High-temperature heat conduction assembly and semiconductor equipment

Abstract

The utility model discloses a high-temperature heat conduction assembly and a semiconductor device. The high-temperature heat conduction assembly comprises a heated member, a heating member and a pressing assembly. The heating piece is connected with the heated piece, and the heating piece is used for generating heat and transferring the heat to the heated piece; one end of the pressing assembly penetrates through the heating piece and is connected with the heated piece, and the other end of the pressing assembly abuts against the side, away from the heated piece, of the heating piece. The heating piece can generate heat and transfer the heat to the heated piece, the heating piece is pressed by the pressing assembly in the heat transfer process, so that the heating piece is pressed towards the direction of the heated piece, and even if the heated piece deforms, stable connection between structures can be kept; therefore, it is ensured that the heating piece can stably transfer heat to the heated piece, and the heat transfer effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a high-temperature heat-conducting component and a semiconductor device. Background Art

[0002] For high-temperature components used in semiconductor equipment, when the high-temperature components are heated, changes in heating temperature will cause the high-temperature components to deform. Excessive deformation will affect the connection and heat transfer effect between the high-temperature components and other matching structures, thereby causing uneven heat conduction and affecting process performance; in severe cases, it may cause structural damage and affect the normal use of the equipment. Utility Model Content

[0003] The utility model aims to provide a high-temperature heat-conducting component and a semiconductor device, aiming to solve the problem that high-temperature components in semiconductor devices are prone to deformation, thereby affecting the connection and heat transfer effect with other matching structures.

[0004] In order to solve the above technical problems, the purpose of the utility model is achieved through the following technical solutions: providing a high-temperature heat-conducting component, including: a heated component, a heating component and a pressing component;

[0005] The heating element is connected to the heated element, and the heating element is used to generate heat and transfer it to the heated element;

[0006] One end of the pressing assembly passes through the heating element and is connected to the heated element, and the other end of the pressing assembly presses against a side of the heating element away from the heated element.

[0007] Furthermore, the high-temperature heat-conducting component also includes a heat-conducting member; one side of the heat-conducting member is fitted and connected to the heating member, and the other side of the heat-conducting member is fitted and connected to the heated member.

[0008] Furthermore, the clamping assembly includes: a connecting piece and an elastic assembly; one end of the connecting piece passes through the heating piece and is connected to the heated piece; the elastic assembly is arranged at the other end of the connecting piece and elastically presses the side of the heating piece away from the heated piece.

[0009] Furthermore, the elastic component includes: a first support plate, an elastic member and a second support plate; the first support plate is sleeved on the other end of the connecting member; the elastic member is sleeved on the other end of the connecting member; the second support plate is sleeved on the other end of the connecting member;

[0010] Wherein, the elastic member is located between the first supporting plate and the second supporting plate and is in a compressed state, and the second supporting plate abuts against a side of the heating member facing away from the heated member.

[0011] Furthermore, the elastic member is an annular structure with elastic deformation.

[0012] Furthermore, the elastic component also includes a positioning ring; the positioning ring is sleeved on the other end of the connecting member and is located radially inward of the elastic member.

[0013] Furthermore, a gap is left between the positioning ring and the first support plate and / or the second support plate.

[0014] Furthermore, the shapes of the heated element, the heat-conducting element and the heating element are adapted to each other; and the clamping assembly is provided in plurality and is evenly distributed.

[0015] Furthermore, the heating element includes a heating plate and a heating wire; the heating plate is closely connected to the heat-conducting element; the heating wire is arranged inside the heating plate and is used to be connected to an external heating power source.

[0016] An embodiment of the utility model further provides a semiconductor device, which includes the high-temperature heat-conducting component as described above.

[0017] The beneficial effects of the embodiments of the utility model are as follows: the heating element can generate heat and transfer it to the heated element. During the heat transfer process, the heating element is pressed against the heating element by the pressing assembly so that the heating element is pressed toward the heated element. Even if the heated element is deformed, a stable connection between the structures can be maintained, thereby ensuring that the heating element can stably transfer heat to the heated element, thereby ensuring the heat transfer effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a high-temperature heat-conducting component provided in an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of a partial cross-sectional structure of a high-temperature heat-conducting component provided in an embodiment of the utility model.

[0021] Description of the symbols in the figure:

[0022] 1. Heated parts;

[0023] 2. Heat conducting parts;

[0024] 3. Heating element; 31. Upper pressing plate; 32. Lower pressing plate; 33. Heating wire;

[0025] 4. Clamping assembly; 41. Connecting piece; 42. First supporting plate; 43. Elastic piece; 44. Second supporting plate; 45. Positioning ring. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0028] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0029] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0030] See also Figure 1 and Figure 2 The embodiment of the utility model provides a high-temperature heat-conducting component, including: a heated part 1, a heating part 3 and a clamping component 4; the heating part 3 is connected to the heated part 1, and the heating part 3 is used to generate heat and transfer it to the heated part 1; one end of the clamping component 4 passes through the heating part 3 and is connected to the heated part 1, and the other end of the clamping component 4 presses the side of the heating part 3 away from the heated part 1.

