Display device and electronic apparatus

By adopting a protective layer structure of a hardened layer, a transition layer and a reverse-reverse layer in an OLED display device, the problem of mismatch in film layers during bending is solved, and the bending resistance and display effect are improved.

CN222337820UActive Publication Date: 2025-01-10HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202323385364.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-12
Publication Date
2025-01-10
Estimated Expiration
2033-12-12

AI Technical Summary

Technical Problem

When existing OLED display devices are bent or folded, the anti-reflection protective layer is prone to mismatch or misalignment of the film layer, resulting in failure of the display effect and affecting the bending resistance of the display device.

Method used

Adopt a protective layer structure including a hardened layer, a transition layer and a reverse-reverse layer. By setting a transition layer between the hardened layer and a reverse-reverse layer, the adhesion is improved, ensuring the structural stability is maintained during bending or folding, and reducing the reverse-reverse layer. Layers fall off and misalign.

Benefits of technology

It effectively improves the bending resistance of the display device, avoids the failure of the anti-reverse layer, and improves the display effect and service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of terminal equipment, in particular to a display device and electronic equipment, the display device comprises a bending area and a straight area arranged on at least one side of the bending area, and the display device comprises a display module; the protective layer is located on the surface of one side of the display module, and the protective layer is at least arranged in the bending area; the protective layer comprises a hardened layer, a transition layer and an anti-reflection layer which are arranged in a stacked mode, the hardened layer is arranged between the anti-reflection layer and the display module, the transition layer is arranged between the hardened layer and the anti-reflection layer, the transition layer is connected with the hardened layer, the transition layer is connected with the anti-reflection layer, and the adhesive force grade between the transition layer and the hardened layer is superior to or equal to 4B; and the adhesive force level between the transition layer and the anti-reflection layer is superior to or equal to 4B. According to the display device, the protection layer can keep good structural stability in the bending process, and the bending resistance of the display device is improved.
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Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to a display device and an electronic device. Background Art

[0002] With the rapid development of display technology, OLED (Organic Light Emitting Device) display products have attracted widespread attention due to their self-luminescence, low power consumption, fast response, etc. However, the light-emitting side electrodes in OLED are usually made of metal materials, which have high reflectivity, seriously reducing the display effect of OLED display products.

[0003] It is usually necessary to set an anti-reflection protective layer in OLED display products to improve product performance. The anti-reflection protective layer is usually a structure in which multiple film layers are stacked. With the development trend of foldable display devices, flexible display modules are used more and more widely. The anti-reflection protective layer needs to match the flexible display module for bending or folding. The anti-reflection protective layer in the related technology is prone to film mismatch and dislocation when bent or folded, which leads to the failure of the anti-reflection effect of the display device, further affecting the display effect of the display device. Utility Model Content

[0004] In view of this, the present application proposes a display device and an electronic device, which can improve the bending resistance of the display device and avoid the problem of failure of the display device.

[0005] In a first aspect, the present application provides a display device, comprising a bent area and a straight area arranged on at least one side of the bent area, the display device comprising:

[0006] Display module;

[0007] A protective layer, the protective layer is located on a side surface of the display module, and the protective layer is at least arranged in the bending area;

[0008] The protective layer includes a stacked hardening layer, a transition layer and an anti-reflection layer, the transition layer is arranged between the hardening layer and the anti-reflection layer, the hardening layer is arranged between the transition layer and the display module, the transition layer is connected to the hardening layer, the transition layer is connected to the anti-reflection layer, the adhesion grade between the transition layer and the hardening layer is better than or equal to 4B, and the adhesion grade between the transition layer and the anti-reflection layer is better than or equal to 4B.

[0009] A transition layer is provided between the anti-reflection layer and the hardened layer in the embodiment of the present application. The transition layer serves as an intermediate connection layer between the hardened layer and the anti-reflection layer. The transition layer is connected to the hardened layer, and the transition layer is connected to the anti-reflection layer. The adhesion level between the transition layer and the hardened layer is better than or equal to 4B, and the adhesion level between the transition layer and the anti-reflection layer is better than or equal to 4B. In the display device provided in the embodiment of the present application, the adhesion between the hardened layer and the transition layer, and between the transition layer and the anti-reflection layer is good, which can effectively improve the bonding performance between the hardened layer and the anti-reflection layer, so that the display device maintains good structural stability during bending or folding, reduces the situation where the anti-reflection layer falls off or is misplaced during bending or folding of the display device, and improves the bending resistance of the display device.

[0010] In a possible implementation, the transition layer is selected from a polysilazane layer or a siloxane layer.

[0011] Polysilazane is a type of polymer with Si-N bonds as repeating units in the main chain. It contains a large number of active silicon-nitrogen bonds and silicon-hydrogen bonds, which can provide a large number of active silicon atoms for the transition layer, which is beneficial to improving the tightness of the connection between the transition layer and the hardening layer, the transition layer and the anti-reflection layer, and improving the bending resistance of the display device. Siloxane refers to a compound containing Si-O-Si bonds, which can provide a large number of active silicon atoms for the transition layer, which is beneficial to improving the tightness of the connection between the transition layer and the hardening layer, the transition layer and the anti-reflection layer, and improving the bending resistance of the display device.

