Semiconductor lead frame processing injection molding device

Abstract

The utility model relates to the technical field of semiconductor lead frame processing, and discloses a semiconductor lead frame processing injection molding device, which comprises supporting legs, a workbench fixedly arranged at the tops of the supporting legs, a control panel fixedly arranged at one side of the workbench, and a supporting column fixedly arranged at the top of the workbench; the injection molding assemblies are arranged above and below the working table, and each injection molding assembly comprises an injection molding cooling part arranged above and below the working table; the lifting part is arranged above and below the workbench, and by arranging the upper mold, when machining is needed, a rotating handle is rotated to enable a threaded rod to drive the upper mold to move downwards on a cylinder through a connecting block, so that the upper mold and the lower mold are closed for injection molding machining; and the ejector rod is matched with the ejector plate through the air cylinder to eject the ejector plate, so that the cooled machined part can be conveniently taken out from the interior of the lower mold, and the effect of convenient use is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lead frame processing, in particular to a semiconductor lead frame processing injection molding device. Background Art

[0002] Semiconductor lead frame is an important basic material in the electronic information industry, mainly used as the chip carrier of integrated circuits. The injection molding device is an important part of the injection molding machine. Its main function is to plasticize the plastic into a molten state evenly and inject a certain amount of molten material into the mold cavity with sufficient pressure and speed. This is a key step in the injection molding process. The performance of the injection molding device directly affects the quality and production efficiency of the product.

[0003] Nowadays, the lead frame is cooled by using the temperature of air, which wastes time. At the same time, the ordinary injection molding device has a poor injection molding effect on the semiconductor lead frame, which easily causes product quality problems. It cannot be removed quickly and conveniently, which reduces work efficiency. Utility Model Content

[0004] The utility model aims to provide a semiconductor lead frame processing injection molding device to achieve the purpose of easy demoulding and use.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor lead frame processing injection molding device, comprising: a support leg, wherein a workbench is fixedly installed on the top of the support leg, a control panel is fixedly installed on one side of the workbench, and a support column is fixedly installed on the top of the workbench; an injection molding component, wherein the injection molding component is arranged above and below the workbench.

[0006] Preferably, the injection molding assembly includes: an injection molding cooling part, which is arranged above and below the workbench; and a lifting part, which is arranged above and below the workbench.

[0007] Preferably, the injection molding cooling part includes: a lower mold, which is fixedly installed on the top of the workbench; a cooling water tank, which is fixedly installed on the bottom of the workbench; a cylinder, which is fixedly installed on the inner side of the supporting leg; one side of the cooling water tank is connected to a connecting water pipe, and one end of the connecting water pipe is fixedly installed with a switch valve.

[0008] Preferably, one end of the connecting water pipe is connected to a delivery pipe, and the other end of the delivery pipe is connected to the interior of the lower mold.

[0009] Preferably, the ejection end of the cylinder is fixedly connected to an ejector rod and extends above the workbench. An ejector plate is fixedly installed on the top of the ejector rod, and there are four groups in total, which are compatible with the inner side of the support column. A top plate is fixedly installed on the top of the ejector plate.

[0010] Preferably, the lifting part includes: an upper mold, which is arranged below the top plate; a feed port, which is opened at the top of the top plate; a connecting block is fixedly installed on one side of the upper mold, a slide groove is opened on the top of the connecting block, and a cylinder is movable through the inside of the slide groove, and there are two groups of cylinders in total, and a spring is fixedly installed on the top of the connecting block and is located on the outer wall of the cylinder.

[0011] Preferably, a threaded rod is fixedly mounted on the top of the upper mold and extends to above the top plate, and there are two groups of threaded rods in total, and a rotating handle is fixedly mounted on the top of the threaded rod.

[0012] Preferably, a connecting pipe is fixedly installed inside the feed port, and one end of the connecting pipe is connected to a telescopic tube, and one end of the telescopic tube is connected to the inside of the upper mold.

[0013] The utility model provides a semiconductor lead frame processing injection molding device, which has the following beneficial effects:

[0014] (1) The utility model is provided with a lower mold. After the workpiece is injected into the cavity of the lower mold and the upper mold through the feed port for injection molding, the water source is opened by switching the valve so that the water in the cooling water tank is transported to the interior of the lower mold through the delivery pipe to cool the workpiece, thereby achieving the effect of facilitating demoulding.

