Wafer film pasting device

Abstract

The utility model belongs to the technical field of wafer processing, and particularly relates to a wafer film pasting device which comprises a carrying table, a film pressing assembly and a film cutting assembly, the film pressing assembly comprises a film pressing roller and a driving mechanism used for driving the film pressing roller, and the driving mechanism comprises a rotating motor, a driving belt wheel, a middle belt wheel, a driving rod, a synchronous belt wheel and a driven belt wheel. Connecting blocks are arranged between the two ends of the film pressing roller and the second synchronous belt, the film pressing roller is elastically connected with the connecting blocks, and the film cutting assembly comprises a rotary film cutting mechanism and a linear film cutting mechanism which are elastically arranged. The rotating motor drives the connecting blocks on the two sides to move synchronously through the driving belt wheel, the first synchronous belt wheel, the middle belt wheel, the driving rod, the synchronous belt wheel and the second synchronous belt in sequence, so that the film pressing roller between the two connecting blocks is driven to move in a reciprocating mode to enable a protective film to be attached to a wafer to complete film pasting, manual operation is replaced, the film pressing effect is improved, and the production efficiency is improved. And the elastically arranged film pressing roller can play a buffering role, so that the wafer is prevented from being crushed.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer film pasting device. Background Art

[0002] Wafer laminating equipment is used to cover the surface of the wafer with a protective film to protect the wafer and prevent it from being damaged during cutting.

[0003] A Chinese patent with application number CN202222904570.6 discloses an anti-static wafer laminating machine, which includes a frame, an adsorption table, a sliding frame, a pressing rubber roller rotatably connected to the sliding frame, and an ion blower. When the blue film is pulled into the surface of the adsorption table, the pressing rubber roller abuts against the surface of the blue film on the side away from the adsorption table. When the blue film covers the surface of the adsorption table, the pressing rubber roller can slide horizontally with the sliding frame. At this time, the pressing rubber roller abuts against the adsorption table. It can be seen from the attached drawings that the sliding frame needs to be manually pulled by the handle thereon. However, manual operation is relatively cumbersome, and uneven force often occurs during the operation, causing the sliding frame to tilt or get stuck, resulting in poor film pressing effect. Utility Model Content

[0004] The technical problem to be solved by the utility model is: in order to solve the problem that the sliding frame in the prior art needs to be manually pulled by the handle thereon, but the manual operation is cumbersome, and uneven force often occurs during the operation, causing the sliding frame to tilt or get stuck, resulting in a poor film pressing effect. A wafer film bonding device is now provided.

[0005] The utility model solves the technical problem by adopting a technical solution: a wafer film attaching device, comprising:

[0006] A stage for carrying a wafer;

[0007] A film pressing assembly, comprising a film pressing roller and a driving mechanism for driving the film pressing roller to reciprocate along the X-axis direction, wherein the driving mechanism comprises a rotary motor, a driving pulley connected to the output end of the rotary motor, an intermediate pulley connected to the driving pulley through a first synchronous belt, a driving rod coaxially arranged with the intermediate pulley, synchronous pulleys arranged at both ends of the driving rod, and a driven pulley connected to the synchronous pulley through a second synchronous belt, connecting blocks are arranged between both ends of the film pressing roller and the second synchronous belt, and the film pressing roller is elastically connected to the connecting blocks;

[0008] And a film cutting assembly, which includes an elastically arranged rotary film cutting mechanism and a linear film cutting mechanism

[0009] Furthermore, both ends of the lamination roller are provided with mounting blocks, the connecting block is provided with a receiving groove for the mounting block to be installed, and an elastic member is provided between the mounting block and the groove top of the receiving groove.

[0010] Furthermore, both ends of the mounting block along the X-axis direction are protruded to form slide rails that slidably cooperate with the walls of the accommodating groove.

[0011] Furthermore, the laminating assembly also includes an X-axis guide rail arranged along the X-axis direction and an X-axis slider slidably arranged on the X-axis guide rail, and the X-axis slider is fixedly connected to the connecting block.

