Power supply chip of corner protection structure

Abstract

The utility model discloses a power supply chip of a corner protection structure, comprising a main body protection mechanism, side end placement mechanisms and a packaging reinforcement mechanism, the two ends of the main body protection mechanism are provided with the side end placement mechanisms, and the main body protection mechanism is internally provided with the packaging reinforcement mechanism. The main body protection mechanism comprises a core body, an outer frame, an outer frame pile, a smooth plain end and a jacking frame. When the power supply chip of the corner protection structure is placed, stored or moved, placed and used, the corners of the body can be protected through the outer frame pile structures at the corners of the periphery of the core body, the original sharpness is reduced due to the fact that the outer side of the top end of each outer frame pile adopts the circular arc design with a smooth flat opening, and when the power supply chip is collided or falls off, the power supply chip can be prevented from falling off. And in cooperation with a top position frame structure of which the top surface is distributed and connected in an arched manner, external structure damage and corner gouges caused by physical factors such as collision and the like can be effectively reduced, and an internal chip is protected through external protection.

Description

Technical Field

[0001] The utility model relates to the technical field of power chips, in particular to a power chip with a corner protection structure. Background Art

[0002] A chip is also called an integrated circuit, abbreviated as IC, or called a microcircuit, microchip, or wafer. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of a semiconductor wafer. A power chip can also refer to a monolithic power management chip, which has the advantages of high cost performance, high integration, simple peripheral circuits, and optimal performance indicators. It can constitute an isolated switching power supply for high-efficiency converters and industry-specific switching power supplies. Monolithic power chips have currently become the preferred integrated circuit for the international development of medium and small power supplies, precision power supplies, and switching power supply modules.

[0003] Most of the existing chip body structures do not have good protection around the corners except for the external packaging. Before being placed on the circuit board structure, they are easily damaged or bumped, causing damage. For this reason, we propose a power chip with a corner protection structure. Utility Model Content

[0004] The purpose of the utility model is to provide a power chip with a corner protection structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a power chip with an edge protection structure, comprising a main body protection mechanism, an edge placement mechanism and a packaging reinforcement mechanism, the edge placement mechanisms are arranged at both ends of the main body protection mechanism, and the packaging reinforcement mechanism is arranged inside the main body protection mechanism, the main body protection mechanism comprises a core body, an outer frame, an outer frame pile, a smooth flat mouth and a top frame, and the outer frame is arranged around the core body, the outer frame piles are arranged around the outer frame, and the top of the outer frame piles is arranged with a smooth flat mouth, and the top surface of the outer frame is arranged with a top frame.

[0006] Furthermore, the core body is engaged with the outer frame, and smooth flat openings are opened at equal intervals around the top surface of the outer frame.

[0007] Furthermore, the top frame and the outer frame piles are fixedly connected to the outer frame, and the outer frame piles are evenly distributed along the four peripheral corners of the outer frame.

[0008] Furthermore, the edge placement mechanism includes a placement frame, a placement hole, a metal washer and a rubber ring, and the placement frame is provided with a placement hole at the center, the bottom surface of the placement hole is provided with a metal washer, and the bottom surface of the metal washer is provided with a rubber ring.

[0009] Furthermore, the placement rack is fixedly connected to the packaging reinforcement mechanism, and four groups of placement racks are provided.

[0010] Furthermore, the metal gasket is engaged with the inner wall of the placement hole, and the rubber ring is in contact with the bottom surface of the metal gasket.

[0011] Furthermore, the packaging reinforcement mechanism includes an inner substrate, an embedded frame and a packaging layer, and the top surface of the inner substrate is provided with the inner embedded frame, and the top surface of the inner substrate is provided with the packaging layer.

[0012] Furthermore, the inner substrate and the inner embedded frame are connected by welding, and the packaging layer is evenly distributed around the surfaces of the inner substrate and the inner embedded frame.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] In the power chip with this corner protection structure, during the process of placing, storing, or moving and placing for use, the outer frame pile structure at the four corners of the core body can provide protection for the corners of the body. Since the outer top of the outer frame pile adopts a smooth flat arc design to reduce the original sharpness, when it is bumped or dropped, combined with the top frame structure with arched distribution connections on the top surface, it can effectively reduce external structural damage and corner scratches caused by physical factors such as bumps, and maintain protection for internal chips through external protection.

