Head binding device of chip mounter

Abstract

The utility model relates to the technical field of semiconductors, in particular to a chip mounter binding device, which is used for picking and mounting chips and comprises a working module, a sealing module and an air pipe. The working module comprises a support and a connecting shaft rotatably arranged on the support in a penetrating mode, and the working end of the connecting shaft is exposed out of the support. One end of the sealing module is hermetically connected with the connecting shaft, the sealing module is far away from the working end of the connecting shaft, and the other end of the sealing module is hermetically connected with the air pipe; a vacuum channel is arranged in the connecting shaft, and the air pipe sequentially passes through the sealing module and the vacuum channel and then is communicated with the outside. The chip mounter binding head device solves the technical problems that a conventional chip mounter binding head device is insufficient in vacuum sealing performance, cannot ensure that a vacuum pressure value is within a deviation range when a chip is mounted, and is difficult to meet the requirement of high precision of chip mounting.

Description

[Technical field]

[0001] The utility model relates to the technical field of semiconductors, in particular to a head binding device for a chip mounter. [Background technology]

[0002] The head binding device of the chip mounter is an indispensable equipment in the integrated circuit packaging process. It is mainly used for picking and mounting chips during the automatic chip mounting process in the semiconductor industry. The chip is picked up by using the suction nozzle of the head binding device to remove the chip from the wafer, and the chip is mounted on the lead frame.

[0003] However, the existing head binding device of the chip mounter has insufficient vacuum sealing performance and cannot ensure that the vacuum pressure value range is within the deviation range during chip mounting, which makes it difficult to meet the high-precision requirements of chip mounting.

[0004] In view of this, the utility model provides a head binding device for a chip mounting machine with good vacuum sealing and high chip mounting accuracy to solve the above technical problems. [Contents of the utility model]

[0005] In order to solve the technical problems that the vacuum sealing of the existing head binding device of the chip mounting machine is insufficient, the vacuum pressure value during chip mounting cannot be guaranteed to be within the deviation range, and the high-precision requirements of chip mounting are difficult to meet, the utility model provides a head binding device for the chip mounting machine.

[0006] The technical solution of the utility model to solve the technical problem is to provide a head binding device for a chip mounter, which is used for picking up and mounting chips, and includes a working module, a sealing module and an air pipe;

[0007] The working module comprises a bracket and a connecting shaft rotatably arranged through the bracket, wherein the working end of the connecting shaft is exposed outside the bracket;

[0008] One end of the sealing module is sealingly connected to the connecting shaft, and the sealing module is arranged away from the working end of the connecting shaft, and the other end of the sealing module is sealingly connected to the air pipe;

[0009] A vacuum channel is provided inside the connecting shaft, and the air pipe is communicated with the outside after passing through the sealing module and the vacuum channel in sequence.

[0010] Preferably, the sealing module comprises a fastener and a small bearing sleeved on the connecting shaft, wherein the fastener is fastened to the outer ring of the small bearing; one side of the fastener is detachably connected to the bracket, and the other side is connected to the air pipe.

[0011] Preferably, the side of the fastener facing the bracket includes a first turning portion and a second turning portion that cooperate with each other, the first turning portion abuts against the side of the small bearing away from the connecting shaft, and the second turning portion abuts against the outer side of the small bearing; the fastener presses the outer ring of the small bearing through the first turning portion and the second turning portion.

[0012] Preferably, the contact surface of the first transition portion abutting against the small bearing is lower than the top end surface of the connecting shaft.

[0013] Preferably, the sealing module further comprises a sealing ring; the sealing ring is arranged between the fastener and the small bearing, between the fastener and the bracket and / or between the small bearing and the connecting shaft.

[0014] Preferably, a bearing assembly is provided inside the bracket; the bearing assembly is arranged along the length direction of the connecting shaft, and the bearing assembly is sleeved on the connecting shaft.

[0015] Preferably, the bearing assembly comprises a first bearing group and a second bearing group, and the first bearing group and / or the second bearing group are composed of at least two large bearings connected together; a spacer ring is also provided between the first bearing group and the second bearing group.

[0016] Preferably, the head binding device of the placement machine also includes a driving module, and the driving module is located on the outer side of the bracket; the driving module includes a motor and a synchronous wheel assembly, and the motor is drivingly connected to the connecting shaft through the synchronous wheel assembly.

[0017] Preferably, the synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel and a synchronous belt arranged between the first synchronous wheel and the second synchronous wheel; the first synchronous wheel is installed on the part of the connecting shaft exposed from the bracket, and the second synchronous wheel is installed on the output end of the motor.

[0018] Preferably, the working module further comprises a suction nozzle, the suction nozzle is connected to the working end of the connecting shaft, and the suction nozzle and the connecting shaft are internally connected.

[0019] Compared with the prior art, the head binding device for a chip mounter provided by the utility model has the following advantages:

[0020] 1. The first embodiment of the utility model provides a head binding device for a chip mounter, which is used for picking up and mounting chips. The head binding device for the chip mounter includes a working module, a sealing module and an air pipe; the working module includes a bracket and a connecting shaft rotatably inserted into the bracket, and the working end of the connecting shaft is exposed from the bracket; one end of the sealing module is sealed and connected to the connecting shaft, and the sealing module is arranged away from the working end of the connecting shaft, and the other end of the sealing module is sealed and connected to the air pipe; a vacuum channel is provided inside the connecting shaft, and the air pipe is connected to the outside world after passing through the sealing module and the vacuum channel in turn.

[0021] It can be understood that the chip mounting machine head binding device provided in the first embodiment of the utility model can be used for picking up and mounting chips during the automatic mounting process in the semiconductor industry. A sealing module is arranged in the head binding device, and the two ends of the sealing module are respectively sealed with the connecting shaft and the air pipe to ensure good vacuum sealing and high vacuum degree when picking up the chip, thereby ensuring that the position of the chip does not shift during the high-speed movement process of picking up the chip for mounting.

[0022] It should be noted that, the utility model designs the sealing module of the head binding device and the positions of the connecting shaft and the air pipe respectively connected to the sealing module. One end of the sealing module is sealed and connected to the connecting shaft, and the other end is sealed and connected to the air pipe, so that the requirements of chip manufacturing can be met during chip mounting, and the quality of the chip can be prevented from being affected by insufficient vacuum sealing. Through this design, the technical problems of insufficient vacuum sealing of the head binding device of the existing chip mounting machine, inability to ensure that the vacuum pressure value during chip mounting is within the deviation range, and difficulty in meeting the high-precision requirements of chip mounting are solved.

