Thermoelectric coefficient tester capable of rapidly disassembling and assembling wafer sample

Abstract

The utility model relates to the field of testers, in particular to a thermoelectric coefficient tester capable of quickly disassembling and assembling a wafer sample. The technical problems that according to an existing tester, due to the fact that the thicknesses and the sizes of detected wafers are different, appropriate testers need to be selected when the different wafers are tested, cup joint parts are not convenient to rapidly replace for cup joint of the wafers, the operation time is prolonged, and the testing efficiency is reduced are solved. And meanwhile, the risk of misoperation can be increased due to frequent replacement of the tester or sleeving parts, so that the accuracy of a test result is influenced. According to the technical scheme, the thermoelectric coefficient tester for rapidly disassembling and assembling the wafer sample comprises a detector, an adjusting and fixing assembly, a supporting assembly, an anti-shaking assembly, a display screen and a temperature adjusting button; the screw is rotated through the rotating buckle, the connecting block is combined with the fixing column, the device is rapidly assembled and disassembled, meanwhile, the connecting mode of the screw can provide high fixing force, and it is ensured that the fixing column of the sample is kept stable in the testing process.

Description

Technical Field

[0001] The utility model relates to the field of testers, in particular to a thermoelectric coefficient tester for quickly disassembling and assembling a wafer sample. Background Art

[0002] A wafer is a material sample with a circular shape, usually used for experiments and tests. It can be a solid material, such as metal, ceramic or plastic, or a film or sheet material. The thermoelectric coefficient tester for wafer samples is an instrument specifically used to measure the thermoelectric coefficient of wafer samples. It controls temperature changes and measures the relationship between potential difference and temperature, thereby calculating the thermoelectric coefficient of the wafer sample. Existing testers usually use a stable structure to socket wafers for testing during the test. Due to the different thicknesses and sizes of the test wafers, it is necessary to select a suitable tester when testing different wafers, and it is not convenient to quickly replace the socket parts to socket the wafers, which increases the operation time and reduces the test efficiency. At the same time, frequent replacement of testers or socket parts may increase the risk of operating errors, thereby affecting the accuracy of the test results. Therefore, we proposed a thermoelectric coefficient tester for quickly disassembling and assembling wafer samples to solve the above-mentioned problems. Utility Model Content

[0003] In order to overcome the problem of existing testers, due to the different thicknesses and sizes of the test wafers, it is necessary to select a suitable tester when testing different wafers, and it is not convenient to quickly replace the socket parts to socket the wafers, which increases the operation time and reduces the test efficiency. At the same time, frequent replacement of testers or socket parts may increase the risk of operating errors, thereby affecting the accuracy of the test results.

[0004] The technical solution of the utility model is: a thermoelectric coefficient tester for quickly disassembling and assembling disc samples, comprising a detector, an adjusting and fixing component, a supporting component, an anti-sway component, a display screen and a temperature adjustment button; an adjusting and fixing component for adjusting and fixing different discs for testing is installed above the detector, a supporting component for supporting and fixing the disc sample so that it remains stable during the test is installed between the adjusting and fixing component and the detector, an anti-sway component for reducing the movement of the equipment due to machine vibration during the test is installed at the lower end corner of the detector, a display screen for displaying the tester's operating interface and test results is installed on the outer wall of the detector, and a temperature adjustment button for adjusting the temperature during the test is installed on the outer side of the display screen.

[0005] Preferably, the fixing column is connected to the connecting block by rotating the screw by rotating the buckle, so that the device can be assembled and disassembled quickly. At the same time, the connection method of the screw can provide a strong fixing force to ensure that the fixing column of the sample remains stable during the test and prevent the sample from loosening or shifting due to vibration or external force during the test. Two sets of pressure plates are used to fit the wafer and fix it, which can provide uniform pressure to ensure that the wafer sample is subjected to uniform contact pressure on the entire surface, so that the temperature distribution of the sample is uniform. The pressure plate is driven to rise and fall to adjust to adapt to wafers of different thicknesses using an adjusting rod, and the compaction is adjusted according to different detection conditions. It has a wider range of applications. The fixing column is clamped to the upper end of the wafer table by using a limit block to sleeve the wafer, ensuring that the fixing column can be accurately clamped to the upper end of the wafer table, making the installation and disassembly of the fixing column relatively easy. At the same time, the fixing column is replaced to sleeve to adapt to wafer samples of different sizes to meet different testing requirements. The limit buckle connects and fixes the support plate to the detector, which is convenient for replacing the old wafer table with a new one, reducing the cost and maintenance difficulty of the testing instrument.