[0015] It can be matched with four sets of mounting frames for auxiliary fixing and installation. Since the mounting holes are provided with metal washers and rubber ring structures, the stability and safety of the mounting screws can be provided to avoid the phenomenon of conductive contact short circuit.

[0016] The surface of the inner substrate of this power integrated circuit is also equipped with a welded and fixed arched embedded frame structure, which is arranged on the top surface of the inner substrate to provide overall protection for the internal structure of the chip, maintain the stability of the packaging structure, and cooperate with the external frame to form internal and external protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 It is a three-dimensional structural diagram of the edge placement mechanism of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the packaging reinforcement mechanism of the utility model from a front view.

[0020] In the figure: 1. Main body protection mechanism; 101. Core body; 102. Outer frame; 103. Outer frame pile; 104. Smooth flat mouth; 105. Top frame; 2. Edge placement mechanism; 201. Placement frame; 202. Placement hole; 203. Metal gasket; 204. Rubber ring; 3. Packaging reinforcement mechanism; 301. Inner substrate; 302. Embedded frame; 303. Packaging layer. DETAILED DESCRIPTION

[0021] Example 1

[0022] like Figure 1 As shown, a power chip with an edge protection structure comprises: a main body protection mechanism 1; edge placement mechanisms 2 are arranged at both ends of the main body protection mechanism 1, and a packaging reinforcement mechanism 3 is arranged inside the main body protection mechanism 1, the main body protection mechanism 1 comprises a core body 101, an outer frame 102, an outer frame pile 103, a smooth flat mouth 104 and a top frame 105, and the core body 101 is provided with an outer frame 102 around, the outer frame pile 103 is arranged around the outer frame 102, and the top of the outer frame pile 103 is provided with a smooth flat mouth 104, and the top surface of the outer frame 102 is provided with a top frame 105, the core body 101 and the outer frame 102 are engaged with each other, and the smooth flat mouth 104 is equidistantly opened around the top surface of the outer frame 102, the top frame 105 and the outer frame pile 103 are fixedly connected to the outer frame 102, and the outer frame pile 103 is arranged along the outer The four corners of the frame 102 are equidistantly distributed. When the power chip is placed, stored, or moved for use, the outer frame 102 and the outer frame piles 103 can be engaged with the outer walls of the core 101. The outer frame piles 103 structure at the four corners of the core 101 can provide protection for the corners of the body. The top outer side of the outer frame piles 103 adopts a circular arc design with a smooth flat mouth 104 to reduce the original sharpness. When it is bumped or dropped, the top frame 105 structure connected by the arched top surface can effectively reduce external structural damage and corner scratches caused by physical factors such as bumps, improve the external protection and stability of the structure, and facilitate stable use by users. This top frame 105 is fixedly distributed along the top surface of the outer frame 102 in the form of welding to form an external protection frame, which maintains protection for internal chips through external protection.

[0023] Example 2

[0024] like Figure 2As shown, a power chip with an edge protection structure, the edge placement mechanism 2 includes a placement frame 201, a placement hole 202, a metal gasket 203 and a rubber ring 204, and the placement frame 201 is provided with a placement hole 202 in the center, the bottom surface of the placement hole 202 is provided with a metal gasket 203, and the bottom surface of the metal gasket 203 is provided with a rubber ring 204, the placement frame 201 and the packaging reinforcement mechanism 3 are fixedly connected, and the placement frame 201 is provided with four groups, the metal gasket 203 is engaged with the inner wall of the placement hole 202, and the rubber ring 204 is in contact with the bottom surface of the metal gasket 203. In the process of placing the power chip, the bottom of the chip is welded and connected, and the four groups of placement frames 201 can also be used for auxiliary fixed placement. The screws are screwed into the placement hole 202 and fixed to the mainboard structure where the chip is placed. Since the metal gasket 203 and the rubber ring 204 structure are provided in the placement hole 202, the stability and safety of the placement screws can be provided to avoid the phenomenon of conductive contact short circuit and the like.

