Wafer film expanding mechanism

Abstract

The utility model discloses a wafer film expanding mechanism, and relates to the technical field of wafer processing, the wafer film expanding mechanism comprises a film material adsorption platform and at least three clamping and stretching modules, and the at least three clamping and stretching modules are uniformly distributed around the film material adsorption platform along the circumferential direction of a target circle. Each clamping and stretching module can clamp the membrane material on the membrane material adsorption platform in the position where the clamping and stretching module is located and stretch the membrane material in the radial direction of a target circle, and the target circle takes the center of the membrane material adsorption platform as the circle center. According to the technical scheme, the wafer expansion distance can be controlled according to requirements while the wafer expansion operation can be automatically realized, and the orderly arrangement of the chips on the film material is ensured.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a wafer film expansion mechanism. Background Art

[0002] At present, most of the wafer expansion machines on the market use the method of lifting the film material by the cylinder to stretch the film material carrying the wafer, thereby achieving the purpose of expanding the chip spacing on the wafer. However, in actual use, it is found that this method of wafer expansion is not only unable to control the wafer expansion spacing according to demand, but also because its lifting mechanism is generally in the shape of a disc, the film material is stretched, causing the chip to deflect at a certain angle along with the film material, thus failing to ensure that the chips are neatly arranged on the film material. Utility Model Content

[0003] The embodiment of the present application provides a wafer expansion mechanism, which aims to effectively solve the technical problems that the existing wafer expansion machine cannot control the expansion spacing according to demand during wafer expansion and cannot ensure that the chips are neatly arranged on the film material.

[0004] To this end, an embodiment of the present application provides a wafer film expansion mechanism, including a film material adsorption platform and at least three clamping and stretching modules, wherein the at least three clamping and stretching modules are evenly distributed around the film material adsorption platform along the circumferential direction of a target circle, and each of the clamping and stretching modules can clamp the film material on the film material adsorption platform at its position and stretch the film material along the radial direction of the target circle, and the target circle has the center of the film material adsorption platform as its center.

[0005] Optionally, in some embodiments of the present application, the clamping and stretching module includes a clamping component and a power component that drives the clamping component to move away from or closer to the film material adsorption platform.

[0006] Optionally, in some embodiments of the present application, the clamping and stretching module also includes a linear guide rail extending radially along the target circle, and the clamping assembly is slidably arranged on the linear guide rail and is drivingly connected to the power assembly so that under the drive of the power assembly, the clamping assembly moves away from or closer to the film material adsorption platform along the extension direction of the linear guide rail.

[0007] Optionally, in some embodiments of the present application, the clamping and stretching module also includes a slider and a clamping claw cantilever, the clamping assembly is fixed on the clamping claw cantilever, and the clamping claw cantilever is slidably arranged on the linear guide rail through the slider, and the slider is also drivingly connected to the power assembly.

[0008] Optionally, in some embodiments of the present application, the power assembly includes a screw and a servo motor that drives the screw to rotate, the extension direction of the screw is the same as the extension direction of the linear guide rail, and the slider is threadedly connected to the screw so that when the servo motor drives the screw to rotate, the slider moves linearly relative to the screw along the extension direction of the screw.

[0009] Optionally, in some embodiments of the present application, the power assembly further includes a reducer, and the servo motor is drivingly connected to one end of the screw rod through the reducer.

[0010] Optionally, in some embodiments of the present application, the power assembly includes a cylinder shaft and a telescopic cylinder driving the cylinder shaft to extend and retract, the extension direction of the cylinder shaft is the same as the extension direction of the linear guide rail, and the slider is fixed on the cylinder shaft so that when the telescopic cylinder drives the cylinder shaft to extend and retract, the slider moves linearly along the linear guide rail.

[0011] Optionally, in some embodiments of the present application, the clamping and stretching module further includes a guide rail mounting bracket extending radially along the target circle, and the linear guide rail is mounted on the guide rail mounting bracket.

[0012] Optionally, in some embodiments of the present application, the clamping assembly includes a fixed jaw, a movable jaw and a lifting cylinder, the fixed jaw and the movable jaw are arranged opposite to each other in the vertical direction, and the movable jaw is driven and connected to the lifting cylinder so that it can move away from or closer to the fixed jaw under the drive of the lifting cylinder.

[0013] Optionally, in some embodiments of the present application, the film material adsorption platform includes a circular platform body and a vacuum adsorption machine, and a plurality of vacuum adsorption holes are distributed in an array on the surface of the circular platform body, and each of the vacuum adsorption holes is connected to an air pipe of the vacuum adsorption machine.

