Rectifier with silicon structure heat dissipation device

Abstract

The utility model discloses a rectifier with a silicon structure heat dissipation device, which belongs to the technical field of heat dissipation of rectifiers, and comprises a rectifier main body and a heat dissipation assembly, the rectifier main body is arranged in an inner cavity of the heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation shell, the rectifier main body is embedded in the inner cavity of the heat dissipation shell, and the silicon structure heat dissipation device is arranged in the inner cavity of the heat dissipation shell. A silica gel gasket is arranged in an inner cavity of the heat dissipation shell, a plurality of heat dissipation holes are formed in the center of the surface of the silica gel gasket, the heat dissipation holes are distributed in an array shape, and supporting blocks are installed on the two sides of the lower surface of the silica gel gasket. And then the heat is released through air circulation through the cooperation of the ventilation area and the ventilation holes, and meanwhile, the arranged cooling fan can accelerate the air flow of the ventilation area, so that the cooling speed of the rectifier main body is accelerated, and the cooling effect of the cooling assembly on the rectifier main body is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of rectifiers, in particular to a rectifier with a silicon structure heat dissipation device. Background Art

[0002] A rectifier is a rectifying device, which is simply a device that converts alternating current (AC) into direct current (DC). It has two main functions: first, it converts alternating current (AC) into direct current (DC) and supplies it to the load or inverter after filtering; second, it provides charging voltage to the battery, so it also acts as a charger.

[0003] According to the publication number: CN220290802U, a rectifier component with high efficiency in heat dissipation is proposed, including: a shell seat, a shell cover, a base plate and internal components; the internal components have two groups of chip components, the two groups of chip components are arranged side by side, and the chip components have a common electrode plate, a chip, a pressing block, a silver sheet, an electrode seat, an insulating sleeve, a flat gasket, a butterfly spring, a pressing plate, a connecting plate, a flat gasket, a spring gasket and an M10 bolt from bottom to top, and the chip is pressed on the common electrode plate by the pressing block; the bottom of the shell seat is open, the base plate is fixed to the bottom of the shell seat, and a heat conducting plate is provided between the common electrode plate and the base plate; the inside of the base plate has a water channel, and the water inlet joint and the water outlet joint of the water channel are located on the same side of the base plate. The utility model arranges a heat conducting plate at the bottom of the chip, the heat conducting plate is plugged into the base plate, and the base plate has a water channel inside, and the flowing water is used to take away the heat to achieve the function of rapid heat dissipation, thereby improving the efficiency and service life of the wire.

[0004] According to the above introduction, the rectifier is cooled by water, which may easily cause water to enter the inside of the rectifier. Moreover, after long-term use of water cooling, the water will also become hot, which not only has no heat dissipation function for the rectifier, but also reduces the heat dissipation efficiency of the rectifier. In order to solve the above problems, we propose a rectifier with a silicon structure heat dissipation device. Utility Model Content

[0005] The purpose of the utility model is to provide a rectifier with a silicon structure heat dissipation device, which can provide heat dissipation for the rectifier body through the silicone gasket in the heat dissipation component, and then release the heat through the ventilation area and the ventilation holes through air circulation. At the same time, the heat dissipation fan can speed up the air flow in the ventilation area, so that the heat dissipation speed of the rectifier body is accelerated, and the heat dissipation effect of the heat dissipation component on the rectifier body is enhanced, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a rectifier with a silicon structure heat dissipation device, comprising a rectifier body and a heat dissipation assembly, the rectifier body comprising a shell and an electronic component, the electronic component being mounted on the shell of the rectifier body, the rectifier body being mounted in the inner cavity of the heat dissipation assembly, the heat dissipation assembly comprising a heat dissipation shell, the rectifier body being embedded in the inner cavity of the heat dissipation shell, the inner cavity of the heat dissipation shell being provided with a silicone gasket, a plurality of heat dissipation holes being provided at the center of the surface of the silicone gasket, the heat dissipation holes being distributed in an array, support blocks being mounted on both sides of the lower surface of the silicone gasket, the bottom of the support block being connected to the bottom of the inner cavity of the heat dissipation shell, a ventilation area for ventilation and heat dissipation being formed between the support block and the bottom of the heat dissipation shell.

[0007] Preferably, a through slot is provided at the bottom of the heat dissipation housing, and a heat dissipation fan is embedded in the through slot, and the heat dissipation fan is located directly below the heat dissipation hole.

[0008] Preferably, two side walls of the heat dissipation housing are provided with a plurality of ventilation holes used in conjunction with the ventilation area, and the apertures of the ventilation holes are all equal.

