Discrete semiconductor device bonding machine

Abstract

The utility model discloses a semiconductor discrete device bonding machine, which relates to the technical field of semiconductors, and comprises a bonding machine main body, the upper surface of the bonding machine main body is in sliding connection with an operation table, the upper surface of the operation table is fixedly connected with a positioning frame, the inner side of the positioning frame is in sliding connection with a positioning key, and the upper end of the bonding machine main body is fixedly connected with a positioning block. The surface of the positioning block is slidably connected with an alignment shell, and the outer surface of the alignment shell is rotatably connected with a threaded push rod. The chip alignment device is reasonable in design structure, the threaded push rod can be rotated to push the alignment shell to move, so that the pushing plate gets close to and clamps a chip, the deformation motor is started to drive the pushing gear to rotate, the pushing disc is pushed to rotate, and the stress plate is pushed out to clamp the chip; the chips clamped from the two sides cannot be driven and blocked by the positioning keys, the effect of being suitable for clamping the chips of various sizes is achieved, and the problem that the chip clamping frame cannot be suitable for fixing the chips of various sizes is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor discrete device bonding machine. Background Art

[0002] Semiconductor processing equipment is a general term for various equipment used in the processing and manufacturing of semiconductor products. Electronic products are divided into conductors and insulators according to their conductivity. Semiconductors are between conductors and insulators. Semiconductor components are divided into discrete and integrated according to the packaging form. In the manufacturing of discrete semiconductor devices, after the copper frame is bonded, bonding, also known as wire bonding, is required to physically connect the chip to the pin, generally using aluminum wire or copper wire.

[0003] When processing chips, the bonding machine needs to clamp and place them. When the bonding machine moves at high speed, the chips slide. The traditional fixed frame cannot be used for chips of various sizes. When processing different chips, the fixed frame needs to be disassembled repeatedly. Moreover, when the chip is fixed and pressed, the pressing position cannot be changed in time according to the chip requirements. To this end, we provide semiconductor discrete device bonding machines to solve the above problems. Utility Model Content

[0004] 1) Technical issues solved

[0005] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a semiconductor discrete device bonding machine.

[0006] 2) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor discrete device bonding machine, comprising a bonding machine main body, the upper surface of the bonding machine main body is slidably connected with an operating table, the upper surface of the operating table is fixedly connected with a positioning frame, the inner side of the positioning frame is slidably connected with a positioning key, the upper end of the bonding machine main body is fixedly connected with a positioning block, the surface of the positioning block is slidably connected with a correction shell, the outer surface of the correction shell is rotatably connected with a threaded push rod, the threaded push rod is threadedly connected to the positioning block, the inner side of the correction shell is fixedly connected with a deformation motor, the output end of the deformation motor is fixedly connected with a pushing gear, the outer surface of the pushing gear is meshed with a pushing disk, the pushing disk is rotatably connected with the correction shell, the inner side of the pushing disk is slidably connected with a pushing plate, the inner sides of the pushing plate are slidably connected with rockers, the rockers are hinged to the correction shell, the upper surface of the operating table is slidably connected with a clamping plate, the inner side of the clamping plate is fixedly connected with a limited position frame, the inner side of the limited position frame is slidably connected with an adjusting frame, and the upper end of the adjusting frame is sleeved with a pressing plate.

[0008] Furthermore, the positioning key is composed of a receiving key, a receiving spring and a contact shaft. One end of the receiving key is a triangle and the other end is a round rod. The receiving spring is sleeved on the outside of the round rod of the receiving key. The contact shaft has a cylindrical shape and a flat surface on the circumference. The contact shaft is rotatably connected to one end of the triangle of the receiving key. The receiving key is slidably connected to the positioning frame, and the end of the positioning frame close to the positioning key is triangular stepped.

[0009] Furthermore, the alignment shell includes a wrapping shell, a guide rod and a guide spring. The outer surface of the wrapping shell is fixedly connected to the guide rod, the guide rod is slidably connected to the positioning block, and the outer surface of the guide rod is sleeved with a guide spring.

