Component removal device

Abstract

The utility model belongs to the technical field of electronic component disassembly, and relates to a component removal device which comprises a feeding mechanism, a grabbing mechanism, a bearing table and a grinding mechanism, the feeding mechanism is configured to convey a target workpiece, the grabbing mechanism and the bearing table are both arranged on the peripheral side of the feeding mechanism, the grabbing mechanism is configured to grab the target workpiece on the feeding mechanism, and the grinding mechanism is configured to grind the target workpiece on the bearing table. Transferring to a bearing table; the bearing table is configured to fix a target workpiece; the grinding mechanism comprises a cutter and a first driving assembly, the cutter is installed on the first driving assembly, and the first driving assembly is configured to drive the cutter to grind a chip in a target workpiece. Through cooperation of the grabbing mechanism, the bearing table and the grinding mechanism, the chips in the target workpiece can be automatically removed. Compared with an existing method for manually disassembling and removing the chip, the risk that other electronic components in the target workpiece are damaged can be reduced, the quality of the repaired target workpiece is improved, and the chip removal efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic component disassembly, and in particular to a component removal device. Background Art

[0002] The appearance of general consumer electronic products is developing towards thin and light size, but the functions of electronic products are increasing, which makes the design of components on the circuit board of electronic products correspondingly integrated and high-density. There are many types of chip components on the circuit board, and most of them are protected by special glue. At present, for the repair and disassembly of chip components on the circuit board, hot air is generally used to heat and melt the tin, and then the chip components are manually clamped and disassembled to remove them.

[0003] However, due to the different sizes of chip components and the high density of chip component layout, manual chip removal is prone to touching and damaging other surrounding components. In addition, when heating and melting the chip solder joints, it is easy to cause the solder joints of other surrounding components to melt as well, resulting in undesirable phenomena such as bridging solder joints and empty solder joints, which greatly reduces the quality of the disassembled circuit board. Utility Model Content

[0004] In view of this, it is necessary to provide a component removal device to improve the technical problem of the existing manual disassembly of easily damaged components and the poor quality of the circuit board after disassembly.

[0005] The present application provides a component removal device, which includes a feeding mechanism, a gripping mechanism, a supporting platform and a grinding mechanism. The feeding mechanism is configured to transport a target workpiece, the gripping mechanism is configured to grip the target workpiece on the feeding mechanism and transfer it to the supporting platform; the supporting platform is configured to fix the target workpiece; the grinding mechanism includes a tool and a first drive assembly, the tool is installed on the first drive assembly, and the first drive assembly is configured to drive the tool to grind a target element in the target workpiece.

[0006] The above-mentioned component removal device can realize the automatic removal of the target component in the target workpiece through the cooperation of the grabbing mechanism, the supporting platform and the grinding mechanism. Specifically, when the target component in the target workpiece needs to be removed, the grabbing mechanism first grabs the target workpiece from the feeding mechanism and transfers the target workpiece to the supporting platform. Subsequently, the supporting platform fixes the target workpiece. After the target workpiece is fixed, the tool in the grinding mechanism grinds the target component in the target workpiece through the drive of the first driving assembly, thereby realizing the removal of the target component in the target workpiece. Compared with the existing manual disassembly and removal of the target component, it can not only reduce the risk of damage to other electronic components in the target workpiece and improve the quality of the target workpiece after rework, but also reduce the labor intensity of the operator and improve the chip removal efficiency.

[0007] In at least one embodiment, the grinding mechanism further includes a height sensing assembly mounted on the tool and configured to measure a height of a target element in the target workpiece.

[0008] In the above embodiment, the component removal device can measure the height of the target component in the target workpiece through the height detection component, and adjust the grinding depth of the tool according to the real-time data, so as to improve the grinding accuracy of the target component during the grinding process, ensure that the target component is effectively removed without damaging the surrounding components, and further improve the quality of the target workpiece after rework.

[0009] In at least one embodiment, the height detection assembly includes a probe and a driving member, wherein the probe is connected to the driving member, and the driving member is configured to drive the probe to move toward or away from a target workpiece.

[0010] In the above embodiment, through the control of the driving member, the probe can accurately adjust its position to achieve precise measurement of the height of the target element in the target workpiece, providing an important reference basis for subsequent grinding operations and ensuring the accuracy and stability of the grinding effect.

[0011] In at least one embodiment, the grinding mechanism further includes a first photographing component, which is configured to obtain first image information of the target workpiece on the carrier to detect the degree of removal of the target element in the target workpiece.

