Uniform plating inflating device for chemical nickel bath

Abstract

The utility model discloses a chemical nickel bath uniform plating inflating device which comprises a chemical nickel aqueduct, nanometer air supply devices and an air blower, the bottom of the chemical nickel aqueduct is fixedly connected with a plurality of nanometer air supply devices in an embedded mode, the nanometer air supply devices are evenly distributed in a rectangular array mode, a plurality of air supply pipelines are arranged at the bottom of the chemical nickel aqueduct, and the air blower is arranged on the air supply pipelines. The air supply pipeline is communicated with the bottom of the nanometer air supply device, one end of the air supply pipeline is connected with an air guide pipe, a flow regulating valve is fixedly connected to the air supply pipeline at one end of the air guide pipe, a cooling device is fixedly connected in the air guide pipe, and the other end of the cooling device is connected with an air blower. The utility model aims to provide the uniform plating inflating device for the chemical nickel bath, which can accurately control the gas flow and generate fine bubbles through the nano gas supply device so as to optimize the chemical reaction environment, so that the uniformity and the quality of a plating layer are obviously improved, and the production efficiency and the equipment stability are enhanced at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical plating equipment, in particular to a chemical nickel tank uniform plating aeration device. Background Art

[0002] In the field of electroplating and chemical plating, uniform coating quality is a key element to achieve high-performance metal surface treatment. Chemical nickel plating is a technology that deposits nickel on the surface of workpieces through a chemical reduction reaction. It is widely used in various industries such as automobiles, aviation, electronics and medical devices. Chemical nickel plating has the advantages of good corrosion resistance, high hardness and uniform thickness. Therefore, ensuring the uniformity and quality of the coating is crucial to extend the life of the product and improve its performance.

[0003] In the traditional chemical nickel plating process, uniform distribution of gas is a common challenge. The introduction of gas is usually through simple mechanical stirring or directly delivered to the inside of the liquid tank through a pipe. Although these methods can provide the necessary gas stirring to a certain extent, they often fail to achieve the miniaturization and uniform distribution of bubbles, resulting in inconsistencies in the thickness and surface smoothness of the coating. In addition, inaccurate control of gas flow will also affect the efficiency of the chemical reaction and the quality of the coating.

[0004] In view of the above problems, it is an urgent need in the industry to develop a device that can provide more refined and uniform gas distribution. The ideal solution should be able to generate extremely fine bubbles in the chemical nickel solution to promote a more uniform chemical reaction, while maintaining stability and consistency during the plating process by precisely controlling the gas flow. In addition, considering the heat that may be generated during the chemical reaction, proper cooling of the gas is also an important aspect to ensure the stability of the chemical plating process. Therefore, a new chemical nickel tank uniform plating aeration device that integrates a nano-gas supply device, precise flow regulation and an effective gas cooling system came into being to address the shortcomings of traditional methods. Utility Model Content

[0005] In view of the above-mentioned deficiencies existing in the prior art, the purpose of the utility model is to provide a chemical nickel tank uniform plating aeration device, which can accurately control the gas flow through a nano gas supply device to generate fine bubbles to optimize the chemical reaction environment, thereby significantly improving the uniformity and quality of the coating, while enhancing production efficiency and equipment stability.

[0006] The technical solution adopted by the utility model to achieve the above-mentioned purpose is: a chemical nickel tank uniform plating aeration device, including a chemical nickel aqueduct, a nano gas supply device, a gas supply pipeline, a flow regulating valve, an air guide pipe, a cooling device, and a blower. The chemical nickel aqueduct is the main container structure, and a plurality of nano gas supply devices are embedded and connected to the bottom of the chemical nickel aqueduct. The nano gas supply devices are used to uniformly release gas into the nickel solution in the form of extremely fine bubbles to promote the uniform progress of the chemical reaction and improve the quality of the plating layer. The nano gas supply devices are uniformly distributed in a rectangular array, and a plurality of gas supply pipelines are arranged at the bottom of the chemical nickel aqueduct. The gas supply pipelines are respectively connected to the bottom of the nano gas supply devices. The gas supply pipeline is used to transport gas from an external source to each nano gas supply device. One end of the gas supply pipeline is connected to the gas guide pipe. A flow regulating valve is fixedly connected to the gas supply pipeline at one end of the gas guide pipe. The flow regulating valve is used to accurately control the flow of gas to ensure the consistency and accuracy of gas supply during the electroplating process. A cooling device is fixedly connected in the gas guide pipe. Before the gas enters the gas supply system, the gas is cooled by the cooling device to ensure the stability of the chemical reaction during the treatment process. The other end of the cooling device is connected to the blower to provide the necessary power to push the gas through the entire gas supply system to ensure that the gas can reach all nano gas supply devices.