[0010] Furthermore, the pushing disk is in the shape of a disc, and an arc-shaped sliding groove is provided on the end surface of the pushing disk.

[0011] Furthermore, the pushing plate is composed of a force-bearing plate and a side plate. The force-bearing plate is in a "T" shape. The force-bearing plate is slidably connected to the pushing plate. Side plates are hinged at both ends of the force-bearing plate. A slide groove is provided on the inner side of the side plate to be slidably connected to the rocker.

[0012] Furthermore, the clamping plate is composed of a clamping shell, a clamping shaft and a clamping spring. The two sides of the clamping shell are beveled edges. The inner side of the clamping shell is fixedly connected to the clamping shaft, and the outer surface of the clamping shaft is sleeved with the clamping spring.

[0013] Furthermore, the adjustment frame is composed of a clamping plate, an adjusting screw and a push-up spring. The clamping plate is slidably connected to the inner side of the limit frame. The surface of the limit frame is threadedly connected with the adjusting screw. The outer surface of the adjusting screw is sleeved with a pressing plate, and the outer side of the adjusting screw is sleeved with a push-up spring.

[0014] 3) Beneficial effects:

[0015] Compared with the prior art, the semiconductor discrete device bonding machine has the following beneficial effects:

[0016] 1. The utility model drives the alignment shell to move by rotating the threaded push rod, so that the pushing plate approaches and clamps the chip, and starts the deformation motor to drive the pushing gear to rotate, so that the pushing disk is pushed to rotate, and the force plate is pushed out to clamp the chip. By setting the positioning frame into a triangular step shape, the chip clamping from both sides will not be blocked by the positioning key, so that the effect of being suitable for clamping chips of various sizes is achieved, and the problem that the chip clamping frame cannot be used for fixing multiple different sizes is solved.

[0017] 2. The utility model uses a clamping spring to push the clamping shell to clamp the chip from both sides, and by moving the adjusting screw pins, the clamping plate slides inside the limit frame, so that the pressing plate reaches a suitable position, and by rotating the adjusting screw pins, the pressing plate presses and fixes the chip, thereby achieving the effect of clamping the chip and pressing it at a suitable position, solving the problem that the pressing position cannot be changed according to demand during chip processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall appearance structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the positioning frame of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the push disk of the utility model;

[0021] Figure 4 This is a schematic diagram of the clamping plate structure of the utility model.

[0022] In the figure: 1. bonding machine body; 2. operating table; 3. positioning frame; 4. positioning key; 401. receiving key; 402. receiving spring; 403. contact shaft; 5. positioning block; 6. alignment shell; 601. wrapping shell; 602. guide rod; 603. guide spring; 7. threaded push rod; 8. deformation motor; 9. pushing gear; 10. pushing disk; 11. pushing plate; 111. force plate; 112. side plate; 12. rocker; 13. clamping plate; 131. clamping shell; 132. clamping shaft; 133. clamping spring; 14. limit frame; 15. adjustment frame; 151. clamping plate; 152. adjusting threaded nail; 153. lifting spring; 16. pressing plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] like Figure 1-4As shown, the utility model provides a technical solution: a semiconductor discrete device bonding machine, including a bonding machine body 1, an operating table 2 is slidably connected to the upper surface of the bonding machine body 1, a positioning frame 3 is fixedly connected to the upper surface of the operating table 2, a positioning key 4 is slidably connected to the inner side of the positioning frame 3, and a positioning block 5 is fixedly connected to the upper end of the bonding machine body 1. The positioning key 4 is composed of a receiving key 401, a receiving spring 402 and a contact shaft 403. One end of the receiving key 401 is a triangle and the other end is a round rod. The receiving spring 402 is sleeved on the outside of the round rod of the receiving key 401. The contact shaft 403 has a cylindrical shape and a plane is provided on the circumferential surface. The contact shaft 403 is rotatably connected to one end of the triangle of the receiving key 401, and the receiving key 401 is slidably connected to the positioning frame 3. The end of the positioning frame 3 close to the positioning key 4 is in a triangular step shape. The positioning key 4 can be squeezed and pushed close to the chip. The positioning frame 3 is arranged in a triangular step shape to prevent the positioning key 4 from blocking the clamping mechanism on both sides.

