LED aluminum substrate with flexible structure
By designing a flexible structure and a multi-layer heat dissipation system on the LED aluminum substrate, the problem of poor compressive resistance of the aluminum substrate is solved, and the effect of efficient heat dissipation and extended service life is achieved.
Patent Information
- Application Number
- CN202421190620.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The existing aluminum substrate structure has low strength, poor compressive resistance, is susceptible to external pressure extrusion deformation, and is insufficient protection.
The LED aluminum substrate with a flexible structure is designed, including a lamp base substrate, a first heat dissipation substrate and a second heat dissipation substrate. Through the flexible buffer structure and a multi-layer heat dissipation groove system, compressive resistance and heat dissipation effect are improved.
It improves the structural strength and compressive resistance of the aluminum substrate, and achieves efficient heat dissipation through multiple heat dissipation channels, extending the service life of LED light-emitting chips.
Smart Images
Figure CN222335219U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED lamp aluminum substrate products, in particular to an LED aluminum substrate with a flexible structure. Background Art
[0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board is composed of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. There are also double-sided boards designed for high-end use, with a structure of circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer.
[0003] The existing aluminum substrate has low structural strength and poor pressure resistance. It is easily damaged by external pressure, extrusion, deformation and has defects. It also has poor self-protection and is easily damaged. Utility Model Content
[0004] The utility model aims to provide an LED aluminum substrate with a flexible structure. By arranging the flexible structure, the structural strength of the aluminum substrate is improved, so that the aluminum substrate itself has good pressure resistance.
[0005] In order to achieve the above object, the basic scheme of the utility model is as follows:
[0006] An LED aluminum substrate with a flexible structure comprises a lamp holder substrate, a first heat dissipation substrate and a second heat dissipation substrate which are connected in sequence, and bolts are detachably connected between the lamp holder substrate, the first heat dissipation substrate and the second heat dissipation substrate;
[0007] The outside of the lamp holder substrate is covered with a flexible buffer structure, which includes a covering layer enclosing the outside of the lamp holder substrate, and a plurality of pressure-resistant protrusions are distributed along the circumference of the covering layer surface. The covering layer includes a rubber outer layer, a protective layer and an anti-corrosion layer arranged in sequence from the outside to the inside. The protective layer is an elastic steel wire mesh structure, and its surface is coated with a galvanized layer.
[0008] Furthermore, a heat dissipation area is formed at the center of the lamp holder substrate, and a plurality of first heat dissipation grooves are provided in the heat dissipation area, a plurality of annular mounting areas are formed along the edge of the lamp holder substrate toward the heat dissipation area, and a plurality of LED light-emitting chips are installed in each annular mounting area, and annular heat dissipation grooves are formed between adjacent annular mounting areas, and a plurality of second heat dissipation grooves are provided in each annular heat dissipation groove; a first heat dissipation space is provided on the first heat dissipation substrate, and the first heat dissipation groove and the second heat dissipation groove are respectively interconnected with the first heat dissipation space, a second heat dissipation space is provided on the second heat dissipation substrate, one side of the second heat dissipation space is interconnected with the first heat dissipation space, and the other side is connected to the outside.
[0009] Furthermore, a plurality of heat sinks are installed on the outer edge of the lamp holder substrate, and the heat sinks are distributed at equal distances on the outer edge of the lamp holder substrate, and the side edges of the heat sinks are arc-shaped.
[0010] Furthermore, the first heat dissipation space includes a plurality of first heat dissipation grooves opened on the first heat dissipation substrate, the first heat dissipation grooves are radially distributed on the surface of the first heat dissipation substrate, and the first heat dissipation grooves are respectively interconnected with the first heat dissipation grooves and the second heat dissipation grooves.
[0011] Furthermore, the second heat dissipation space includes a plurality of second heat dissipation grooves opened on the second heat dissipation substrate, and the second heat dissipation grooves are in an arc shape.
[0012] Furthermore, the lamp holder substrate includes an aluminum substrate and a thermally conductive film layer, and the thermally conductive film layer is coated on the surface of the aluminum substrate.
[0013] Compared with the prior art, the beneficial effects of this solution are:
[0014] 1. The flexible buffer structure is coated on the outside of the lamp holder substrate, and the surface of the coating layer has a number of pressure-resistant convex parts distributed along its circumference, which improves the structural strength of the aluminum substrate and makes the aluminum substrate itself have good pressure resistance.