[0014] The wafer film expansion mechanism provided by the technical solution of the present application includes a film material adsorption platform and at least three clamping and stretching modules, at least three clamping and stretching modules are evenly distributed around the film material adsorption platform along the circumferential direction of the target circle, and each clamping and stretching module can clamp the film material on the film material adsorption platform at its position and stretch the film material along the radial direction of the target circle, and the target circle takes the center of the film material adsorption platform as the center of the circle. In this way, when the film material carrying the wafer is adsorbed on the film material adsorption platform, the at least three clamping and stretching modules arranged around it can clamp the film material at its position and stretch the film material along the radial direction of the target circle to automatically realize the wafer film expansion operation. At the same time, since each clamping and stretching module clamps the film material in its position and stretches the film material along the radial direction of the target circle, that is, stretches the film material by stretching it in a straight line along the corresponding position, the chips will only change their spacing as the film material is stretched, and there will be no problem of angle deflection, thereby ensuring that the chips are neatly arranged on the film material, and the chip spacing after the wafer expansion can also be controlled by controlling the stroke of the corresponding clamping and stretching module to stretch the film material along the radial direction of the target circle. It can be seen that this technical solution can automatically realize the wafer expansion operation, control the expansion spacing according to demand, and ensure that the chips are neatly arranged on the film material. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 A schematic structural diagram of a wafer expansion mechanism according to an embodiment of the present application;

[0017] Figure 2 for Figure 1 The schematic diagram of the split structure of the wafer expansion mechanism shown;

[0018] Figure 3 for Figure 1 A schematic structural diagram of a clamping and stretching module of a wafer expansion mechanism is shown;

[0019] Figure 4 for Figure 3 Schematic diagram of the split structure of the clamping and stretching module shown.

[0020] Description of Figure Numbers:

[0021] 1. Wafer film expansion mechanism; 100. Film material adsorption platform; 110. Circular platform body; 200. Clamping and stretching module; 210. Clamping assembly; 211. Fixed clamping jaw; 212. Movable clamping jaw; 213. Lifting cylinder; 220. Power assembly; 221. Screw rod; 222. Servo motor; 223. Reducer; 224. Coupling; 230. Linear guide rail; 240. Slider; 250. Clamping jaw cantilever; 260. Guide rail mounting bracket; 300. Mechanism mounting platform.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0024] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] In one embodiment, Figure 1 and Figure 2 As shown, an embodiment of the present application provides a wafer film expansion mechanism 1, which may specifically include a film material adsorption platform 100 and at least three clamping and stretching modules 200, at least three clamping and stretching modules 200 are evenly distributed around the film material adsorption platform 100 along the circumferential direction of a target circle, and each clamping and stretching module 200 can clamp the film material (not shown) on the film material adsorption platform 100 at its position and stretch the film material along the radial direction of the target circle, and the target circle takes the center of the film material adsorption platform 100 as the center.

[0027] It can be understood that the wafer expansion mechanism 1 can be specifically applied to the wafer expansion operation of the wafer processing process, so as to achieve the purpose of expanding the chip spacing on the wafer by stretching the film material carrying the wafer. In order to carry and install the film material adsorption platform 100 and at least three clamping and stretching modules 200, the wafer expansion mechanism 1 can also specifically include a mechanism installation platform 300, so that the film material adsorption platform 100 and at least three clamping and stretching modules 200 are respectively installed on the mechanism installation platform 300. The at least three clamping and stretching modules 200 mentioned above are uniformly distributed around the film material adsorption platform 100 along the circumferential direction of the target circle. Specifically, the arrangement direction of the at least three clamping and stretching modules 200 is the circumferential direction of a target circle, and the film material adsorption platform 100 is located within the range of the target circle. The angles or distances between two adjacent clamping and stretching modules 200 are equal. In this way, it can be ensured that the at least three clamping and stretching modules 200 can uniformly stretch the film adsorbed on the film material adsorption platform 100 in multiple radial directions of the target circle.

[0028] In this way, the wafer expansion mechanism 1 provided in the embodiment of the present application, when the film material carrying the wafer is adsorbed on the film material adsorption platform 100, can automatically realize the wafer expansion operation by clamping the film material in the position and stretching the film material along the radial direction of the target circle through at least three clamping and stretching modules 200 arranged around it. At the same time, since each clamping and stretching module 200 clamps the film material in the position, and stretches the film material along the radial direction of the target circle, that is, stretches the film material by stretching along the corresponding azimuth straight line, the chip will only change the spacing with the stretching of the film material, and there will be no problem of angle deflection, so as to well ensure that the chips are neatly arranged on the film material, and the chip spacing after the wafer expansion can also be controlled by controlling the stroke of the corresponding clamping and stretching module 200 to stretch the film material along the radial direction of the target circle. It can be seen that the technical solution can automatically realize the wafer expansion operation, and can control the spacing of the expanded crystals according to the needs, and ensure that the chips are neatly arranged on the film material.

