Heat dissipation device

Abstract

The utility model provides a heat dissipation device, and relates to the technical field of heat dissipation equipment. Comprising a heat conducting plate on which a curved heat conducting pipe is fixedly arranged; the heat conduction pipe is connected with heat dissipation fins, and a fan is arranged on the heat dissipation fins. And the diagonal planes of fan blades of the fan to the air flow face the heat dissipation fins. By optimizing the structural design of the heat dissipation device, increasing the heat dissipation area and improving the flowing mode of airflow, the problem that an original heat dissipation device is low in heat dissipation efficiency is effectively solved, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation device. Background Art

[0002] With the continuous development of electronic technology, various electronic devices play an important role in industrial production and people's production and life. In particular, the development of chips has brought great progress in the miniaturization and popularization of electronic devices.

[0003] The operation of electronic devices, especially the operation of chips, especially when it involves the processing of high-frequency signals, will generate a lot of heat, which requires a heat sink to dissipate the heat. Among them, the heat sink for cooling the chips inside the device is one of them. The heat sink uses metal heat fins or heat fins plus fans to cool the chips inside the device, so that the device can operate stably.

[0004] The existing heat dissipation device has insufficient heat dissipation effect due to its own structural limitations and needs to be improved. Specifically, the heat sink passes through the heat dissipation fins on the hot metal, or the structure of the heat dissipation pipe plus the heat dissipation fins, and then cooperates with the fan. During the heat dissipation process, the heat conduction area is small, so that the heat conduction efficiency is low and the heat dissipation effect is poor. Therefore, the utility model proposes a heat dissipation device to at least partially solve the problems that may exist in the prior art. Utility Model Content

[0005] In order to overcome the above problems or at least partially solve the above problems, an embodiment of the utility model provides a heat dissipation device to at least partially solve the problems that may exist in the prior art.

[0006] The embodiment of the utility model is achieved as follows:

[0007] The present application provides a heat dissipation device, comprising:

[0008] A heat conducting plate, on which a curved heat conducting pipe is fixedly arranged;

[0009] The heat conducting pipe is connected with a heat dissipation fin, and the heat dissipation fin is provided with a fan; the fan blades of the fan have oblique surfaces facing the airflow toward the heat dissipation fin.

[0010] In some embodiments of the utility model, a heat sink is further included, and the heat conducting plate is disposed at the lower end of the heat sink;

[0011] The heat sink is provided with a curved groove for accommodating the heat pipe, and the upper end of the heat sink is provided with the heat dissipation fin connected with the heat pipe;

[0012] The outer periphery of the heat dissipation frame is provided with mounting feet, and the positions of the mounting feet are provided with mounting holes.

[0013] In some embodiments of the utility model, a groove is provided in the center of the heat dissipation fin, and the fan is arranged inside the groove;

[0014] The bottom of the groove is a closed structure, and the side thereof is provided with an air outlet.

[0015] In some embodiments of the present invention, two or more heat-conducting pipes are symmetrically arranged relative to the heat-conducting plate, and each of the heat-conducting pipes has a first end connected to the heat-conducting plate and a second end distributed along the periphery of the heat dissipating fins.

[0016] In some embodiments of the present invention, the heat conducting plate is square, the heat dissipating fins are circular in orthographic projection, and both are made of copper material.

[0017] In some embodiments of the present invention, the fan is a high-speed fan, and the number of fan blades is 12.

[0018] In some embodiments of the present invention, the heat conducting pipe is a copper pipe.

[0019] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0020] A curved heat pipe is fixedly arranged on the heat conducting plate; the heat conducting pipe is connected to a heat dissipation fin, and a fan is arranged on the heat dissipation fin; the fan blade has an oblique surface facing the airflow toward the heat dissipation fin. By optimizing the structural design of the heat dissipation device, increasing the heat dissipation area, and improving the flow mode of the airflow, the problem of low heat dissipation efficiency of the original heat dissipation device is effectively solved, and the heat dissipation effect is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the back structure of a heat dissipation device provided in one embodiment of the utility model;

[0023] Figure 2 It is a front structural schematic diagram of a heat dissipation device provided in one embodiment of the utility model.