[0012] In the above embodiment, the automatic monitoring of the removal degree of the target component by the first shooting component can not only realize the automatic multiple removal of the target component to improve the degree of automation of the component removal device, but also reduce the risk of damage to the mainboard of the target workpiece due to the difficulty in controlling the single grinding depth, thereby further improving the quality of the target workpiece after rework.

[0013] In at least one embodiment, the component removal device further includes a tool magazine, wherein a plurality of tools of the same or different specifications are accommodated in the tool magazine.

[0014] In the above embodiment, on the one hand, by setting up the tool library, the automatic replacement of the tool in the component removal device can be realized, the time of manual tool replacement can be reduced, and the automation degree of the component removal device can be further improved. On the other hand, the tools of different specifications in the tool library can meet the needs of target components in different target workpieces, and improve the versatility of the component removal device.

[0015] In at least one embodiment, the supporting platform includes a base, a supporting portion and a fixed cover, the supporting portion is mounted on the base and is provided with at least one receiving groove for accommodating a target workpiece; the fixed cover is detachably mounted on the supporting portion, and is provided with a through hole corresponding to the receiving groove; the through hole is configured to expose a target element in the target workpiece when the fixed cover fixes the target workpiece.

[0016] In the above embodiment, the component removal device fixes the target workpiece through the fixing cover, which can prevent the target workpiece from shaking during the grinding process and improve the grinding accuracy. At the same time, a through hole is provided in the fixing cover to ensure the visibility and handling convenience of the target component during the removal process, further improving the removal efficiency of the target component.

[0017] In at least one embodiment, the bearing portion is slidably mounted on the base; the component removal device further comprises a pick-and-place mechanism, which is configured to install the fixed cover on the bearing platform or remove the fixed cover from the bearing platform.

[0018] In the above embodiment, through the cooperation of the carrying part and the pick-and-place mechanism, the operator can easily install the fixed cover on the carrying platform, or remove the fixed cover from the carrying platform, so as to process the target workpiece and remove the target component, thereby further improving the automation and efficiency of the component removal device.

[0019] In at least one embodiment, the pick-and-place mechanism includes a bracket, a second drive assembly and a pick-and-place assembly, the second drive assembly is mounted on the bracket, and the pick-and-place assembly is connected to the second drive assembly; the second drive assembly is configured to drive the pick-and-place assembly to move toward or away from the bearing part when the bearing part slides to correspond to the pick-and-place assembly, so as to install or remove the fixed cover.

[0020] In the above embodiment, the fast installation and removal of the fixed cover is achieved through the coordinated action of the second drive assembly and the pick-and-place assembly. Specifically, when removing the fixed cover, the load-bearing portion slides to correspond to the pick-and-place assembly, and the second drive assembly drives the pick-and-place assembly to move in the direction close to the load-bearing portion to adsorb the fixed cover; then, the second drive assembly drives the pick-and-place assembly to move in the direction away from the load-bearing portion to separate the fixed cover from the load-bearing portion, thus completing the removal of the fixed cover. When installing the fixed cover, it is only necessary to drive the pick-and-place assembly with the fixed cover adsorbed thereon to move in the direction close to the load-bearing portion through the second drive assembly, and fix the fixed cover to the load-bearing portion.

[0021] In at least one embodiment, the component removal device also includes a second shooting component, which is arranged between the feeding mechanism and the supporting platform; the second shooting component is configured to obtain second image information of the target workpiece on the grasping mechanism; the grasping mechanism is configured to adjust the position of the target workpiece according to the second image information so that the orthographic projection of the target workpiece along the vertical direction corresponds to the receiving groove in the supporting platform.

[0022] In the above embodiment, the gripping mechanism can accurately adjust the position of the target workpiece through the second shooting component so that the target workpiece can be accurately positioned and placed on the carrier, thereby reducing the risk of position deviation of the target workpiece in the subsequent grinding process, causing errors, and improving the processing quality of the component removal device.

[0023] In at least one embodiment, the grabbing mechanism includes a third driving component, a material picking component and a third shooting component. The material picking component is connected to the third driving component, and the third shooting component is installed on the material picking component; the third shooting component is configured to obtain third image information of the target workpiece on the feeding mechanism to locate the target workpiece; the third driving component is configured to drive the material picking component according to the third image information, grab the target workpiece on the feeding mechanism, and move it to the supporting platform.