[0023] 2. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein the sealing module includes a fastener and a small bearing sleeved on the connecting shaft, wherein the fastener is tightly connected to the outer ring of the small bearing; one side of the fastener is detachably connected to the bracket, and the other side is connected to the air pipe.

[0024] It can be understood that the fastener is tightly connected to the outer ring of the small bearing, and the fastener is detachably fixed to the bracket. Since the small bearing is sleeved on the connecting shaft, that is, the connecting shaft is sleeved on the inner ring part of the small bearing, through this design, the position of the connecting shaft can be fixed to ensure that the head binding device has high vacuum sealing.

[0025] 3. In the SMT head binding device provided by the first embodiment of the utility model, the side of the fastener facing the bracket includes a first turning part and a second turning part that cooperate with each other, the first turning part abuts against the side of the small bearing away from the connecting shaft, and the second turning part abuts against the outer side of the small bearing; the fastener presses the outer ring of the small bearing through the first turning part and the second turning part.

[0026] It can be understood that the first turning part and the second turning part are arranged on the side of the fastener facing the bracket, and the first turning part and the second turning part cooperate with each other, wherein the first turning part abuts against the side of the small bearing away from the connecting shaft, and the second turning part abuts against the outer side of the small bearing.

[0027] It should be noted that the fastener presses the outer ring of the small bearing through the first turning part and the second turning part. Through this design, the position of the connecting shaft is further fixed to ensure that the air pipe is sealed and connected to the vacuum channel inside the connecting shaft through the fastener, further improving the vacuum sealing of the head binding device.

[0028] 4. In the first embodiment of the present invention, the first transition portion provides a head binding device for a chip mounter, wherein the contact surface of the first transition portion against the small bearing is lower than the top end surface of the connecting shaft.

[0029] It can be understood that the first turning part presses the outer ring of the small bearing by abutting against the small bearing, wherein the contact surface between the first turning part and the small bearing needs to be lower than the top end surface of the connecting shaft. Through this design, the air pipe can be connected to the vacuum channel through the sealing module, ensuring that the vacuum channel inside the connecting shaft is connected to the output end of the air pipe through the fastener.

[0030] 5. In the SMT head binding device provided in the first embodiment of the utility model, the sealing module further comprises a sealing ring; the sealing ring is arranged between the fastener and the small bearing, between the fastener and the bracket and / or between the small bearing and the connecting shaft.

[0031] It can be understood that by providing sealing rings at the parts connecting between the fastener and the small bearing, the parts connecting between the fastener and the bracket, and the parts connecting between the small bearing and the connecting shaft, the high sealing performance of the head binding device can be ensured, and the device is wear-resistant and durable, thereby improving the service life of the head binding device.

[0032] 6. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein a bearing assembly is provided inside the bracket; the bearing assembly is arranged along the length direction of the connecting shaft, and the bearing assembly is sleeved on the connecting shaft.

[0033] It can be understood that the bearing assembly is sleeved on the connecting shaft and arranged along the length direction of the bearing assembly. Through this design, the rigidity of the connecting shaft can be ensured.

[0034] It should be noted that during the process of the head binding device sucking the chip for mounting, the bearing assembly is responsible for supporting the rotation of the connecting shaft, reducing the friction generated during the mounting process, ensuring the rotation accuracy of the connecting shaft, and ensuring that the head binding device rotates concentrically to meet the high-precision requirements of the chip mounting position.

[0035] 7. The first embodiment of the utility model provides a head binding device for a chip placement machine, wherein the bearing assembly includes a first bearing group and a second bearing group, and the first bearing group and / or the second bearing group are composed of at least two large bearings connected together; a spacer ring is also provided between the first bearing group and the second bearing group.

[0036] It can be understood that by arranging the first bearing group and the second bearing group on the head binding device, and the first bearing group and / or the second bearing group are composed of at least two large bearings connected together, it can be ensured that when the head binding device is pressed down to realize chip picking and mounting, no lateral force is generated on the chip, thereby meeting the high precision requirements of the chip picking and mounting position.

[0037] It should be noted that a spacer ring is arranged between the first bearing group and the second bearing group, and the function of the spacer ring is to separate the axial forces exerted on the first bearing group and the second bearing group.

[0038] 8. The first embodiment of the utility model provides a head binding device for a chip mounter, further comprising a driving module, which is located on the outer side of the bracket; the driving module comprises a motor and a synchronous wheel assembly, and the motor is connected to the connecting shaft through the synchronous wheel assembly.

[0039] It can be understood that the motor and the synchronous wheel assembly are arranged on the outer side of the bracket, and the motor is connected to the connecting shaft through the synchronous wheel assembly. The rotation of the motor first drives the synchronous wheel assembly to achieve synchronous rotation, and then the synchronous wheel assembly drives the connecting shaft to rotate synchronously. Through this design, the friction force encountered by the connecting shaft when rotating is lower.

[0040] It should be noted that compared with the situation where the motor and the connecting shaft rotate directly in synchronization, the embodiment of the utility model sets the drive module on the outer side of the bracket. The motor and the connecting shaft are not set on the same axis, but are connected by a synchronous wheel assembly, which greatly improves the sealing inside the head binding device.

[0041] 9. The first embodiment of the utility model provides a head binding device for a chip placement machine, wherein the synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel, and a synchronous belt arranged between the first synchronous wheel and the second synchronous wheel; the first synchronous wheel is installed on the portion of the connecting shaft exposed to the bracket, and the second synchronous wheel is installed on the output end of the motor.

[0042] It can be understood that the embodiments of the utility model realize the rotation of the connecting shaft when the motor rotates through a synchronous belt transmission method, so as to reduce the size of the head binding device in its vertical direction, reserve sufficient space for installing a downward-looking camera, and then realize 360° rotation correction of the chip mounting angle, improve the accuracy of the chip mounting angle, and be compatible with the replacement of suction nozzles of different sizes.

[0043] It should be noted that the synchronous belt transmission method is to install a second synchronous wheel at the output end of the motor. When the motor is working, the rotation of the motor drives the second synchronous wheel to achieve synchronous rotation; the first synchronous wheel is installed on the part of the connecting shaft exposed to the bracket, and a synchronous belt is set between the first synchronous wheel and the second synchronous wheel. Through this design, when the second synchronous wheel rotates, the first synchronous wheel is connected to the second synchronous wheel through the synchronous belt, and the rotation of the second synchronous wheel drives the first synchronous wheel to achieve synchronous rotation.