[0015] (2) The utility model is provided with an upper mold. When processing is required, the handle is turned to make the threaded rod drive the upper mold to move downward on the cylinder through the connecting block so that the upper mold and the lower mold are closed for injection molding. When the processing is completed, the ejector rod is used to cooperate with the ejector plate through the cylinder to eject the ejector plate, so that the cooled workpiece can be taken out from the inside of the lower mold, thereby achieving the effect of being easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a side view of the injection molding component structure of the utility model;

[0018] Figure 3 This is a front view of the injection molding component structure of the utility model;

[0019] Figure 4 This is a view of the lifting and lowering part of the injection molding component structure of the utility model.

[0020] In the figure: 1 supporting leg, 2 working table, 3 control panel, 4 supporting column, 5 injection molding component, 51 injection molding cooling part, 511 lower mold, 512 cooling water tank, 513 connecting water pipe, 514 switch valve, 515 conveying pipeline, 516 cylinder, 517 ejector rod, 518 ejector plate, 519 ejector plate, 52 lifting part, 521 upper mold, 522 connecting block, 523 cylinder, 524 spring, 525 threaded rod, 526 rotating handle, 527 feeding port, 528 telescopic tube. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0023] Example 1

[0024] A preferred embodiment of a semiconductor lead frame processing injection molding device provided by the utility model is as follows: Figure 1-4 As shown: A semiconductor lead frame processing injection molding device, comprising: a support leg 1, wherein a workbench 2 is fixedly installed on the top of the support leg 1, a control panel 3 is fixedly installed on one side of the workbench 2, and a support column 4 is fixedly installed on the top of the workbench 2; an injection molding component 5, and the injection molding component 5 is arranged above and below the workbench 2.

[0025] The injection molding assembly 5 includes: an injection molding cooling portion 51 , which is disposed above and below the workbench 2 ; and a lifting portion 52 , which is disposed above and below the workbench 2 .

[0026] The injection molding cooling part 51 includes: a lower mold 511, which is fixedly installed on the top of the workbench 2; a cooling water tank 512, which is fixedly installed on the bottom of the workbench 2; a cylinder 516, which is fixedly installed on the inner side of the supporting leg 1; one side of the cooling water tank 512 is connected to a connecting water pipe 513, and one end of the connecting water pipe 513 is fixedly installed with a switch valve 514.

[0027] One end of the connecting water pipe 513 is connected to a delivery pipe 515 , and the other end of the delivery pipe 515 is connected to the interior of the lower mold 511 .

[0028] The ejection end of the cylinder 516 is fixedly connected to the ejection rod 517 and extends to the top of the workbench 2. The top of the ejection rod 517 is fixedly installed with an ejection plate 518, and there are four groups in total, which are compatible with the inner side of the support column 4. The top of the ejection plate 518 is fixedly installed with a top plate 519.

[0029] Furthermore, in this embodiment, a lower mold 511 is provided. After the workpiece is injected into the cavity of the lower mold 511 and the upper mold 521 through the feed port 527 for injection molding, the water source is opened by switching the valve 514 so that the water inside the cooling water tank 512 is transported to the interior of the lower mold 511 through the delivery pipe 515 to cool the workpiece, thereby facilitating demolding.

[0030] Example 2

[0031] On the basis of Example 1, a preferred embodiment of a semiconductor lead frame processing injection molding device provided by the utility model is as follows: Figure 1-4 As shown: the lifting part 52 includes: an upper mold 521, which is arranged below the top plate 519; a feed port 527, which is opened at the top of the top plate 519; a connecting block 522 is fixedly installed on one side of the upper mold 521, a slide groove is opened on the top of the connecting block 522, and a cylinder 523 is movable inside the slide groove and penetrates therethrough, and there are two groups of them, and a spring 524 is fixedly installed on the top of the connecting block 522 and is located on the outer wall of the cylinder 523.

[0032] A threaded rod 525 is fixedly installed on the top of the upper mold 521 and extends to the top of the top plate 519. There are two sets of threaded rods 525 in total. A rotating handle 526 is fixedly installed on the top of the threaded rod 525.