[0024] In the above embodiment, the component removal device can accurately identify and locate the target workpiece through the third shooting component, and accurately grab the target workpiece through the third driving component and the picking component. Thus, the picking accuracy of the grabbing mechanism is improved, so as to further improve the working efficiency and processing quality of the component removal device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a component removal device provided in an embodiment of the present application;

[0026] Figure 2 yes Figure 1 A schematic diagram of the feeding mechanism shown;

[0027] Figure 3 yes Figure 1 The structural schematic diagram of the grinding mechanism shown;

[0028] Figure 4 yes Figure 3 A schematic diagram of a part of the structure of the grinding mechanism shown;

[0029] Figure 5 It is a schematic diagram of the structure of the grinding mechanism and the supporting platform in one embodiment of the present application;

[0030] Figure 6 yes Figure 1 The structural schematic diagram of the grabbing mechanism shown;

[0031] Figure 7 yes Figure 6 A partial structural schematic diagram of the grabbing mechanism shown;

[0032] Figure 8 yes Figure 1 A schematic structural diagram of the second shooting assembly shown;

[0033] Fig. 9 yes Figure 1 The structural schematic diagram of the bearing platform shown;

[0034] Fig.10 yes Fig. 9 A schematic diagram of the internal structure of the carrier platform shown;

[0035] Fig.11 yes Figure 1 The structural schematic diagram of the pick-and-place mechanism shown;

[0036] Fig.12 It is a structural schematic diagram of the cooperation between the pick-and-place mechanism and the carrying platform in one embodiment of the present application.

[0037] Main component symbols

[0038] Component removal device 100

[0039] Feeding mechanism 10

[0040] Track 11

[0041] Transport Vehicle 12

[0042] Grasping mechanism 20

[0043] The third driving component 21

[0044] Reclaiming assembly 22

[0045] The third shooting component 23

[0046] Carrying platform 30

[0047] Base 31

[0048] Carrying part 32

[0049] Accommodation groove 321

[0050] Fixed cover 33

[0051] Ball screw 34

[0052] Dust cover 35

[0053] Grinding mechanism 40

[0054] Tool 41

[0055] The first drive assembly 42

[0056] Height detection component 43

[0057] Probe 431

[0058] Drive 432

[0059] First shooting component 44

[0060] Tool magazine 50

[0061] Tool setting probe 60

[0062] Pick and place mechanism 70

[0063] Bracket 71

[0064] Second drive assembly 72

[0065] Pick and place components 73

[0066] The second shooting component 80

[0067] Dust cover 81

[0068] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0069] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0070] Hereinafter, if used, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. Positional terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to the components, and may change accordingly according to changes in the orientation of the components placed in the accompanying drawings.

[0071] In this application, if used, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, detachable connection, or integrated; can be directly connected or indirectly connected through an intermediate medium. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0072] When the following embodiments are described in detail in conjunction with schematic diagrams, for ease of explanation, the diagrams showing the local structures of the devices will not be partially enlarged according to the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of this application.

[0073] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0074] The present application provides a component removal device 100, which is used to remove scrapped components in a reworked circuit board. The components may be chips, capacitors, resistors, etc. The present application does not limit this, and those skilled in the art may select according to actual conditions. For the convenience of description in the present application, a chip will be used as an example for description.

[0075] like Figure 1 As shown, the component removal device 100 includes a feeding mechanism 10, a gripping mechanism 20, a carrier 30 and a grinding mechanism 40. The feeding mechanism 10 is configured to convey a target workpiece, which is a reworked circuit board. Figure 2 As shown, the feeding mechanism 10 includes two rails 11 and a plurality of transport carriers 12. The two rails 11 are arranged in parallel, and the plurality of transport carriers 12 are arranged between the two parallel rails 11 at intervals. The transport carriers 12 are configured to carry the target workpiece and can slide back and forth along the rails 11 to transport the target workpiece.

[0076] In one embodiment, if Figure 2 As shown, the number of transport carriers 12 is 3, and the 3 transport carriers 12 move independently of each other. It can be understood that when transporting the target workpiece, the 3 transport carriers 12 can transport the target workpiece alternately to reduce the downtime waiting time of the feeding mechanism 10 and improve the conveying efficiency of the feeding mechanism 10. In other embodiments, the number of transport carriers 12 can also be 4, 5 or other numbers, which is not limited in this application, and those skilled in the art can choose according to actual conditions.

[0077] In one embodiment, the distance between the two rails 11 is adjustable to meet the needs of target workpieces of different sizes, thereby improving the versatility of the component removal device 100 .

