Lead-free reflow soldering machine for production of electronic industrial equipment

Abstract

The utility model discloses a lead-free reflow soldering machine for production of electronic industrial equipment, which relates to the technical field of electronic industrial equipment and comprises a lead-free reflow soldering machine main body, a plurality of cabinet doors are arranged on the lead-free reflow soldering machine main body, cabinet bodies are fixedly mounted on the cabinet doors, and partition frames are fixedly mounted on the inner sides of the cabinet bodies. A collecting mechanism is arranged on the inner side of the cabinet body and located below the partition frame, a loading plate is movably arranged on the cabinet body and located above the partition frame, a plurality of positioning mechanisms are arranged at the top of the loading plate, and a connecting assembly is arranged at the end, away from the cabinet door, of the loading plate. The circuit board can be fixed through the positioning mechanism, the situation that welding fails due to the fact that welding of electronic elements deviates in the welding process is prevented, the circuit board loaded with the positioning mechanism can be turned over through the connecting mechanism, workers can conveniently observe the welding situation after turning over, and the welding efficiency is improved. The practicability of the device is greatly improved, and the production efficiency of electronic products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic industrial equipment, in particular to a lead-free reflow soldering machine for the production of electronic industrial equipment. Background Art

[0002] Lead-free reflow soldering machine is an important equipment used in the production of electronic products, mainly used for soldering electronic components. Its main feature is that it does not use lead-containing solder, thus reducing the impact of electronic products on the environment. During the reflow process, the solder particles will melt at the appropriate temperature and time to form metallurgical welding, so that a strong connection is formed between the electronic components and the circuit board. The setting of parameters such as temperature and speed of the reflow soldering machine has an important influence on the quality of the soldering. The temperature curve setting of the lead-free reflow soldering machine usually includes the flux active stage, the solder melting stage and the cooling stage. The flux active stage requires appropriate time and temperature to ensure that the solder particles can completely clean the soldering surface before melting. The solder melting stage requires sufficient time and temperature to allow the solder particles to completely melt and form metallurgical welding. The cooling stage needs to control the cooling speed to avoid excessive internal stress.

[0003] During the use of the lead-free reflow soldering machine, a loading rack for electronic products needs to be placed inside it. The built-in loading rack of the lead-free reflow soldering machine is usually composed of a hollow plate. If the circuit board is taken out directly after the soldering is completed, it cannot be guaranteed whether the product is in a qualified state when it is produced. If a qualified inspection is carried out after it is taken out, it is necessary to reset the soldering position of the electronic components after putting it back, which affects the production efficiency of the electronic products.

[0004] Therefore, we propose a lead-free reflow soldering machine for the production of electronic industrial equipment to solve the above-mentioned technical problems. Utility Model Content

[0005] In view of this, the present invention is lacking in the needle, and its main purpose is to provide a lead-free reflow soldering machine for the production of electronic industrial equipment, which is used to solve the above-mentioned problems.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: it includes a lead-free reflow soldering machine body, a plurality of cabinet doors are arranged on the lead-free reflow soldering machine body, a cabinet body is fixedly installed on the cabinet doors, a partition frame is fixedly installed on the inner side of the cabinet body, a collecting mechanism is arranged on the inner side of the cabinet body and below the partition frame, a loading plate is movably arranged on the cabinet body and above the partition frame, a plurality of positioning mechanisms are arranged on the top of the loading plate, and a connecting component is arranged on the loading plate and at one end away from the cabinet door.

[0007] As a preferred solution, the collection mechanism includes a reserved cavity provided on the cabinet and below the dividing frame, and a collection box is inserted into the inner side of the reserved cavity.

[0008] As a preferred solution, the loading plate is evenly provided with first penetration holes.

[0009] As a preferred embodiment, the positioning mechanism includes a loading frame fixedly mounted on a loading plate, the loading frame being provided with a second through hole, the second through hole corresponding to the first through hole, a screw rod being inserted into a side of the loading plate away from the loading frame, the screw rod extending to the inner side of the loading frame being threadedly mounted with a nut.

[0010] As a preferred solution, a limiting groove for placing the circuit board is provided on the top of the loading frame, a plug-in groove is provided on the limiting groove, a plug-in rod is plugged into the plug-in groove, and a limiting strip is fixedly installed on the plug-in rod and located inside the limiting groove.

[0011] As a preferred solution, the connecting component includes external grooves symmetrically opened on both sides of the cabinet body, and sliding grooves are opened on the inner sides of the external grooves. A connecting shaft is fixedly installed on one end of the loading plate away from the cabinet door, and the connecting shaft passes through the sliding groove.