[0044] 10. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein the working module further comprises a suction nozzle, which is connected to the working end of the connecting shaft, and the suction nozzle and the connecting shaft are internally connected.

[0045] It can be understood that when the suction nozzle is connected to the working end of the connecting shaft and the two are internally connected, the air pipe is sealed and connected to the equipment responsible for air extraction. The equipment responsible for air extraction is turned on to keep the air pipe continuously evacuated to extract the gas in the air pipe, the sealing module, the vacuum channel and the suction nozzle, so that there is an air pressure difference between the inside of the suction nozzle and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle, and then the chip is picked up and mounted, so as to ensure the rigidity of deep cavity mounting and meet the high-precision requirements of the chip mounting position.

Brief Description of the Drawings

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0047] Figure 1 It is a schematic diagram of the overall structure of the head binding device of the chip mounter in the first embodiment of the utility model.

[0048] Figure 2 It is a cross-sectional view of the internal structure of the head binding device of the chip placement machine according to the first embodiment of the utility model.

[0049] Figure 3 The utility model Figure 2 A partial enlarged view of part A.

[0050] Description of the accompanying drawings:

[0051] 100. Head binding device for chip mounter;

[0052] 1. Working module; 11. Bracket; 12. Connecting shaft; 121. Vacuum channel; 13. Bearing assembly; 131. First bearing group; 1311. Large bearing; 132. Second bearing group; 133. Spacer ring; 14. Suction nozzle;

[0053] 2. Sealing module; 21. Fastener; 211. First turning part; 212. Second turning part; 22. Small bearing; 23. Sealing ring; 31. Air pipe;

[0054] 4. Drive module; 41. Motor; 42. Synchronous wheel assembly; 421. First synchronous wheel; 422. Second synchronous wheel; 423. Synchronous belt. [Specific implementation method]

[0055] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0056] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0057] It should be noted that the terms "first" and "second" etc. in the specification and claims of the present utility model are used to distinguish different objects rather than to describe a specific order.

[0058] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0059] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0060] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0061] See also Figure 1 and Figure 2 The first embodiment of the utility model provides a head binding device 100 for a chip mounter, which is used for picking up and mounting chips. The head binding device 100 for a chip mounter includes a working module 1, a sealing module 2 and an air pipe 31; the working module 1 includes a bracket 11 and a connecting shaft 12 rotatably inserted into the bracket 11, and the working end of the connecting shaft 12 is exposed from the bracket 11; one end of the sealing module 2 is sealed and connected to the connecting shaft 12, and the sealing module 2 is arranged away from the working end of the connecting shaft 12, and the other end of the sealing module 2 is sealed and connected to the air pipe 31; a vacuum channel 121 is provided inside the connecting shaft 12, and the air pipe 31 is connected to the outside after passing through the sealing module 2 and the vacuum channel 121 in sequence.

[0062] The chip mounter head binding device 100 provided in the first embodiment of the present invention is mainly used for picking up and accurately mounting chips during the automatic mounting process in the semiconductor industry.

[0063] Specifically, the head binding device 100 of the SMT machine is provided with a sealing module 2, one end of the sealing module 2 is sealedly connected to the air pipe 31, and the other end is sealedly connected to the connecting shaft 12, wherein the sealing module 2 is sealedly connected to the connecting shaft 12, and then communicated with the vacuum channel 121 opened inside the connecting shaft 12.

[0064] The above design can ensure good vacuum sealing and high vacuum degree when picking up the chip, thereby ensuring that the position of the chip does not shift during the high-speed movement of the chip when picking up the chip for mounting.

[0065] It can be understood that the first embodiment of the utility model designs the sealing module 2 of the head binding device 100 of the placement machine and the positions of the connecting shaft 12 and the air pipe 31 respectively connected to the sealing module 2. One end of the sealing module 2 is sealedly connected to the connecting shaft 12, and the other end is sealedly connected to the air pipe 31, so as to meet the chip manufacturing requirements during chip placement and avoid the quality of the chip being affected by insufficient vacuum sealing.

[0066] It should be noted that the vacuum channel 121 is arranged inside the connecting shaft 12.

[0067] Among them, the vacuum channel 121 is arranged along the length direction of the connecting shaft 12 and runs through both ends of the connecting shaft 12. One end of the sealing module 2 is sealed and connected to the connecting shaft 12 to seal the end of the connecting shaft 12, so that the sealing module 2 is connected to the vacuum channel 121 inside the connecting shaft 12.

[0068] The utility model solves the technical problems that the vacuum sealing performance of the existing head binding device of the chip mounting machine is insufficient, the vacuum pressure value during chip mounting cannot be guaranteed to be within the deviation range, and the high-precision requirement of chip mounting is difficult to meet.

[0069] It should be further explained that the connecting shaft 12 is rotatably inserted into the bracket 11, and the air outlet end of the air pipe 31 is connected to the vacuum channel 121 inside the connecting shaft 12 through the sealing module 2, wherein the working end of the connecting shaft 12 is exposed from the bracket 11, and in the head binding device 100 of the placement machine, the working end of the connecting shaft 12 is generally connected to the suction nozzle, and the working end of the connecting shaft 12 is internally connected to the suction nozzle, that is, the vacuum channel 121 is internally connected to the suction nozzle, and the suction nozzle seals the working end of the connecting shaft 12 so that the vacuum channel 121 inside the connecting shaft 12 is connected to the inside of the suction nozzle.

[0070] In the head binding device 100 of the placement machine, the air pipe 31 is connected to the inside of the suction nozzle after passing through the sealing module 2 and the vacuum channel 121 inside the connecting shaft 12 in sequence. The specific process of adsorbing the chip is as follows: the air inlet end of the air pipe 31 is connected to the vacuum device, and the air outlet end thereof is connected to the sealing module 2. After the suction nozzle is attached to the chip, the vacuum device is turned on to keep the air pipe 31 pumped, and the gas in the air pipe 31, the inside of the sealing module 2, the vacuum channel 121 and the inside of the suction nozzle is extracted, so that there is an air pressure difference between the inside of the suction nozzle and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle. At this time, the chip can be picked up and mounted by adsorption at the working end of the suction nozzle.