[0078] In one embodiment, if Figure 1 As shown, the gripping mechanism 20 and the carrier 30 are both arranged on the outer peripheral side of the feeding mechanism 10, and the gripping mechanism 20 is configured to grip the target workpiece on the feeding mechanism 10 and transfer it to the carrier 30. The carrier 30 is configured to fix the target workpiece. The grinding mechanism 40 includes a tool 41 and a first drive assembly 42, the tool 41 is installed on the first drive assembly 42, and the first drive assembly 42 is configured to drive the tool 41 to grind the chip in the target workpiece.

[0079] It can be understood that when it is necessary to remove the chip in the target workpiece, the grabbing mechanism 20 first grabs the target workpiece from the feeding mechanism 10 and transfers the target workpiece to the carrier 30. Subsequently, the carrier 30 fixes the target workpiece to ensure the stability of the subsequent processing process. After the target workpiece is fixed, the tool 41 in the grinding mechanism 40 grinds the chip in the target workpiece through the drive of the first driving component 42, thereby removing the chip in the target workpiece.

[0080] Compared with the existing manual disassembly and removal of chips, the component removal device 100 realizes automatic removal of chips from the target workpiece through the cooperation of the gripping mechanism 20, the carrier 30 and the grinding mechanism 40. In this way, it can not only reduce the risk of damage caused by touching other electronic components in the target workpiece and improve the quality of the target workpiece after repair, but also reduce the labor intensity of operators and improve the chip removal efficiency.

[0081] In one embodiment, if Figure 1 , Figure 3 , Figure 4 and Figure 5 As shown, the grinding mechanism 40 further includes a height detection component 43, which is mounted on the tool 41 and is configured to measure the height of the chip in the target workpiece. It can be understood that during the grinding of the chip, the component removal device 100 can measure the height of the chip in the target workpiece through the height detection component 43 and adjust the grinding depth of the tool 41 according to the real-time data.

[0082] As a result, the chip grinding accuracy during the grinding process is improved, ensuring that the chip is effectively removed without damaging surrounding components, thereby improving the quality of the target workpiece after rework.

[0083] In one embodiment, the height detection assembly 43 includes a probe 431 and a driver 432. The probe 431 is connected to the driver 432, and the driver 432 is configured to drive the probe 431 to move toward or away from the target workpiece, which is conducive to accurately measuring the height of the chip in the target workpiece.

[0084] It can be understood that when the height of the chip in the target workpiece needs to be measured, the driving member 432 first drives the probe 431 to move toward the target workpiece until the probe 431 abuts against the top surface of the chip in the target workpiece, at which time the first height is measured.

[0085] Then, the driving member 432 continues to drive the probe 431 to move toward the target workpiece until the probe 431 touches the top surface of the mainboard in the target workpiece, at which time the second height is measured. Finally, the difference between the first height and the second height is calculated to obtain the height of the chip in the target workpiece.

[0086] It should be noted that, through the control of the driving member 432, the probe 431 can accurately adjust its position to achieve precise measurement of the chip height in the target workpiece, providing an important reference basis for subsequent grinding operations and ensuring the accuracy and stability of the grinding effect.

[0087] It should also be noted that while the first driving component 42 drives the tool 41 to grind the chip, the driving member 432 drives the probe 431 to measure the height of the chip after grinding. In short, the grinding of the chip and the measurement of the chip height are performed simultaneously. In addition, as the height of the chip decreases, the tool 41 gradually moves toward the direction close to the chip to ensure that the tool 41 is always in contact with the chip for grinding.

[0088] In other embodiments, the height detection component 43 may also be other structures, and the process of measuring the chip height in the target workpiece may also be other methods. This application does not limit this, and technicians in this field may choose according to actual conditions.

[0089] In one embodiment, the height detection component 43 is disposed on the outer side wall of the tool 41, that is, the height detection component 43 moves synchronously with the tool 41. By moving the height detection component 43 synchronously with the tool 41, it can be ensured that the chip height information detected by the height detection component 43 is consistent with the actual height to be cut, avoiding errors caused by the difference between the detection position and the cutting position. In addition, the height detection component 43 that moves synchronously with the tool 41 can monitor the distance between the tool 41 and the workpiece in real time, without the need for additional downtime for height adjustment.

[0090] Of course, in other embodiments, the height detection component 43 may also be set at other positions, which is not limited in the present application, and those skilled in the art may choose according to actual conditions.