[0012] In a possible implementation, the anti-reflection layer is selected from any one of a niobium oxide layer, a zirconium oxide layer, an aluminum oxide layer, a zinc oxide layer and a silicon oxide layer.

[0013] The above-mentioned oxide layer not only has a good anti-reflection effect, but also contains a large number of active oxygen atoms, which can combine with the silicon atoms in the transition layer to enhance the adhesion between the transition layer and the anti-reflection layer, and enhance the bonding performance between the hardening layer and the anti-reflection layer, thereby enhancing the bending resistance of the display device.

[0014] In a possible implementation, the hardening layer is selected from any one of a polyacrylic resin layer, a polyurethane resin layer and a polysiloxane resin layer.

[0015] The above-mentioned hardened layer can not only give the display device excellent strength and hardness, but also provide a large number of active oxygen atoms, which can combine with the silicon atoms in the transition layer to enhance the adhesion between the hardened layer and the transition layer, and enhance the bonding performance between the hardened layer and the anti-reflection layer, thereby enhancing the bending resistance of the display device.

[0016] In a possible implementation manner, a first diffusion layer is provided between the hardening layer and the transition layer.

[0017] The hardened layer is connected to the transition layer, and a first diffusion layer is formed between the hardened layer and the transition layer, thereby improving the bonding performance between the hardened layer and the transition layer.

[0018] In a possible implementation manner, a second diffusion layer is provided between the transition layer and the anti-reflection layer.

[0019] The anti-reflection layer is connected to the transition layer, and a second diffusion layer is formed between the anti-reflection layer and the transition layer, thereby improving the bonding performance of the anti-reflection layer and the transition layer.

[0020] In a possible implementation manner, the thickness of the hardened layer is 3 μm to 5 μm.

[0021] The thickness of the hardened layer may be 3 μm, 3.5 μm, 4 μm, 4.5 μm or 5 μm, etc., which is not limited here. The hardened layer within the above thickness range can improve the hardness of the display device.

[0022] In a possible implementation manner, the thickness of the transition layer is 0.1 μm to 1 μm.

[0023] The thickness of the transition layer can be 0.1 μm, 0.3 μm, 0.5 μm, 0.7 μm, 0.9 μm or 1 μm, etc., which is not limited here. Compared with the hardening layer, the thickness of the transition layer of the present application is thinner, which can improve the bonding performance of the hardening layer and the anti-reflection layer without affecting the anti-reflection effect of the anti-reflection layer.

[0024] In a possible implementation manner, the anti-reflection layer has a thickness of 0.1 μm to 0.35 μm.

[0025] The thickness of the anti-reflection layer can be 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm or 0.35 μm, etc., which is not limited here. The thickness of the anti-reflection layer of the present application is relatively thin, which can meet the requirements of thinness and lightness of the display device while achieving the anti-reflection effect.

[0026] In a possible implementation, the hardened layer contains reinforcing particles, and the reinforcing particles are any one of silicon dioxide, aluminum oxide, polystyrene and polymethyl acrylate, and / or the average particle size of the reinforcing particles is 50 nm to 200 nm.

[0027] The average particle size of the reinforcing particles may be 50 nm, 80 nm, 100 nm, 120 nm, 150 nm, 180 nm or 200 nm, etc., which is not limited here. The present application increases the hardness of the hardening layer by adding nanometer-sized reinforcing particles to the hardening layer, thereby increasing the hardness of the display device.

[0028] In a possible implementation manner, the anti-reflection layer is a single-layer structure.

[0029] The anti-reflection layer with a single-layer structure has a simple structure and a small thickness, and can achieve an excellent anti-reflection effect, while being conducive to making the display device lighter and thinner.

[0030] In a possible embodiment, the anti-reflection layer includes at least one group of a first sub-anti-reflection layer and a second sub-anti-reflection layer stacked together, the first sub-anti-reflection layer is located between the hardening layer and the second sub-anti-reflection layer, and the refractive index of the first sub-anti-reflection layer is different from the refractive index of the second sub-anti-reflection layer.

[0031] The present application adopts a multi-layer anti-reflection layer, and the refractive index of two adjacent anti-reflection layers is different, so that the light of the external environment reflected by the multi-layer anti-reflection layer undergoes destructive interference, thereby improving the anti-reflection effect of the anti-reflection layer.

[0032] In a possible implementation, the protection layer further includes a base layer, and the base layer is disposed between the display module and the hardening layer.

[0033] By arranging a base layer on the surface of the hardening layer on the side away from the anti-reflection layer, support and buffer can be provided for the hardening layer and the anti-reflection layer.

[0034] In a possible implementation manner, the protection layer further includes an anti-fingerprint layer, and the anti-fingerprint layer is disposed on a surface of the anti-reflection layer on a side away from the hardening layer.

[0035] Providing an anti-fingerprint layer in the protective layer is beneficial to improving the fingerprint resistance and anti-fouling ability of the display device.

[0036] In a possible implementation, the display device further includes an adhesive layer, and the adhesive layer is located between the display module and the hardening layer.

[0037] By providing an adhesive layer in the display device, the adhesive performance between the protective layer and the display module can be improved, thereby improving the structural stability of the display device.