[0071] Ideally, the interior of the head binding device 100 of the SMT machine is in a completely vacuum state. However, in reality, a completely vacuum state is not easy to achieve, the cost is relatively high, and the requirements for the exhaust equipment are relatively high.

[0072] Optionally, the head binding device 100 of the placement machine also includes a device for replacing a suction nozzle. For the connecting shaft 12 in the working module 1, its working end can be connected to suction nozzles of different sizes, and the suction nozzle can be replaced automatically or manually, which can be set according to actual conditions.

[0073] For details, please continue to refer to Figure 2 The sealing module 2 includes a fastener 21 and a small bearing 22 sleeved on the connecting shaft 12 , and the fastener 21 is tightly connected to the outer ring of the small bearing 22 .

[0074] The outer ring of the small bearing 22 is connected to the fastener 21 , and the inner ring of the small bearing 22 is sleeved on the connecting shaft 12 .

[0075] Furthermore, one side of the fastener 21 is detachably connected to the bracket 11 , and the other side is connected to the air pipe 31 .

[0076] It can be understood that, as a specific implementation in the first embodiment of the utility model, while the fastener 21 is fastened to the outer ring of the small bearing 22 , the side of the fastener 21 facing the small bearing 22 is also detachably fixed to the bracket 11 .

[0077] Therefore, it can be known that the side where the fastener 21 is connected to the bracket 11 is sealed through the small bearing 22, and the side where the fastener 21 is connected to the air pipe 31 is also sealed.

[0078] It should be noted that, through the mutual cooperation between the fastener 21 and the small bearing 22 sleeved on the connecting shaft 12, wherein the fastener 21 abuts against the outer ring of the small bearing 22, after the fastener 21 is detachably fixed to the bracket 11, the small bearing 22 is fixed by the abutment of the fastener 21. Since the small bearing 22 is sleeved on the connecting shaft 12, that is, the connecting shaft 12 is sleeved on the inner ring of the small bearing 22, through this design, the position of the connecting shaft 12 can be fixed to ensure that the head binding device 100 of the placement machine has high vacuum sealing.

[0079] It should be further explained that the connection method between the fastener 21 and the bracket 11 includes but is not limited to threaded connection and snap connection, which can be set specifically according to actual conditions. As a preferred implementation scheme of the first embodiment of the utility model, the specific connection method in which one side of the fastener 21 is detachably connected to the bracket 11 is a threaded connection.

[0080] For further information, see Figure 2 and Figure 3 The side of the fastener 21 facing the bracket 11 includes a first turning portion 211 and a second turning portion 212 that cooperate with each other. The first turning portion 211 abuts against the side of the small bearing 22 away from the connecting shaft 12, and the second turning portion 212 abuts against the outer side of the small bearing 22; the fastener 21 presses the outer ring of the small bearing 22 through the first turning portion 211 and the second turning portion 212.

[0081] It can be understood that the first turning portion 211 and the second turning portion 212 are arranged on the fastener 21, and the first turning portion 211 and the second turning portion 212 are both arranged facing the bracket 11, and the first turning portion 211 and the second turning portion 212 on the fastener 21 cooperate with each other and are tightly connected with the outer ring of the small bearing 22 to press the outer ring of the small bearing 22.

[0082] The first turning portion 211 of the first embodiment of the present invention abuts against a side of the small bearing 22 away from the connecting shaft 12 , and the second turning portion 212 abuts against an outer side surface of the small bearing 22 .

[0083] It should be noted that the fastener 21 presses the outer ring of the small bearing 22 through the first turning portion 211 and the second turning portion 212, and the outer ring of the small bearing 22 is sleeved on the connecting shaft 12. Through this design, the position of the connecting shaft 12 is further fixed to ensure that the air pipe 31 is sealed and connected to the vacuum channel 121 inside the connecting shaft 12 after passing through the fastener 21, thereby further improving the vacuum sealing of the head binding device 100 of the placement machine.

[0084] Please continue reading Figure 2 and Figure 3 The contact surface of the first transition portion 211 against the small bearing 22 is lower than the top end surface of the connecting shaft 12 .

[0085] It can be understood that the first turning portion 211 presses the outer ring of the small bearing 22 by pressing against the small bearing 22 . Specifically, the first turning portion 211 presses against a side of the small bearing 22 away from the connecting shaft 12 .

[0086] As a preferred implementation scheme of the first embodiment of the utility model, the contact surface between the first turning portion 211 and the small bearing 22 needs to be arranged on a top end surface lower than the connecting shaft 12 .

[0087] It should be noted that by designing the horizontal plane where the first turning portion 211 is located to be lower than the top end surface of the connecting shaft 12, the air pipe 31 can be connected to the vacuum channel 121 inside the connecting shaft 12 through the sealing module 2, so as to ensure that the vacuum channel 121 is connected to the output end of the air pipe 31 after passing through the small bearing 22 and the fastener 21.

[0088] See also Figure 2 and Figure 3 The sealing module 2 further includes a sealing ring 23 ; the sealing ring 23 is arranged between the fastener 21 and the small bearing 22 .

[0089] It can be understood that the sealing ring 23 is an important sealing element, and its main functions include preventing leakage or seepage of fluid (liquid or gas), maintaining a pressure difference between the inside of the device and the outside (even a complete vacuum state), and preventing the entry of pollutants and dust.

[0090] It should be noted that the sealing ring 23 in the utility model connects the vacuum channel 121 inside the connecting shaft 12 with the air outlet end of the air pipe 31 through its good sealing effect, ensuring high sealing inside the SMT head binding device 100, and is wear-resistant and durable, thereby improving the service life of the SMT head binding device 100.

[0091] Furthermore, the sealing ring 23 can also protect the sealing surface in contact with it from being damaged; optionally, in addition to being set in the portion connecting the fastener 21 and the small bearing 22, the sealing ring 23 can also be set between the fastener 21 and the bracket 11, and can also be set between the small bearing 22 and the connecting shaft 12, wherein the sealing ring 23 can be set in the portion connecting the above two.

[0092] In particular, the sealing ring 23 cannot be connected to the inner ring and outer ring of the small bearing 22. The sealing effect of the sealing ring 23 can ensure the high sealing performance inside the SMT head binding device 100. Its setting on the inner and outer rings of the small bearing 22 will affect the normal rotation of the small bearing 22.