[0091] In one embodiment, if Figure 4 As shown, the grinding mechanism 40 further includes a first photographing component 44, which is configured to obtain first image information of the target workpiece on the carrier 30 to detect the removal degree of the chip in the target workpiece.

[0092] In one embodiment, the first photographing component 44 is a CCD camera, which is mounted on the outer wall of the tool 41. When the first driving component 42 drives the tool 41 to grind the chip in the target workpiece to a certain depth, the CCD camera takes a picture of the target workpiece to obtain first image information of the target workpiece.

[0093] In one embodiment, since the color of the chip in the target workpiece is different from that of the mainboard in the target workpiece, the component removal device 100 analyzes the color of the chip position in the first image information and the color of the mainboard. If the color of the chip position is different from that of the mainboard, it means that the chip in the target workpiece has not been completely removed. At this time, the first driving component 42 continues to drive the tool 41 to grind the chip; if the color of the chip position is the same as that of the mainboard, it means that the chip in the target workpiece has been completely removed. At this time, the first driving component 42 drives the tool 41 to move to the next chip position.

[0094] Alternatively, in another embodiment, the component removal device 100 can analyze the height between the top surface of the chip and the top surface of the mainboard in the first image information to determine whether the chip is completely removed. If the height difference between the top surface of the chip and the top surface of the mainboard is greater than zero, it means that the chip in the target workpiece has not been completely removed. At this time, the first drive component 42 continues to drive the tool 41 to grind the chip. If the height between the top surface of the chip and the top surface of the mainboard is equal to zero, it means that the chip in the target workpiece has been completely removed. At this time, the first drive component 42 drives the tool 41 to move to the next chip position.

[0095] The component removal device 100 in the present application automatically monitors the degree of chip removal through the first shooting component 44, which can not only realize automatic multiple removal of chips to improve the degree of automation of the component removal device 100, but also reduce the risk of damage to the mainboard of the target workpiece due to the difficulty in controlling the depth of a single grinding, thereby further improving the quality of the target workpiece after rework.

[0096] In other embodiments, the first shooting component 44 may also be other structures, as long as it can detect the degree of chip removal. This application does not limit this, and technicians in this field can choose according to actual conditions.

[0097] In one embodiment, the grinding mechanism 40 further includes a dust collection component (not shown), which is disposed on the outer peripheral side of the tool 41, and is configured to collect dust generated by grinding when the tool 41 grinds the chips in the target workpiece. It should be noted that, by providing the dust collection component (not shown), the wear of the equipment parts by dust can be reduced, the service life of the equipment can be extended, and the maintenance cost can be reduced. Secondly, the pollution of the surface of the target workpiece by the dust generated during the grinding process can be reduced, which helps to improve the processing quality.

[0098] In one embodiment, if Figure 1 and Fig.12 As shown, the tool 41 in the grinding mechanism 40 is configured to be replaceable. The component removal device 100 further includes a tool magazine 50, wherein the tool magazine 50 contains a plurality of tools 41 of the same or different specifications.

[0099] It can be understood that when the tool 41 installed on the first drive assembly 42 reaches the preset life or breaks, the first drive assembly 42 will drive the tool 41 to move to the tool magazine 50, and remove the old tool 41 and place it in the tool magazine 50. After the old tool 41 is removed, the first drive assembly 42 will connect with the new tool 41 to continue the subsequent grinding work. In this way, the grinding mechanism 40 automatically replaces the tool 41.

[0100] When removing chips of different specifications, the grinding mechanism 40 will also automatically replace the tool 41 of the corresponding specification in the tool library 50 to meet the chip requirements. For example, if the diameter of the chip in the target workpiece is changed from 5mm to 15mm, the grinding mechanism 40 needs to correspondingly replace the tool 41 with a diameter of 5mm with a tool 41 with a diameter of 15mm.

[0101] It should be noted that, on the one hand, the tool magazine 50 can realize automatic replacement of the tool 41 in the component removal device 100, reduce the time of manual replacement of the tool 41, and further improve the automation of the component removal device 100. On the other hand, the tools 41 of different specifications in the tool magazine 50 can meet the requirements of chips in different target workpieces, and improve the versatility of the component removal device 100.

[0102] In one embodiment, the tool magazine 50 contains 6 types of tools 41, and each type of tool 41 has 16 tools. In other embodiments, the specifications and quantity of the tools 41 in the tool magazine 50 may also be other, which is not limited in this application, and those skilled in the art may select according to actual conditions.

