Circuit board laminating device
By using components such as lamination platform, fixing frame, hydraulic rod, pressure plate, placement box and spring in circuit board lamination device, the misalignment problem caused by circuit board sliding is solved, and higher positioning accuracy and operation convenience are achieved .
Patent Information
- Application Number
- CN202420764512.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-12
AI Technical Summary
When existing circuit board lamination devices are multi-laminated, circuit boards may slide against each other, resulting in misalignment of the lamination.
A circuit board lamination device is designed, including a lamination platform, fixing frame, hydraulic rod, pressure plate, placement box, positioning pin and spring. Through the arrangement of these components, the circuit board is restricted to the ejection assembly and reduces offset. The possibility of the circuit board is achieved through the cooperation of the base, the second spring, the placement plate and the guide rod.
It improves positioning accuracy during lamination, reduces circuit board misalignment, simplifies operation steps, and improves the convenience and quality of circuit board lamination.
Smart Images
Figure CN222321874U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board printing, in particular to a circuit board laminating device. Background Art
[0002] A circuit board laminating device is a device used to manufacture multi-layer circuit boards. Its main function is to press multiple conductive layers and insulating layers together to form a reinforced multi-layer circuit board structure.
[0003] A circuit board laminating device usually includes components such as a laminator, a heating element, a pressure sensor and a control system. The laminator is a key device for achieving multi-layer lamination. It uses high-precision lamination technology, can provide stable temperature and pressure, and ensures a firm bond between the layers of material. It also includes other auxiliary equipment. In the existing circuit board laminating device technology, when multiple layers are laminated, the circuit boards may slide against each other, resulting in problems such as misalignment of the layers during circuit board lamination production. Utility Model Content
[0004] Therefore, the technical problem to be solved by the utility model is to overcome the problem in the prior art that when multiple layers are pressed together, the circuit boards may slide against each other, resulting in misalignment of the layers during the lamination production of the circuit boards.
[0005] In order to solve the above technical problems, the utility model provides a circuit board laminating device, including a laminating platform; a fixing frame is fixedly connected to the top of the laminating platform; a hydraulic rod is fixedly connected to the top of the fixing frame; a pressure plate is fixedly connected to the transmission end of the hydraulic rod; a positioning pin is provided at the middle of the fixing frame away from the hydraulic rod; a plurality of positioning pins are arranged in the middle of the pressure plate and are symmetrically arranged; a first spring is sleeved on the outer wall of the positioning pin close to the hydraulic rod; one end of the first spring is fixedly connected to the top of the pressure plate; the other end of the first spring is fixedly connected to the top of the positioning pin; a placement box is fixedly connected to the top of the laminating platform close to the fixed frame; an ejection assembly is arranged inside the placement box; this step restricts the circuit board to the ejection assembly through the arrangement of the laminating platform, the fixing frame, the hydraulic rod, the pressure plate, the placement box, the positioning pin and the first spring, thereby reducing the possibility of the circuit board being offset during lamination, improving the accuracy of positioning during lamination, and reducing the situation of misalignment of the circuit board during lamination.
[0006] In one embodiment of the utility model, the ejection assembly includes a base, a second spring, a placement plate, and a guide rod; the base is fixedly connected to the inside of the placement box; the placement plate slides inside the placement box; the second spring is fixedly connected between the placement plate and the base; multiple groups of the second springs are arranged at the bottom of the placement plate, and are evenly distributed at the four corners of the bottom of the placement plate; the guide rod is fixedly connected to the bottom of the placement plate; the guide rod slides inside the base; this step ejects the laminated circuit board through the arrangement of the base, the second spring, the placement plate, and the guide rod, thereby improving the convenience of the circuit board lamination operation and reducing the cumbersomeness of the operation steps.
[0007] In one embodiment of the utility model, a push rod is provided at the bottom of the pressing plate; the push rods are arranged in multiple groups at the bottom of the pressing plate and are evenly distributed at the bottom of the pressing plate; the bottom end of the push rod is fixedly connected to a suction cup; the top end of the push rod is fixedly connected to a third spring; the third spring is fixedly connected to the inside of the pressing plate; in this step, through the arrangement of the push rod, the third spring and the suction cup, the suction cup absorbs the circuit board and drives the circuit board to move upward, thereby improving the convenience of the circuit board lamination operation and increasing the convenience of the circuit board lamination and moving upward.
[0008] In one embodiment of the utility model, a heating rod is provided on the outer side wall of the placement box; the heating rods are provided in multiple groups on the outer side wall of the placement box and are evenly distributed on the outer side wall of the placement box; this step improves the uniformity of heating the circuit board and improves the quality of circuit board lamination through the provision of the heating rods.