[0025] like Figure 3 As shown, a power chip with a corner protection structure, the packaging reinforcement mechanism 3 includes an inner substrate 301, an embedded frame 302 and a packaging layer 303, and the top surface of the inner substrate 301 is provided with an embedded frame 302, and the top surface of the inner substrate 301 is provided with a packaging layer 303, the inner substrate 301 and the embedded frame 302 are welded, and the packaging layer 303 is evenly distributed around the surface of the inner substrate 301 and the embedded frame 302. The surface of the inner substrate 301 of this power integrated circuit is also provided with a welded and fixed arched embedded frame 302 structure, which is arranged on the top surface of the inner substrate 301, and then a sealed embedded reinforcement structure is formed by the packaging layer 303, providing overall protection for the internal structure of the chip, keeping the packaging structure stable, and cooperating with the external frame to form internal and external protection.

[0026] In summary, when the power chip with the corner protection structure is in use, first, the surface of the inner substrate 301 of the chip is also provided with a welded and fixed arched embedded frame 302 structure, which is distributed on the top surface of the inner substrate 301 with an arrangement structure, and then a sealed embedded reinforcement structure is formed through the packaging layer 303. During the placement, storage or mobile placement of the power chip, the outer frame 102 and the outer frame piles 103 can be engaged with the outer walls of the core 101. The outer frame piles 103 structure at the four corners of the core 101 can provide protection for the corners of the body, and since the top outer position of the outer frame piles 103 adopts a circular arc design with a smooth flat mouth 104, the original sharpness is reduced. When it is bumped or dropped, the top frame 105 structure with an arched distribution connection on the top surface can effectively reduce external structural damage and corner scratches caused by physical factors such as bumps. During the placement of the power chip, the bottom of the chip is welded and connected, and it can also be used in conjunction with four sets of placement frames 201 for auxiliary fixed placement.

Claims

1. A power chip with an edge protection structure, comprising a main body protection mechanism (1), an edge placement mechanism (2) and a packaging reinforcement mechanism (3), characterized in that: The two ends of the main body protection mechanism (1) are provided with edge placement mechanisms (2), and the interior of the main body protection mechanism (1) is provided with a packaging reinforcement mechanism (3). The main body protection mechanism (1) comprises a core body (101), an outer frame (102), an outer frame pile (103), a smooth flat mouth (104) and a top frame (105), and the core body (101) is provided with an outer frame (102) around the periphery, the outer frame pile (103) is provided with an outer frame pile (103) around the periphery, and the top of the outer frame pile (103) is provided with a smooth flat mouth (104), and the top surface of the outer frame (102) is provided with a top frame (105).

2. A power chip with a corner protection structure according to claim 1, characterized in that: The core (101) is engaged with the outer frame (102), and smooth flat openings (104) are equidistantly provided around the top surface of the outer frame (102).

3. The power chip with a corner protection structure according to claim 1, characterized in that: The top frame (105) and the outer frame piles (103) are fixedly connected to the outer frame (102), and the outer frame piles (103) are evenly distributed along the four peripheral corners of the outer frame (102).

4. The power chip with a corner protection structure according to claim 1, characterized in that: The edge placement mechanism (2) comprises a placement frame (201), a placement hole (202), a metal washer (203) and a rubber ring (204), wherein the placement frame (201) is provided with a placement hole (202) at its center, the bottom surface of the placement hole (202) is provided with a metal washer (203), and the bottom surface of the metal washer (203) is provided with a rubber ring (204).

5. The power chip with a corner protection structure according to claim 4, characterized in that: The placement frame (201) is fixedly connected to the packaging reinforcement mechanism (3), and four groups of the placement frames (201) are provided.

6. The power chip with a corner protection structure according to claim 4, characterized in that: The metal gasket (203) is engaged with the inner wall of the placement hole (202), and the rubber ring (204) is in contact with the bottom surface of the metal gasket (203).

7. The power chip with a corner protection structure according to claim 1, characterized in that: The packaging reinforcement mechanism (3) comprises an inner substrate (301), an inner embedded frame (302) and a packaging layer (303), wherein the top surface of the inner substrate (301) is provided with the inner embedded frame (302), and the top surface of the inner substrate (301) is provided with the packaging layer (303).

8. The power chip with a corner protection structure according to claim 7, characterized in that: The inner substrate (301) and the inner embedded frame (302) are connected by welding, and the packaging layer (303) is evenly distributed around the surfaces of the inner substrate (301) and the inner embedded frame (302).

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