[0029] In some examples, such as Figures 2 to 4As shown, the clamping and stretching module 200 may specifically include a clamping component 210 and a power component 220 that drives the clamping component 210 to move away from or close to the film material adsorption platform 100. In this way, through the above-mentioned structural arrangement, after the power component 220 drives the clamping component 210 to approach the film material adsorption platform 100, the film material on the film material adsorption platform 200 is clamped at the position where the clamping component 210 is located, and then, the clamping component 210 can also be driven by the power component 220 to move away from the film material adsorption platform 100 to stretch the film material along the radial direction of the target circle. Further, the clamping and stretching module 200 also includes a linear guide rail 230 extending along the radial direction of the target circle, and the clamping component 210 is slidably arranged on the linear guide rail 230 and is connected to the power component 220 to move away from or close to the film material adsorption platform 100 along the extension direction of the linear guide rail 230 under the drive of the power component 220. In this way, the linear motion of the clamping assembly 210 in the radial direction of the target circle can be ensured by the guiding effect of the linear guide rail 230. Furthermore, the clamping and stretching module 200 also includes a slider 240 and a clamping claw cantilever 250, the clamping assembly 210 is fixed on the clamping claw cantilever 250, and the clamping claw cantilever 250 is slidably set on the linear guide rail 230 through the slider 240, and the slider 240 is also connected to the power assembly 220. In this way, the above-mentioned structural arrangement can be used to make the power assembly 220 drive the slider 240 to slide along the linear guide rail 230, and the clamping claw cantilever 250 can drive the clamping assembly 210 to perform the same linear motion, that is, the clamping assembly 210 moves away from or close to the film material adsorption platform 100.

[0030] In some examples, such as Figures 2 to 4 As shown, the power assembly 220 may specifically include a screw rod 221 and a servo motor 222 for driving the screw rod 221 to rotate. The extension direction of the screw rod 221 is the same as the extension direction of the linear guide 230. The slider 240 is threadedly connected to the screw rod 221, so that when the servo motor 222 drives the screw rod 221 to rotate, the slider 240 makes a linear motion relative to the screw rod 221 along the extension direction of the screw rod 221. In this way, the slider 240 can slide along the extension direction of the linear guide 230 under the drive of the power assembly 220 through the above-mentioned structure. Further, in order to make the rotation of the screw rod 221 more stable and controllable, the power assembly 220 also includes a reducer 223, and the servo motor 222 is driven and connected to one end of the screw rod 221 through the transmission of the reducer 223. Preferably, the motor shaft of the reducer 223 can be fastened and connected to the screw rod 221 through a coupling 224, so as to drive the screw rod 221 to rotate synchronously with the motor shaft of the reducer 223.

[0031] It is understandable to those skilled in the art that, in addition to using a motor to drive the screw rod to rotate so that the slider 240 can slide along the extension direction of the linear guide 230, the power component 220 can also be driven by a cylinder. In this case, the power component 220 may specifically include a cylinder shaft and a telescopic cylinder (not shown) for driving the cylinder shaft to extend and retract. The extension direction of the cylinder shaft is the same as the extension direction of the linear guide 230. The slider 240 is fixed on the cylinder shaft so that when the telescopic cylinder drives the cylinder shaft to extend and retract, the slider 240 can move linearly along the linear guide 230.

[0032] In some examples, such as Figures 2 to 4 As shown, the clamping and stretching module 200 also includes a guide rail mounting bracket 260 extending radially along the target circle, and the linear guide 230 is installed on the guide rail mounting bracket 260 to achieve the installation and fixation of the linear guide 230. At the same time, the guide rail mounting bracket 260 can be specifically fixed on the mechanism mounting platform 300.