[0031] In this embodiment, the heated part 1 is a high-temperature component in the semiconductor device, and it is necessary to maintain a certain high temperature of the heated part 1 to meet the process requirements; heat can be generated by an external power supply of the heating part 3, and the generated heat is transferred to the heated part 1 by the heating part 3, thereby maintaining the high temperature requirement of the heated part 1.

[0032] In this embodiment, in order to prevent the heated part 1 from deforming at different heating temperatures and affecting the connection between the heat transfer structures and the heat transfer effect, a clamping component 4 is additionally provided. During the heat transfer process, the clamping component 4 is pressed against the side of the heating part 3 away from the heated part 1, so that the heating part 3 is pressed toward the heated part 1, thereby enhancing the tightness of the heating part 3 and the heated part 1. In this way, even if the heated part 1 is deformed, a stable connection between the structures can be maintained, thereby ensuring that the heating part 3 can stably transfer heat to the heated part 1, thereby ensuring the heat transfer effect.

[0033] In one embodiment, the high-temperature heat-conducting assembly further includes a heat-conducting member 2 , one side of the heat-conducting member 2 is bonded and connected to the heating member 3 , and the other side of the heat-conducting member 2 is bonded and connected to the heated member 1 .

[0034] In this embodiment, the two side surfaces of the heat conductor 2 can be adaptively designed according to the shapes of the heating element 3 and the heated element 1. After the two side surfaces of the heat conductor 2 are respectively designed to fit the heating element 3 and the heated element 1, the heating element 3 can transfer the generated heat to the heated element 1 more comprehensively through the heat conductor 2, thereby improving the heat transfer effect.

[0035] In this embodiment, the heat conducting member 2 can be made of metal materials with high thermal conductivity, such as silicon, copper, aluminum, iron, silver, gold, etc. The heat conducting member 2 can also be made of synthetic materials such as graphene, aluminum nitride, silicon carbide, and aluminum nitride. The specific material can be selected according to the needs, and this embodiment does not make specific limitations.

[0036] In one embodiment, the clamping assembly 4 includes: a connecting member 41 and an elastic component; one end of the connecting member 41 passes through the heating member 3 and is connected to the heated member 1; the elastic component is arranged at the other end of the connecting member 41 and elastically presses the side of the heating member 3 away from the heated member 1.

[0037] In this embodiment, the connecting member 41 is used to connect the heating member 3 and the heated member 1 to maintain relative stability between the two. One end of the connecting member 41 penetrates the heating member 3 and is fixedly connected to the heated member 1. It should be noted that one end of the connecting member 41 may also penetrate the heating member 3 and the heat conductive member 2 at the same time and be fixedly connected to the heated member 1, or the connecting member 41 may also penetrate at a position avoiding the heat conductive member 2. No specific limitation is made here and it can be set according to the actual application scenario. The other end of the connecting piece 41 is used to install an elastic component, which elastically presses against the side of the heating element 3 away from the heated element 1 and deforms. The elastic force generated by the deformation can squeeze the heated element 1. After being squeezed by the elastic force, the heated element 1 transfers the force to the heat conductive element 2, so that the heating element 3 and the heat conductive element 2 fit more closely, and then the heat conductive element 2 continues to transfer the force to the heated element 1, so that the heat conductive element 2 and the heated element 1 fit more closely; in this way, based on the set clamping component 4, the connection between the heating element 3, the heat conductive element 2 and the heated element 1 can be made tighter, thereby ensuring a stable connection between the structures and maintaining the heat transfer effect.

[0038] In some preferred embodiments, the connecting member 41 can adopt a half-thread screw, that is, one end of the connecting member 41 is a threaded end, and the other end of the connecting member 41 is a smooth rod end. Correspondingly, a threaded hole can be set on the heated member 1, and one end of the connecting member 41 passes through the heating member 3 and is threadedly connected to the threaded hole set on the heated member 1. The elastic component is arranged on the smooth rod end of the connecting member 41 and is located on the side of the heating member 3 away from the heated member 1.

[0039] In some preferred embodiments, the elastic component can adopt a deformable structure with a rebound function, and the rebound force generated by the deformation of the elastic component is pressed against the heating element 3; it should be understood that the elastic component needs to always maintain a deformed state, that is, always maintain elastic pressure on the heating element 3, so as to ensure the stable connection and heat transfer effect of the heating element 3, the heat conducting element 2 and the heated element 1.