[0012] Furthermore, the rotary film cutting mechanism includes a cover plate, a rotating handwheel arranged on the cover plate, a rotating block connected to the output shaft of the rotating handwheel, a rotating rod elastically connected to the rotating block, a roller arranged at one end of the rotating rod and a rotary cutter arranged at the other end of the rotating rod.

[0013] Furthermore, both ends of the rotating rod are provided with U-shaped grooves extending along the Y-axis direction, the roller is slidably installed on one of the U-shaped grooves and locked by bolts, and the rotating cutter is slidably installed on the other U-shaped groove and locked by bolts.

[0014] Furthermore, the linear film cutting mechanism includes a Y-axis guide rail arranged along the Y-axis direction, a Y-axis slider slidably arranged on the Y-axis guide rail, a fixed block fixed on the Y-axis slider, and a linear cutter elastically arranged on the fixed block.

[0015] Furthermore, the carrier includes a steel ring positioning plate, an adsorption plate elastically arranged in the middle of the steel ring positioning plate, and a heating plate located at the bottom of the steel ring positioning plate, and the steel ring positioning plate is provided with a positioning hole for positioning the steel ring.

[0016] Furthermore, a connecting plate is provided between the two connecting blocks, and a handle is provided on the connecting plate.

[0017] Furthermore, both ends of the X-axis guide rail are provided with limit blocks for limiting the travel of the X-axis slider.

[0018] The beneficial effect of the utility model is that the rotating motor in the utility model drives the connecting blocks on both sides to move synchronously through the driving pulley, the first synchronous pulley, the intermediate pulley, the driving rod, the synchronous pulley and the second synchronous belt in sequence, thereby driving the film pressing roller between the two connecting blocks to reciprocate along the X-axis to press the protective film so that the protective film and the wafer are bonded to complete the film bonding, replacing manual operation and improving the film pressing effect. The elastically arranged film pressing roller can play a buffering role to avoid damaging the wafer.

[0019] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0022] Figure 2 It is a side view of the utility model after removing the panel;

[0023] Figure 3 This is a three-dimensional structural diagram of the utility model after removing the film cutting component;

[0024] Figure 4 yes Figure 3 A partial enlarged view of part A;

[0025] Figure 5 It is a schematic diagram of the structure of the membrane cutting assembly;

[0026] In the figure:

[0027] 1. Carrier; 101. Steel ring positioning plate; 102. Adsorption plate;

[0028] 2. Film pressing assembly; 201. Film pressing roller; 202. Rotating motor; 203. Driving pulley; 204. First synchronous belt; 205. Intermediate pulley; 206. Driving rod; 207. Synchronous pulley; 208. Second synchronous belt; 209. Driven pulley; 210. Connecting block; 2101. Accommodating groove; 211. Mounting block; 2111. Slide rail; 212. Elastic member; 213. X-axis guide rail; 214. X-axis slider; 215. Connecting plate; 216. Handle; 217. Limiting block;

[0029] 3. Film cutting assembly; 301. Rotary film cutting mechanism; 3011. Cover plate; 3012. Rotary hand wheel; 3013. Rotary block; 3014. Rotary rod; 3015. Roller; 3016. Rotary cutter; 3017. U-shaped groove; 302. Linear film cutting mechanism; 3021. Y-axis guide rail; 3022. Y-axis slider; 3023. Fixed block; 3024. Linear cutter. DETAILED DESCRIPTION

[0030] The utility model is now described in further detail in conjunction with the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, so they only show the components related to the utility model, and the directions and references (for example, up, down, left, right, etc.) can only be used to help describe the features in the drawings. Therefore, the following specific embodiments are not adopted in a restrictive sense, and the scope of the subject matter claimed is limited only by the attached claims and their equivalents.