[0006] Preferably, the adjustment and fixing assembly includes a fixed column, a connecting block, a screw, a rotating buckle, a pressure plate, a connecting rod, an adjusting rod and a clamping plate. A connecting block is provided above the fixed column, a screw is provided inside the connecting block, a rotating buckle is provided at one end of the screw, and a threaded groove for accommodating the screw is provided at the upper end of the fixed column. The fixed column is movably connected to the connecting block through the screw. The screw is connected to the connecting block by rotating the rotating buckle to connect the fixed column, so that the device can be quickly assembled and disassembled. At the same time, the connection method of the screw can provide a strong fixing force to ensure that the fixed column of the sample remains stable during the test, prevent the sample from loosening or shifting due to vibration or external force during the test, and ensure the accuracy of the test results.

[0007] Preferably, a connecting rod is provided at the lower end of the connecting block. There are two groups of connecting rods, which are symmetrically arranged along the lower end of the connecting block. A pressure plate is provided at the outer end of the connecting rod. By using two groups of pressure plates to fit the disc and fix it, uniform pressure can be provided to ensure that the disc sample is subjected to uniform contact pressure on the entire surface, so that the temperature distribution of the sample is uniform, thereby improving the accuracy and reliability of the test results.

[0008] Preferably, an adjusting rod is provided at the upper end of the connecting rod, the adjusting rod passes through the connecting rod and is fixedly connected to the pressure plate, a clamping plate is provided between the adjusting rod and the pressure plate, and a nut is provided at the end of the adjusting rod away from the pressure plate. The pressure plate is driven to rise and fall by the adjusting rod to adapt to round pieces of different thicknesses, and the compaction is adjusted according to different detection conditions, which has a wider range of applications.

[0009] Preferably, the supporting assembly includes a supporting plate, a limit buckle, a wafer table and a limit block. The wafer table is located at the upper end center of the supporting plate. A limit block is provided at the upper end of the wafer table. There are two groups of limit blocks. A limit hole for accommodating the limit block is opened at the lower end of the fixed column. The fixed column is fixedly connected to the wafer table through the limit block. The fixed column is clamped to the upper end of the wafer table by using the limit block to sleeve the wafer, ensuring that the fixed column can be accurately clamped to the upper end of the wafer table, making the installation and disassembly of the fixed column relatively easy. At the same time, the fixed column can be replaced for sleeve connection to adapt to wafer samples of different sizes to meet different testing requirements.

[0010] Preferably, a limit buckle is provided at the upper corner of the support plate, and the support plate is fixedly connected to the detector through the limit buckle. By using the limit buckle to connect and fix the support plate to the detector, it is convenient to replace the old wafer stage with a new one, thereby reducing the cost and maintenance difficulty of the test instrument and improving the accuracy of the test results.

[0011] Preferably, the anti-sway component includes a supporting plate, connecting columns and anti-slip particles. A connecting column is provided between the supporting plate and the detector. Anti-slip particles are laid on the lower end of the supporting plate. Anti-slip particles are laid on the bottom of the supporting plate to prevent slipping. The anti-slip particles can increase the friction between the supporting plate and the ground, prevent the sample from sliding or moving during the test, and improve the stability of equipment detection.

[0012] Beneficial effects of the utility model:

[0013] 1. Compared with the traditional tester, the device can be quickly assembled and disassembled by rotating the screw and connecting the connecting block to the fixed column. At the same time, the screw connection method can provide a strong fixing force to ensure that the fixed column of the sample remains stable during the test and prevent the sample from loosening or shifting due to vibration or external force during the test. Two sets of pressure plates are used to fit the disc and fix it, which can provide uniform pressure and ensure that the disc sample is subjected to uniform contact pressure on the entire surface, so that the temperature distribution of the sample is uniform, and the reliability of the test results is improved. The adjustment rod is used to drive the pressure plate to rise and fall to adapt to discs of different thicknesses, and the compaction is adjusted according to different test conditions. It has a wider range of applications.