[0009] In one embodiment of the utility model, the outer wall of the placement box close to the heating rod is fixedly connected with a reinforcing rib; the bottom of the reinforcing rib is fixedly connected to the top of the laminating platform; the reinforcing rib is arranged in multiple groups on the outer wall of the placement box and is evenly distributed on the outer wall of the placement box; this step increases the strength of the placement box by setting the reinforcing ribs and reduces the possibility of damage to the placement box when the placement box is under pressure.
[0010] In one embodiment of the utility model, the laminating platform is fixedly connected with an anti-overflow plate away from the top of the placement box; when the insulating oil in the placement box overflows, the anti-overflow plate limits the insulating oil on the top of the laminating platform; this step collects the overflowed insulating oil through the setting of the anti-overflow plate to reduce the pollution of other equipment.
[0011] In one embodiment of the utility model, the bottom of the laminating platform is fixedly connected with supporting legs; the supporting legs are arranged in multiple groups at the bottom of the laminating platform and are evenly distributed at the four corners of the bottom of the laminating platform; the supporting legs support and fix the laminating platform; this step improves the stability of the device during use by setting the supporting legs.
[0012] In one embodiment of the utility model, a reinforcement seat is fixedly connected to the bottom end of the support leg; the reinforcement seat increases the contact area of the support leg and increases the stability of the device when in use; this step increases the stability of the device when in use by setting the reinforcement seat.
[0013] The above technical solution of the utility model has the following advantages compared with the prior art:
[0014] The utility model discloses a circuit board laminating device, which limits the circuit board on the ejection assembly through the arrangement of a laminating platform, a fixing frame, a hydraulic rod, a pressing plate, a placing box, a positioning pin and a first spring, thereby reducing the possibility of circuit board deviation during lamination, improving the positioning accuracy during lamination, and reducing the occurrence of circuit board misalignment during lamination.
[0015] The circuit board laminating device described in the utility model can eject the laminating circuit board through the arrangement of the base, the second spring, the placement plate and the guide rod, thereby improving the convenience of the circuit board laminating operation and reducing the complexity of the operation steps. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments of the utility model in combination with the accompanying drawings.
[0017] Figure 1 It is a three-dimensional diagram of the utility model;
[0018] Figure 2 It is a schematic diagram of the structure of the cooperation between the middle pressure plate and the placement plate of the utility model;
[0019] Figure 3 It is a schematic diagram of the structure of the cooperation between the positioning pin and the pressure plate in the utility model;
[0020] Figure 4 It is a schematic diagram of the structure of the placement plate and the base in the utility model;
[0021] Explanation of the reference numerals in the drawings in the specification: 1. Laminating platform; 11. Fixing frame; 12. Hydraulic rod; 13. Pressing plate; 14. Placement box; 15. Positioning pin; 16. First spring; 2. Base; 21. Second spring; 22. Placement plate; 23. Guide rod; 3. Push rod; 31. Third spring; 32. Suction cup; 4. Heating rod; 5. Reinforcing rib; 6. Anti-overflow plate; 7. Leg; 8. Reinforcement seat. DETAILED DESCRIPTION
[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0023] Reference Figures 1 to 3 As shown, a circuit board laminating device of the utility model comprises a laminating platform 1; a fixing frame 11 is fixedly connected to the top of the laminating platform 1; a hydraulic rod 12 is fixedly connected to the top of the fixing frame 11; a pressing plate 13 is fixedly connected to the transmission end of the hydraulic rod 12; a positioning pin 15 is provided in the middle of the fixing frame 11 away from the hydraulic rod 12; a plurality of positioning pins 15 are arranged in the middle of the pressing plate 13 and are symmetrically arranged; a first spring 16 is sleeved on the outer wall of the positioning pin 15 close to the hydraulic rod 12; one end of the first spring 16 is fixedly connected to the top of the pressing plate 13; the other end of the first spring 16 is fixedly connected to the top of the positioning pin 15; a placement box 14 is fixedly connected to the top of the laminating platform 1 close to the fixing frame 11 ; An ejection assembly is provided inside the placement box 14; during operation, the multi-layer circuit boards are stacked on the ejection assembly, the circuit boards are placed between a pair of first springs 16 to restrict the circuit boards on the ejection assembly, the hydraulic rod 12 is started to drive the pressing plate 13 downward to laminate the multi-layer circuit boards, the pressing plate 13 is downward, the positioning pin 15 is lifted up and stretches the first spring 16, and a positioning groove is provided on the ejection assembly; this step restricts the circuit boards on the ejection assembly through the arrangement of the lamination platform 1, the fixing frame 11, the hydraulic rod 12, the pressing plate 13, the placement box 14, the positioning pin 15, and the first spring 16, thereby reducing the possibility of the circuit boards being offset during lamination, improving the accuracy of positioning during lamination, and reducing the possibility of the circuit boards being misaligned during lamination.