[0031] like Figure 1-Figure 5 As shown, a wafer film attaching device includes a frame, on which a carrier 1, a film pressing assembly 2 and a film cutting assembly 3 are provided:

[0032] The carrier 1 is used for carrying the wafer;

[0033] The film pressing assembly 2 includes a film pressing roller 201 and a driving mechanism for driving the film pressing roller 201 to reciprocate along the X-axis direction, wherein the driving mechanism includes a rotating motor 202, a driving pulley 203 connected to the output end of the rotating motor 202, an intermediate pulley 205 connected to the driving pulley 203 through a first synchronous belt 204, a driving rod 206 coaxially arranged with the intermediate pulley 205, synchronous pulleys 207 arranged at both ends of the driving rod 206, and a driven pulley 209 connected to the synchronous pulley 207 through a second synchronous belt 208, and connecting blocks 210 are arranged between the two ends of the film pressing roller 201 and the second synchronous belt 208, and the film pressing roller 201 is elastically connected to the connecting blocks 210;

[0034] The film cutting assembly 3 includes a rotating film cutting mechanism 301 and a linear film cutting mechanism 302 which are elastically arranged.

[0035] First, place the wafer on the carrier 1, pull the protective film to cover the wafer, and then start the rotating motor 202 to drive the driving pulley 203 to rotate, the driving pulley 203 drives the intermediate pulley 205 to rotate through the first synchronous belt 204, the intermediate pulley 205 drives the two synchronous pulleys 207 to rotate synchronously, and the synchronous pulley 207 drives the film pressing roller 201 to reciprocate along the X-axis direction through the second synchronous belt 208. The film pressing roller 201 presses the protective film to make the protective film and the wafer fit together to complete the film lamination. During the film lamination process, the elastically set film pressing roller 201 can play a buffering role to avoid damaging the wafer. Finally, the film cutting assembly 3 separates the applied protective film from the entire roll of protective film.

[0036] In some examples, mounting blocks 211 are provided at both ends of the film pressing roller 201, and the connecting block 210 is provided with a receiving groove 2101 for installing the mounting block 211, and an elastic member 212 is provided between the mounting block 211 and the groove top of the receiving groove 2101, and the elastic member 212 is a spring, and a bolt is installed at the groove top of the receiving groove 2101, and a spring cavity for accommodating the spring is provided at the top of the mounting block 211, one end of the spring is connected to the bottom of the spring cavity, and the other end is connected to the nut of the bolt; during the film pressing process, the film pressing roller 201 reciprocates along the X-axis direction, and the film pressing roller 201 contacts the wafer, and an interaction force is generated between the two. Under the action of the elastic member 212, the film pressing roller 201 can float up and down inside the receiving groove 2101, which can play a buffering role and avoid the wafer from being crushed during the film pressing process.

[0037] In some examples, the mounting block 211 has two protrusions at both ends along its X-axis direction, and a slide rail 2111 that slidably cooperates with the wall of the accommodating groove 2101 is formed between the two protrusions. The wall of the accommodating groove 2101 can be regarded as a slider, and the cooperation between the slide rail 2111 and the slider can ensure that the mounting block 211 slides in a straight line direction inside the accommodating groove 2101.

[0038] In some examples, the film pressing assembly 2 also includes an X-axis guide rail 213 arranged along the X-axis direction and an X-axis slider 214 slidably arranged on the X-axis guide rail 213, the X-axis slider 214 is fixedly connected to the connecting block 210, the X-axis guide rail 213 is fixed on the frame, and the cooperation between the X-axis guide rail 213 and the X-axis slider 214 ensures the linear motion of the film pressing roller 201.

