic pressing structure 22 maintains a state of elastically pressing the chip 42. It should be understood that a magnetic attraction structure is provided at the relative position between the pressing component 2 and the electromagnetic component 12, that is, it has magnetism, so that it can be adsorbed when the electromagnetic component 12 is energized.

[0060] Furthermore, a driving component 13 is provided on the workbench 1 , and the driving component 13 is connected to the electromagnetic component 12 .

[0061] Specifically, the driving member 13 is a lifting cylinder, and the electromagnetic member 12 slides along the vertical direction of the workbench panel 11 through the lifting cylinder to approach or move away from the pressing assembly 2.

[0062] Specifically, the end surface of the electromagnetic member 12 close to the pressing assembly 2 is higher than the carrier plate 4 .

[0063] In a feasible implementation manner, please refer to Figure 3 The electromagnetic component 12 rises vertically along the workbench panel 11 to a position slightly higher than the plane where the end of the carrier plate 4 is away from the workbench panel 11, so as to ensure that the electromagnetic component 12 can absorb the pressing component 2 after the pressing component 2 moves down to press the chip 42.

[0064] Optionally, the height difference between the electromagnetic component 12 and the carrier 4 after rising includes but is not limited to 0.2mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, etc., as long as it can be ensured that the electromagnetic component 12 can adsorb the pressing component 2 after being energized, and the pressing component 2 can also maintain pressure on the chip 42 when the electromagnetic component 12 is de-energized and moves downward.

[0065] Furthermore, a vacuum component 14 is provided on the workbench 1 near the workbench panel 11 .

[0066] It should be noted that the vacuum component 14 is arranged close to the workbench panel 11 to absorb objects in the workbench panel 11. The workbench panel 11 is used to place the carrier 4, and the carrier 4 and the vacuum component 14 are provided with through holes at corresponding positions. When the carrier 4 is placed on the carrier 4, the carrier 41 covers the through holes. When the vacuum component 14 is started, the carrier 41 placed in the carrier 4 is absorbed through the through holes to fix it on the carrier 4 so that it does not produce positional displacement, so that the chip on the carrier 41 can be accurately pressed when the pressing component 2 is pressed down.

[0067] Please also refer to Figure 5 and Figure 6 The pressing assembly 2 includes a pressure strip 21 , on which a plurality of elastic pressing structures 22 are provided.

[0068] Specifically, a guide pin 43 is provided on the carrier plate 4 , and a matching hole 211 is provided on the pressure strip 21 corresponding to the guide pin 43 . The matching hole 211 and the vertical projection of the elastic pressing structure 22 on the workbench panel 11 do not overlap.

[0069] It should be noted that the pressing assembly 2 and the workbench 1 are detachably connected. After the carrier 41 with the chip 42 mounted on it is placed in the workbench panel 11 and fixed, the pressing assembly 2 is moved above the workbench panel 11, cooperates with the guide pins 43 on the carrier 4, and is pressed down toward the workbench panel 11 using the guide pins 43 as a guide.

[0070] It can be understood that, through the guidance of the guide pin 43, the pressing assembly 2 will not be positionally shifted during the pressing process so that the pressing assembly 2 can accurately press the chip of the pre-welded part on the carrier 41, and under the limitation of the guide pin 43 and the matching hole 211, the pressing assembly 2 generates lateral force on the chip 42 when pressing the chip 42, thereby ensuring the high precision of the chip 42 mounting.

[0071] Furthermore, the elastic pressing structure 22 includes a first elastic member 221 and a pressing block 222 , and two ends of the first elastic member 221 are connected to the pressing strip 21 and the pressing block 222 , respectively.

[0072] In a specific implementation scheme, a plurality of elastic pressing structures 22 consisting of a first elastic member 221 and a pressing block 222 are arranged at corresponding positions of the pressing assembly 2 and the workbench panel 11, wherein one end of the first elastic member 221 is connected to the pressure strip 21, and the other end is connected to the pressing block 222. When the pressing assembly 2 is pressed downward under the guidance of the guide pin 43, the pressing block 222 abuts against the pre-soldered chip 42 on the carrier 41 and elastically presses the corresponding chip 42 under the action of the first elastic member.