[0038] In a second aspect, the present application provides an electronic device, comprising a housing and a display device disposed in the housing, wherein the display device comprises the display device described in the first aspect.

[0039] In the electronic device provided in the present application, the display device can maintain good anti-bending performance during bending or folding, avoiding the problem of film layer shedding during the bending process of the display device resulting in failure of the anti-reflection layer, thereby improving the display performance of the electronic device and increasing the service life of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1A schematic diagram of the structure of a mobile phone provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of a structure of a display device provided in an embodiment of the present application in a folded state;

[0042] Figure 3 Another structural schematic diagram of a display device provided in an embodiment of the present application in a folded state;

[0043] Figure 4 A schematic diagram of a structure of a display device provided in an embodiment of the present application in a flattened state;

[0044] Figure 5 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0045] Figure 6 A schematic diagram of the structure of the protective layer provided in the embodiment of the present application;

[0046] Figure 7 A schematic diagram of the structure of a protective layer including a first buffer layer and a second buffer layer provided in an embodiment of the present application;

[0047] Figure 8 A schematic diagram of the structure of a multi-layer anti-reflection layer provided in an embodiment of the present application;

[0048] Fig. 9 A schematic diagram of the structure of the adhesive layer and the protective layer provided in an embodiment of the present application.

[0049] Figure ID:

[0050] 1000-Electronic equipment;

[0051] 1001-bending area;

[0052] 100-display device; 200-housing; 201-first housing; 202-second housing;

[0053] 10- protective layer;

[0054] 1-hardened layer;

[0055] 2- Transition layer;

[0056] 3-anti-reflection layer;

[0057] 311-first anti-reflection sub-layer;

[0058] 322-second anti-reflection sub-layer;

[0059] 4- first buffer layer;

[0060] 5- second buffer layer;

[0061] 6-basal layer;

[0062] 7- Anti-fingerprint layer;

[0063] 8-adhesive layer;

[0064] 20-display module;

[0065] 21-display panel;

[0066] 211-array substrate;

[0067] 212-light emitting layer;

[0068] 213-encapsulation layer;

[0069] 22-Cover plate. DETAILED DESCRIPTION

[0070] In the description of the embodiments of the present utility model, it should be understood that the terms "length", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present utility model. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0071] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0072] Some embodiments of the present invention are further described in detail below in conjunction with the drawings of this specification.

[0073] In the related art, it is usually necessary to set an anti-reflection protective layer in the display device to reduce the reflection of light and improve the display contrast of the display device. As the display device develops towards flexible and foldable devices, it is difficult for existing display devices to meet the above requirements. An anti-reflection layer and a hardening layer are set on one side of the display module in the display device. When the display module is a flexible display module, the hardening layer and the anti-reflection layer are prone to delamination during the bending or folding of the flexible display module, resulting in the anti-reflection layer falling off or cracks in the display module, causing the anti-reflection layer to fail, and then causing the display failure of the flexible display device.

[0074] Therefore, in order to enable the display device to meet the requirements of anti-reflection performance, hardness and bending resistance, the present application provides an electronic device. It should be noted that the electronic device of the present application includes but is not limited to mobile phones, tablet computers, laptops, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks and other mobile or fixed terminals with bending functions.

[0075] In the embodiment of the present application, a mobile phone is taken as the above-mentioned electronic device for illustration, and the mobile phone provided in the embodiment of the present application is a foldable mobile phone.

[0076] like Figure 1 As shown, it is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application, the electronic device 1000 includes a shell 200 and a display device 100, the display device 100 and the shell 200 are connected, the display device 100 is used for human-computer interaction, images or videos, etc., the display device 100 and the shell 200 can be synchronously folded inward and / or outward along a folding line L, the area where the folding line L is located is a bending area 1001, and the area on the electronic device 1000 except the bending area 1001 is a straight area.

[0077] Specifically, the shell 200 includes a first shell 201 and a second shell 202, and the first shell 201 and the second shell 202 are arranged on both sides of the bending area 1001. The first shell 201 can rotate around the folding direction T along the folding line L, or the second shell 202 can rotate around the folding direction T along the folding line L in the opposite direction of the folding direction T, so that the display device 100 and the shell 200 are folded synchronously.

[0078] like Figure 2 FIG. 1 is a schematic diagram of a structure of a display device 100 folded inwardly. The display device 100 includes a display module 20 and a protective layer 10. The protective layer 10 is disposed on a surface of one side of the display module 20. Figure 2 The middle protective layer 10 is disposed inside the display module 20. Figure 1 The first shell 201 can also be along Figure 1The folding line L shown in FIG. 1 rotates in the opposite direction of the folding direction T, or the second housing 202 can rotate along the folding line L around the folding direction T, so that the display device 100 and the housing 200 can be folded outward synchronously. At this time, the state of the display device 100 is as shown in FIG. Figure 3 As shown, that is, Figure 3 FIG. 1 is a schematic diagram of a structure in which the display device 100 is folded outward. Figure 3 In the illustrated embodiment, the display module 20 is disposed inside the protection layer 10 .

[0079] It should be noted that the folding line L and the bending area 1001 are not physical components on the display device 100. The folding line L is a virtual line when the display device 100 is folded, and the bending area 1001 is a physical area where the display device 100 is bent when it is folded.