[0039] In some examples, the rotary film cutting mechanism 301 includes a cover plate 3011, a rotating handwheel 3012 arranged on the cover plate 3011, a rotating block 3013 connected to the output shaft of the rotating handwheel 3012, a rotating rod 3014 elastically connected to the rotating block 3013, a roller 3015 arranged at one end of the rotating rod 3014 and a rotating cutter 3016 arranged at the other end of the rotating rod 3014, the rotating block 3013 is provided with a through groove for the rotating rod 3014 to pass through, and U-shaped grooves 3017 are provided on both groove walls of the through groove, the pin passes through the two U-shaped grooves 3017 and the rotating rod 3014 therebetween, a spring is provided between the bottom of the through groove and the rotating rod 3014, there are at least two springs, and they are distributed on both sides of the pin. By turning the rotating hand wheel 3012, the rotating block 3013 drives the rotating rod 3014 to rotate synchronously, and the roller 3015 and the rotating cutter 3016 rotate synchronously. The roller 3015 presses down the cutting edge of the protective film during the rolling process, and the rotating cutter 3016 cuts the protective film along the cutting edge. During the process, the elastically connected rotating rod 3014 can play a buffering role.

[0040] In some examples, both ends of the rotating rod 3014 are provided with U-shaped grooves 3017 extending along the Y-axis direction, the roller 3015 is slidably installed on one of the U-shaped grooves 3017 through a mounting seat and locked by a bolt, and the rotating cutter 3016 is also slidably installed on the other U-shaped groove 3017 through a mounting seat and locked by a bolt; the bolts are loosened, the sliding mounting seat moves the roller 3015 and the rotating cutter 3016 to a predetermined position, and then the bolts are tightened so that the screw rod abuts against the bottom of the U-shaped groove 3017 to lock the roller 3015 and the rotating cutter 3016.

[0041] In some examples, the linear film cutting mechanism 302 includes a Y-axis guide rail 3021 arranged along the Y-axis direction, a Y-axis slider 3022 slidably arranged on the Y-axis guide rail 3021, a fixed block 3023 fixed to the Y-axis slider 3022, and a linear cutter 3024 elastically arranged on the fixed block 3023; the Y-axis slider 3022 is driven to slide along the Y-axis guide rail 3021, and the fixed block 3023 drives the linear cutter 3024 thereon to move along the Y-axis, thereby cutting the protective film.

[0042] In some examples, the carrier 1 includes a steel ring positioning plate 101, an adsorption plate 102 elastically arranged in the middle part of the steel ring positioning plate 101, and a heating plate located at the bottom of the steel ring positioning plate 101. The steel ring positioning plate 101 is provided with a positioning hole for positioning the steel ring for positioning the steel ring. While the adsorption plate 102 adsorbs the wafer, the heating plate heats it to make the protective film fit the wafer. In the initial state, the adsorption plate 102 is higher than the steel ring positioning plate 101. Under the action of the film pressing roller 201, the adsorption plate 102 can float up and down.

[0043] In some examples, a connecting plate 215 is disposed between the two connecting blocks 210 , and a handle 216 is disposed on the connecting plate 215 .

[0044] In some examples, both ends of the X-axis guide rail 213 are provided with limit blocks 217 for limiting the travel of the X-axis slider 214 , thereby limiting the travel of the lamination roller 201 .

[0045] Working principle:

[0046] First, the wafer is placed on the carrier 1, the adsorption plate 102 adsorbs the wafer while the heating plate heats it, and the protective film is pulled to cover the wafer, and then the rotary motor 202 is started to drive the driving pulley 203 to rotate, the driving pulley 203 drives the intermediate pulley 205 to rotate through the first synchronous belt 204, the intermediate pulley 205 drives the two synchronous pulleys 207 to rotate synchronously through the driving rod 206, and the synchronous pulley 207 drives the film pressing roller 201 to reciprocate along the X-axis direction through the second synchronous belt 208, and the film pressing roller 201 presses the protective film to make the protective film The protective film is bonded to the wafer. During the lamination process, the elastically set lamination roller 201 and the elastically set adsorption plate 102 can play a buffering role to avoid crushing the wafer while making the protective film and the wafer fit more closely. Finally, the cover plate 3011 is covered on the carrier 1, and the rotating hand wheel 3012 is turned. The rotating block 3013 drives the rotating rod 3014 to rotate, and the roller 3015 and the rotating cutter 3016 rotate synchronously. The roller 3015 presses down the cutting edge of the protective film during the rolling process, and the rotating cutter 3016 cuts the protective film along the cutting edge.