[0009] Preferably, thermal conductive silicone grease is applied around the inner wall of the heat dissipation housing, and the thermal conductive silicone grease is in contact with the outer shell of the rectifier body.

[0010] Preferably, the other two side walls of the heat dissipation housing are fixedly connected with a plurality of first heat dissipation fins, and the distance between two adjacent first heat dissipation fins is equal.

[0011] Preferably, the bottom of the heat dissipation housing is fixedly connected with second heat dissipation fins from front to back, and the second heat dissipation fins located in the middle of the bottom of the heat dissipation housing are provided with groove openings for use with a heat dissipation fan.

[0012] Preferably, the distances between two adjacent ventilation holes are equal, and a dustproof net is embedded in the inner cavity of the ventilation hole.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The utility model provides a rectifier with a silicon structure heat dissipation device, which can provide heat dissipation for the rectifier body through the silicone gasket in the heat dissipation component, and then release the heat through the cooperation of the ventilation area and the ventilation holes through air circulation. At the same time, the heat dissipation fan can speed up the air flow in the ventilation area, so that the heat dissipation speed of the rectifier body is accelerated, and the heat dissipation effect of the heat dissipation component on the rectifier body is enhanced.

[0015] The utility model provides a rectifier with a silicon structure heat dissipation device, which can enhance the heat dissipation effect of the heat dissipation shell on the rectifier body by arranging thermal conductive silicone grease, and at the same time, the first heat dissipation fins and the second heat dissipation fins can provide heat dissipation for the heat dissipation shell, further accelerating the heat dissipation speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a partial cross-sectional schematic diagram of the heat dissipation housing structure of the utility model;

[0018] Figure 3 It is a schematic diagram of the exploded structure of the heat dissipation housing and the rectifier main body of the utility model;

[0019] Figure 4 It is a bottom-up exploded schematic diagram of the heat dissipation housing and the rectifier main structure of the utility model.

[0020] Numbers in the figure: 1. Rectifier body; 101. Shell; 102. Electronic components; 2. Heat dissipation assembly; 21. Heat dissipation shell; 22. Silicone gasket; 23. Heat dissipation holes; 24. Support block; 25. Ventilation area; 3. Cooling fan; 4. Ventilation holes; 5. Thermal grease; 6. First heat dissipation fin; 7. Second heat dissipation fin; 8. Dust net. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] The utility model provides Figures 1 to 4A rectifier with a silicon structure heat dissipation device shown in the figure comprises a rectifier body 1 and a heat dissipation assembly 2, the rectifier body 1 comprises a housing 101 and an electronic component 102, the electronic component 102 is mounted on the housing 101 of the rectifier body 1, the rectifier body 1 is mounted in the inner cavity of the heat dissipation assembly 2, the heat dissipation assembly 2 comprises a heat dissipation shell 21, the rectifier body 1 is embedded in the inner cavity of the heat dissipation shell 21, the inner cavity of the heat dissipation shell 21 is provided with a silicone gasket 22, a plurality of heat dissipation holes 23 are opened at the center of the surface of the silicone gasket 22, the heat dissipation holes 23 are distributed in an array, support blocks 24 are installed on both sides of the lower surface of the silicone gasket 22, the bottom of the support block 24 is connected to the bottom of the inner cavity of the heat dissipation shell 21, and the support block 24 is connected to the inner cavity of the heat dissipation shell 21. A ventilation area 25 for ventilation and heat dissipation is formed between the bottoms, a through groove is provided at the bottom of the heat dissipation shell 21, and a heat dissipation fan 3 is embedded in the through groove, and the heat dissipation fan 3 is located directly below the heat dissipation hole 23. The two side walls of the heat dissipation shell 21 are provided with multiple ventilation holes 4 used in conjunction with the ventilation area 25, and the apertures of the ventilation holes 4 are all equal. The silicone gasket 22 in the heat dissipation component 2 can provide heat dissipation for the rectifier body 1, and then the heat is released through the cooperation of the ventilation area 25 and the ventilation holes 4 through air circulation. At the same time, the heat dissipation fan 3 can speed up the air flow in the ventilation area 25, so that the heat dissipation speed of the rectifier body 1 is accelerated, thereby enhancing the heat dissipation effect of the heat dissipation component 2 on the rectifier body 1.

[0023] Thermal grease 5 is applied around the inner wall of the heat dissipation shell 21 , and the thermal grease 5 is in contact with the outer shell 101 of the rectifier body 1 . The thermal grease 5 can enhance the heat dissipation effect of the heat dissipation shell 21 on the rectifier body 1 .