[0073] Specifically, a limit block is provided at the corresponding end of the pressing block 222 and the first elastic member 221. One end of the first elastic member 221 is connected to the pressure strip 21, and the other end is connected to the pressing block 222 based on the limit block. When the pressing assembly 2 is pressed down until the pressing block 222 abuts against the chip 42, the first elastic member 221 maintains a connection with the pressing block 222 under the action of the limit block and provides an elastic force to the pressing block 222 in a vertical direction of the pressing block 222, so that the pressing block 222 elastically presses the chip 42.

[0074] It can be understood that the first elastic member 221 elastically abuts against the chip 42 , and by providing a buffer of the first elastic member 221 , it is possible to prevent the pressing block 222 from excessively squeezing the chip 42 and causing damage to the chip 42 .

[0075] Please also refer to Figure 4 The pressing assembly 2 includes a cover plate 23 , which is disposed at one end of the pressure strip 21 away from the workbench panel 11 , and a fixing member 231 is disposed on the cover plate 23 .

[0076] In a feasible embodiment, a fixing structure cooperating with the fixing member 231 is provided on the carrier 4. When the pressing assembly 2 abuts against the chip 42, the fixing member 231 is matched with the fixing structure, so that the cover plate 23 is fixedly connected to the carrier 4.

[0077] Optionally, the fixing member 231 may be a mechanical structure that can be used for fastening connection, such as a screw, a bolt, a stud, a pin or a rivet.

[0078] It can be understood that the cover plate 23 is fixedly connected to the carrier 4 by the fixing part 231, so that the cover plate 23, the pressing assembly 2 and the carrier 4 form a fixed whole, and the pressure strip 21 keeps the state of elastically pressing the chip 42 on the carrier 41 and is fixed between the cover plate 23 and the carrier 4, thereby ensuring that after the electromagnetic part 12 is powered off, the pressing assembly 2 always keeps the chip 42 pressed during the process of the carrier 4 being taken out of the workbench 1, ensuring that the chip 42 does not shift in position relative to the carrier 41 during subsequent transportation and reflow soldering.

[0079] Furthermore, a second elastic member 232 is provided at one end of the cover plate 23 close to the pressure strip 21 .

[0080] Optionally, the first elastic member 221 and the second elastic member 232 may be elastic objects such as springs, spring sheets, washers or pads.

[0081] In a specific embodiment, a second elastic member 232 is provided at the opposite end of the cover plate 23 and the pressure strip 21. During the fixing process of the cover plate 23 and the carrier 4, the second elastic member 232 elastically presses the pressure strip 21 to prevent the cover plate 23 from over-pressing the pressure strip 21 and thus causing the pressure block 222 to over-press the chip 42.

[0082] During the process of fixing the cover plate 23 and the carrier plate 4, the electromagnetic component 12 has not been powered off. At this time, the electromagnetic component 12 is slightly higher than the carrier plate 4 and always maintains an adsorption state with the pressing assembly 2. The height of the pressing assembly 2 does not change. When the electromagnetic component 12 is powered off and moves downward, the pressure strip 21 will drop to be pressed against the plane of the carrier plate 4 under the action of the second elastic component 232. That is, at this time, the pressure strip 21 is fixed in the interlayer between the cover plate 23 and the carrier plate 4, so that the pressure block 222 can continuously and stably press the chip 42.

[0083] On the other hand, the height difference between the electromagnetic component 12 and the carrier 4 is small. Therefore, during the above process, although the pressure on the chip 42 varies, the variation is small, and the pressing block 222 can press the chip 42 within this variation range.