[0012] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that it mainly has the following advantages:

[0013] The device is used to carry the circuit board during the welding process of the circuit board through the cabinet door and the cabinet body, so that the lead-free reflow soldering machine body can automatically perform the welding work. The partition frame is used to divide the space inside the cabinet body, so that the bottom of the cabinet body can collect the waste generated by welding, so that the device can maintain a good working environment. The circuit board can be fixed by the positioning mechanism to prevent the welding of electronic components from offset during the welding process, resulting in welding failure. The circuit board loaded with the positioning mechanism can be flipped by the connecting mechanism. After flipping, it is convenient for the staff to observe the welding situation, which greatly improves the practicality of the device and improves the production efficiency of electronic products.

[0014] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0016] Figure 2 This is a schematic diagram of the cabinet structure of an embodiment of the utility model;

[0017] Figure 3 It is a side view of the cabinet structure of an embodiment of the utility model;

[0018] Figure 4 It is a schematic diagram of the enlarged structure of point A of an embodiment of the utility model;

[0019] Figure 5 It is a schematic cross-sectional view of the positioning mechanism structure of an embodiment of the utility model;

[0020] Figure 6 It is a schematic cross-sectional view of the cabinet structure of an embodiment of the utility model;

[0021] Figure 7 It is a schematic diagram of the enlarged structure of point B of an embodiment of the utility model.

[0022] Explanation of the reference numerals: 1. Lead-free reflow soldering machine body; 2. Cabinet door; 3. Cabinet body; 4. Reserved cavity; 5. Collection box; 6. Partition frame; 7. Loading plate; 8. First penetration hole; 9. Connecting shaft; 10. External groove; 11. Sliding groove; 12. Loading frame; 13. Limiting groove; 14. Plug-in groove; 15. Plug-in rod; 16. Limiting strip; 17. Second penetration hole; 18. Screw; 19. Nut. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] See also Figures 1 to 7 The embodiment of the utility model provides a lead-free reflow soldering machine for the production of electronic industrial equipment, including a lead-free reflow soldering machine body 1, a plurality of cabinet doors 2 are arranged on the lead-free reflow soldering machine body 1, a cabinet 3 is fixedly installed on the cabinet door 2, a partition frame 6 is fixedly installed on the inner side of the cabinet 3, a collecting mechanism is arranged on the inner side of the cabinet 3 and below the partition frame 6, a loading plate 7 is movably arranged on the cabinet 3 and above the partition frame 6, a plurality of positioning mechanisms are arranged on the top of the loading plate 7, and a connecting component is arranged on the loading plate 7 and at one end away from the cabinet door 2;

[0026] In this embodiment, the lead-free reflow soldering machine body 1 is an important equipment suitable for the production of electronic products, mainly used for soldering electronic components, especially soldering electronic components on circuit boards, and is widely used. The cabinet door 2 and the cabinet body 3 are used to carry the circuit board during the soldering process of the circuit board, so that the lead-free reflow soldering machine body 1 automatically performs the soldering work. The partition frame 6 is used to divide the space inside the cabinet body 3, so that the waste chips generated by the welding are collected under the cabinet body 3, so that the device can maintain a good working environment. The circuit board can be fixed by the positioning mechanism to prevent the soldering of electronic components from being offset during the soldering process, resulting in soldering failure. The circuit board loaded with the positioning mechanism can be flipped by the connecting mechanism. After flipping, it is convenient for the staff to observe the welding situation, which greatly improves the practicality of the device and the production efficiency of electronic products.

[0027] See also Figures 1 to 7 The collecting mechanism includes a reserved cavity 4 arranged on the cabinet 3 and below the dividing frame 6, a collecting box 5 is inserted into the inner side of the reserved cavity 4, and first penetration holes 8 are evenly opened on the loading plate 7. The positioning mechanism and the first penetration holes 8 can make the waste chips generated by the circuit board during the welding process fall directly into the collecting box 5 inside the reserved cavity 4. When the collecting box 5 collects the target amount of waste chips, the collecting box 5 is pulled out of the reserved cavity 4, thereby completing the cleaning of the waste chips inside the collecting box 5.