[0033] In some examples, such as Figures 2 to 4 As shown, the clamping assembly 210 includes a fixed clamping jaw 211, a movable clamping jaw 212 and a lifting cylinder 213. The fixed clamping jaw 211 and the movable clamping jaw 212 are arranged opposite to each other in the vertical direction, and the movable clamping jaw 212 is drivingly connected to the lifting cylinder 213 so as to move away from or close to the fixed clamping jaw 211 under the drive of the lifting cylinder 213. In this way, the movable clamping jaw 212 can be driven up and down by the lifting cylinder 213 to make the movable clamping jaw 212 close to the fixed clamping jaw 211, so that the movable clamping jaw 212 cooperates with the fixed clamping jaw 211 to clamp the film material on the film material adsorption platform 100 at the position. Furthermore, a first boss is protruding from a surface of the fixed jaw 211 facing the movable jaw 212, and the first boss is located on a side of the fixed jaw 211 adjacent to the film material adsorption platform 100, and a second boss is protruding from a surface of the movable jaw 212 facing the fixed jaw 211, and the second boss is located on a side of the movable jaw 212 adjacent to the film material adsorption platform 100. In this way, the relative abutment between the first boss and the second boss can more firmly clamp the film on the film material adsorption platform 100 in the current position.

[0034] In some examples, such as Figure 1 and Figure 2 As shown, the film material adsorption platform 100 includes a circular platform body 110 and a vacuum adsorption machine. A plurality of vacuum adsorption holes (not shown) are arranged in an array on the surface of the circular platform body 110, and each vacuum adsorption hole is connected to the air pipe of the vacuum adsorption machine. In this way, after the film material carrying the wafer is placed on the circular platform body 110, the air pipe of the vacuum adsorption machine is used to evacuate the plurality of vacuum adsorption holes, so that a huge suction force is generated on the upper surface of the circular platform body 110 to adsorb the film material.

[0035] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the inventive concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A wafer expansion mechanism, characterized in that: It includes a film material adsorption platform and at least three clamping and stretching modules, wherein the at least three clamping and stretching modules are evenly distributed around the film material adsorption platform along the circumferential direction of a target circle, and each of the clamping and stretching modules can clamp the film material on the film material adsorption platform at its position and stretch the film material along the radial direction of the target circle, wherein the target circle takes the center of the film material adsorption platform as the center; the clamping and stretching module includes a clamping component and a power component for driving the clamping component to move away from or close to the film material adsorption platform, wherein the power component includes a servo motor or a telescopic cylinder.

2. The wafer expansion mechanism according to claim 1, characterized in that: The clamping and stretching module also includes a linear guide rail extending radially along the target circle. The clamping component is slidably arranged on the linear guide rail and is drivingly connected to the power component so that under the drive of the power component, it moves away from or close to the film material adsorption platform along the extension direction of the linear guide rail.

3. The wafer expansion mechanism according to claim 2, characterized in that: The clamping and stretching module also includes a slider and a clamping claw cantilever. The clamping assembly is fixed on the clamping claw cantilever, and the clamping claw cantilever is slidably arranged on the linear guide rail through the slider. The slider is also drivingly connected to the power assembly.

4. The wafer expansion mechanism according to claim 3, characterized in that: The power assembly includes a screw and a servo motor that drives the screw to rotate. The extension direction of the screw is the same as the extension direction of the linear guide rail. The slider is threadedly connected to the screw so that when the servo motor drives the screw to rotate, the slider moves linearly relative to the screw along the extension direction of the screw.

5. The wafer expansion mechanism according to claim 4, characterized in that: The power assembly also includes a reducer, and the servo motor is drivingly connected to one end of the screw rod through the reducer.

6. The wafer expansion mechanism according to claim 3, characterized in that: The power assembly includes a cylinder shaft and a telescopic cylinder that drives the cylinder shaft to extend and retract. The extension direction of the cylinder shaft is the same as the extension direction of the linear guide rail. The slider is fixed on the cylinder shaft so that when the telescopic cylinder drives the cylinder shaft to extend and retract, the slider moves linearly along the linear guide rail.

7. The wafer expansion mechanism according to claim 2, characterized in that: The clamping and stretching module also includes a guide rail mounting bracket extending radially along the target circle, and the linear guide rail is installed on the guide rail mounting bracket.

8. The wafer expansion mechanism according to claim 1, characterized in that: The clamping assembly includes a fixed jaw, a movable jaw and a lifting cylinder. The fixed jaw and the movable jaw are arranged opposite to each other in the vertical direction, and the movable jaw is driven and connected to the lifting cylinder so that it can move away from or close to the fixed jaw under the drive of the lifting cylinder.

9. The wafer expansion mechanism according to any one of claims 1 to 8, characterized in that: The membrane material adsorption platform comprises a circular platform body and a vacuum adsorption machine. A plurality of vacuum adsorption holes are distributed in an array on the surface of the circular platform body, and each of the vacuum adsorption holes is connected to an air pipe of the vacuum adsorption machine.

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