[0007] In one embodiment, four corners of the lower end of the chemical nickel aqueduct are respectively fixedly connected with supporting legs.

[0008] In one embodiment, the nano gas supply device includes a gas supply box and a nano gas permeable plate. The gas supply box is embedded and connected to the bottom of the chemical nickel aqueduct, and the nano gas permeable plate is embedded and connected to the upper end of the gas supply box.

[0009] In one of the embodiments, the cooling device includes a transverse plate, a longitudinal plate, a cold coil, a cover plate, and a supercooling box. One end of the supercooling box is connected to the middle part of the air duct through an air outlet pipe, and the other end of the supercooling box is connected to the blower through an air inlet pipe. The upper end of the supercooling box is fixedly connected to a cover plate by bolts, and the lower end of the cover plate is fixedly connected to a plurality of longitudinal plates, and the longitudinal plate is fixedly connected to a plurality of transverse plates, the longitudinal plates are arranged perpendicular to each other, and a plurality of air passages are formed between the longitudinal plates and the transverse plates, and the longitudinal plates and the transverse plates are embedded and fixedly connected with cold coils.

[0010] In one embodiment, the longitudinal plate and the transverse plate are both made of copper or aluminum.

[0011] Beneficial effects of the utility model:

[0012] 1. Improve the uniformity and quality of the coating: The nano-gas supply device generates extremely fine bubbles, which can achieve a more uniform gas distribution in the chemical nickel solution; the uniform bubble distribution helps to promote the uniformity of the chemical reaction, thereby significantly improving the uniformity and smoothness of the coating, reducing the problem of local excessive thickness or thinness, and ultimately achieving the effect of improving the overall quality of the coating;

[0013] 2. Accurately control gas flow: The gas flow can be accurately controlled through the flow control valve to ensure the consistency and accuracy of gas supply during the electroplating process; this fine flow control helps maintain the stability of the chemical reaction and avoid coating defects caused by uneven gas supply;

[0014] 3. Optimize the chemical reaction environment: Cooling the gas through a cooling device can effectively control the temperature during the chemical reaction and maintain the stability of the chemical reaction. Proper temperature control can not only prevent the reaction from getting out of control due to overheating, but also ensure the quality of the plating solution and the coating;

[0015] 4. Improve production efficiency and save energy: This device can effectively improve production efficiency and reduce material waste and rework by improving the consistency of the coating process and reducing the defect rate. In addition, optimized gas control and temperature management can also help reduce energy consumption, achieving both economic and environmental benefits.

[0016] 5. Enhance equipment stability and durability: The design of the utility model also takes into account the mechanical stability of the equipment. The setting of the legs ensures the stable use of the device and avoids operational risks caused by mechanical vibration or imbalance;

[0017] In summary, the utility model provides an efficient, stable and economical solution to improve and optimize the production process of chemical nickel plating, bringing broad application prospects and significant industrial value. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the connection structure of the nano gas supply device of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the cooling device of the utility model;

[0021] Figure 4 This is a schematic diagram of the cold coil connection structure of the utility model.