[0047] The above-mentioned ideal embodiments of the utility model are inspirations. Through the above-mentioned description, relevant staff can make various changes and modifications without deviating from the technical concept of the utility model. The technical scope of the utility model is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer film attaching device, characterized in that: include: A carrier (1) for carrying a wafer; A film pressing assembly (2), comprising a film pressing roller (201) and a driving mechanism for driving the film pressing roller (201) to reciprocate along the X-axis direction, the driving mechanism comprising a rotating motor (202), a driving pulley (203) connected to the output end of the rotating motor (202), an intermediate pulley (205) connected to the driving pulley (203) via a first synchronous belt (204), a driving rod (206) coaxially arranged with the intermediate pulley (205), synchronous pulleys (207) arranged at both ends of the driving rod (206), and a driven pulley (209) connected to the synchronous pulley (207) via a second synchronous belt (208), connecting blocks (210) are provided between the two ends of the film pressing roller (201) and the second synchronous belt (208), and the film pressing roller (201) is elastically connected to the connecting blocks (210); And a film cutting assembly (3), which comprises an elastically arranged rotary film cutting mechanism (301) and a linear film cutting mechanism (302).

2. The wafer film attaching device according to claim 1, characterized in that: Both ends of the film pressing roller (201) are provided with mounting blocks (211), the connecting block (210) is provided with a receiving groove (2101) for installing the mounting block (211), and an elastic member (212) is provided between the mounting block (211) and the groove top of the receiving groove (2101).

3. The wafer laminating device according to claim 2, characterized in that: Both ends of the mounting block (211) along the X-axis direction thereof are protruded to form slide rails (2111) that are slidably matched with the groove wall of the accommodating groove (2101).

4. The wafer film attaching device according to claim 1, characterized in that: The film pressing assembly (2) further comprises an X-axis guide rail (213) arranged along the X-axis direction and an X-axis slider (214) slidably arranged on the X-axis guide rail (213), and the X-axis slider (214) is fixedly connected to the connecting block (210).

5. The wafer film attaching device according to claim 1, characterized in that: The rotary film cutting mechanism (301) comprises a cover plate (3011), a rotary hand wheel (3012) arranged on the cover plate (3011), a rotary block (3013) connected to the output shaft of the rotary hand wheel (3012), a rotary rod (3014) elastically connected to the rotary block (3013), a roller (3015) arranged at one end of the rotary rod (3014), and a rotary cutter (3016) arranged at the other end of the rotary rod (3014).

6. The wafer film attaching device according to claim 5, characterized in that: Both ends of the rotating rod (3014) are provided with U-shaped grooves (3017) extending along the Y-axis direction, the roller (3015) is slidably mounted on one of the U-shaped grooves (3017) and locked by bolts, and the rotating cutter (3016) is slidably mounted on the other U-shaped groove (3017) and locked by bolts.

7. The wafer film attaching device according to claim 1, characterized in that: The linear film cutting mechanism (302) comprises a Y-axis guide rail (3021) arranged along the Y-axis direction, a Y-axis slider (3022) slidably arranged on the Y-axis guide rail (3021), a fixed block (3023) fixed to the Y-axis slider (3022), and a linear cutter (3024) elastically arranged on the fixed block (3023).

8. The wafer film attaching device according to claim 1, characterized in that: The carrier (1) comprises a steel ring positioning plate (101), an adsorption plate (102) elastically arranged in the middle of the steel ring positioning plate (101), and a heating plate located at the bottom of the steel ring positioning plate (101); and a positioning hole for positioning the steel ring is provided on the steel ring positioning plate (101).

9. The wafer film attaching device according to claim 1, characterized in that: A connecting plate (215) is provided between the two connecting blocks (210), and a handle (216) is provided on the connecting plate (215).

10. The wafer film attaching device according to claim 4, characterized in that: Limit blocks (217) for limiting the travel of the X-axis slider (214) are provided at both ends of the X-axis guide rail (213).

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