[0014] 2. By using the limit block to clamp the fixed column to the upper end of the wafer table and to mount the wafer, it is ensured that the fixed column can be accurately clamped to the upper end of the wafer table, making the installation and disassembly of the fixed column relatively easy. At the same time, the fixed column can be replaced to adapt to wafer samples of different sizes to meet different test requirements. The limit buckle connects and fixes the support plate to the detector, which is convenient for replacing the old wafer table with a new one, reducing the cost and maintenance difficulty of the test instrument and improving the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the adjustment and fixing assembly of the utility model;

[0017] Figure 3 This is a schematic diagram of the screw structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the anti-sway component structure of the utility model;

[0019] Figure 5 It is a schematic diagram of the layered structure of the fixed column of the utility model.

[0020] Explanation of the accompanying drawings: 1. Detector; 2. Adjustment and fixing assembly; 201. Fixing column; 202. Connecting block; 203. Screw; 204. Rotating buckle; 205. Pressing plate; 206. Connecting rod; 207. Adjusting rod; 208. Card; 3. Support assembly; 301. Support plate; 302. Limiting buckle; 303. Wafer table; 304. Limiting block; 4. Anti-sway assembly; 401. Loading plate; 402. Connecting column; 403. Anti-skid particles; 5. Display screen; 6. Temperature adjustment button. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1-5 The utility model provides an embodiment: a thermoelectric coefficient tester for quickly disassembling and assembling a wafer sample, comprising a tester 1, an adjusting and fixing component 2, a supporting component 3, an anti-sway component 4, a display screen 5 and a temperature adjustment button 6; an adjusting and fixing component 2 for adjusting and fixing different wafers for testing is installed above the tester 1, a supporting component 3 for supporting and fixing the wafer sample to keep it stable during the test is installed between the adjusting and fixing component 2 and the tester 1, an anti-sway component 4 for reducing the movement of the equipment caused by the vibration of the machine during the test is installed at the lower end corner of the tester 1, a display screen 5 for displaying the operation interface of the tester and the test results is installed on the outer wall of the tester 1, and a temperature adjustment button 6 for adjusting the temperature during the test is installed on the outer side of the display screen 5.

[0023] See also Figure 1-2In this embodiment, the adjustment and fixing assembly 2 includes a fixing column 201, a connecting block 202, a screw 203, a rotating buckle 204, a pressing plate 205, a connecting rod 206, an adjusting rod 207 and a clamping plate 208. A connecting block 202 is provided above the fixing column 201, a screw 203 is provided inside the connecting block 202, a rotating buckle 204 is provided at one end of the screw 203, a thread groove for accommodating the screw 203 is provided at the upper end of the fixing column 201, and the fixing column 201 is movably connected to the connecting block 202 through the screw 203. By rotating the screw 203 with the connecting block 202 and connecting the fixing column 201 using the rotating buckle 204, the device can be quickly assembled and disassembled. The connection method of the screw rod 203 can provide a strong fixing force, ensuring that the fixing column 201 of the sample remains stable during the test, preventing the sample from loosening or shifting due to vibration or external force during the test, and ensuring the accuracy of the test results. A connecting rod 206 is provided at the lower end of the connecting block 202. The connecting rod 206 is provided with two groups. The two groups of connecting rods 206 are symmetrically arranged along the lower end of the connecting block 202. A pressing plate 205 is provided at the outer end of the connecting rod 206. By using two groups of pressing plates 205 to fit the wafer and fix it, uniform pressure can be provided to ensure that the wafer sample is subjected to uniform contact pressure on the entire surface, so that the temperature distribution of the sample is uniform, thereby improving the accuracy and reliability of the test results.

[0024] See also Figure 1-3 In this embodiment, an adjusting rod 207 is provided at the upper end of the connecting rod 206, and the adjusting rod 207 passes through the connecting rod 206 and is fixedly connected to the pressing plate 205. A clamping plate 208 is provided between the adjusting rod 207 and the pressing plate 205, and a nut is provided at the end of the adjusting rod 207 away from the pressing plate 205. The adjusting rod 207 is used to drive the pressing plate 205 to rise and fall to adapt to wafers of different thicknesses, and the compaction is adjusted according to different detection conditions. It has a wider range of applications. The supporting assembly 3 includes a supporting plate 301, a limiting buckle 302, a wafer table 303 and a limiting block 304. The wafer table 303 is located on the supporting plate 30 1, a limit block 304 is provided at the upper end of the wafer stage 303, and two groups of limit blocks 304 are provided. A limit hole for accommodating the limit block 304 is opened at the lower end of the fixed column 201. The fixed column 201 is fixedly connected to the wafer stage 303 through the limit block 304. The fixed column 201 is clamped to the upper end of the wafer stage 303 by using the limit block 304 to sleeve the wafer, ensuring that the fixed column 201 can be accurately clamped to the upper end of the wafer stage 303, making the installation and disassembly of the fixed column 201 relatively easy. At the same time, the fixed column 201 can be replaced to fit the wafer samples of different sizes to meet different test requirements.