[0080] Please refer to Figure 4 , is a schematic structural diagram of a display device 100 provided in an embodiment of the present application in a flattened state. The display device 100 includes a stacked display module 20 and a protective layer 10 , and the protective layer 10 is disposed on one side surface of the display module 20 .

[0081] like Figure 5 As shown, Figure 5The cross-sectional structure diagram of the display module 20 provided in the embodiment of the present application, in some embodiments, the display module 20 includes a display panel 21, optionally, the display panel 21 is an OLED (Organic Light-Emitting Diode), and the OLED display panel 21 includes an array substrate 211, a light-emitting layer 212 and an encapsulation layer 213 stacked in sequence. Among them, the light-emitting layer 212 has a pixel unit, and the pixel unit includes at least two sub-pixels of two colors. Exemplarily, in this embodiment, three sub-pixels of three colors are included: PX1, PX2 and PX3, so that the OLED display panel 21 presents different colors. The array substrate 211 is mainly used to control the pixel unit in the light-emitting layer 212. The array substrate 211 includes a plurality of pixel circuits arranged in an array, and the pixel circuit includes a thin film transistor (TFT) and a pixel unit connected to the pixel circuit. In the preparation process of the array substrate 211, the same film layer adopts the same process, and the active layer between different pixel circuits is an integrated graphic structure. The active layer itself is not conductive. The conductive area of ​​the active layer is achieved by doping the active layer. The conductive active layer can be electrically connected to the wiring layer to replace part of the wiring. In the specific implementation, optionally, the active layer of each transistor includes a polysilicon active layer or a metal oxide active layer. The polysilicon active layer can be formed by low-temperature polycrystalline silicon (Low Temperature Poly-Silicon, LTPS) technology, which has the advantages of simple structure, good stability, high electron mobility, and small circuit area. Optionally, the active layer can be made of low-temperature polycrystalline oxide (Low Temperature Polycrystalline Oxide, LPTO). The encapsulation layer 213 is mainly used to encapsulate the light-emitting layer 212, and isolate the invasion of water and oxygen, reducing the influence of water and oxygen in the external environment on the display panel 21. In some embodiments, the display module 20 also includes a cover plate 22, which is arranged on one side of the display panel 21, and the cover plate 22 is located between the display panel 21 and the protective layer 10.

[0082] Optionally, the display panel 21 can also be an LCD panel (Liquid Crystal Display). Of course, the display panel can also be other display panels, such as Micro-LED (self-luminous micron-scale LEDs as light-emitting pixel units), Mini Led (LED devices with chip sizes between 50 and 200 μm) and quantum dots, etc., which will not be repeated here.

[0083] In the embodiment of the present application, the display panel 21 is a flexible display panel, and the cover plate 22 is a flexible cover plate, that is, the display module 20 is a flexible display module, and the display device 100 is a flexible display device.

[0084] The protective layer 10 includes a hardening layer 1, a transition layer 2 and an anti-reflection layer 3. Figure 4 and Figure 6 , the transition layer 2 is located between the hardened layer 1 and the anti-reflection layer 3, and the hardened layer 1 is located between the display module 20 and the transition layer 2. The transition layer 2 is connected to the hardened layer 1 and the anti-reflection layer 3, respectively. Among them, the adhesion level between the transition layer 2 and the hardened layer 1 is better than or equal to 4B, and the adhesion level between the transition layer 2 and the anti-reflection layer 3 is better than or equal to 4B. Adhesion refers to the mutual attraction between the contact parts of the substances, which can reflect the strength of the bonding performance between the substances. In the embodiment of the present application, the adhesion level between the transition layer 2 and the hardened layer 1 is better than or equal to 4B, and the adhesion level between the transition layer 2 and the anti-reflection layer 3 is better than or equal to 4B. For example, the adhesion level between the transition layer 2 and the hardened layer 1 can be 4B or 5B, and the adhesion level between the transition layer 2 and the anti-reflection layer 3 can be 4B or 5B. It can be understood that the larger the adhesion level number, the better the adhesion performance. The transition layer 2 and the hardening layer 1, and the transition layer 2 and the anti-reflection layer 3 of the present application have excellent bonding properties, that is, the hardening layer 1, the transition layer 2 and the anti-reflection layer 3 are tightly bonded, thereby improving the structural stability of the protective layer 10 during the bending process, reducing the problem of the anti-reflection layer 3 falling off and delamination during the bending process of the protective layer 10, and thus improving the bending resistance of the display device 100.

[0085] In this embodiment, the adhesion between the transition layer 2 and the hardening layer 1 and the adhesion between the transition layer 2 and the anti-reflection layer 3 can be tested by the cross-cut method (GB / T 9286).