[0093] As a preferred implementation scheme of the first embodiment of the utility model, the sealing ring 23 is arranged between the fastener 21 and the small bearing 22. It can be understood that the number and position of the sealing ring 23 can be set according to actual needs. That is to say, the specific implementation method of this embodiment cannot be used to limit the utility model. Any modifications, equivalent replacements and improvements made within the principles of the utility model should be included in the protection scope of the utility model.

[0094] Please continue reading Figure 2 A bearing assembly 13 is provided inside the bracket 11 ; the bearing assembly 13 is arranged along the length direction of the connecting shaft 12 , and the bearing assembly 13 is sleeved on the connecting shaft 12 .

[0095] It can be understood that the bearing assembly 13 is not only sleeved on the connecting shaft 12, but also arranged along the length direction of the connecting shaft 12. Through this design, the rigidity of the connecting shaft 12 can be ensured.

[0096] It should be noted that the bearing assembly 13 is located inside the bracket 11. When the head binding device 100 of the placement machine absorbs the chip for placement, the bearing assembly 13 can support the rotation of the connecting shaft 12 to correct the angle of the chip.

[0097] In addition, the bearing assembly 13 can also reduce the friction generated during the chip mounting process and ensure the rotation accuracy of the connecting shaft 12, ensuring that the head binding device 100 of the chip mounting machine rotates concentrically to meet the high-precision requirements of the chip mounting position.

[0098] For further information, please refer to Figure 2 The bearing assembly 13 includes a first bearing group 131 and a second bearing group 132. The first bearing group 131 and / or the second bearing group 132 are composed of at least two large bearings 1311 connected together.

[0099] It can be understood that the first bearing group 131 and the second bearing group 132 both include large bearings 1311. In the first bearing group 131 and the second bearing group 132, the number of large bearings 1311 can be one, two or more. The specific number of large bearings 1311 can be set according to actual conditions. For example, when the length of the connecting shaft 12 and the specific model of the large bearings 1311 used change, the specific number of large bearings 1311 can be changed accordingly.

[0100] It should be noted that, as a specific implementation of the first embodiment of the utility model, the first bearing group 131 and the second bearing group 132 are both composed of two large bearings 1311 connected together. The large bearings 1311 provided in the first bearing group 131 and the second bearing group 132 can ensure that when the head binding device 100 of the placement machine is pressed down to realize chip picking and placement, no lateral force is generated on the chip, thereby meeting the high-precision requirements of the chip placement position.

[0101] It should be further explained that, for the SMT head binding device 100 provided in the first embodiment of the present invention, the first bearing group 131 and the second bearing group 132 of the bearing assembly 13 are both composed of two large bearings 1311 connected together. This design can provide good stability when mounting chips, but the specific implementation method of this embodiment cannot limit the present invention. For example, the number of large bearings 1311 included in the first bearing group 131 and the second bearing group 132 can be different, and the provision of multiple large bearings 1311 can improve the working performance of the SMT head binding device 100 and reduce the friction inside the device. Therefore, any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

[0102] Please continue reading Figure 2 , the cross-sectional area of ​​the connecting shaft 12 changes continuously in the length direction thereof.

[0103] Specifically, starting from the end of the connecting shaft 12 exposed from the bracket 11, the cross-sectional area of ​​the connecting shaft 12 decreases when reaching the second bearing group 132; when passing through the second bearing group 132 and the first bearing group 131, the cross-sectional area of ​​the connecting shaft 12 remains unchanged; when passing between the first bearing group 131 and the end of the connecting shaft 12, the cross-sectional area of ​​the connecting shaft 12 first decreases and then increases; when reaching the small bearing 22, the cross-sectional area of ​​the connecting shaft 12 decreases.

[0104] It can be understood that in the process of the continuous change of the cross-sectional area of ​​the connecting shaft 12, the outer peripheral surface of the connecting shaft 12 is tightly connected to the large bearing 1311 in the first bearing group 131 and the second bearing group 132, and is also tightly connected to the small bearing 22 to ensure that the connecting shaft 12 will not shake in its horizontal direction; wherein, when passing between the first bearing group 131 and the end of the connecting shaft 12, the cross-sectional area of ​​the connecting shaft 12 first decreases and then increases, which can ensure that the connecting shaft 12 will not slide up and down in its vertical direction (that is, in the length direction). Through this design, the stability of the head binding device 100 of the placement machine when picking up and mounting chips can be ensured.

[0105] It should be noted that the amplitude of the change in the cross-sectional area of ​​the connecting shaft 12, as well as the position of the change in the cross-sectional area, can be adjusted according to actual conditions. For example, when the model and size of the large bearing 1311 and the small bearing 22 change, the amplitude and position of the change in the above-mentioned cross-sectional area will also change accordingly, which will not be elaborated here.

[0106] As an optional implementation in the first embodiment of the present invention, a spacer ring 133 is further provided between the first bearing group 131 and the second bearing group 132 .

[0107] It can be understood that the spacer ring 133 is arranged between the bottom end face of the first bearing group 131 and the top end face of the second bearing group 132, and the spacer ring 133 is pressed by the large bearings 1311 of the first bearing group 131 and the second bearing group 132 respectively. The function of the spacer ring 133 is to separate the axial force exerted on the first bearing group 131 and the second bearing group 132.

[0108] Optionally, the spacer ring 133 may not be provided between the first bearing group 131 and the second bearing group 132. In this case, the first bearing group 131 and the second bearing group 132 are connected via the large bearing 1311. This can also ensure that when the head binding device 100 of the placement machine is pressed down to pick up and mount the chip, no lateral force is generated on the chip, thereby meeting the high-precision requirements of the chip mounting position.

[0109] Please continue reading Figure 1 and Figure 2 The head binding device 100 of the placement machine also includes a driving module 4, which is located on the outer side of the bracket 11; the driving module 4 includes a motor 41 and a synchronous wheel assembly 42, and the motor 41 is transmission-connected to the connecting shaft 12 through the synchronous wheel assembly 42.

[0110] It can be understood that the driving module 4 is used to drive the head binding device 100 of the placement machine to achieve high-precision chip picking and placement, wherein the driving module 4 includes a motor 41 and a synchronous wheel assembly 42, and the motor 41 and the synchronous wheel assembly 42 are arranged on the outer side of the bracket 11.