[0025] See also Figure 3-5In this embodiment, a limit buckle 302 is provided at the upper corner of the support plate 301, and the support plate 301 is fixedly connected to the detector 1 through the limit buckle 302. By using the limit buckle 302 to connect and fix the support plate 301 to the detector 1, it is convenient to replace the old wafer stage 303 with a new wafer stage 303, thereby reducing the cost and maintenance difficulty of the test instrument and improving the accuracy of the test results. The anti-sway component 4 includes a bearing plate 401, a connecting column 402 and anti-skid particles 403. A connecting column 402 is provided between the bearing plate 401 and the detector 1, and anti-skid particles 403 are laid at the lower end of the bearing plate 401. Anti-skid particles 403 are laid at the bottom of the bearing plate 401 to prevent slipping. The anti-skid particles 403 can increase the friction between the bearing plate 401 and the ground, prevent the sample from sliding or moving during the test, and improve the stability of equipment detection.

[0026] When working, first, according to the wafer to be tested, use a tool to insert the limit buckle 302 into the inside and rotate it clockwise, remove the support plate 301 and connect the wafer table 303 for replacement, and use the limit buckle 302 to fix the support plate 301 to the upper end of the detector 1 after replacing the suitable wafer table 303. Secondly, the fixing column 201 is preferentially plugged into the upper end of the wafer table 303, and the limit block 304 is used to snap into the fixing column 201 inside the limit hole to prevent it from falling off, ensuring that the fixing column 201 can be accurately snapped into the upper end of the wafer table 303, making the installation and removal of the fixing column 201 relatively easy, and replacing the fixing column 201 at the same time. 01 is sleeved to adapt to disc specimens of different sizes to meet different test requirements. After the fixed column 201 is fixed, the disc is passed through the fixed column 201 to fit with the disc stage 303. The rotating buckle 204 is manually grasped and aligned with the threaded hole on the upper end of the fixed column 201 and rotated clockwise to thread the fixed column 201 and the connecting block 202. The equipment can be quickly assembled and disassembled. At the same time, the connection method of the screw 203 can provide a strong fixing force to ensure that the fixed column 201 of the specimen remains stable during the test, prevent the specimen from loosening or shifting due to vibration or external force during the test, and realize the preliminary installation of the test parts.

[0027] After the connection block 202 is fixed, a tool is used to insert the nut on the top of the adjustment rod 207 and rotate the adjustment rod 207, so that the adjustment rod 207 pushes the pressure plate 205 downward along the inside of the connection rod 206 until the two sets of pressure plates 205 fit the wafer, providing uniform pressure, ensuring that the wafer sample is subjected to uniform contact pressure on the entire surface, ensuring good contact with the electrodes of the detector 1, making the temperature distribution of the sample uniform, and allowing the current and heat to be effectively transmitted and distributed in the sample. At the same time, the adjustment rod 207 drives the pressure plate 205 to rise and fall to adjust to adapt to wafers of different thicknesses, and adjusts and compacts according to different detection conditions. After the wafer is compacted and fixed, the stable adjustment button is turned, and the detector 1 will apply a constant temperature gradient to the wafer sample. This is usually achieved by heating on both sides of the wafer. Due to the thermoelectric effect, the wafer sample will generate an electric potential difference under the action of the temperature gradient. The detector 1 collects and combines the known temperature gradient value, and obtains the thermoelectric coefficient of the sample through a certain calculation formula, which is transmitted by the detector 1 to the display screen 5 for display and broadcast to obtain the measured value.