[0033] A connecting pipe is fixedly installed inside the feed port 527 , and one end of the connecting pipe is connected to a telescopic pipe 528 , and one end of the telescopic pipe 528 is connected to the inside of the upper mold 521 .

[0034] Furthermore, the present embodiment is provided with an upper mold 521. When processing is required, the rotating handle 526 is rotated to allow the threaded rod 525 to drive the upper mold 521 to move downward on the cylinder 523 through the connecting block 522, so that the upper mold 521 and the lower mold 511 are closed for injection molding. When the processing is completed, the ejector rod 517 is cooperated with the ejector plate 518 by the cylinder 516 to eject the ejector plate 519, so as to facilitate the removal of the cooled workpiece from the interior of the lower mold 511 for easy use.

[0035] During use, by providing an upper mold 521, when processing is required, the rotating handle 526 is rotated to make the threaded rod 525 drive the upper mold 521 to move downward on the cylinder 523 through the connecting block 522, so that the upper mold 521 and the lower mold 511 are closed for injection molding. Furthermore, the workpiece is poured into the cavity of the lower mold 511 and the upper mold 521 through the feed port 527 for injection molding. After that, the water source is opened by opening the switch valve 514 so that the water inside the cooling water tank 512 is transported to the inside of the lower mold 511 through the delivery pipe 515 to cool the workpiece. Finally, when the processing is completed, the ejector rod 517 is cooperated with the ejector plate 518 to eject the ejector plate 519 through the cylinder 516, so as to facilitate the removal of the cooled workpiece from the inside of the lower mold 511, thereby completing the injection molding of the workpiece.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor lead frame processing injection molding device, characterized in that: include: Support leg (1), Wherein, a workbench (2) is fixedly mounted on the top of the support leg (1), a control panel (3) is fixedly mounted on one side of the workbench (2), and a support column (4) is fixedly mounted on the top of the workbench (2); Injection molding components (5), the injection molding components (5) are arranged above and below the workbench (2); The injection molding component (5) comprises: Injection molding cooling parts (51), the injection molding cooling parts (51) are arranged above and below the workbench (2); A lifting part (52), wherein the lifting part (52) is arranged above and below the workbench (2); The injection molding cooling part (51) includes: A lower mold (511), wherein the lower mold (511) is fixedly mounted on the top of the workbench (2); A cooling water tank (512), wherein the cooling water tank (512) is fixedly mounted on the bottom of the workbench (2); A cylinder (516), wherein the cylinder (516) is fixedly mounted on the inner side of the supporting leg (1); A connecting water pipe (513) is provided on one side of the cooling water tank (512), and a switch valve (514) is fixedly installed on one end of the connecting water pipe (513).

2. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: One end of the connecting water pipe (513) is connected to a delivery pipe (515), and the other end of the delivery pipe (515) is connected to the interior of the lower mold (511).

3. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: The ejection end of the cylinder (516) is fixedly connected to an ejection rod (517) and extends to the top of the workbench (2). The top of the ejection rod (517) is fixedly installed with an ejection plate (518), and there are four sets of ejection plates in total, which are compatible with the inner side of the support column (4). The top of the ejection plate (518) is fixedly installed with a top plate (519).

4. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: The lifting part (52) includes: An upper mold (521), wherein the upper mold (521) is disposed below the top plate (519); A feed inlet (527), wherein the feed inlet (527) is opened at the top of the top plate (519); A connecting block (522) is fixedly installed on one side of the upper mold (521), a slide groove is opened on the top of the connecting block (522), and a cylinder (523) is movably penetrated inside the slide groove, and there are two groups of them in total. A spring (524) is fixedly installed on the top of the connecting block (522) and is located on the outer wall of the cylinder (523).

5. The semiconductor lead frame processing injection molding device according to claim 4, characterized in that: A threaded rod (525) is fixedly mounted on the top of the upper mold (521) and extends to the top of the top plate (519). There are two groups of threaded rods in total. A rotating handle (526) is fixedly mounted on the top of the threaded rod (525).

6. The semiconductor lead frame processing injection molding device according to claim 5, characterized in that: A connecting pipe is fixedly installed inside the feed port (527), and one end of the connecting pipe is connected to a telescopic pipe (528), and one end of the telescopic pipe (528) is connected to the inside of the upper mold (521).

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