Taper grinding wheel and grinding equipment

Abstract

The utility model relates to a taper grinding wheel and grinding equipment, the taper grinding wheel comprises a grinding wheel body and a working layer, the working layer is formed on the circumferential surface of the grinding wheel body in a surrounding mode and used for grinding seed crystals, the working layer comprises a first working face and a second working face, and the first working face is parallel to the central axis of the grinding wheel body; the second working face is connected to the first working face and obliquely arranged towards the central axis of the grinding wheel body. According to the technical scheme provided by the invention, through the combined action of the first working surface and the second working surface, the processing steps of the seed crystal are reduced, and the processing efficiency of the seed crystal is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of sapphire processing equipment, and in particular, to a tapered grinding wheel and grinding equipment. Background Art

[0002] In the process of sapphire processing, the kyberyzing method is usually used to produce sapphire crystals. Before using a sapphire single crystal furnace to grow crystals, it is generally necessary to process the seed crystal so that the structure of the seed crystal can adapt to the sapphire single crystal furnace.

[0003] In the related art, a grinding wheel for a round seed crystal is used to grind the round seed crystal through a grinding wheel grinding body. The grinding wheel grinding body is constructed as a grinding circular surface with a diameter smaller than the grinding wheel body and arranged on the grinding wheel body. The grinding process of the grinding circular surface requires continuous adjustment of the processing position of the seed crystal in order to grind the seed crystal into an arc, which is not conducive to the processing efficiency of the seed crystal. Utility Model Content

[0004] The purpose of the present disclosure is to provide a tapered grinding wheel and a grinding device. The tapered grinding wheel is provided with a first working surface and a second working surface to realize the processing of the curvature of the seed crystal and improve the production efficiency of the seed crystal.

[0005] In order to achieve the above object, the present disclosure provides a tapered grinding wheel, comprising:

[0006] Grinding wheel body;

[0007] A working layer is formed around the circumferential surface of the grinding wheel body and is used for grinding seed crystals. The working layer includes a first working surface and a second working surface. The first working surface is arranged parallel to the central axis of the grinding wheel body, and the second working surface is connected to the first working surface. The second working surface is arranged inclined toward the central axis of the grinding wheel body.

[0008] Optionally, the angle between the second working surface and the central axis of the grinding wheel body is 7-8°.

[0009] Optionally, an axial length of the first working surface is smaller than an axial length of the second working surface.

[0010] Optionally, the axial length of the first working surface is 5 mm, and the axial length of the second working surface is 35 mm.

[0011] Optionally, the grinding wheel particle size of the working layer is 150#.

[0012] Optionally, the hardness of the working layer is greater than the hardness of the grinding wheel body.

[0013] Optionally, the working layer and the grinding wheel body are an integrally-molded structure.

[0014] Optionally, the grinding wheel body comprises an assembly hole, and the assembly hole is coaxially arranged with the central axis of the grinding wheel body.

[0015] Optionally, the ratio of the diameter of the assembly hole to the diameter of the grinding wheel body is 0.6:1.

[0016] According to a second aspect of the present disclosure, a grinding device is also provided, comprising the above-mentioned tapered grinding wheel.

[0017] Through the above technical solution, the first working surface and the second working surface are set to work together to realize the processing of the seed crystal, the second working surface is constructed as an inclined surface inclined toward the central axis of the grinding wheel body, so as to realize the curvature processing of the seed crystal, and the first working surface is arranged parallel to the central axis of the grinding wheel body, so as to realize the thickness grinding of the seed crystal. Therefore, through the mutual cooperation of the first working surface and the second working surface, the processing steps of the seed crystal are reduced and the processing efficiency of the seed crystal is improved.

[0018] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0020] Figure 1 is a schematic cross-sectional view of a tapered grinding wheel provided in an exemplary embodiment of the present disclosure.