[0086] Specifically, a hardening layer 1 with a transition layer 2 (referred to as sample S1) and an anti-reflection layer 3 with a transition layer 2 (referred to as sample S2) are provided, and sample S1 and sample S2 are placed on hard and flat surfaces respectively. A cutting tool is used to scribble on sample S1 and sample S2. The scribing angle is not limited. For example, the cutting tool is used to scribble along an angle of 0 to 180° with the horizontal direction. For example, the scribing can be performed at an angle of 0°, 45°, 90°, 135°, etc. with the long side direction of sample S1 and sample S2. The present application does not limit the cutting direction of the cutting tool on the sample. For example, in sample S1, the cutting direction of the cutting tool can be from the transition layer 2 to the hardening layer 1, and in sample S2, the cutting direction of the cutting tool can be from the anti-reflection layer 3 to the transition layer 2. During the scribing cutting process, the cutting tool should form a grid array pattern with a specified interval on the coating with uniform force and speed. The cutting tool can be, for example, a 6-blade cutting tool. Place the center point of a 75 mm transparent pressure-sensitive tape on the grid, parallel to a set of cutting lines. Flatten the area of ​​the tape on the grid with your fingers. Press the tape with your fingertips to ensure good contact between the tape and sample S1 and sample S2. Peel off the tape smoothly within 0.5 to 1.0 s at an angle of nearly 60° within 5 minutes.

[0087] Rating method: Visually inspect the peeling of cut surface samples S1 and S2 under good lighting conditions. Adhesion is divided into 6 levels: 0B, 1B, 2B, 3B, 4B and 5B. The adhesion of coatings increases from 0B to 5B, and 5B is the best. Test at least 3 different locations of samples S1 and S2. If the results are inconsistent and the difference is greater than 1 level unit, select another 3 locations for retesting.

[0088] Through the above test process, it can be concluded that the transition layer 2 and the hardening layer 1 in sample S1 have a higher adhesion level. Similarly, the transition layer 2 and the anti-reflection layer 3 in sample S2 have a higher adhesion level. This shows that the hardening layer 1, the transition layer 2 and the anti-reflection layer 3 in the protective layer 10 of the present application are well bonded, and can show good bending resistance during the bending process of the display device 100.

[0089] In some embodiments, the anti-reflection layer 3 is made of metal oxide or non-metal oxide, generally inorganic. For example, the anti-reflection layer 3 is selected from any one of a niobium oxide layer, a zirconium oxide layer, an aluminum oxide layer, a zinc oxide layer, and a silicon oxide layer. The above oxide layer can reduce the light reflection of the external environment on the anti-reflection layer, thereby reducing the light reflection.

[0090] In some embodiments, the material of the hardening layer 1 is an organic resin, and the hardening layer 1 is selected from any one of a polyacrylic resin layer, a polyurethane resin layer and a polysiloxane resin layer. Exemplarily, the hardening layer 1 can be selected from any one of a polyacrylate resin layer, a polyurethane resin layer, a polyurethane polyacrylate resin layer, a silane-modified polyacrylate resin layer, a silane-modified polyurethane polyacrylate resin layer and a polysiloxane resin layer.

[0091] In some embodiments, the transition layer 2 is selected from a polysilazane layer or a siloxane layer. Polysilazane and siloxane have an anchoring effect on the substrate, so that the transition layer can be closely connected to the anti-reflection layer 3 and the hardening layer 1 respectively. In addition, polysilazane and siloxane themselves have excellent physical and mechanical properties and chemical stability, which can give the display device 100 excellent corrosion resistance, heat resistance and excellent mechanical properties.

[0092] Specifically, the anti-reflection layer 3 is an inorganic oxide layer, and the hardened layer 1 is an organic resin layer. The interface adhesion between the hardened layer of the organic resin and the anti-reflection layer of the oxide is poor. In the present application, a transition layer 2 is provided between the hardened layer 1 and the anti-reflection layer 3. The transition layer 2 is a polysilazane layer or a siloxane layer. When the protective layer is prepared, under the action of thermal curing, the oxygen atoms in the anti-reflection layer 3 and the silicon atoms in the polysilazane layer or the siloxane layer can interact with each other to form silicon-oxygen bonds, so that the anti-reflection layer 3 and the transition layer 2 are closely connected, thereby improving the adhesion between the anti-reflection layer 3 and the transition layer 2. Under the action of thermal curing, the oxygen atoms in the hardened layer and the polysilazane layer can interact with each other to form silicon-oxygen bonds. The silicon atoms in the alkane layer or the siloxane layer can interact with each other to form silicon-oxygen bonds, so that the hardened layer 1 and the transition layer 2 are tightly connected, and the adhesion of the hardened layer 1 and the transition layer 2 is improved. In this way, the transition layer 1 can be tightly connected to the hardened layer 1 and the anti-reflection layer 3 respectively, and the bonding performance between the hardened layer 1 and the anti-reflection layer 3 is improved, so that the hardened layer 1 and the anti-reflection layer 3 in the protective layer 10 are tightly bonded. During the bending process of the display device 100, the protective layer 10 has excellent structural stability, which can reduce the misalignment of the hardened layer 1 and the anti-reflection layer 3 and the generation of cracks in the anti-reflection layer 3, and improve the bending resistance of the display device 100.