[0015] 2. The heat generated by a part of the LED light-emitting chip is heat-exchanged with the outside air through the heat sink, thereby achieving heat dissipation; the heat generated by the LED light-emitting chip near the center of the lamp holder substrate is dissipated through the first heat dissipation, the first heat dissipation space and the second heat dissipation space in turn; the heat generated by another part of the LED light-emitting chip is dissipated through the first heat dissipation, the first heat dissipation space and the second heat dissipation space; using multiple heat dissipation paths can achieve an efficient heat dissipation effect.
[0016] 3. An aluminum substrate is selected as the main structure of the lamp holder substrate. The aluminum substrate has good heat dissipation function. Coating a thermal conductive film layer on the outside of the aluminum substrate can further improve the heat dissipation effect, thereby increasing the service life of the LED light-emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 It is a structural schematic diagram of the flexible buffer structure in the utility model;
[0019] Figure 3 It is a structural schematic diagram of the first heat dissipation substrate in the utility model;
[0020] Figure 4 It is a structural schematic diagram of the second heat dissipation substrate in the utility model.
[0021] The figure marks in the drawings of the specification include: lamp holder substrate 1, heat sink 11, first heat dissipation substrate 2, first heat dissipation groove 21, second heat dissipation substrate 3, second heat dissipation groove 31, bolt 4, annular mounting area 5, LED light-emitting chip 51, annular heat dissipation groove 6, second heat dissipation groove 61, heat dissipation area 7, first heat dissipation groove 71. DETAILED DESCRIPTION
[0022] The present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods:
[0023] Example:
[0024] LED aluminum substrate with flexible structure, such as Figure 1 As shown, it includes a lamp holder substrate 1, a first heat dissipation substrate 2 and a second heat dissipation substrate 3 which are connected in sequence, and the lamp holder substrate 1, the first heat dissipation substrate 2 and the second heat dissipation substrate 3 are detachably connected by bolts 4, and the lamp holder substrate 1 includes an aluminum substrate and a thermal conductive film layer, and the thermal conductive film layer is coated on the surface of the aluminum substrate, and the material of the thermal conductive film layer is one of copper, silver, glass silver, and aluminum-plated silver;
[0025] like Figure 2 As shown, the outside of the lamp holder substrate 1 is covered with a flexible buffer structure 12, and the flexible buffer structure 12 includes a covering layer enclosing the outside of the lamp holder substrate, and a plurality of pressure-resistant protrusions are distributed along the circumference of the covering layer surface. The covering layer includes a rubber outer layer, a protective layer and an anti-corrosion layer arranged in sequence from the outside to the inside, and the protective layer is an elastic steel wire mesh structure, and its surface is coated with a galvanized layer.
[0026] like Figure 1 As shown, a plurality of heat sinks 11 are installed on the outer edge of the lamp holder substrate 1, and each heat sink 11 is equidistantly distributed on the outer edge of the lamp holder substrate 1, and the side of the heat sink 11 is arc-shaped. A heat dissipation area 7 is formed at the center of the lamp holder substrate 1, and a plurality of first heat dissipation grooves 71 are opened in the heat dissipation area 7. The inner diameter of the first heat dissipation groove 71 gradually increases along the direction from the lamp holder substrate 1 to the first heat dissipation substrate 2, and the groove body depth of the first heat dissipation groove 71 is 1.8-2.6mm.
[0027] like Figure 1 As shown, the lamp holder substrate 1 is formed with a plurality of annular mounting areas 5 along its edge toward the heat dissipation area 7, and a plurality of LED light-emitting chips 51 are installed in each annular mounting area 5, and annular heat dissipation grooves 6 are formed between adjacent annular mounting areas 5, and a plurality of second heat dissipation grooves 61 are opened in each annular heat dissipation groove 6, and the inner diameter of the second heat dissipation groove 61 gradually increases along the direction of the lamp holder substrate 1 toward the first heat dissipation substrate 2, and the groove body depth of the second heat dissipation groove 61 is 2.6-3.5mm.
[0028] like Figure 3 and 4 As shown, a plurality of first heat dissipation grooves 21 are provided on the first heat dissipation substrate 2, and each of the first heat dissipation grooves 21 is radially distributed on the surface of the first heat dissipation substrate 2. A plurality of first connection channels are connected between each of the first heat dissipation grooves 21, and the first connection channels are provided in the first heat dissipation substrate 2. A first heat dissipation space is formed between each of the first heat dissipation grooves 21 and each of the first connection channels, and the first heat dissipation grooves 71 and the second heat dissipation grooves 61 are respectively connected to the first heat dissipation space. A plurality of second heat dissipation grooves 31 are provided on the second heat dissipation substrate 3, and the second heat dissipation grooves 31 are in an arc shape, and a plurality of second connection channels are connected between each of the second heat dissipation grooves 31, and the second connection channels are provided in the second heat dissipation substrate 3. A second heat dissipation space is formed between each of the second heat dissipation grooves 31 and each of the second connection channels, and the second heat dissipation space is connected to the first heat dissipation space and the outside.