[0103] In one embodiment, if Figure 5 and Fig. 9 As shown, the component removal device 100 further includes a tool setting device 60, which is configured to identify the wear state of the tool 41. Specifically, the first drive assembly 42 drives the tool 41 to move to the tool setting position (specifically, the position where the tool 41 contacts the tool setting device 60), and the tool setting device 60 performs damage detection on the tool 41. It is worth noting that if the tool setting device 60 detects that the tool 41 is damaged, the first drive assembly 42 will drive the tool 41 to move to the tool magazine 50 to automatically replace the tool 41.

[0104] Therefore, not only can the degree of automation of the component removal device 100 be further improved, and the work efficiency can be improved, but also the risk of the defective tool 41 damaging the target workpiece can be reduced, and the quality of the target workpiece after rework can be improved.

[0105] In other embodiments, other methods may be used to identify the wear condition of the tool 41 , which is not limited in the present application and those skilled in the art may choose according to actual conditions.

[0106] In one embodiment, if Figure 1 , Fig. 9 and Fig.10 As shown, the carrier 30 includes a base 31, a carrier portion 32 and a fixed cover 33. The base 31 is mounted on the outer peripheral side of the feeding mechanism 10, and the carrier portion 32 is mounted on the base 31 and is provided with at least one receiving groove 321 for accommodating the target workpiece. The fixed cover 33 is detachably mounted on the carrier portion 32, and the fixed cover 33 is provided with a through hole (not shown) corresponding to the receiving groove 321, and the through hole is configured to expose the chip in the target workpiece when the fixed cover 33 fixes the target workpiece.

[0107] It can be understood that before grinding the chips in the target workpiece, the grabbing mechanism 20 first grabs the target workpiece from the feeding mechanism 10 and places the target workpiece in the receiving groove 321. Subsequently, the fixing cover 33 is installed on the bearing portion 32 to fix the target workpiece. After the fixing cover 33 fixes the target workpiece, the chips in the target workpiece are exposed to the fixing cover 33 through the through hole so that the tool 41 can grind the chips. After the grinding of the chips in the target workpiece is completed, the operator removes the fixing cover 33 from the bearing portion 32 and transfers the ground target workpiece to the next processing position.

[0108] It should be noted that the component removal device 100 fixes the target workpiece by the fixing cover 33, which can prevent the target workpiece from shaking during the grinding process and improve the grinding accuracy. At the same time, a through hole is provided in the fixing cover 33 to ensure the visibility and handling convenience of the chip during the removal process, further improving the chip removal efficiency.

[0109] In one embodiment, one of the bearing part 32 and the fixing cover 33 is provided with a suction cup (not shown), and the bearing part 32 and the fixing cover 33 are detachably connected through the suction cup (not shown). Alternatively, in another embodiment, one of the bearing part 32 and the fixing cover 33 is provided with a card slot (not shown), and the other is provided with a buckle (not shown) matched with the card slot, and the bearing part 32 and the fixing cover 33 are detachably connected through the cooperation of the buckle and the card slot.

[0110] In other embodiments, the bearing portion 32 and the fixing cover 33 may also adopt other detachable structures such as a magnetic structure, which is not limited in the present application and those skilled in the art may select according to actual conditions.

[0111] In one embodiment, if Figure 1 , Fig.11 and Fig.12As shown, the bearing portion 32 is slidably mounted on the base 31, and the component removal device 100 further includes a pick-and-place mechanism 70, which is configured to install the fixed cover 33 on the bearing platform 30, or remove the fixed cover 33 from the bearing platform 30. Through the cooperation between the bearing portion 32 and the pick-and-place mechanism 70, the fixed cover 33 can be conveniently installed on the bearing platform 30, or removed from the bearing platform 30, so as to process the target workpiece and remove the chip, further improving the automation and efficiency of the component removal device 100.

[0112] In one embodiment, if Fig.10 As shown, the bearing part 32 is slidably mounted on the base 31 through the ball screw 34. Specifically, the ball screw 34 is mounted on the base 31, and the nut seat of the ball screw 34 is connected to the bearing part 32. When the ball screw 34 rotates, the nut seat of the ball screw 34 drives the bearing part 32 to reciprocate along the length direction of the ball screw 34.

[0113] It should be noted that when the ball screw 34 does not rotate, the bearing portion 32 is always in a relatively fixed state. Thus, it can be ensured that the bearing portion 32 does not swing when grinding the chips in the target workpiece, thereby improving the grinding accuracy of the component removal device 100. In other embodiments, the bearing portion 32 may also adopt other sliding connection methods and other limit fixing methods, which are not limited in this application, and those skilled in the art may choose according to actual conditions.