[0093] In the preparation process of the protective layer 10 of the present application, a hardening layer slurry can be coated on the substrate, the hardening layer slurry contains polyacrylic resin, polyurethane resin or polysiloxane resin, and initially cured so that the hardening layer slurry is initially hardened into a semi-solid or solid state, and then a transition layer slurry is coated on the surface of the semi-solid or solid hardening layer slurry, the transition layer slurry contains polysilazane or siloxane, and initially cured so that the transition layer slurry is initially hardened into a semi-solid or solid state, and then an anti-reflection layer slurry is coated on the surface of the semi-solid or solid transition layer slurry, and initially cured so that the anti-reflection layer slurry is initially hardened into a semi-solid or solid state, and finally the three-layer structure formed is cured to obtain the protective layer 10, the protective layer 10 includes a hardening layer 1, a transition layer 2 and an anti-reflection layer 3 arranged in a stacked manner, the transition layer 2 is connected to the hardening layer 1, and the transition layer 2 is connected to the anti-reflection layer 3. Of course, each film layer of the protective layer 10 of the present application can also be prepared by a roll-to-roll sputtering process, and finally each film layer is subjected to a thermal curing treatment.

[0094] In some embodiments, Figure 7 As shown, during the process of preparing the protective layer 10, when the formed three-layer structure is cured, a first diffusion layer 4 is formed between the transition layer 2 and the hardening layer 1, and a second diffusion layer 5 is formed between the transition layer 2 and the anti-reflection layer 3. The presence of the first diffusion layer 4 and the second diffusion layer 5 can improve the bonding performance of the hardening layer 1 and the anti-reflection layer 3, thereby improving the overall bending resistance of the protective layer 10.

[0095] In some embodiments, the thickness of the first diffusion layer 4 is 10nm to 50nm, specifically 10nm, 20nm, 30nm, 40nm or 50nm, etc., which is not limited here. The thickness of the second diffusion layer 5 is 10nm to 50nm, specifically 10nm, 20nm, 30nm, 40nm or 50nm, etc., which is not limited here.

[0096] In some embodiments, polysilazane is a type of polymer in which silicon atoms and nitrogen atoms are alternately connected by covalent bonds to form a basic skeleton. The chemical formula of the polysilazane layer is as shown in formula (I):

[0097]

[0098] In formula (I), R1, R2 and R3 are each independently selected from hydrogen, an alkyl group or an alkyl group containing an R6 substituent, the R6 substituent is selected from any one of an alkenyl group, an alkynyl group and an alkyloxy group, and n is 1 to 10. In this embodiment, the silicon-oxygen bond in the hardened layer 1 of the present application can be an alkoxy silicon functional group such as methoxy silicon and ethoxy silicon.

[0099] The polysilazane layer of the material shown in formula (I) contains a large number of active silicon atoms, which can combine with oxygen atoms in the hardening layer 1 to improve the adhesion between the hardening layer 1 and the transition layer 2, and can also combine with oxygen atoms in the anti-reflection layer 3 to improve the adhesion between the transition layer 2 and the anti-reflection layer 3, thereby improving the bonding force between the hardening layer 1 and the anti-reflection layer 3. When R1, R2 and R3 are selected from hydrogen, the structure shown in formula (I) is an inorganic polysilazane, also known as perhydropolysilazane, which contains a large number of active silicon-nitrogen bonds and silicon-hydrogen bonds, which can react with oxygen atoms to form Si-O bonds. When R1, R2 and R3 are selected from alkyl groups, the structure shown in formula (I) may contain one or more identical or different alkyl groups, including but not limited to methyl, ethyl, propylethyl and other branched or branched groups. Of course, it may also contain straight-chain alkyl or branched alkyl groups containing other functional groups (R6 substituents: alkenyl, methoxysilicon, ethoxysilicon, etc.), and its structure contains a large number of active silicon-nitrogen bonds, methoxysilicon, ethoxysilicon and carbon-carbon alkenyl groups that can combine with oxygen atoms, thereby enhancing the bonding strength between the hardened layer 1 and the anti-reflection layer 3.

[0100] In some embodiments, siloxane refers to a compound containing Si—O—Si bonds, and the general chemical formula of siloxane is as shown in formula (II):

[0101]

[0102] In formula (II), R4 is selected from an alkyl group; and R5 is selected from an alkyl group, an alkenyl group or an epoxy group.

[0103] Optionally, the siloxane contains one or more linear or branched alkyl groups with the same or different functional groups, including but not limited to ethyltrimethoxysilane, ethyl orthosilicate, methyl orthosilicate, etc. It can also be a linear or branched alkyl group containing a functional group (for example, alkenyl, epoxy, etc.), including but not limited to 3-(2,3-epoxypropoxy)propyltrimethoxysilane, 3-(2,3-epoxypropoxy)propyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, etc. The above-mentioned siloxane compounds contain a large number of active silicon-oxygen bonds, which can combine with oxygen atoms in the hardening layer 1 to improve the adhesion between the hardening layer 1 and the transition layer 2, and can also combine with oxygen atoms in the anti-reflection layer 3 to improve the adhesion between the transition layer 2 and the anti-reflection layer 3, thereby improving the bonding performance between the hardening layer 1 and the anti-reflection layer 3. In some embodiments, the silicon-oxygen bonds in siloxane are Si-O bonds and Si-O-Si bonds. Of course, Si-alkenyl, Si-alkoxy and other groups in siloxane also tend to combine with the hardening layer 1 and the anti-reflection layer 3 to enhance the bonding performance of the protective layer 10.