[0022] In the figure: 1 chemical nickel aqueduct, 2 nanometer gas supply device, 3 gas supply pipeline, 4 flow regulating valve, 5 air duct, 6 cooling device, 7 blower, 8 legs, 101 gas supply box, 102 nanometer air permeable plate, 201 horizontal plate, 202 vertical plate, 203 cold coil, 204 covering plate, 205 supercooling box. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4 A chemical nickel tank uniform plating aeration device comprises a chemical nickel aqueduct 1, a nano gas supply device 2, a gas supply pipeline 3, a flow regulating valve 4, an air guide pipe 5, a cooling device 6, and a blower 7. The chemical nickel aqueduct 1 is a main container structure. A plurality of nano gas supply devices 2 are embedded and connected to the bottom of the chemical nickel aqueduct 1. The nano gas supply devices 2 are used to uniformly release gas into the nickel solution in the form of extremely fine bubbles to promote the uniform progress of the chemical reaction and improve the quality of the plating layer. The nano gas supply devices 2 are uniformly distributed in a rectangular array. A plurality of gas supply pipelines 3 are arranged at the bottom of the chemical nickel aqueduct 1. The gas supply pipelines 3 are respectively connected to the bottom of the nano gas supply devices 2. The gas supply pipelines 3 are used to release gas into the nickel solution in the form of extremely fine bubbles. The gas is transported from an external source to each nano-gas supply device 2. One end of the gas supply pipe 3 is connected to the air guide pipe 5. A flow regulating valve 4 is fixedly connected to the gas supply pipe 3 at one end of the air guide pipe 5. The flow regulating valve 4 is used to accurately control the flow of the gas to ensure the consistency and accuracy of the gas supply during the electroplating process. A cooling device 6 is fixedly connected to the air guide pipe 5. Before the gas enters the gas supply system, the gas is cooled by the cooling device 6 to ensure the stability of the chemical reaction during the treatment process. The other end of the cooling device 6 is connected to the blower 7 to provide the necessary power to push the gas through the entire gas supply system to ensure that the gas can reach all the nano-gas supply devices 2.

[0025] In one embodiment, four corners of the lower end of the chemical nickel aqueduct 1 are respectively fixedly connected with supporting legs 8, and the supporting legs 8 are used to mechanically support the chemical nickel aqueduct 1.

[0026] In one embodiment, the nano-gas supply device 2 includes a gas supply box 101 and a nano-gas permeable plate 102. The gas supply box 101 is embedded and connected to the bottom of the chemical nickel trough 1, and the upper end of the gas supply box 101 is embedded and connected to the nano-gas permeable plate 102. When in use, the gas is transported from the gas supply pipe 3 to the gas supply box 101, and then pressed out through the micropores on the nano-gas permeable plate 102 to form extremely fine bubbles. The tiny bubbles are evenly distributed in the chemical nickel solution, thereby improving the stirring effect of the solution and the uniformity of the chemical reaction, thereby making the coating more uniform and smooth.

[0027] In one embodiment, the cooling device 6 includes a transverse plate 201, a longitudinal plate 202, a cold coil 203, a cover plate 204, and a supercooling box 205. The design of the supercooling box 205 enables it to effectively reduce the temperature of the gas passing through it. One end of the supercooling box 205 is connected to the middle part of the air duct 5 through an air outlet pipe, and the other end of the supercooling box 205 is connected to the blower 7 through an air inlet pipe. The upper end of the supercooling box 205 is fixedly connected to the cover plate 204 by bolts. The cover plate 204 is used to ensure the sealing of the supercooling box 205. A plurality of longitudinal plates 202 are fixedly connected to the lower end of the cover plate 204. A plurality of transverse plates 201 are fixedly connected to the longitudinal plates 202. The longitudinal plates 202 and the transverse plates 201 are arranged perpendicular to each other, and the longitudinal plates 202 and the transverse plates 201 are arranged perpendicular to each other to form a structural frame. This arrangement not only increases the structural strength inside the supercooling box 205, but also forms a number of air passages between the longitudinal plate 202 and the transverse plate 201. The longitudinal plate 202 and the transverse plate 201 are embedded and fixedly connected with cold coils 203. When in use, the heat in the gas in the supercooling box 205 is absorbed by circulating the coolant in the cold coils 203.

[0028] In one embodiment, the longitudinal plate 202 and the transverse plate 201 are both made of copper or aluminum and connected to the cold coil 203, which can significantly improve the efficiency of the gas cooling process. A higher heat exchange rate means faster cooling speed and lower energy consumption.