[0024] In the figure: 101, heat conduction plate; 102, heat conduction pipe; 103, fan; 104, heat dissipation fins; 131, fan blades; 201, heat dissipation frame; 202, receiving groove; 203, mounting foot; 204, screws. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Example 1

[0027] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0028] Please refer to Figure 1 and Figure 2 As shown, an embodiment of the utility model provides a heat dissipation device, which includes: a heat conducting plate 101, on which a curved heat conducting pipe 102 is fixedly arranged; a heat dissipation fin 104 is connected to the heat conducting pipe 102, and a fan 103 is arranged on the heat dissipation fin 104; a blade 131 of the fan 103, whose oblique surface to the airflow faces the heat dissipation fin 104.

[0029] In this embodiment, the heat conduction area is increased by designing the curved heat pipe 102, so that the heat can be more effectively conducted to the heat dissipation fins 104, thereby improving the heat dissipation efficiency; the heat dissipation area is further effectively increased by combining the above-mentioned heat dissipation fins 104 with the fan 103, and the airflow generated by the fan accelerates the dissipation of heat, thereby improving the heat dissipation effect, and the fan blades 131 of the above-mentioned fan 103, whose oblique cut surface of the airflow faces the heat dissipation fins 104, and the rotation direction of the fan 103 makes the fan blades 131 blow air toward the heat dissipation fins 104, so that the airflow toward the heat dissipation fins 104 has a certain compressed air effect, so that the airflow passes through the heat dissipation fins more effectively, thereby further improving the heat dissipation efficiency.

[0030] The fan 104 of the heat dissipation device has a temperature sensor and / or a speed feedback line integrated therein, and the feedback line and the power supply line of the fan 104 are concentrated together. For example, the fan 104 can use a three-core or four-core line to concentrate the feedback line and the power supply line together.

[0031] Example 2

[0032] The utility model embodiment provides a heat dissipation device, wherein, referring to Figure 1 and Figure 2 As shown, it includes a heat sink 201, the heat conducting plate 101 is arranged at the lower end of the heat sink 201; the heat sink 201 is provided with a curved receiving groove 202 for accommodating the heat conducting pipe 102, the upper end of the heat sink 201 is provided with the heat dissipation fin 104 connected to the heat conducting pipe 102; the outer periphery of the heat sink 201 is provided with a mounting foot 203, and the mounting foot 203 is provided with a mounting hole. Figure 2 As shown, the heat sink can be installed at a location where heat dissipation is required, such as a computer motherboard, by using screws 204 through the mounting holes on the mounting feet 203. The heat conducting plate 101 on the heat sink can be directly aligned with the CPU or installed on the CPU or other chips after being coated with heat dissipating ester. The mounting holes can be aligned with the holes on the motherboard, and screws can be used to tighten them and the wires can be plugged in.

[0033] As a preferred embodiment, the heat sink fin 104 is provided with a groove in the center, and the fan 103 is arranged inside the groove; the groove has a closed bottom structure and an air outlet on the side. By arranging the fan 103 in the groove of the heat sink fin 104, on the one hand, the volume of the entire heat sink can be reduced and the space can be better utilized; on the other hand, by arranging the air outlet on the side of the groove of the heat sink fin 104, while the bottom of the groove is relatively closed, Figure 2 As shown, since the oblique surface of the fan blade 131 faces the bottom of the groove, the airflow can produce a certain compression effect in the space below the fan blade 131 and between the heat sink fins 104, and the airflow passes through the bottom of the groove, flows to the side of the groove, and flows out from the air outlet on the side of the groove, so that the airflow is always in contact with the heat conduction position during the process of flowing out from the above-mentioned air outlet.

[0034] As a preferred implementation method, refer to Figure 1 As shown, two or more heat-conducting pipes 102 are symmetrically arranged relative to the heat-conducting plate 101, and each of the heat-conducting pipes 102 has a first end connected to the heat-conducting plate 101, and a second end distributed along the periphery of the heat-dissipating fins 104. By arranging a plurality of heat-conducting pipes 102, it is possible to increase the connection area between the heat-conducting plate 101 and the heat-conducting pipes 102, thereby improving the heat conduction efficiency and the heat dissipation effect.