[0024] Reference Figure 2 and Figure 4 As shown, the ejection assembly includes a base 2, a second spring 21, a placement plate 22, and a guide rod 23; the base 2 is fixedly connected to the inside of the placement box 14; the placement plate 22 slides inside the placement box 14; the second spring 21 is fixedly connected between the placement plate 22 and the base 2; multiple groups of the second springs 21 are arranged at the bottom of the placement plate 22, and are evenly distributed at the four corners of the bottom of the placement plate 22; the guide rod 23 is fixedly connected to the bottom of the placement plate 22; the guide rod 23 slides inside the base 2; during operation, the circuit board is placed on the placement plate 22 , the pressing plate 13 moves downward and contacts the placing plate 22, the placing plate 22 drives the guide rod 23 to move downward, compressing the second spring 21. When the guide rod 23 contacts the bottom of the base 2, the pressing plate 13 and the placing plate 22 perform a lamination operation on the multi-layer circuit board. After the lamination is completed, the second spring 21 drives the placing plate 22 and the guide rod 23 to reset and eject the circuit board. In this step, the circuit board after lamination is ejected through the arrangement of the base 2, the second spring 21, the placing plate 22 and the guide rod 23, thereby improving the convenience of the circuit board lamination operation and reducing the cumbersomeness of the operation steps.
[0025] Reference Figure 3As shown, a push rod 3 is provided at the bottom of the pressing plate 13; the push rod 3 is arranged in multiple groups at the bottom of the pressing plate 13 and is evenly distributed at the bottom of the pressing plate 13; the bottom end of the push rod 3 is fixedly connected to a suction cup 32; the top end of the push rod 3 is fixedly connected to a third spring 31; the third spring 31 is fixedly connected to the inside of the pressing plate 13; during operation, when the pressing plate 13 contacts the circuit board, the suction cup 32 contacts and adsorbs the circuit board, and the suction cup 32 drives the push rod 3 to compress the third spring 31 upward. After lamination contact, the hydraulic rod 12 drives the pressing plate 13 to move upward, and the suction cup 32 drives the circuit board to move upward; in this step, the suction cup 32 adsorbs the circuit board and drives the circuit board to move upward through the setting of the push rod 3, the third spring 31, and the suction cup 32, thereby improving the convenience of the circuit board lamination operation and increasing the convenience of the circuit board moving upward after lamination.
[0026] Reference Figure 1 As shown, the outer wall of the placement box 14 is provided with a heating rod 4; the heating rod 4 is provided in multiple groups on the outer wall of the placement box 14 and is evenly distributed on the outer wall of the placement box 14; during operation, insulating oil is placed in the placement box 14, and the heating rod 4 is connected to an external power supply to heat the placement box 14; this step improves the uniformity of heating the circuit board and improves the quality of circuit board lamination through the provision of the heating rod 4.
[0027] Reference Figure 1 As shown, the outer wall of the placement box 14 close to the heating rod 4 is fixedly connected with a reinforcing rib 5; the bottom of the reinforcing rib 5 is fixedly connected to the top of the laminating platform 1; the reinforcing rib 5 is arranged in multiple groups on the outer wall of the placement box 14 and is evenly distributed on the outer wall of the placement box 14; during operation, the reinforcing rib 5 strengthens the strength of the placement box 14; this step increases the strength of the placement box 14 by setting the reinforcing rib 5, and reduces the possibility of damage to the placement box 14 when the placement box 14 is under pressure.
[0028] Reference Figure 1 As shown, the laminating platform 1 is fixedly connected with an anti-overflow plate 6 away from the top of the placement box 14; during operation, when the insulating oil in the placement box 14 overflows, the anti-overflow plate 6 limits the insulating oil to the top of the laminating platform 1; this step collects the overflowed insulating oil through the setting of the anti-overflow plate 6 to reduce the pollution of other equipment.
[0029] Reference Figure 1 As shown, the bottom of the laminating platform 1 is fixedly connected with supporting legs 7; the supporting legs 7 are arranged in multiple groups at the bottom of the laminating platform 1 and are evenly distributed at the four corners of the bottom of the laminating platform 1; during operation, the supporting legs 7 support and fix the laminating platform 1; this step improves the stability of the device during use by setting the supporting legs 7.
[0030] Reference Figure 1As shown, the bottom end of the support leg 7 is fixedly connected with a reinforcement seat 8; during operation, the reinforcement seat 8 increases the contact area of the support leg 7 and increases the stability of the device when in use; this step increases the stability of the device when in use by setting the reinforcement seat 8.