[0114] In one embodiment, if Fig. 9 As shown, a telescopic dust cover 35 is provided on the base 31, and the dust cover 35 is connected to the bearing part 32 and is configured to be telescopic when the bearing part 32 slides. It can be understood that by providing the telescopic dust cover 35, it is possible to reduce the dust generated by the grinding chip from falling into the parts, thereby reducing the wear of the dust on the equipment parts, extending the service life of the equipment, and reducing the maintenance cost.

[0115] In one embodiment, if Figure 3 , Fig.11 and Fig.12 As shown, the pick-and-place mechanism 70 includes a bracket 71, a second drive assembly 72 and a pick-and-place assembly 73, the third drive member 432 is mounted on the bracket 71, and the pick-and-place assembly 73 is connected to the second drive assembly 72. The second drive assembly 72 is configured to drive the pick-and-place assembly 73 to move toward or away from the bearing portion 32 when the bearing portion 32 slides to correspond to the pick-and-place assembly 73, so as to install or remove the fixed cover 33. It should be noted that the bearing portion 32 corresponds to the pick-and-place assembly 73 specifically means that the bearing portion 32 is located at the positive projection of the pick-and-place assembly 73 along the vertical direction.

[0116] It can be understood that when removing the fixed cover 33, the bearing part 32 slides to correspond to the pick-and-place assembly 73, and the second driving assembly 72 drives the pick-and-place assembly 73 to move in the direction close to the bearing part 32 to absorb the fixed cover 33; then, the second driving assembly 72 drives the pick-and-place assembly 73 to move in the direction away from the bearing part 32 to separate the fixed cover 33 from the bearing part 32, that is, the removal of the fixed cover 33 is completed. When installing the fixed cover 33, it is only necessary to drive the pick-and-place assembly 73 with the fixed cover 33 absorbed thereon to move in the direction close to the bearing part 32 through the second driving assembly 72, and fix the fixed cover 33 to the bearing part 32.

[0117] In one embodiment, if Figure 1 , Figure 8 and Fig. 9 As shown, the component removal device 100 further includes a second shooting component 80, which is disposed between the feeding mechanism 10 and the carrier 30. The second shooting component 80 is configured to obtain second image information of the target workpiece on the gripping mechanism 20. The gripping mechanism 20 is configured to adjust the position of the target workpiece according to the second image information so that the orthographic projection of the target workpiece along the vertical direction corresponds to the receiving groove 321 in the carrier 30.

[0118] It can be understood that, in the process of the gripping mechanism 20 transferring the target workpiece to the carrier 30, the second shooting component 80 obtains the second image information of the target workpiece on the gripping mechanism 20. Subsequently, the gripping mechanism 20 adjusts the position of the target workpiece accordingly according to the second image information, so that the target workpiece is aligned with the receiving groove 321 in the carrier 30. Thus, it is ensured that the target workpiece can be accurately positioned and placed in the carrier 30, reducing the risk of the target workpiece position deviation and error in the subsequent grinding process, and improving the processing quality of the component removal device 100.

[0119] In one embodiment, if Figure 1 and Figure 8 As shown, the second shooting assembly 80 is provided with a retractable dust cover 81. It can be understood that when the gripping mechanism 20 transfers the target workpiece to the carrier 30, the retractable dust cover is in a retracted state, and the dust cover 81 does not cover the lens of the second shooting assembly 80; and when the target workpiece is fixed to the carrier 30 and the grinding mechanism 40 grinds the chip in the target workpiece, the dust cover 81 is in an extended state, covering the lens of the second shooting assembly 80.

[0120] Therefore, by setting the retractable dust cover 81, the dust generated by the grinding chip can be prevented from falling onto the lens surface of the second shooting component 80, ensuring the clarity of the second image obtained by the second shooting component 80 and improving the accuracy of the target workpiece position correction.

[0121] In one embodiment, if Figure 1, Figure 6 and Figure 7 As shown, the grabbing mechanism 20 includes a third driving component 21, a picking component 22 and a third shooting component 23. The picking component 22 is connected to the third driving component 21, and the third shooting component 23 is installed on the picking component 22. The third shooting component 23 is configured to obtain the third image information of the target workpiece on the feeding mechanism 10 to locate the target workpiece, for example, to identify and locate the position of the chip in the target workpiece. The third driving component 21 is configured to drive the picking component 22 according to the third image information, grab the target workpiece on the feeding mechanism 10, and transfer it to the carrier 30.