[0025] The surface of the positioning block 5 is slidably connected to the alignment shell 6, and the outer surface of the alignment shell 6 is rotatably connected to the threaded push rod 7. The alignment shell 6 includes a wrapping shell 601, a guide rod 602 and a guide spring 603. The outer surface of the wrapping shell 601 is fixedly connected to the guide rod 602, the guide rod 602 is slidably connected to the positioning block 5, and the outer surface of the guide rod 602 is sleeved with a guide spring 603. The alignment shell 6 can move laterally to push the chip to be clamped through power.

[0026] The threaded push rod 7 is threadedly connected to the positioning block 5, and a deformation motor 8 is fixedly connected to the inner side of the alignment shell 6. A pushing gear 9 is fixedly connected to the output end of the deformation motor 8. A pushing disk 10 is meshed on the outer surface of the pushing gear 9. The pushing disk 10 is rotatably connected to the alignment shell 6, and a pushing plate 11 is slidably connected to the inner side of the pushing disk 10. The pushing disk 10 is disc-shaped, and an arc-shaped slide groove is provided on the end face of the pushing disk 10. The pushing disk 10 can push out the pushing plate 11 by rotation, so that the pushing plate 11 can fix the chip more securely.

[0027] The inner sides of both ends of the pushing plate 11 are slidably connected with rockers 12, and the rockers 12 are hinged to the alignment shell 6. The pushing plate 11 is composed of a force-bearing plate 111 and a side plate 112. The force-bearing plate 111 is in a "T" shape, and the force-bearing plate 111 is slidably connected to the pushing disk 10. Side plates 112 are hinged at both ends of the force-bearing plate 111, and a slide groove is provided on the inner side of the side plate 112 to be slidably connected to the rocker 12. The pushing plate 11 is provided with foldable side plates 112 on both sides, so that the chip will not be affected by the excessive length of the pushing plate 11 when clamping.

[0028] A clamping plate 13 is slidably connected to the upper surface of the operating table 2. The clamping plate 13 consists of a clamping shell 131, a clamping shaft 132 and a clamping spring 133. The clamping shell 131 has beveled edges on both sides. The clamping shaft 132 is fixedly connected to the inner side of the clamping shell 131. The clamping spring 133 is sleeved on the outer surface of the clamping shaft 132. The clamping plate 13 can use the clamping spring 133 to push the clamping shell 131 to clamp the chip from both sides of the chip.

[0029] The inner side of the clamping plate 13 is fixedly connected to the limit frame 14, and the inner side of the limit frame 14 is slidably connected to the adjusting frame 15, and the upper end of the adjusting frame 15 is sleeved with a pressing plate 16. The adjusting frame 15 consists of a clamping plate 151, an adjusting threaded pin 152 and a pushing spring 153. The clamping plate 151 is slidably connected to the inner side of the limit frame 14, and the surface of the limit frame 14 is threadedly connected with the adjusting threaded pin 152, and the outer surface of the adjusting threaded pin 152 is sleeved with the pressing plate 16, and the outer side of the adjusting threaded pin 152 is sleeved with a pushing spring 153. The adjusting frame 15 can adjust and change the position angle and pressing force of the pressing plate 16.

[0030] Working principle: When in use, first place the chip to be processed on the surface of the operating table 2, and push the alignment shell 6 to move by rotating the threaded push rod 7, so that the pushing plate 11 approaches and clamps the chip. When the chip size is small, start the deformation motor 8 to drive the pushing gear 9 to rotate, so that the pushing disk 10 is pushed to rotate, and the force plate 111 is pushed out to clamp the chip. By setting the positioning frame 3 into a triangular step shape, when the chip is small, it can be clamped from both sides without being blocked by the positioning key 4. The clamping shell 131 is pushed by the clamping spring 133 to clamp the chip from both sides. By moving the adjusting threaded nail 152, the locking plate 151 slides inside the limit frame 14, so that the pressing plate 16 reaches the appropriate position, and the pressing plate 16 presses and fixes the chip by rotating the adjusting threaded nail 152.