[0111] Specifically, the motor 41 is connected to the connecting shaft 12 through the synchronous wheel assembly 42. When the motor 41 in the driving module 4 is working, the rotation of the motor 41 first drives the synchronous wheel assembly 42 to achieve synchronous rotation, and then the synchronous wheel assembly 42 drives the connecting shaft 12 to rotate synchronously. It should be noted that in the first embodiment of the utility model, the rotation of the motor 41 drives the rotation of the synchronous wheel assembly 42, thereby realizing the driving of the connecting shaft 12. Through this design, it is avoided that the motor 41 needs to be directly connected to the end of the connecting shaft 12, occupying the position of the end of the connecting shaft 12 to drive the rotation of the connecting shaft 12, thereby ensuring the good sealing of the air pipe 31, the inside of the sealing module 2 and the vacuum channel 121 in the connecting shaft 12.

[0112] The first embodiment of the present invention provides a head binding device 100 for a chip mounter, which realizes synchronous rotation of the connecting shaft 12 and the motor 41 through a synchronous wheel assembly 42. This design can reduce the friction force on the connecting shaft 12 during rotation.

[0113] It should be noted that, compared with the situation where the motor 41 and the connecting shaft 12 directly rotate synchronously on the same axis, the embodiment of the utility model sets the driving module 4 on the outer side of the bracket 11, and the motor 41 and the connecting shaft 12 are not set on the same axis, but the motor 41 is set on the side of the connecting shaft 12, that is, the motor 41 is set on the outer side of the bracket 11, and the transmission connection between the motor 41 and the connecting shaft 12 is realized by the synchronous wheel assembly 42, which greatly improves the sealing inside the head binding device 100 of the placement machine.

[0114] Please continue reading Figure 2 The synchronous wheel assembly 42 includes a first synchronous wheel 421 , a second synchronous wheel 422 , and a synchronous belt 423 disposed between the first synchronous wheel 421 and the second synchronous wheel 422 .

[0115] The first synchronous wheel 421 is installed on a portion of the connecting shaft 12 exposed from the bracket 11 , and the second synchronous wheel 422 is installed on an output end of the motor 41 .

[0116] It can be understood that in the SMT head binding device 100 provided by the present invention, the motor 41 of the drive module 4 is arranged off-axis from the connecting shaft 12, and the motor 41 is connected to the connecting shaft 12 through a synchronous wheel assembly 42, which is specifically achieved through a synchronous belt drive.

[0117] It should be noted that the synchronous belt transmission method is realized through the synchronous wheel structure, which is also called the synchronous gear structure. It is a mechanical transmission device that transmits motion and power. The main function of this device is to transmit motion and torque between two or more shafts to achieve synchronous operation of the equipment; the synchronous wheel structure is widely used in various engineering machinery, automation equipment, and transportation vehicles such as automobiles.

[0118] In the specific implementation of the first embodiment of the utility model, the synchronous operation of the motor 41 and the connecting shaft 12 can be achieved through a synchronous belt transmission method. When the second synchronous wheel 422 rotates, the first synchronous wheel 421 is connected to the second synchronous wheel 422 through a synchronous belt 423, and the rotation of the second synchronous wheel 422 drives the first synchronous wheel 421 to achieve synchronous rotation.

[0119] Specifically, a first synchronous wheel 421 is installed on the portion of the connecting shaft 12 exposed from the bracket 11, and a second synchronous wheel 422 is installed at the output end of the motor 41. In the first embodiment of the utility model, the first synchronous wheel 421 and the second synchronous wheel 422 are located on the same plane, and a synchronous belt 423 is arranged between the first synchronous wheel 421 and the second synchronous wheel 422. Both sides of the synchronous belt 423 are respectively wound around the first synchronous wheel 421 and the second synchronous wheel 422 to achieve synchronous rotation between the first synchronous wheel 421 and the second synchronous wheel 422.

[0120] Furthermore, when the motor 41 is working, the second synchronous wheel 422 installed at the output end of the motor 41 rotates synchronously with the rotation of the motor 41. The rotation of the second synchronous wheel 422 causes the synchronous belt 423 to rotate, thereby driving the rotation of the first synchronous wheel 421. At this time, the connecting shaft 12 on which the first synchronous wheel 421 is installed also rotates accordingly, thereby realizing the transmission connection between the motor 41 and the connecting shaft 12.

[0121] The head binding device 100 of the chip mounter in the first embodiment of the utility model drives the rotation of the connecting shaft 12 while realizing the rotation of the motor 41 through a synchronous belt transmission method, so as to reduce the size of the head binding device 100 of the chip mounter in its vertical direction, thereby reserving sufficient space for installing a downward-looking camera. When the head binding device 100 of the chip mounter is working, the connecting shaft 12 can realize a 360° rotation to correct the chip mounting angle and improve the accuracy of the chip mounting angle.

[0122] In addition, by reducing the vertical dimension of the head binding device 100 of the placement machine, a certain space can be reserved to provide equipment for replacing the suction nozzle to meet the compatibility of replacing suction nozzles of different sizes.

[0123] Optionally, the motor 41 is located on the outer side of the bracket 11 and is detachably connected to the bracket 11. The motor 41 can be installed on the bracket 11 by bolting the two, snapping the two, or other installation methods. In other words, the specific implementation method of this embodiment cannot be used to limit the utility model. Any modifications, equivalent replacements and improvements made within the principles of the utility model should be included in the protection scope of the utility model.

[0124] Please continue reading Figure 1 and Figure 2The working module 1 also includes a suction nozzle 14, which is connected to the working end of the connecting shaft 12, and the suction nozzle 14 and the connecting shaft 12 are internally connected.

[0125] It can be understood that the suction nozzle 14 is connected to the working end of the connecting shaft 12 , and the interior of the suction nozzle 14 is communicated with the interior of the connecting shaft 12 , that is, the interior of the suction nozzle 14 is communicated with the vacuum channel 121 provided inside the connecting shaft 12 .

[0126] Specifically, the air pipe 31 passes through the sealing module 2 , the vacuum channel 121 inside the connecting shaft 12 , and the inside of the suction nozzle 14 in sequence, and finally communicates with the outside through the inside of the suction nozzle 14 .

[0127] It should be noted that, as a preferred implementation scheme of the first embodiment of the utility model, the air outlet end of the air pipe 31 is connected to the sealing module 2, and the air inlet end of the air pipe 31 is connected to the air extraction device, thereby realizing a sealed connection among the air extraction device, the air pipe 31 and the sealing module 2.