[0028] Through the above steps, the screw 203 is rotated by rotating the buckle 204 to connect the fixing column 201 with the connecting block 202, and the device can be quickly assembled and disassembled. At the same time, the connection method of the screw 203 can provide a strong fixing force to ensure that the fixing column 201 of the sample remains stable during the test, and prevents the sample from loosening or shifting due to vibration or external force during the test. The two sets of pressing plates 205 are used to fit the disc and fix it, which can provide uniform pressure to ensure that the disc sample is subjected to uniform contact pressure on the entire surface, so that the temperature distribution of the sample is uniform. The adjusting rod 207 is used to drive the pressing plate 205 to rise and fall to adjust to adapt to different thicknesses. The wafer can be adjusted and compacted according to different detection conditions and has a wider range of applications. The fixed column 201 is clamped to the upper end of the wafer table 303 by using the limit block 304 to mount the wafer, ensuring that the fixed column 201 can be accurately clamped to the upper end of the wafer table 303, making the installation and disassembly of the fixed column 201 relatively easy. At the same time, the fixed column 201 can be replaced to adapt to wafer samples of different sizes to meet different testing requirements. The limit buckle 302 connects and fixes the support plate 301 to the detector 1, which is convenient for replacing the old wafer table 303 with a new wafer table 303, reducing the cost and maintenance difficulty of the detector 1.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A thermoelectric coefficient tester for quickly disassembling and assembling a wafer sample, comprising a detector (1); characterized in that: The device also comprises an adjusting and fixing component (2), a supporting component (3), an anti-sway component (4), a display screen (5) and a temperature adjustment button (6); an adjusting and fixing component (2) for adjusting and fixing different discs for testing is installed above the detector (1); a supporting component (3) for supporting and fixing the disc sample so that it remains stable during the test is installed between the adjusting and fixing component (2) and the detector (1); an anti-sway component (4) for reducing the movement of the device due to machine vibration during the test is installed at the lower corner of the detector (1); a display screen (5) for displaying an operation interface and test results is installed on the outer wall of the detector (1); and a temperature adjustment button (6) for adjusting the temperature during the test is installed on the outer side of the display screen (5).

2. The thermoelectric coefficient tester for quick disassembly and assembly of wafer samples according to claim 1, characterized in that: The adjusting and fixing assembly (2) comprises a fixing column (201), a connecting block (202), a screw rod (203), a rotating buckle (204), a pressing plate (205), a connecting rod (206), an adjusting rod (207) and a clamping plate (208); a connecting block (202) is arranged above the fixing column (201); a screw rod (203) is arranged inside the connecting block (202); a rotating buckle (204) is arranged at one end of the screw rod (203); a threaded groove for accommodating the screw rod (203) is provided at the upper end of the fixing column (201); and the fixing column (201) is movably connected to the connecting block (202) via the screw rod (203).

3. The thermoelectric coefficient tester for quick disassembly and assembly of wafer samples according to claim 2, characterized in that: A connecting rod (206) is provided at the lower end of the connecting block (202). The connecting rod (206) is provided in two groups. The two groups of connecting rods (206) are symmetrically arranged along the lower end of the connecting block (202). A pressing plate (205) is provided at the outer end of the connecting rod (206).

4. The thermoelectric coefficient tester for quick disassembly and assembly of wafer samples according to claim 3, characterized in that: An adjusting rod (207) is provided at the upper end of the connecting rod (206), the adjusting rod (207) passes through the connecting rod (206) and is fixedly connected to the pressing plate (205), a clamping plate (208) is provided between the adjusting rod (207) and the pressing plate (205), and a nut is provided at one end of the adjusting rod (207) away from the pressing plate (205).

5. The thermoelectric coefficient tester for quick disassembly and assembly of wafer samples according to claim 2, characterized in that: The support assembly (3) comprises a support plate (301), a limiting buckle (302), a wafer platform (303) and a limiting block (304); the wafer platform (303) is located at the center of the upper end of the support plate (301); a limiting block (304) is provided at the upper end of the wafer platform (303); the limiting block (304) is provided in two groups; a limiting hole for accommodating the limiting block (304) is provided at the lower end of the fixed column (201); the fixed column (201) is fixedly connected to the wafer platform (303) via the limiting block (304).

6. The thermoelectric coefficient tester for quick disassembly and assembly of wafer samples according to claim 5, characterized in that: A limiting buckle (302) is provided at the upper corner of the support plate (301), and the support plate (301) is fixedly connected to the detector (1) via the limiting buckle (302).

7. The thermoelectric coefficient tester for quick disassembly and assembly of wafer samples according to claim 1, characterized in that: The anti-sway component (4) comprises a bearing plate (401), a connecting column (402) and anti-skid particles (403); a connecting column (402) is provided between the bearing plate (401) and the detector (1); and the lower end of the bearing plate (401) is paved with anti-skid particles (403).

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