Claims

1. A semiconductor discrete device bonding machine, comprising a bonding machine body (1), characterized in that: The upper surface of the bonding machine body (1) is slidably connected to an operating table (2), the upper surface of the operating table (2) is fixedly connected to a positioning frame (3), the inner side of the positioning frame (3) is slidably connected to a positioning key (4), the upper end of the bonding machine body (1) is fixedly connected to a positioning block (5), the surface of the positioning block (5) is slidably connected to a positioning shell (6), the outer surface of the positioning shell (6) is rotatably connected to a threaded push rod (7), the threaded push rod (7) is threadedly connected to the positioning block (5), the inner side of the positioning shell (6) is fixedly connected to a deformation motor (8), and the output end of the deformation motor (8) is fixedly connected to a pushing gear ( 9), a pushing disc (10) is meshed on the outer surface of the pushing gear (9), the pushing disc (10) is rotatably connected to the alignment housing (6), a pushing plate (11) is slidably connected to the inner side of the pushing disc (10), rockers (12) are slidably connected to the inner sides of both ends of the pushing plate (11), the rockers (12) are hinged to the alignment housing (6), a clamping plate (13) is slidably connected to the upper surface of the operating table (2), a limit frame (14) is fixedly connected to the inner side of the clamping plate (13), an adjustment frame (15) is slidably connected to the inner side of the limit frame (14), and a pressing plate (16) is sleeved on the upper end of the adjustment frame (15).

2. The semiconductor discrete device bonding machine according to claim 1, characterized in that: The positioning key (4) is composed of a receiving key (401), a receiving spring (402) and a contact shaft (403). One end of the receiving key (401) is a triangle and the other end is a round rod. The receiving spring (402) is sleeved on the outer side of the round rod of the receiving key (401). The contact shaft (403) is cylindrical in shape and has a flat surface. The contact shaft (403) is rotatably connected to one end of the triangle of the receiving key (401). The receiving key (401) is slidably connected to the positioning frame (3). The end of the positioning frame (3) close to the positioning key (4) is in a triangular stepped shape.

3. The semiconductor discrete device bonding machine according to claim 1, characterized in that: The alignment shell (6) comprises a wrapping shell (601), a guide rod (602) and a guide spring (603); the outer surface of the wrapping shell (601) is fixedly connected to the guide rod (602); the guide rod (602) is slidably connected to the positioning block (5); and the outer surface of the guide rod (602) is sleeved with the guide spring (603).

4. The semiconductor discrete device bonding machine according to claim 1, characterized in that: The pushing disk (10) is in the shape of a disk, and an arc-shaped sliding groove is provided on the end surface of the pushing disk (10).

5. The semiconductor discrete device bonding machine according to claim 1, characterized in that: The pushing plate (11) is composed of a force-bearing plate (111) and a side plate (112). The force-bearing plate (111) is T-shaped in appearance. The force-bearing plate (111) is slidably connected to the pushing plate (10). Both ends of the force-bearing plate (111) are hinged with side plates (112). A sliding groove is arranged on the inner side of the side plate (112) and is slidably connected to the rocker (12).

6. The semiconductor discrete device bonding machine according to claim 1, characterized in that: The clamping plate (13) is composed of a clamping shell (131), a clamping shaft (132) and a clamping spring (133); the clamping shell (131) has beveled edges on both sides; the clamping shaft (132) is fixedly connected to the inner side of the clamping shell (131); and the clamping spring (133) is sleeved on the outer surface of the clamping shaft (132).

7. The semiconductor discrete device bonding machine according to claim 1, characterized in that: The adjustment frame (15) is composed of a clamping plate (151), an adjustment screw pin (152) and a push-up spring (153); the clamping plate (151) is slidably connected to the inner side of the limit frame (14); the surface of the limit frame (14) is threadedly connected with the adjustment screw pin (152); the outer surface of the adjustment screw pin (152) is sleeved with a pressing plate (16); and the outer side of the adjustment screw pin (152) is sleeved with the push-up spring (153).

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