[0024] The other two side walls of the heat dissipation shell 21 are fixedly connected with a plurality of first heat dissipation fins 6, and the distance between two adjacent first heat dissipation fins 6 is equal. The bottom of the heat dissipation shell 21 is fixedly connected with second heat dissipation fins 7 from front to back. The second heat dissipation fins 7 located in the middle of the bottom of the heat dissipation shell 21 are provided with groove openings for use with the heat dissipation fan 3. The first heat dissipation fins 6 and the second heat dissipation fins 7 can provide heat dissipation for the heat dissipation shell 21, further accelerating the heat dissipation speed.

[0025] The distances between two adjacent ventilation holes 4 are equal, and the inner cavity of the ventilation hole 4 is embedded with a dustproof net 8. The ventilation hole 4 can provide a dustproof effect without affecting the release of heat inside the heat dissipation housing 21.

[0026] During specific use, first, the silicone gasket 22 in the heat dissipation assembly 2 can provide heat dissipation for the rectifier body 1, and then the bottom of the rectifier body 1 is spaced apart from the bottom of the heat dissipation shell 21 by the support block 24, thereby forming a ventilation area 25, and then the air flow in the ventilation area 25 is accelerated with the cooperation of the heat dissipation fan 3 and the ventilation hole 4, so that the heat of the rectifier body 1 can be quickly dissipated, and the heat is circulated out with the air flow, and at the same time, thermal conductive silicone grease 5 is applied to the inside of the heat dissipation shell 21, which can, on the one hand, make the rectifier body 1 and the heat dissipation shell 21 bonded, and on the other hand, provide heat dissipation effect for the rectifier body 1, and then the first heat dissipation fins 6 and the second heat dissipation fins 7 installed on the outer wall of the heat dissipation shell 21 can provide heat dissipation for the heat dissipation shell 21, further accelerating the heat dissipation speed of the rectifier body 1, improving the heat dissipation efficiency of the rectifier body 1, and extending the service life of the rectifier body 1.

[0027] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A rectifier with a silicon structure heat dissipation device, comprising a rectifier body (1) and a heat dissipation component (2), characterized in that: The rectifier body (1) comprises a housing (101) and an electronic component (102), wherein the electronic component (102) is mounted on the housing (101) of the rectifier body (1), wherein the rectifier body (1) is mounted in the inner cavity of a heat dissipation assembly (2), wherein the heat dissipation assembly (2) comprises a heat dissipation shell (21), wherein the rectifier body (1) is embedded in the inner cavity of the heat dissipation shell (21), wherein the inner cavity of the heat dissipation shell (21) is provided with a silicone gasket (22), wherein a plurality of heat dissipation holes (23) are formed at the center of the surface of the silicone gasket (22), wherein the heat dissipation holes (23) are distributed in an array, and support blocks (24) are mounted on both sides of the lower surface of the silicone gasket (22), wherein the bottom of the support block (24) is connected to the bottom of the inner cavity of the heat dissipation shell (21), and a ventilation area (25) capable of ventilation and heat dissipation is formed between the support block (24) and the bottom of the heat dissipation shell (21).

2. A rectifier with a silicon structure heat dissipation device according to claim 1, characterized in that: A through slot is provided at the bottom of the heat dissipation housing (21), and a heat dissipation fan (3) is embedded in the through slot. The heat dissipation fan (3) is located directly below the heat dissipation hole (23).

3. A rectifier with a silicon structure heat dissipation device according to claim 2, characterized in that: The two side walls of the heat dissipation housing (21) are provided with a plurality of ventilation holes (4) for use in conjunction with the ventilation area (25), and the apertures of the ventilation holes (4) are all equal.

4. The rectifier with a silicon structure heat dissipation device according to claim 3, characterized in that: Thermal conductive silicone grease (5) is applied around the inner wall of the heat dissipation housing (21), and the thermal conductive silicone grease (5) is in contact with the outer shell (101) of the rectifier body (1).

5. The rectifier with a silicon structure heat dissipation device according to claim 1, characterized in that: The other two side walls of the heat dissipation housing (21) are fixedly connected with a plurality of first heat dissipation fins (6), and the distance between two adjacent first heat dissipation fins (6) is equal.

6. The rectifier with a silicon structure heat dissipation device according to claim 5, characterized in that: The bottom of the heat dissipation housing (21) is fixedly connected with second heat dissipation fins (7) from front to back, and the second heat dissipation fins (7) located in the middle of the bottom of the heat dissipation housing (21) are provided with groove openings for use with the heat dissipation fan (3).

7. The rectifier with a silicon structure heat dissipation device according to claim 3, characterized in that: The distances between two adjacent ventilation holes (4) are equal, and a dustproof net (8) is embedded in the inner cavity of the ventilation hole (4).

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