[0021] Description of Reference Numerals

[0022] 1. Grinding wheel body; 101. Assembly hole; 2. Working layer; 201. First working surface; 202. Second working surface; 3. Transition layer. DETAILED DESCRIPTION

[0023] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0024] The terms "first" and "second" used in the present disclosure are to distinguish one element from another and have no order or importance. In addition, when the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0025] according to Figure 1As shown, an embodiment of the present disclosure provides a tapered grinding wheel for grinding seed crystals to improve the output efficiency of crystals. Specifically, the tapered grinding wheel includes a grinding wheel body 1 and a working layer 2, the working layer 2 is formed around the circumferential surface of the grinding wheel body 1, and is used to grind the seed crystal, the working layer 2 includes a first working surface 201 and a second working surface 202, the first working surface 201 is arranged parallel to the central axis M of the grinding wheel body 1, the second working surface 202 is connected to the first working surface 201, and the second working surface 202 is arranged inclined toward the central axis M of the grinding wheel body.

[0026] Through the above technical solution, the first working surface 201 and the second working surface 202 are set to work together to realize the processing of the seed crystal, the second working surface 202 is used to process the curvature of the seed crystal, and the first working surface 201 is used to grind the thickness of the seed crystal. Through the mutual cooperation of the first working surface 201 and the second working surface 202, the processing steps of the seed crystal are reduced and the processing efficiency of the seed crystal is improved.

[0027] In order to improve the service life and processing accuracy of the grinding wheel, in some embodiments, for example, reference Figure 1 As shown, the tapered grinding wheel of the present disclosure may further include a transition layer 3, which is located between the grinding wheel body 1 and the working layer 2 and is used to connect and buffer the stress between the working layer 2 and the grinding wheel body 1. For example, the transition layer 3 may be constructed as a film-like structure.

[0028] In order to facilitate the processing of the curvature of the seed crystal to meet the needs of the processing technology, in some embodiments, for example, reference Figure 1 As shown, the angle between the second working surface 202 and the central axis M of the grinding wheel body 1 may be 7-8°, for example, 7.33°.

[0029] In order to facilitate the grinding of the curvature of the seed crystal, in some embodiments, for example, reference Figure 1 As shown, the axial length of the first working surface 201 can be smaller than the axial length of the second working surface 202, so that the processing area of ​​the second working surface 202 is larger than that of the first working surface 201, which is beneficial to the grinding of the curvature of the seed crystal. For example, the axial length of the first working surface 201 can be 5 mm, and the axial length of the second working surface 202 can be 35 mm.

[0030] It should be noted that the limitation of the axial lengths of the first working surface 201 and the second working surface 202 in the present disclosure is only for the present disclosure, and the present disclosure does not make any special limitation on this.

[0031] In order to strengthen the grinding force on the surface of the seed crystal, in some embodiments, the grinding wheel grit of the working layer 2 can be 150#.

[0032] To facilitate the grinding of the seed crystal and extend the service life of the grinding wheel, in some embodiments, the hardness of the working layer 2 can be greater than the hardness of the grinding wheel body 1. For example, the working layer 2 can be made of corundum and the grinding wheel body 1 can be made of aluminum.

[0033] In order to enhance the overall stability of the grinding wheel, in some embodiments, the working layer 2 and the grinding wheel body 1 can be an integrally formed structure. For example, the abrasive, binder and chemical raw materials can be mixed, injected into the grinding tool for compression molding, and then sintered at high temperature to shape. The obtained grinding wheel can be refined and tested to complete the entire manufacturing process.

[0034] The description of the manufacturing process of the grinding wheel in the present disclosure is exemplary. The manufacturing of the grinding wheel can be adaptively adjusted according to actual conditions, and the present disclosure does not make any specific limitation on this.

[0035] The structural limitation of the working layer 2 and the grinding wheel body 1 in the present disclosure is only for the present disclosure. The structures of the working layer 2 and the grinding wheel body 1 can be adaptively adjusted according to actual conditions. For example, the working layer 2 can be set on the grinding wheel body 1 by coating, or fixed on the grinding wheel body 1 by a bonding agent. The present disclosure does not make specific limitations on this.