[0029] The working principle of the utility model is:

[0030] 1. Introduction and preliminary treatment of gas

[0031] Gas introduction: The gas is first sucked into the system through the blower 7, which provides the power required for the gas flow;

[0032] Gas cooling: The gas before cooling enters the supercooling box 205 through the air inlet pipe. In the supercooling box 205, the copper and aluminum longitudinal plates 202 and the transverse plates 201 can be cooled by the cold coil 203. The cooled longitudinal plates 202 and the transverse plates 201 can absorb the heat in the gas to achieve gas cooling. The cooled gas flows to the air guide pipe 5 through the air outlet pipe.

[0033] 2. Precise control and distribution of gas

[0034] Flow control: When the gas is transmitted from the supercooling box 205 through the air duct 5, the flow rate is precisely controlled by the flow regulating valve 4 installed on the air duct 5, thereby ensuring the consistency and accuracy of the gas supply during the electroplating process;

[0035] Gas distribution: The controlled gas is further transported to each nano gas supply device 2 located at the bottom of the chemical nickel aqueduct 1 through the gas supply pipeline 3;

[0036] 3. Final treatment and use of gas

[0037] Nano-scale dispersion: After reaching the nano-gas supply device 2, the gas is pressed into the gas supply box 101, and then pressed out through the micropores of the nano-gas permeable plate 102 embedded in the upper end of the gas supply box 101. The micropore design of the nano-gas permeable plate 102 allows the gas to be released into the nickel solution in the form of extremely fine bubbles.

[0038] Promotion of chemical reaction: These extremely fine bubbles are evenly distributed in the chemical nickel solution, effectively improving the stirring effect of the solution and promoting the uniform progress of the chemical reaction. The uniform stirring and fine bubble size help to improve the uniformity and smoothness of the coating, thereby improving the quality of the coating.

[0039] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0040] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chemical nickel bath blanketing aeration device, comprising a chemical nickel bath (1), a nanometer air supply device (2), an air supply pipeline (3), a flow regulating valve (4), an air guide pipe (5), a cooling device (6), and a blower (7), characterized in that: A plurality of nano-gas supply devices (2) are embedded and fixedly connected at the bottom of the chemical nickel aqueduct (1), and the nano-gas supply devices (2) are evenly distributed in a rectangular array. A plurality of gas supply pipes (3) are arranged at the bottom of the chemical nickel aqueduct (1), and the gas supply pipes (3) are respectively connected to the bottoms of the nano-gas supply devices (2). One end of the gas supply pipe (3) is connected to an air guide pipe (5), and a flow regulating valve (4) is fixedly connected to the gas supply pipe (3) at one end of the air guide pipe (5). A cooling device (6) is fixedly connected to the air guide pipe (5), and the other end of the cooling device (6) is connected to a blower (7).

2. The gas-injection device for chemical nickel bath blanketing according to claim 1, characterized in that: The four corners of the lower end of the chemical nickel aqueduct (1) are respectively fixedly connected with supporting legs (8).

3. The gas-injection device for chemical nickel bath blanketing according to claim 1, characterized in that: The nano gas supply device (2) comprises a gas supply box (101) and a nano gas permeable plate (102); the gas supply box (101) is embedded and connected to the bottom of the chemical nickel aqueduct (1); and the nano gas permeable plate (102) is embedded and connected to the upper end of the gas supply box (101).

4. The gas-injection device for chemical nickel bath blanketing according to claim 1, characterized in that: The cooling device (6) comprises a horizontal plate (201), a vertical plate (202), a cold coil (203), a cover plate (204), and a supercooling box (205); one end of the supercooling box (205) is connected to the middle of the air guide pipe (5) via an air outlet pipe, and the other end of the supercooling box (205) is connected to the blower (7) via an air inlet pipe; the upper end of the supercooling box (205) is fixedly connected to the cover plate (204) via bolts. A plurality of longitudinal plates (202) are fixedly connected to the lower end of the cover plate (204), a plurality of transverse plates (201) are fixedly connected to the longitudinal plates (202), the longitudinal plates (202) and the transverse plates (201) are arranged perpendicular to each other, a plurality of air passages are formed between the longitudinal plates (202) and the transverse plates (201), and cold coils (203) are embedded and fixedly connected to the longitudinal plates (202) and the transverse plates (201).

5. The gas-injection device for chemical nickel bath blanketing according to claim 4, characterized in that: The longitudinal plate (202) and the transverse plate (201) are both copper or aluminum plates.

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