[0084] In a specific embodiment, the working process of the chip automatic pressing device 100 pressing the chip 42 is as follows:

[0085] Loading: After placing the carrier 41 on the carrier plate 4, place the carrier plate 4 at a preset position on the workbench panel 11, and raise the electromagnetic member 12 to a position slightly higher than the upper surface of the carrier plate 4 through the driving member 13;

[0086] Pre-welding: the carrier 41 on the carrier plate 4 is transferred to the heating platform, and the chip 42 is mounted on the carrier 41 by vacuum adsorption to form a pre-weld on the carrier 41;

[0087] Fix the carrier 41: take the carrier 41 back from the heating table to the carrier plate 4, repeat the above process until all the carriers 41 on the carrier plate 4 are mounted, and then turn on the vacuum assembly 14 on the workbench 1 to absorb the carrier 41;

[0088] Pressing the chip 42: Move the pressure strip 21 to the top of the carrier 4, make the matching hole 211 on the pressure strip 21 match with the guide pin 43 on the carrier 4, and press down under the guidance of the guide pin 42, so that the pressure block and the chip 42 are pressed against each other to elastically press the chip 42, and after pressing, energize the electromagnetic component 12 to adsorb the pressure strip 21;

[0089] Fixing the cover plate 23: moving the cover plate 23 to a preset position above the pressure strip 21, and fixing it to the carrier plate 4 via the fixing member 231;

[0090] Taking out: the electromagnetic component 12 is powered off, the electromagnetic component 12 is lowered by the driving component 13, the vacuum component 14 is disconnected, and the carrier plate 4 fixedly connected to the cover plate 23 is taken out.

[0091] Compared with the prior art, the chip automatic pressing device of the utility model has the following advantages:

[0092] 1. An automatic chip pressing device of the utility model includes a workbench and a pressing assembly. A workbench panel is provided at one end of the workbench. The pressing assembly is arranged above the workbench panel. An electromagnetic component is provided on the workbench panel. The pressing assembly and the electromagnetic component are magnetically matched. A fixing component and an elastic pressing structure are provided at the position of the pressing assembly corresponding to the workbench panel. The fixing component and the elastic pressing structure are staggered relative to the workbench panel.

[0093] This embodiment uses the adsorption force generated by the electromagnetic component when it is energized to automatically adsorb the pressing component, so that the pressing component maintains a state of pressing the chip, realizes automatic pressing of the chip, and improves work efficiency; and the chip pressing achieved by the electromagnetic component does not require human intervention, avoiding human-caused displacement or damage of the chip, thereby ensuring the accuracy and yield rate of chip mounting.

[0094] 2. The pressing assembly of the utility model includes a pressure strip, on which a plurality of elastic pressing structures are arranged.

[0095] The elastic pressing structure of this embodiment corresponds to the mounting position of the chip, and multiple elastic pressing structures are used to press each chip individually, ensuring that each chip can be pressed and the chip position does not shift during subsequent transportation and reflow soldering, thereby improving the yield and accuracy of chip mounting; in addition, the pressing of the elastic pressing structure and the chip is not limited by the differences in chip size, thickness, shape, etc., that is, multiple types of chips can be pressed at the same time, with high compatibility and high market competitiveness.

[0096] 3. The elastic pressing structure of the utility model comprises a first elastic member and a pressing block, and the two ends of the first elastic member are respectively connected to the pressing strip and the pressing block.

[0097] It should be noted that the elastic pressing structure specifically consists of a first elastic member and a pressure block that are connected to each other, wherein one end of the first elastic member is connected to the pressure block, and the other end is connected to the pressure strip. The electromagnetic member is energized to adsorb the pressure strip and bring it close to the carrier, so that the pressure block abuts against the chip and elastically compresses the chip under the action of the first elastic member, preventing the pressure block from excessively squeezing the chip and causing damage to the chip.

[0098] 4. A loading tray is provided inside the workbench panel of the utility model, and a placement slot is provided on the loading tray.

[0099] It can be understood that multiple chips are mounted on a carrier by vacuum adsorption to form pre-welding, and then the carrier with chips is placed on a carrier to wait for compaction. According to actual needs, one or more carriers can be placed on the carrier, so as to compact the chips on multiple carriers in one batch and improve production efficiency.

[0100] 5. The carrier plate of the utility model is provided with guide pins, and the pressure strip is provided with matching holes corresponding to the guide pins.

[0101] In this embodiment, guide pins are provided on the carrier to guide the movement of the pressure strip. After the pressure strip cooperates with the guide pins, the chip is pressed in the direction indicated by the guide pins, thereby ensuring that no lateral force is generated on the chip when the pressing assembly is pressed down. At the same time, no lateral movement is generated during the subsequent tightening of the cover plate, thereby ensuring the high-precision requirements of the chip mounting position.