[0035] As a preferred embodiment, the heat conducting plate 101 is square, the heat sink fins 104 are circular in orthographic projection, and the heat pipes 103 are all made of copper. Since copper has good thermal conductivity, it can better conduct heat. The square heat conducting plate 101 can adapt its shape to the shape of the chip, such as the CPU of a computer. The circular heat sink fins 104 can save materials compared to square or other shaped heat sink fins 104, and it is also beneficial to the distribution of heat pipes.

[0036] As an example, Figure 1 As shown, the heat pipes 102 are two, and the two heat pipes 102 pass through the heat conducting plate 101 from opposite sides respectively. The other side of the heat pipe 102 is bent and distributed along the heat dissipation fins 104, as shown in FIG. Figure 1 As shown, the two heat pipes 102 form an S-shape, and both heat pipes pass through the heat conductive plate 101. The heat pipes 102 are distributed near the edge of the heat dissipating fins 104, and the corresponding curved receiving grooves 202 can also be S-shaped, so that the heat pipes 102 can be connected to the heat dissipating fins 104 with a larger area, thereby improving the heat conduction efficiency and the heat dissipation effect.

[0037] As a preferred embodiment, the fan 103 is a high-speed fan, and the fan blades 131 are provided with 12 pieces. Through the fan 103 with the above-mentioned 12 fan blades 131, it is possible to increase the flow rate of the airflow, that is, to increase the air volume of the fan, thereby further improving the heat dissipation effect of the above-mentioned heat dissipation device.

[0038] It should be noted that it usually has a higher speed and stronger air volume, which is used for rapid heat dissipation or increased air flow. For example, its application in computers can help reduce the temperature of devices such as processors and graphics cards, thereby maintaining their normal operation. The above-mentioned high-speed fan can use a brushless DC motor (BLDC) as a fan motor. This type of motor has the advantages of high efficiency, low noise and long life, and is suitable for high-speed fans. The speed of the BLDC motor can be accurately adjusted by a controller to achieve the required wind speed; it can also be an induction motor, which has a simple and reliable structure, but may have low efficiency.

[0039] It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. Although optional embodiments of the utility model embodiments have been described, once those skilled in the art know the basic creative concept, they can make additional changes and modifications to these embodiments. Therefore, the attached claims are intended to be interpreted as including optional embodiments and all changes and modifications that fall within the scope of the utility model embodiments.

[0040] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or terminal device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or terminal device including the elements.

[0041] The technical solution provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. At the same time, for those skilled in the art, according to the principle and implementation method of the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A heat conducting plate (101) on which a curved heat conducting pipe (102) is fixedly arranged; The heat conducting pipe (102) is connected to a heat dissipation fin (104), and a fan (103) is provided on the heat dissipation fin (104); the fan blade (131) of the fan (103) has an oblique surface with respect to the airflow facing the heat dissipation fin (104).

2. The heat dissipation device according to claim 1, characterized in that: It also includes a heat dissipation frame (201), wherein the heat conduction plate (101) is arranged at the lower end of the heat dissipation frame (201); The heat dissipation frame (201) is provided with a curved receiving groove (202) for accommodating the heat conduction pipe (102), and the heat dissipation fin (104) connected to the heat conduction pipe (102) is provided at the upper end of the heat dissipation frame (201); The outer periphery of the heat dissipation frame (201) is provided with mounting feet (203), and mounting holes are provided at the positions of the mounting feet (203).

3. The heat dissipation device according to claim 1 or 2, characterized in that: A groove is provided in the center of the heat dissipation fin (104), and the fan (103) is arranged inside the groove; The bottom of the groove is a closed structure, and the side thereof is provided with an air outlet.

4. The heat dissipation device according to claim 1, characterized in that: Two or more heat-conducting pipes (102) are symmetrically arranged relative to the heat-conducting plate (101), and each of the heat-conducting pipes (102) has a first end connected to the heat-conducting plate (101) and a second end distributed along the periphery of the heat-dissipating fins (104).

5. The heat dissipation device according to claim 4, characterized in that: The heat conducting plate (101) is square, and the heat dissipating fins (104) are circular in orthographic projection, and both are made of copper material.

6. The heat dissipation device according to claim 5, characterized in that: The fan (103) is a high-speed fan, and the fan blades (131) are provided with 12 pieces.

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