[0122] It can be understood that when the grabbing mechanism 20 grabs the target workpiece, it first obtains the third image information through the third shooting component 23 to locate the target workpiece and identify the position of the chip in the target workpiece. Then, the third driving component 21 drives the picking component 22 to grab the target workpiece on the feeding mechanism 10 according to the third image information and transfer it to the carrier 30.

[0123] It should be noted that the third shooting component 23 can accurately identify and locate the target workpiece, and accurately grasp the target workpiece through the third driving component 21 and the picking component 22, and transfer the target workpiece to the supporting platform 30 to improve the picking accuracy of the grabbing mechanism 20.

[0124] In summary, the component removal device 100 in the present application can realize automatic removal of the target component in the target workpiece through the cooperation of the gripping mechanism 20, the carrier 30 and the grinding mechanism 40. Compared with the existing manual disassembly and removal of the target component, it can not only reduce the risk of damage to other electronic components in the target workpiece and improve the quality of the target workpiece after repair, but also reduce the labor intensity of the operator and improve the chip removal efficiency.

[0125] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the disclosure scope of the present application.

Claims

1. A component removal device, characterized in that: The component removal device includes a feeding mechanism, a grabbing mechanism, a carrying platform and a grinding mechanism, wherein the feeding mechanism is configured to convey a target workpiece, the grabbing mechanism is configured to grab the target workpiece on the feeding mechanism and transfer it to the carrying platform; the carrying platform is configured to fix the target workpiece; The grinding mechanism includes a tool and a first driving assembly. The tool is mounted on the first driving assembly. The first driving assembly is configured to drive the tool to grind a target element in the target workpiece.

2. The component removal device according to claim 1, characterized in that: The grinding mechanism further includes a height detection assembly, which is mounted on the tool and configured to measure the height of the target element in the target workpiece.

3. The component removal device according to claim 2, characterized in that: The height detection assembly includes a probe and a driving member. The probe is connected to the driving member, and the driving member is configured to drive the probe to move toward or away from the target workpiece.

4. The component removal device according to claim 3, characterized in that: The grinding mechanism further includes a first photographing component, which is configured to obtain first image information of the target workpiece on the carrier to detect a removal degree of the target element in the target workpiece.

5. The component removal device according to any one of claims 1 to 4, characterized in that: The component removal device further comprises a tool magazine, wherein a plurality of tools of the same or different specifications are accommodated in the tool magazine.

6. The component removal device according to any one of claims 1 to 4, characterized in that: The bearing platform comprises a base, a bearing part and a fixing cover, wherein the bearing part is mounted on the base and is provided with at least one receiving groove for receiving the target workpiece; The fixing cover is detachably mounted on the bearing portion, and the fixing cover is provided with a through hole corresponding to the accommodating groove; the through hole is configured to expose the target element in the target workpiece when the fixing cover fixes the target workpiece.

7. The component removal device according to claim 6, characterized in that: The bearing portion is slidably mounted on the base; the component removal device further comprises a pick-and-place mechanism, which is configured to install the fixed cover on the bearing platform or remove the fixed cover from the bearing platform.

8. The component removal device according to claim 7, characterized in that: The pick-and-place mechanism comprises a bracket, a second drive assembly and a pick-and-place assembly, wherein the second drive assembly is mounted on the bracket, and the pick-and-place assembly is connected to the second drive assembly; The second driving assembly is configured to drive the pick-and-place assembly to move toward or away from the bearing portion when the bearing portion slides to correspond to the pick-and-place assembly, so as to install or remove the fixed cover.

9. The component removal device according to claim 6, characterized in that: The component removal device further includes a second shooting component, which is disposed between the feeding mechanism and the carrying platform; the second shooting component is configured to obtain second image information of the target workpiece on the gripping mechanism; The gripping mechanism is configured to adjust the position of the target workpiece according to the second image information so that the orthographic projection of the target workpiece along the vertical direction corresponds to the receiving groove in the supporting platform.

10. The component removal device according to claim 1, characterized in that The grabbing mechanism comprises a third driving assembly, a material picking assembly and a third shooting assembly, wherein the material picking assembly is connected to the third driving assembly, and the third shooting assembly is installed on the material picking assembly; The third shooting component is configured to obtain third image information of the target workpiece on the feeding mechanism to locate the target workpiece; the third driving component is configured to drive the picking component according to the third image information, grab the target workpiece on the feeding mechanism, and transfer it to the supporting platform.

Images