[0036] In order to facilitate the assembly of the tapered grinding wheel, in some embodiments, for example, reference Figure 1 As shown, the grinding wheel body 1 may further include an assembly hole 101 , and the assembly hole 101 is coaxially arranged with the central axis M of the grinding wheel body 1 .

[0037] The number of assembly holes 101 can be adaptively adjusted according to actual conditions, and the number of assembly holes 101 can also be multiple, for example, the number of assembly holes 101 can be two or three to meet the needs of different process flows, and the present disclosure does not make specific limitations on this.

[0038] In order to meet the needs of seed crystal processing, in some embodiments, the ratio of the diameter of the assembly hole 101 to the diameter of the grinding wheel body 1 can be 0.6:1. For example, the diameter of the assembly hole 101 can be 127 mm, and the diameter of the grinding wheel body 1 can be 213.5 mm.

[0039] The diameter of the assembly hole 101 may be between 126.975 mm and 127.005 mm. For example, the diameter of the assembly hole 101 may be 127.001 mm, which is not particularly limited in the present disclosure.

[0040] In addition, the radial thickness of the working layer 2 may be 15 mm, which is not specifically limited in the present disclosure.

[0041] The embodiment of the present disclosure also provides a grinding device, including the above-mentioned tapered grinding wheel. The grinding device is usually a surface grinder, and the tapered grinding wheel is installed on the mandrel of the surface grinder, so that the tapered grinding wheel can process the material under the drive of the mandrel. The grinding device has all the beneficial effects of the above-mentioned tapered grinding wheel, and the present disclosure will not repeat them.

[0042] The present disclosure exemplarily describes the working process of the tapered grinding wheel, for example: installing the flange on the assembly hole 101 of the tapered grinding wheel and locking it, assembling the tapered grinding wheel to the surface grinder, setting the down-cut stroke, placing the unprocessed seed crystal on the grinder, turning on the magnetic suction, measuring the length of the seed crystal to be processed, pressing the switch to start the equipment working, the working layer 2 of the grinding wheel starts to process the seed crystal according to the preset stroke trajectory, the second working surface 202 grinds the curvature of the seed crystal, the first working surface 201 grinds the thickness of the seed crystal, and the first working surface 201 and the second working surface 202 work together to improve the production efficiency of the seed crystal and save time cost.

[0043] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0044] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0045] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A tapered grinding wheel, characterized in that: include: Grinding wheel body; and A working layer is formed around the circumferential surface of the grinding wheel body and is used for grinding seed crystals. The working layer includes a first working surface and a second working surface. The first working surface is arranged parallel to the central axis of the grinding wheel body, and the second working surface is connected to the first working surface. The second working surface is arranged inclined toward the central axis of the grinding wheel body.

2. The tapered grinding wheel according to claim 1, characterized in that: The angle between the second working surface and the central axis of the grinding wheel body is 7-8°.

3. The tapered grinding wheel according to claim 1, characterized in that: An axial length of the first working surface is smaller than an axial length of the second working surface.

4. The tapered grinding wheel according to claim 3, characterized in that: The axial length of the first working surface is 5 mm, and the axial length of the second working surface is 35 mm.

5. The tapered grinding wheel according to claim 1, characterized in that: The grinding wheel particle size of the working layer is 150#.

6. The tapered grinding wheel according to claim 1, characterized in that: The hardness of the working layer is greater than the hardness of the grinding wheel body.

7. The tapered grinding wheel according to claim 1, characterized in that: The working layer and the grinding wheel body are integrally formed by injection molding.

8. The tapered grinding wheel according to any one of claims 1 to 7, characterized in that: The grinding wheel body comprises an assembly hole, and the assembly hole is coaxially arranged with the central axis of the grinding wheel body.

9. The tapered grinding wheel according to claim 8, characterized in that: The ratio of the diameter of the assembly hole to the diameter of the grinding wheel body is 0.6:

1.

10. A grinding device, characterized in that: The invention comprises the tapered grinding wheel as described in any one of claims 1 to 9.

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