[0102] 6. The end surface of the electromagnetic component of the utility model close to the pressing assembly is higher than the carrier plate.

[0103] It should be noted that there is a height difference between the electromagnetic component and the carrier, and the height difference is extremely small, so that when the electromagnetic component adsorbs and presses the assembly and when the electromagnetic component is powered off and moves downward, the pressing block can maintain the state of pressing the chip.

[0104] 7. The pressing assembly of the utility model includes a cover plate, which is arranged at one end of the pressure strip away from the workbench panel, and the fixing part is arranged on the cover plate.

[0105] It can be understood that the cover plate is fixedly connected to the pressing assembly and the carrier through fixing parts, so that the cover plate, the pressing assembly and the carrier form a fixed whole, thereby ensuring that after the electromagnetic part is powered off and the carrier is removed from the workbench, the pressing assembly still keeps pressing the chip, ensuring that the chip does not shift in position relative to the carrier during subsequent transportation and reflow soldering.

[0106] 8. The cover plate of the utility model is provided with a second elastic member near one end of the pressure strip.

[0107] It is understandable that a second elastic member is provided at one end of the cover plate close to the pressure strip, so that during the process of fixing the cover plate to the carrier, the cover plate presses the pressing assembly by elastic compression to avoid damage to the chip due to excessive squeezing.

[0108] 9. A driving component is provided on the workbench of the utility model, and the driving component is connected to the electromagnetic component.

[0109] Specifically, a driving member connected to the electromagnetic member is provided on the workbench, and the electromagnetic member can be driven to approach or move away from the pressing assembly by controlling the operation of the driving member.

[0110] 10. A vacuum component is provided on the workbench of the utility model near the workbench panel.

[0111] It should be noted that after the carrier with the chip mounted on it is placed at the preset position on the carrier through visual calibration, the vacuum assembly on the workbench is started to adsorb the carrier, thereby fixing the carrier on the carrier to ensure that the position of the carrier no longer changes, so that the pressure block on the pressure strip can correspond one-to-one with the chip on the carrier.

[0112] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip automatic pressing device, characterized in that: It includes a workbench and a pressing component, wherein a workbench panel is provided at one end of the workbench, the pressing component is arranged above the workbench panel, an electromagnetic component is provided on the workbench panel, the pressing component and the electromagnetic component are magnetically matched, the pressing component is provided with a fixing component and an elastic pressing structure corresponding to the position of the workbench panel, and the fixing component and the elastic pressing structure are staggered relative to the workbench panel.

2. The chip automatic pressing device according to claim 1, characterized in that: The pressing assembly comprises a pressing strip, on which a plurality of elastic pressing structures are arranged.

3. The chip automatic pressing device according to claim 2, characterized in that: The elastic pressing structure comprises a first elastic member and a pressing block, and two ends of the first elastic member are respectively connected to the pressing strip and the pressing block.

4. The chip automatic pressing device according to claim 2, characterized in that: A carrier plate is arranged inside the workbench panel, and a placement groove is arranged on the carrier plate.

5. The chip automatic pressing device according to claim 4, characterized in that: The carrier plate is provided with a guide pin, and the pressure strip is provided with a matching hole corresponding to the guide pin.

6. The chip automatic pressing device according to claim 4, characterized in that: The end surface of the electromagnetic component close to the pressing assembly is higher than the carrier plate.

7. The chip automatic pressing device according to claim 2, characterized in that: The pressing assembly comprises a cover plate, the cover plate is arranged at one end of the pressure strip away from the workbench panel, and the fixing member is arranged on the cover plate.

8. The chip automatic pressing device according to claim 7, characterized in that: The cover plate is provided with a second elastic member at one end close to the pressure strip.

9. The chip automatic pressing device according to claim 1, characterized in that: A driving component is disposed on the workbench, and the driving component is connected to the electromagnetic component.

10. The chip automatic pressing device according to claim 1, characterized in that: A vacuum component is arranged on the workbench near the workbench panel.

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