[0028] See also Figures 1 to 7 The positioning mechanism includes a loading frame 12 fixedly arranged on the loading plate 7, a second through hole 17 is provided on the loading frame 12, and the second through hole 17 corresponds to the first through hole 8. A screw 18 is inserted on the side of the loading plate 7 away from the loading frame 12, and a nut 19 is threadedly installed on the inner side of the screw 18 extending to the loading frame 12. A limiting groove 13 for placing a circuit board is provided on the top of the loading frame 12, and a plug-in groove 14 is provided on the limiting groove 13, and a plug-in rod 15 is plugged into the plug-in groove 14. A limiting strip 16 is fixedly installed on the plug-in rod 15 and located on the inner side of the limiting groove 13;

[0029] In this embodiment, first, multiple loading racks 12 are evenly placed on the loading plate 7, and the first through hole 8 and the second through hole 17 are opposite to each other. Then, the screw 18 is passed through the first through hole 8 and the second through hole 17 in sequence so that it reaches the inner side of the loading rack 12. Finally, the nut 19 is screwed on the screw 18 to fix the loading rack 12 on the loading plate 7. Then, the circuit board is stably placed on the inner side of the limiting groove 13. After the placement is completed, the plug-in rod 15 together with the limiting strip 16 is plugged into the plug-in groove 14, so as to further limit the circuit board and prevent the circuit board from being separated from the limiting groove 13 during the rotation of the loading plate 7.

[0030] See also Figures 1 to 7 The connecting assembly includes outer grooves 10 symmetrically opened on both sides of the cabinet body 3, and the inner sides of the outer grooves 10 are provided with sliding grooves 11. A connecting shaft 9 is fixedly installed on one end of the loading plate 7 away from the cabinet door 2, and the connecting shaft 9 passes through the sliding groove 11;

[0031] In this embodiment, after the circuit board is welded, the loading plate 7 is pulled up to rotate. It should be noted that the sliding groove 11 is composed of two circular holes and one rectangular hole, and the rectangular hole is located on the inner side of the two circular holes. After the loading plate 7 drives the connecting shaft 9 to rotate, the loading plate 7 is pulled horizontally, so that the loading plate 7 drives the connecting shaft 9 to translate a certain distance on the inner side of the sliding groove 11, so that the circuit board can be more completely exposed within the field of vision of the observer, ensuring that the circuit board is produced as a good product.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A lead-free reflow soldering machine for the production of electronic industrial equipment, characterized in that: The lead-free reflow soldering machine comprises a main body (1) of the lead-free reflow soldering machine, wherein a plurality of cabinet doors (2) are arranged on the main body (1), a cabinet body (3) is fixedly mounted on the cabinet door (2), a partition frame (6) is fixedly mounted on the inner side of the cabinet body (3), a collecting mechanism is arranged on the inner side of the cabinet body (3) and below the partition frame (6), a loading plate (7) is movably arranged on the cabinet body (3) and above the partition frame (6), a plurality of positioning mechanisms are arranged on the top of the loading plate (7), and a connecting component is arranged on the loading plate (7) and at one end away from the cabinet door (2).

2. A lead-free reflow soldering machine for electronic industrial equipment production according to claim 1, characterized in that: The collection mechanism comprises a reserved cavity (4) arranged on the cabinet (3) and below the partition frame (6), and a collection box (5) is inserted into the inner side of the reserved cavity (4).

3. The lead-free reflow soldering machine for electronic industrial equipment production according to claim 1, characterized in that: The loading plate (7) is evenly provided with first penetration holes (8).

4. A lead-free reflow soldering machine for electronic industrial equipment production according to claim 3, characterized in that: The positioning mechanism comprises a loading frame (12) fixedly arranged on a loading plate (7), a second through hole (17) being provided on the loading frame (12), the second through hole (17) corresponding to the first through hole (8), a screw rod (18) being inserted into a side of the loading plate (7) away from the loading frame (12), and a nut (19) being threadedly installed on the inner side of the screw rod (18) extending to the loading frame (12).

5. A lead-free reflow soldering machine for electronic industrial equipment production according to claim 4, characterized in that: The top of the loading frame (12) is provided with a limiting groove (13) for placing a circuit board, the limiting groove (13) is provided with a plug-in groove (14), a plug-in rod (15) is plugged into the plug-in groove (14), and a limiting strip (16) is fixedly installed on the plug-in rod (15) and located inside the limiting groove (13).

6. The lead-free reflow soldering machine for electronic industrial equipment production according to claim 1, characterized in that: The connection assembly comprises external grooves (10) symmetrically provided on both sides of the cabinet body (3), the inner sides of the external grooves (10) are provided with sliding grooves (11), and a connecting shaft (9) is fixedly mounted on one end of the loading plate (7) away from the cabinet door (2), and the connecting shaft (9) passes through the sliding groove (11).

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