[0040] In some specific implementations of the elastic component, the elastic component may include: a first support plate 42, an elastic member 43 and a second support plate 44; the first support plate 42 is sleeved on the other end of the connecting member 41; the elastic member 43 is sleeved on the other end of the connecting member 41; the second support plate 44 is sleeved on the other end of the connecting member 41; the elastic member 43 is located between the first support plate 42 and the second support plate 44 and is in a compressed state, and the second support plate 44 abuts against the side of the heating member 3 facing away from the heated member 1.

[0041] In this specific implementation, the first support plate 42, the elastic member 43 and the second support plate 44 can all be annular structures with a central hole. The first support plate 42, the elastic member 43 and the second support plate 44 are all sleeved on the other end of the connecting member 41 through the central hole. The first support plate 42 is limited at the end of the other end of the connecting member 41 (that is, the first support plate 42 will not fall out of the other end of the connecting member 41), and the second support plate 44 is in contact with the heating member 3 on the side away from the first support plate 42. Based on this, when the elastic member 43 is located in the space between the first support plate 42 and the second support plate 44 and is in a compressed state, the two ends of the elastic member 43 transfer the elastic force to the first support plate 42 and the second support plate 44 respectively. Because the first support plate 42 is limited at the other end of the connecting member 41, the entire elastic component can be kept from falling out of the connecting member 41. Therefore, the second support plate 44 can transfer the elastic force to the heating member 3 to achieve extrusion; thereby ensuring the stable connection and heat transfer effect of the heating member 3, the heat conducting member 2 and the heated member 1.

[0042] In this specific implementation, the first support plate 42 and the second support plate 44 are used as the elastic force transmission medium of the elastic member 43, so that the contact area of ​​the force transmission can be increased. In particular, when the elastic force is transmitted to the heating member 3 through the second support plate 44, compared with the method in which the elastic member 43 directly contacts the heating member 3, the contact area between the second support plate 44 and the heating member 3 will be larger by using the second support plate 44 as the elastic force transmission medium, which can reduce the contact pressure ratio. When the temperature of the heating member 3 changes greatly, the elastic component will not be damaged, and at the same time, it can ensure that the elastic component provides a stable elastic extrusion force.

[0043] In some preferred embodiments, because the second support plate 44 is in direct contact with the heating element 3, in order to prevent excessive heat from the heating element 3 from being transferred to the second support plate 44, the second support plate 44 can be made of insulating material, or a thermal insulation layer can be coated on the side of the second support plate 44 that contacts the heating element 3.

[0044] In some preferred embodiments, the elastic member 43 may be an annular structure with elastic deformation, so that the elastic member 43 can be stable after being mounted on the connecting member 41; more preferably, the elastic member 43 may be a disc spring or a compression spring, which has good deformation ability and can maintain stable rebound potential energy for a long time under compression. For example, the elastic member 43 uses a double-layer or multi-layer large-size disc spring, which can increase the elastic extrusion force and meet the use requirements.

[0045] In one embodiment, the elastic component further includes a positioning ring 45 ; the positioning ring 45 is sleeved on the other end of the connecting member 41 and is located radially inward of the elastic member 43 .

[0046] In this embodiment, the shape of the positioning ring 45 can be adapted to the shape of the center hole of the elastic member 43. The outer diameter of the positioning ring 45 is slightly smaller than the diameter of the center hole of the elastic member 43. The positioning ring 45 is located on the radial inner side of the elastic member 43 and can play the role of limiting the elastic member 43, thereby preventing the elastic member 43 from moving radially to maintain stability.

[0047] In one embodiment, a gap is left between the positioning ring 45 and the first supporting plate 42 and / or the second supporting plate 44 .

[0048] In this embodiment, the heated part 1 will generate a certain amount of expansion when the temperature rises. When the heated part 1 expands, it will reversely squeeze the second support plate 44, and the second support plate 44 will reversely squeeze the positioning ring 45. However, because the first support plate 42 is fixed and limited, in order to avoid structural damage caused by the positioning ring 45 reversely squeezing the first support plate 42, a certain gap can be designed between the positioning ring 45 and the first support plate 42 and / or the second support plate 44. It should be understood that the size of the reserved gap can adapt to the expansion generated when the temperature of the heated part 1 rises. For example, for some expansion within 0.3mm, the gap size can be designed to be in the range of 0.4-1mm.

[0049] In some ways of reserving a gap, taking the use of a half-thread screw as an example, the size of the reserved gap can be adjusted by controlling the torque of the connector 41 during the assembly of the high-temperature heat-conducting component; or after the high-temperature heat-conducting component is assembled, that is, the connector 41 has been completely screwed to the bottom (that is, the two ends of the positioning ring 45 are respectively in contact with the first support plate 42 and the second support plate 44), the connector 41 is loosened a certain number of turns to release the required gap size. For example, in a half-thread screw of M5 specification, the pitch is 0.8mm. If a gap of 0.4mm needs to be reserved, the gap of 0.4mm can be released by loosening the connector 41 half a turn after tightening it.