[0128] Furthermore, when the suction nozzle 14 is connected to the working end of the connecting shaft 12 and the two are internally connected, the vacuum device is turned on to enable the vacuum device to keep pumping air to the air pipe 31, and the gas in the air pipe 31, the inside of the sealing module 2, the vacuum channel 121 and the inside of the suction nozzle 14 is extracted, so that there is an air pressure difference between the inside of the suction nozzle 14 and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle 14, thereby realizing the picking and mounting of the chip. Through this design, the rigidity of the head binding device 100 of the placement machine for deep cavity mounting of the chip can be guaranteed to meet the high-precision requirements of the chip mounting position.

[0129] Compared with the prior art, the head binding device for a chip mounter provided by the utility model has the following advantages:

[0130] 1. The first embodiment of the utility model provides a head binding device for a chip mounter, which is used for picking up and mounting chips. The head binding device for the chip mounter includes a working module, a sealing module and an air pipe; the working module includes a bracket and a connecting shaft rotatably inserted into the bracket, and the working end of the connecting shaft is exposed from the bracket; one end of the sealing module is sealed and connected to the connecting shaft, and the sealing module is arranged away from the working end of the connecting shaft, and the other end of the sealing module is sealed and connected to the air pipe; a vacuum channel is provided inside the connecting shaft, and the air pipe is connected to the outside world after passing through the sealing module and the vacuum channel in turn.

[0131] It can be understood that the chip mounting machine head binding device provided in the first embodiment of the utility model can be used for picking up and mounting chips during the automatic mounting process in the semiconductor industry. A sealing module is arranged in the head binding device, and the two ends of the sealing module are respectively sealed with the connecting shaft and the air pipe to ensure good vacuum sealing and high vacuum degree when picking up the chip, thereby ensuring that the position of the chip does not shift during the high-speed movement process of picking up the chip for mounting.

[0132] It should be noted that, the utility model designs the sealing module of the head binding device and the positions of the connecting shaft and the air pipe respectively connected to the sealing module. One end of the sealing module is sealed and connected to the connecting shaft, and the other end is sealed and connected to the air pipe, so that the requirements of chip manufacturing can be met during chip mounting, and the quality of the chip can be prevented from being affected by insufficient vacuum sealing. Through this design, the technical problems of insufficient vacuum sealing of the head binding device of the existing chip mounting machine, inability to ensure that the vacuum pressure value during chip mounting is within the deviation range, and difficulty in meeting the high-precision requirements of chip mounting are solved.

[0133] 2. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein the sealing module includes a fastener and a small bearing sleeved on the connecting shaft, wherein the fastener is tightly connected to the outer ring of the small bearing; one side of the fastener is detachably connected to the bracket, and the other side is connected to the air pipe.

[0134] It can be understood that the fastener is tightly connected to the outer ring of the small bearing, and the fastener is detachably fixed to the bracket. Since the small bearing is sleeved on the connecting shaft, that is, the connecting shaft is sleeved on the inner ring part of the small bearing, through this design, the position of the connecting shaft can be fixed to ensure that the head binding device has high vacuum sealing.

[0135] 3. In the SMT head binding device provided by the first embodiment of the utility model, the side of the fastener facing the bracket includes a first turning part and a second turning part that cooperate with each other, the first turning part abuts against the side of the small bearing away from the connecting shaft, and the second turning part abuts against the outer side of the small bearing; the fastener presses the outer ring of the small bearing through the first turning part and the second turning part.

[0136] It can be understood that the first turning part and the second turning part are arranged on the side of the fastener facing the bracket, and the first turning part and the second turning part cooperate with each other, wherein the first turning part abuts against the side of the small bearing away from the connecting shaft, and the second turning part abuts against the outer side of the small bearing.

[0137] It should be noted that the fastener presses the outer ring of the small bearing through the first turning part and the second turning part. Through this design, the position of the connecting shaft is further fixed to ensure that the air pipe is sealed and connected to the vacuum channel inside the connecting shaft through the fastener, further improving the vacuum sealing of the head binding device.

[0138] 4. In the first embodiment of the present invention, the first transition portion provides a head binding device for a chip mounter, wherein the contact surface of the first transition portion against the small bearing is lower than the top end surface of the connecting shaft.

[0139] It can be understood that the first turning part presses the outer ring of the small bearing by abutting against the small bearing, wherein the contact surface between the first turning part and the small bearing needs to be lower than the top end surface of the connecting shaft. Through this design, the air pipe can be connected to the vacuum channel through the sealing module, ensuring that the vacuum channel inside the connecting shaft is connected to the output end of the air pipe through the fastener.

[0140] 5. In the SMT head binding device provided in the first embodiment of the utility model, the sealing module further comprises a sealing ring; the sealing ring is arranged between the fastener and the small bearing, between the fastener and the bracket and / or between the small bearing and the connecting shaft.

[0141] It can be understood that by providing sealing rings at the parts connecting between the fastener and the small bearing, the parts connecting between the fastener and the bracket, and the parts connecting between the small bearing and the connecting shaft, the high sealing performance of the head binding device can be ensured, and the device is wear-resistant and durable, thereby improving the service life of the head binding device.

[0142] 6. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein a bearing assembly is provided inside the bracket; the bearing assembly is arranged along the length direction of the connecting shaft, and the bearing assembly is sleeved on the connecting shaft.

[0143] It can be understood that the bearing assembly is sleeved on the connecting shaft and arranged along the length direction of the bearing assembly. Through this design, the rigidity of the connecting shaft can be ensured.

[0144] It should be noted that during the process of the head binding device sucking the chip for mounting, the bearing assembly is responsible for supporting the rotation of the connecting shaft, reducing the friction generated during the mounting process, ensuring the rotation accuracy of the connecting shaft, and ensuring that the head binding device rotates concentrically to meet the high-precision requirements of the chip mounting position.

[0145] 7. The first embodiment of the utility model provides a head binding device for a chip placement machine, wherein the bearing assembly includes a first bearing group and a second bearing group, and the first bearing group and / or the second bearing group are composed of at least two large bearings connected together; a spacer ring is also provided between the first bearing group and the second bearing group.

[0146] It can be understood that by arranging the first bearing group and the second bearing group on the head binding device, and the first bearing group and / or the second bearing group are composed of at least two large bearings connected together, it can be ensured that when the head binding device is pressed down to realize chip picking and mounting, no lateral force is generated on the chip, thereby meeting the high precision requirements of the chip picking and mounting position.