[0104] In some embodiments, the thickness of the hardened layer 1 is 3 μm to 5 μm. The thickness of the hardened layer 1 can specifically be 3 μm, 3.5 μm, 4 μm, 4.5 μm or 5 μm, etc. If the hardened layer 1 is too thin, it cannot play a reinforcing role; if the hardened layer 1 is too thick, it will affect the overall bending effect of the protective layer 10.

[0105] In some embodiments, the thickness of the transition layer 2 is 0.1 μm to 1 μm, and the thickness of the transition layer 2 can specifically be 0.1 μm, 0.3 μm, 0.5 μm, 0.8 μm or 1 μm, etc. The thickness of the transition layer 2 is less than the thickness of the hardening layer 1. The thickness of the transition layer 2 of the present application is moderate, which avoids the increase in the thickness of the protective layer 10 due to the large thickness, and at the same time avoids the problem of reduced adhesion of the anti-reflection layer 3 and the hardening layer 1 due to the thin thickness.

[0106] In some embodiments, the anti-reflection layer 3 is a single-layer structure. In other embodiments, the anti-reflection layer 3 is a multi-layer structure, which is beneficial to improve the anti-reflection effect. Specifically, Figure 8 As shown, the anti-reflection layer 3 includes at least one group of stacked first sub-anti-reflection layer 311 and second sub-anti-reflection layer 322, the first sub-anti-reflection layer 311 is located between the hardening layer 1 and the second sub-anti-reflection layer 322, and the refractive index of the first sub-anti-reflection layer 311 is different from the refractive index of the second sub-anti-reflection layer 322. Exemplarily, the refractive index of the first sub-anti-reflection layer 311 is greater than the refractive index of the second sub-anti-reflection layer 322, the refractive index of the first sub-anti-reflection layer 311 is 2.10-2.30, the first sub-anti-reflection layer 311 can be selected from titanium oxide layer, zirconium oxide layer, aluminum oxide layer or niobium oxide layer, the refractive index of the second sub-anti-reflection layer 322 is 1.35-1.50, and the second sub-anti-reflection layer 322 can be selected from silicon oxide layer.

[0107] In some embodiments, the thickness of the anti-reflection layer 3 is 100 nm to 350 nm, specifically 100 nm, 130 nm, 150 nm, 180 nm, 200 nm, 230 nm, 250 nm, 280 nm, 320 nm or 350 nm, etc. Compared with the hardening layer 1, the thickness of the anti-reflection layer 3 of the present application is thinner, and a single-layer or multi-layer structure can be selected according to the performance requirements of the anti-reflection layer 3, and then the thickness of the anti-reflection layer 3 can be designed.

[0108] In some embodiments, the hardened layer 1 contains reinforcing particles, and the reinforcing particles are any one of silicon dioxide, aluminum oxide, polystyrene and polymethyl acrylate, so as to improve the hardness of the hardened layer 1 .

[0109] Optionally, the reinforcing particles are nanometer-sized. Specifically, the average particle size of the reinforcing particles is 50nm to 200nm, and specifically can be 50nm, 80nm, 100nm, 120nm, 150nm, 180nm or 200nm, etc., which is not limited here. If the average particle size of the reinforcing particles is less than 50nm, the hardness of the hardened layer 1 cannot be significantly improved. If the average particle size of the reinforcing particles is greater than 200nm, the roughness of the surface of the hardened layer 1 increases, resulting in a decrease in the bonding force between the hardened layer 1 and the anti-reflection layer 3. In some embodiments, the elongation at break of the hardened layer 1 containing the reinforcing particles is greater than 2.5%.

[0110] In some embodiments, Fig. 9 As shown, the protective layer 10 also includes a base layer 6, which is arranged between the display module 20 and the hardening layer 1. The base layer 6 can provide support and buffer for the hardening layer 1 and the anti-reflection layer 3, and at the same time facilitate the hardening layer 1 and the anti-reflection layer 3 to prepare a coating on the base layer 6, and finally composite it to the display module 20. Exemplarily, the base layer 6 can be a flexible substrate or a hard substrate, and the present application is not limited here. Exemplarily, the base layer 6 can be selected from a polyethylene terephthalate layer, a transparent polyimide layer, a polymethyl methacrylate layer, a polycarbonate layer, a triacetate cellulose layer, a cycloolefin polymer (COP, Cyclo Olefin Polymer) layer or an ultra-thin flexible glass (UTG, Ultra Thin Glass), etc. Preferably, the base layer 6 is a flexible substrate.

[0111] Optionally, the thickness of the base layer 6 is 30 μm to 75 μm, specifically 30 μm, 40 μm, 50 μm, 60 μm, 70 μm or 75 μm, etc. Within the above-defined range, the anti-bending performance of the display device 100 can be effectively improved.

[0112] In some embodiments, continuing as Fig. 9 As shown, the display device 100 further includes an anti-fingerprint layer 7, which is disposed on the surface of the anti-reflection layer 3 on the side away from the hardening layer 1. The material of the anti-fingerprint layer 7 is modified perfluoropolyether siloxane, perfluoropolyether or polyether, etc. Exemplarily, the modified perfluoropolyether siloxane can be a perfluoropolyether siloxane modified by isocyanate, amino, amide group and carboxyl group. The anti-fingerprint layer 7 can prevent water vapor from intruding, improve the service life of the protective layer 10, and also realize the anti-fingerprint function.