[0050] In one embodiment, the shapes of the heated element 1 , the heat-conducting element 2 and the heating element 3 are adapted to each other; a plurality of pressing assemblies 4 are provided and are evenly distributed.

[0051] In this embodiment, in order to maximize the heat transfer effect, the shapes of the heat conductor 2 and the heating element 3 can be adaptively designed based on the shape of the heated element 1. The contact surface between the heated element 1, the heat conductor 2 and the heating element 3 with adapted shapes can be larger, and multiple clamping components 4 are provided to perform elastic pressure at multiple positions at the same time, which can ensure that the contact between the heated element 1, the heat conductor 2 and the heating element 3 is more stable and the heat transfer is more comprehensive and uniform.

[0052] In some specific scenarios, the shape of the heated part 1 is a ring shape, and correspondingly, the shapes of the heat conductor 2 and the heating part 3 are also designed to be ring-shaped, wherein the heat conductor 2 is a ring-shaped thin film structure, and multiple clamping components 4 can be evenly distributed along the ring direction, thereby ensuring a stable connection and heat transfer effect between the structures.

[0053] In some preferred embodiments of the heating element 3, the heating element 3 may include a heating plate and a heating wire 33; the heating plate is closely connected to the heat-conducting element 2; the heating wire 33 is arranged inside the heating plate and is used to connect to an external heating power source.

[0054] In a preferred embodiment of the heating element 3, the heating plate may include an upper pressing plate 31 and a lower pressing plate 32. The upper pressing plate 31 and the lower pressing plate 32 are designed to fit each other. A wire groove is opened between the fitting surfaces of the upper pressing plate 31 and the lower pressing plate 32. The heating wire 33 is arranged in the wire groove. Heat can be generated by connecting the heating wire 33 to an external heating power source. The heat is transferred to the heating plate and then reaches the heat conductor 2, and then transferred to the heated element 1 to achieve the high temperature requirement required by the process.

[0055] More specifically, of the upper pressing plate 31 and the lower pressing plate 32, it is the lower pressing plate 32 that actually contacts and transfers heat with the heat conducting member 2, so the lower pressing plate 32 can be made of metal material or synthetic material with high thermal conductivity; and the upper pressing plate 31 can be made of insulating material to reduce heat dissipation.

[0056] An embodiment of the utility model further provides a semiconductor device, which includes the high-temperature heat-conducting component as described above.

[0057] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A high temperature heat conducting component, characterized in that: include: Heated parts; A heating element, connected to the heated element and used to generate heat and transfer heat to the heated element; A pressing component has one end that penetrates the heating element and is connected to the heated element, and the other end that presses against a side of the heating element that is away from the heated element.

2. The high temperature heat conductive component according to claim 1, characterized in that: Also includes: A heat conducting member is connected to the heating member on one side and connected to the heated member on the other side.

3. The high temperature heat conductive component according to claim 1, characterized in that: The clamping assembly comprises: A connecting piece, one end of which passes through the heating piece and is connected to the heated piece; The elastic component is arranged at the other end of the connecting member and elastically presses the side of the heating member away from the heated member.

4. The high temperature heat conductive component according to claim 3, characterized in that: The elastic component comprises: A first supporting plate, sleeved on the other end of the connecting member; An elastic member, sleeved on the other end of the connecting member; A second supporting plate, sleeved on the other end of the connecting member; Wherein, the elastic member is located between the first supporting plate and the second supporting plate and is in a compressed state, and the second supporting plate abuts against a side of the heating member facing away from the heated member.

5. The high temperature heat conductive component according to claim 4, characterized in that: The elastic member is an annular structure with elastic deformation.

6. The high temperature heat conducting component according to claim 5, characterized in that: The elastic component also includes: The positioning ring is sleeved on the other end of the connecting member and is located radially inward of the elastic member.

7. The high temperature heat conductive component according to claim 6, characterized in that: A gap is left between the positioning ring and the first supporting plate and / or the second supporting plate.

8. The high temperature heat conductive component according to claim 2, characterized in that: The shapes of the heated part, the heat-conducting part and the heating part are adapted to each other; and a plurality of the pressing assemblies are provided and are evenly distributed.

9. The high temperature heat conductive component according to claim 2, characterized in that: The heating element comprises: A heating plate, which is closely connected to the heat conducting member; The heating wire is arranged inside the heating plate and is used to be connected to an external heating power source.

10. A semiconductor device, characterized in that: It comprises a high-temperature heat-conducting component as described in any one of claims 1 to 9.

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