[0029] The specific implementation of this scheme is as follows:
[0030] During installation, the lamp holder substrate 1, the first heat dissipation substrate 2 and the second heat dissipation substrate 3 are connected together by bolts 4; the flexible buffer structure is coated on the outside of the lamp holder substrate 1, and a plurality of pressure-resistant convex portions distributed along the circumference of the coating surface improve the structural strength of the aluminum substrate, so that the aluminum substrate itself has good pressure resistance.
[0031] When in use, the LED light-emitting chip 51 works and generates light and heat. The LED light is dissipated to the surroundings through tiny molecules in the air. The heat generated by the LED light-emitting chip 51 is dissipated through multiple heat dissipation pathways. A portion of the heat is heat-exchanged with the outside air through the heat sink 11 at the outer edge of the lamp holder substrate 1, thereby achieving heat dissipation; the heat generated by the LED light-emitting chip 51 near the center of the lamp holder substrate 1 enters the first heat dissipation space and the second heat dissipation space in turn through the first heat dissipation groove 71, and is finally dissipated outward from the second heat dissipation space, and the heat is dissipated in time; another portion of the heat generated by the LED light-emitting chip 51 is introduced into the second heat dissipation groove 61 through the annular heat dissipation groove 6, and enters the first heat dissipation space and the second heat dissipation space in turn, and is finally dissipated outward from the second heat dissipation space, and the heat is dissipated in time. Using multiple heat dissipation pathways can achieve an efficient heat dissipation effect.
[0032] The above is only an embodiment of the utility model, and the common knowledge such as the known specific structure and characteristics in the scheme is not described in detail here. It should be pointed out that for those skilled in the art, several deformations and improvements can be made without departing from the structure of the utility model, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.
Claims
1. An LED aluminum substrate with a flexible structure, comprising a lamp holder substrate, a first heat dissipation substrate and a second heat dissipation substrate connected in sequence, wherein the lamp holder substrate, the first heat dissipation substrate and the second heat dissipation substrate are detachably connected with bolts; characterized in that: The outside of the lamp holder substrate is covered with a flexible buffer structure, which includes a covering layer enclosing the outside of the lamp holder substrate, and a plurality of pressure-resistant protrusions are distributed along the circumference of the covering layer surface. The covering layer includes a rubber outer layer, a protective layer and an anti-corrosion layer arranged in sequence from the outside to the inside. The protective layer is an elastic steel wire mesh structure, and its surface is coated with a galvanized layer.
2. The LED aluminum substrate with a flexible structure according to claim 1, characterized in that: A heat dissipation area is formed at the center of the lamp holder substrate, and a plurality of first heat dissipation grooves are provided in the heat dissipation area. A plurality of annular mounting areas are formed along the edge of the lamp holder substrate toward the heat dissipation area, and a plurality of LED light-emitting chips are installed in each annular mounting area. Annular heat dissipation grooves are formed between adjacent annular mounting areas, and a plurality of second heat dissipation grooves are provided in each annular heat dissipation groove. A first heat dissipation space is provided on the first heat dissipation substrate, and the first heat dissipation groove and the second heat dissipation groove are respectively interconnected with the first heat dissipation space. A second heat dissipation space is provided on the second heat dissipation substrate, and one side of the second heat dissipation space is interconnected with the first heat dissipation space, and the other side is connected to the outside.
3. The LED aluminum substrate with a flexible structure according to claim 1, characterized in that: A plurality of heat sinks are installed on the outer edge of the lamp holder substrate. The heat sinks are evenly distributed on the outer edge of the lamp holder substrate, and the sides of the heat sinks are arc-shaped.
4. The LED aluminum substrate with a flexible structure according to claim 2, characterized in that: The first heat dissipation space includes a plurality of first heat dissipation grooves opened on the first heat dissipation substrate. The first heat dissipation grooves are radially distributed on the surface of the first heat dissipation substrate, and the first heat dissipation grooves are respectively interconnected with the first heat dissipation grooves and the second heat dissipation grooves.
5. The LED aluminum substrate with a flexible structure according to claim 2, characterized in that: The second heat dissipation space includes a plurality of second heat dissipation grooves opened on the second heat dissipation substrate, and the second heat dissipation grooves are in an arc shape.
6. The LED aluminum substrate with a flexible structure according to claim 1, characterized in that: The lamp holder substrate comprises an aluminum substrate and a heat-conducting film layer, and the heat-conducting film layer is coated on the surface of the aluminum substrate.