[0113] In some embodiments, continuing as Fig. 9As shown, a hardening layer 1, an anti-reflection layer 3 and an anti-fingerprint layer 7 can be sequentially formed on the base layer 6 to form an independent protective layer 10. The protective layer 10 is then fixed to the light-emitting side surface of the display module 20 by optical adhesive bonding, and an adhesive layer 8 is formed between the display module 20 and the protective layer 10. At this time, the display module 20 and the protective layer 10 need to be prepared separately, and then the protective layer 10 is fixed to the light-emitting side of the display module 20 by optical adhesive bonding.

[0114] In some embodiments, the optical adhesive is silicone resin, polyurethane resin, polyacrylate resin, epoxy resin, etc.

[0115] In some embodiments, the thickness of the adhesive layer 8 is 15 μm to 30 μm, and specifically can be 15 μm, 18 μm, 20 μm, 25 μm, 28 μm or 30 μm.

[0116] In summary, the present application sets a transition layer 2 between the hardened layer 1 and the anti-reflection layer 3, the transition layer 2 is connected to the hardened layer 1, and the transition layer 2 is connected to the anti-reflection layer 3. The protective layer 10 of the display device 100 has excellent anti-reflection performance and hardness performance. The pencil hardness of the protective layer 10 is greater than or equal to 2H, the transmittance is greater than 94.5%, and the reflectivity is less than 1.5%. Moreover, the adhesion level between the transition layer 2 and the hardened layer 1 is better than or equal to 4B, and the adhesion level between the transition layer 2 and the anti-reflection layer 3 is better than or equal to 4B, so that the hardened layer 1 and the anti-reflection layer 3 have good connectivity after the protective layer 10 is dynamically bent 20,000 times with a bending radius of R1.0mm under room temperature conditions, and the anti-reflection layer 3 does not have cracks or falling off, indicating that the display device 100 of the present application has reliable bending resistance.

[0117] Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the claims. Any technical personnel in this field may make several possible changes and modifications without departing from the concept of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims of the present application.

Claims

1. A display device, characterized in that: The display device comprises a bending area and a straight area arranged on at least one side of the bending area, and comprises: Display module; A protective layer, the protective layer is located on a side surface of the display module, and the protective layer is at least arranged in the bending area; The protective layer includes a stacked hardening layer, a transition layer and an anti-reflection layer, the transition layer is arranged between the hardening layer and the anti-reflection layer, the hardening layer is arranged between the transition layer and the display module, the transition layer is connected to the hardening layer, the transition layer is connected to the anti-reflection layer, the adhesion grade between the transition layer and the hardening layer is better than or equal to 4B, and the adhesion grade between the transition layer and the anti-reflection layer is better than or equal to 4B.

2. The display device according to claim 1, characterized in that The transition layer is selected from a polysilazane layer or a siloxane layer.

3. The display device according to claim 1, characterized in that The anti-reflection layer is selected from any one of a niobium oxide layer, a zirconium oxide layer, an aluminum oxide layer, a zinc oxide layer and a silicon oxide layer.

4. The display device according to claim 1, characterized in that The hardening layer is selected from any one of a polyacrylic resin layer, a polyurethane resin layer and a polysiloxane resin layer.

5. The display device according to claim 1, characterized in that A first diffusion layer is provided between the hardening layer and the transition layer.

6. The display device according to claim 1, characterized in that: A second diffusion layer is provided between the transition layer and the anti-reflection layer.

7. The display device according to claim 1, characterized in that The thickness of the hardened layer is 3 μm to 5 μm.

8. The display device according to claim 1, characterized in that: The thickness of the transition layer is 0.1 μm to 1 μm.

9. The display device according to claim 1, characterized in that: The thickness of the anti-reflection layer is 0.1 μm to 0.35 μm.

10. The display device according to claim 1, characterized in that The hardened layer contains reinforcing particles, and the reinforcing particles are any one of silicon dioxide, aluminum oxide, polystyrene and polymethyl acrylate; and / or the average particle size of the reinforcing particles is 50nm to 200nm.

11. The display device according to claim 1, characterized in that: The anti-reflection layer is a single-layer structure.

12. The display device according to claim 1, characterized in that: The anti-reflection layer includes at least one group of a first sub-anti-reflection layer and a second sub-anti-reflection layer stacked together, the first sub-anti-reflection layer is located between the hardening layer and the second sub-anti-reflection layer, and the refractive index of the first sub-anti-reflection layer is different from the refractive index of the second sub-anti-reflection layer.

13. The display device according to claim 1, characterized in that: The protective layer further includes a base layer, and the base layer is arranged between the display module and the hardening layer.

14. The display device according to claim 1, characterized in that The protection layer further comprises an anti-fingerprint layer, and the anti-fingerprint layer is arranged on a surface of the anti-reflection layer on a side away from the hardening layer.

15. The display device according to claim 1, characterized in that: The display device further includes an adhesive layer, and the adhesive layer is located between the display module and the hardening layer.

16. An electronic device, characterized in that: The electronic device comprises a housing and a display device disposed in the housing, and the display device comprises the display device according to any one of claims 1 to 15.