[0147] It should be noted that a spacer ring is arranged between the first bearing group and the second bearing group, and the function of the spacer ring is to separate the axial forces exerted on the first bearing group and the second bearing group.

[0148] 8. The first embodiment of the utility model provides a head binding device for a chip mounter, further comprising a driving module, which is located on the outer side of the bracket; the driving module comprises a motor and a synchronous wheel assembly, and the motor is connected to the connecting shaft through the synchronous wheel assembly.

[0149] It can be understood that the motor and the synchronous wheel assembly are arranged on the outer side of the bracket, and the motor is connected to the connecting shaft through the synchronous wheel assembly. The rotation of the motor first drives the synchronous wheel assembly to achieve synchronous rotation, and then the synchronous wheel assembly drives the connecting shaft to rotate synchronously. Through this design, the friction force encountered by the connecting shaft when rotating is lower.

[0150] It should be noted that compared with the situation where the motor and the connecting shaft rotate directly in synchronization, the embodiment of the utility model sets the drive module on the outer side of the bracket. The motor and the connecting shaft are not set on the same axis, but are connected by a synchronous wheel assembly, which greatly improves the sealing inside the head binding device.

[0151] 9. The first embodiment of the utility model provides a head binding device for a chip placement machine, wherein the synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel, and a synchronous belt arranged between the first synchronous wheel and the second synchronous wheel; the first synchronous wheel is installed on the portion of the connecting shaft exposed to the bracket, and the second synchronous wheel is installed on the output end of the motor.

[0152] It can be understood that the embodiments of the utility model realize the rotation of the connecting shaft when the motor rotates through a synchronous belt transmission method, so as to reduce the size of the head binding device in its vertical direction, reserve sufficient space for installing a downward-looking camera, and then realize 360° rotation correction of the chip mounting angle, improve the accuracy of the chip mounting angle, and be compatible with the replacement of suction nozzles of different sizes.

[0153] It should be noted that the synchronous belt transmission method is to install a second synchronous wheel at the output end of the motor. When the motor is working, the rotation of the motor drives the second synchronous wheel to achieve synchronous rotation; the first synchronous wheel is installed on the part of the connecting shaft exposed to the bracket, and a synchronous belt is set between the first synchronous wheel and the second synchronous wheel. Through this design, when the second synchronous wheel rotates, the first synchronous wheel is connected to the second synchronous wheel through the synchronous belt, and the rotation of the second synchronous wheel drives the first synchronous wheel to achieve synchronous rotation.

[0154] 10. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein the working module further comprises a suction nozzle, which is connected to the working end of the connecting shaft, and the suction nozzle and the connecting shaft are internally connected.

[0155] It can be understood that when the suction nozzle is connected to the working end of the connecting shaft and the two are internally connected, the air pipe is sealed and connected to the equipment responsible for air extraction. The equipment responsible for air extraction is turned on to keep the air pipe continuously evacuated to extract the gas in the air pipe, the sealing module, the vacuum channel and the suction nozzle, so that there is an air pressure difference between the inside of the suction nozzle and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle, and then the chip is picked up and mounted, so as to ensure the rigidity of deep cavity mounting and meet the high-precision requirements of the chip mounting position.

[0156] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A head binding device for a chip mounter, used for picking up and mounting chips, characterized in that: It includes a working module, a sealing module and an air pipe; The working module comprises a bracket and a connecting shaft rotatably arranged through the bracket, wherein the working end of the connecting shaft is exposed outside the bracket; One end of the sealing module is sealingly connected to the connecting shaft, and the sealing module is arranged away from the working end of the connecting shaft, and the other end of the sealing module is sealingly connected to the air pipe; A vacuum channel is provided inside the connecting shaft, and the air pipe is communicated with the outside after passing through the sealing module and the vacuum channel in sequence.

2. The head binding device for a chip mounter according to claim 1, characterized in that: The sealing module comprises a fastener and a small bearing sleeved on the connecting shaft, wherein the fastener is tightly connected to the outer ring of the small bearing; One side of the fastener is detachably connected to the bracket, and the other side is communicated with the air pipe.

3. The head binding device for a chip mounter according to claim 2, characterized in that: The side of the fastener facing the bracket includes a first turning portion and a second turning portion that cooperate with each other, the first turning portion abuts against a side of the small bearing away from the connecting shaft, and the second turning portion abuts against an outer side surface of the small bearing; The fastener presses the outer ring of the small bearing through the first turning portion and the second turning portion.

4. The head binding device for a chip mounter according to claim 3, characterized in that: The contact surface of the first turning portion abutting against the small bearing is lower than the top end surface of the connecting shaft.

5. The head binding device for a chip mounter according to claim 2, characterized in that: The sealing module also includes a sealing ring; The sealing ring is arranged between the fastener and the small bearing, between the fastener and the bracket and / or between the small bearing and the connecting shaft.

6. The head binding device for a chip mounter according to claim 1, characterized in that: A bearing assembly is provided inside the bracket; The bearing assembly is arranged along the length direction of the connecting shaft, and the bearing assembly is sleeved on the connecting shaft.

7. The head binding device for a chip mounter according to claim 6, characterized in that: The bearing assembly comprises a first bearing group and a second bearing group, wherein the first bearing group and / or the second bearing group is composed of at least two large bearings connected together; A spacer ring is also provided between the first bearing group and the second bearing group.

8. The head binding device for a chip mounter according to claim 1, characterized in that: The head binding device of the chip mounter further comprises a driving module, and the driving module is located on the outer side of the bracket; The driving module comprises a motor and a synchronous wheel assembly, and the motor is drivingly connected to the connecting shaft via the synchronous wheel assembly.

9. The head binding device for a chip mounter according to claim 8, characterized in that: The synchronous wheel assembly comprises a first synchronous wheel, a second synchronous wheel and a synchronous belt arranged between the first synchronous wheel and the second synchronous wheel; The first synchronous wheel is mounted on a portion of the connecting shaft exposed from the bracket, and the second synchronous wheel is mounted on an output end of the motor.

10. The head binding device for a chip mounter according to claim 1, characterized in that: The working module also includes a suction nozzle, which is connected to the working end of the connecting shaft, and the suction nozzle and the connecting shaft are internally connected.

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