[0031] Working principle: stack the multi-layer circuit boards on the ejection assembly, place the circuit boards between a pair of first springs 16 to restrict the circuit boards on the ejection assembly, start the hydraulic rod 12 to drive the pressure plate 13 downward to laminate the multi-layer circuit boards, the pressure plate 13 moves downward, the positioning pin 15 is lifted and stretches the first spring 16, and the ejection assembly is provided with a positioning groove; the circuit board is placed on the placement plate 22, the pressure plate 13 moves downward to contact the placement plate 22, the placement plate 22 drives the guide rod 23 to move downward, compressing the second spring 21, when the guide rod 23 contacts the bottom of the base 2, the pressure plate 13 and the placement plate 22 laminate the multi-layer circuit boards, after the lamination is completed, the second spring 21 drives The placement plate 22 and the guide rod 23 are reset to push out the circuit board; when the pressing plate 13 contacts the circuit board, the suction cup 32 contacts and adsorbs the circuit board, and the suction cup 32 drives the ejector rod 3 to compress the third spring 31 upward. After lamination contact, the hydraulic rod 12 drives the pressing plate 13 to move upward, and the suction cup 32 drives the circuit board to move upward; insulating oil is put into the placement box 14, and the heating rod 4 is connected to an external power supply to heat the placement box 14; the reinforcing rib 5 strengthens the strength of the placement box 14; when the insulating oil in the placement box 14 overflows, the anti-overflow plate 6 limits the insulating oil to the top of the lamination platform 1; the support leg 7 supports and fixes the lamination platform 1; the reinforcement seat 8 increases the contact area of the support leg 7 and increases the stability of the device during use.
[0032] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.
Claims
1. A circuit board laminating device, comprising a laminating platform (1); characterized in that: The top of the laminating platform (1) is fixedly connected to a fixed frame (11); the top of the fixed frame (11) is fixedly connected to a hydraulic rod (12); the transmission end of the hydraulic rod (12) is fixedly connected to a pressure plate (13); a positioning pin (15) is provided in the middle of the fixed frame (11) away from the hydraulic rod (12); the positioning pins (15) are arranged in multiple groups in the middle of the pressure plate (13) and are symmetrically arranged; the outer wall of the positioning pin (15) close to the hydraulic rod (12) is sleeved with a first spring (16); one end of the first spring (16) is fixedly connected to the top of the pressure plate (13); the other end of the first spring (16) is fixedly connected to the top of the positioning pin (15); the top of the laminating platform (1) is fixedly connected to a placement box (14); the placement box (14) is provided with an ejection assembly.
2. A circuit board laminating device according to claim 1, characterized in that: The ejection assembly comprises a base (2), a second spring (21), a placement plate (22), and a guide rod (23); the base (2) is fixedly connected to the inside of a placement box (14); the placement plate (22) slides inside the placement box (14); the second spring (21) is fixedly connected between the placement plate (22) and the base (2); multiple groups of the second spring (21) are arranged at the bottom of the placement plate (22) and are evenly distributed at the four corners of the bottom of the placement plate (22); the guide rod (23) is fixedly connected to the bottom of the placement plate (22); the guide rod (23) slides inside the base (2).
3. A circuit board laminating device according to claim 2, characterized in that: A push rod (3) is provided at the bottom of the pressing plate (13); a plurality of push rods (3) are provided at the bottom of the pressing plate (13) and are evenly distributed at the bottom of the pressing plate (13); a suction cup (32) is fixedly connected to the bottom end of the push rod (3); a third spring (31) is fixedly connected to the top end of the push rod (3); and the third spring (31) is fixedly connected inside the pressing plate (13).
4. A circuit board laminating device according to claim 3, characterized in that: The outer wall of the placement box (14) is provided with heating rods (4); multiple groups of the heating rods (4) are provided on the outer wall of the placement box (14) and are evenly distributed on the outer wall of the placement box (14).
5. A circuit board laminating device according to claim 4, characterized in that: The outer wall of the placement box (14) close to the heating rod (4) is fixedly connected with a reinforcing rib (5); the bottom of the reinforcing rib (5) is fixedly connected to the top of the laminating platform (1); multiple groups of the reinforcing ribs (5) are arranged on the outer wall of the placement box (14) and are evenly distributed on the outer wall of the placement box (14).
6. A circuit board laminating device according to claim 5, characterized in that: The top of the laminating platform (1) away from the placement box (14) is fixedly connected with an anti-overflow plate (6).
7. A circuit board laminating device according to claim 6, characterized in that: The bottom of the laminating platform (1) is fixedly connected with supporting legs (7); a plurality of supporting legs (7) are arranged at the bottom of the laminating platform (1) and are evenly distributed at the four corners of the bottom of the laminating platform (1).
8. A circuit board laminating device according to claim 7, characterized in that: The bottom end of the supporting leg (7) is fixedly connected with a reinforcement seat (8).