Integrated circuit chip

Abstract

The utility model provides an integrated circuit chip, which relates to the technical field of chips and comprises a chip body, pins are symmetrically arranged on two side surfaces of the chip body, a mounting sheet for isolation is arranged at the bottom of the chip body, and two button fans for heat dissipation are symmetrically arranged in the mounting sheet. According to the utility model, through the design, heat dissipation can be effectively carried out on the bottom of the integrated circuit chip, so that damage caused by untimely heat dissipation is prevented, and unnecessary loss is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to an integrated circuit chip. Background Art

[0002] An integrated circuit is a miniature electronic device or component that uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. All components have formed a whole in structure, making electronic components a big step forward in miniaturization, low power consumption, intelligence and high reliability.

[0003] In the prior art, an integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring, and the integrated circuit chip is mainly mounted on these electronic components, a circuit board. After the integrated circuit chip is mounted on the circuit board, its heat dissipation mainly relies on a heat sink that dissipates heat from the circuit board. In this way, the side of the integrated circuit chip attached to the circuit board cannot effectively dissipate heat, so that when the circuit board is not cooled in time, the integrated circuit chip is easily damaged. Therefore, we propose an integrated circuit chip. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings existing in the prior art. An integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring, and the integrated circuit chip is mainly installed on these electronic components, a circuit board. After the integrated circuit chip is installed on the circuit board, its heat dissipation mainly relies on a radiator that dissipates heat for the circuit board. In this way, the side of the integrated circuit chip attached to the circuit board cannot effectively dissipate heat, so that when the circuit board is not cooled in time, the integrated circuit chip is easily damaged.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An integrated circuit chip comprises a chip body, wherein pins are symmetrically arranged on the two sides of the chip body, a mounting plate for isolation is arranged at the bottom of the chip body, two button fans for heat dissipation are symmetrically arranged inside the mounting plate, and a plurality of feet for raising the mounting plate are arranged at the periphery of the bottom of the mounting plate.

[0007] As a preferred solution of the utility model, the mounting plate further includes a plurality of heat dissipation holes opened around the mounting plate, and a guide plate is also arranged inside the mounting plate to assist airflow to be discharged from the heat dissipation holes.

[0008] The technical effect of adopting the above further solution is that the heat at the bottom of the chip body can be effectively dissipated to the surroundings through the guide plate and the heat dissipation holes, thereby effectively ensuring that the chip body can dissipate heat in time.

[0009] As a preferred solution of the utility model, the mounting plate also includes a heat collecting groove symmetrically opened on its top for facilitating the entry of hot air into the mounting plate, and a heat dissipation net is arranged inside the heat collecting groove for accelerating the flow of hot air into the mounting plate.

[0010] As a preferred solution of the utility model, the mounting sheet also includes a first connecting gasket arranged on the top thereof, and a through groove is opened on the top of the first connecting gasket corresponding to the heat collecting groove, the first connecting gasket is bonded to the mounting sheet, and the other side of the first connecting gasket is bonded to the bottom of the chip body.

[0011] As a preferred solution of the utility model, the foot further includes a second connecting pad arranged at the bottom thereof, the second connecting pad is bonded to the foot, and the bottom of the second connecting pad is bonded to the circuit board.

[0012] As a preferred solution of the utility model, the button fan is fixedly connected to the inside of the mounting plate, and the diameter of the button fan is four centimeters.

[0013] The technical effect of adopting the above further solution is that the button fan is small in size and avoids occupying the installation position of the chip body.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] In the utility model, through the setting of the mounting plate, the mounting plate can effectively mount the chip body on the circuit board, and the stability of the chip body installation is ensured through the second connecting gasket, and the foot can effectively raise the mounting plate to facilitate heat dissipation, and the through groove and the heat collection groove can effectively facilitate the entry of hot air from the chip body, thereby dissipating heat through the button fan, and the guide plate and the heat dissipation hole can effectively discharge the hot air to the surroundings, so as to achieve better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the installation piece of the utility model;

[0018] Figure 3 It is a schematic diagram of the internal planar structure of the mounting plate of the utility model.

[0019] Legend: 1. Chip body; 2. Pins; 3. Mounting plate; 31. Heat dissipation hole; 32. Guide plate; 33. Heat collecting groove; 34. Heat dissipation net; 35. First connecting gasket; 36. Through groove; 4. Button fan; 5. Foot; 51. Second connecting gasket. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0024] Example 1

[0025] like Figure 1-3 As shown, the utility model provides a technical solution: an integrated circuit chip, including a chip body 1, pins 2 are symmetrically arranged on the two sides of the chip body 1, and a mounting plate 3 for isolation is arranged at the bottom of the chip body 1, two button fans 4 for heat dissipation are symmetrically arranged inside the mounting plate 3, and a plurality of feet 5 for raising the mounting plate 3 are arranged at the periphery of the bottom of the mounting plate 3, which can effectively raise the mounting plate 3 and increase heat dissipation.

[0026] Example 2

[0027] like Figure 1-3 As shown, the mounting plate 3 also includes a plurality of heat dissipation holes 31 opened around the mounting plate 3, and a guide plate 32 is also arranged inside the mounting plate 3 to assist the airflow to be discharged from the heat dissipation holes 31, so that the hot air can be quickly discharged to the surroundings to increase the heat dissipation efficiency.

[0028] The mounting plate 3 also includes a heat collecting groove 33 symmetrically opened at the top thereof for facilitating the entry of hot air into the mounting plate 3 , and a heat dissipation net 34 is arranged inside the heat collecting groove 33 for accelerating the flow of hot air into the mounting plate 3 , thereby facilitating the entry of hot air from the chip body 1 into the mounting plate 3 .

[0029] The mounting sheet 3 also includes a first connecting pad 35 arranged on the top thereof, and a through groove 36 is opened on the top of the first connecting pad 35 corresponding to the heat collecting groove 33. The first connecting pad 35 is bonded to the mounting sheet 3, and the other side of the first connecting pad 35 is bonded to the bottom of the chip body 1, which can facilitate the fixed connection of the chip body 1, thereby achieving a better heat dissipation effect.

[0030] The foot 5 also includes a second connecting pad 51 arranged at the bottom thereof. The second connecting pad 51 is bonded to the foot 5, and the bottom of the second connecting pad 51 is bonded to the circuit board. Through the second connecting pad 51, the connection between the chip body 1 and the circuit board can be made more stable, and the pin 2 can be effectively protected.

[0031] The button fan 4 is fixedly connected to the inside of the mounting plate 3 , and the diameter of the button fan 4 is four centimeters, which can effectively reduce the volume and avoid affecting the installation of the chip body 1 .

[0032] The working process of the utility model is as follows: when using an integrated circuit chip, first, the first connecting gasket 35 is installed at the bottom of the chip body 1. After completion, the pin 2 is installed on the circuit board, and the second connecting gasket 51 is bonded to the circuit board. Then, the circuit board can be installed in the electronic device. During the use of the circuit board, when the heat dissipation device in the electronic device dissipates heat to it, the heat at the bottom of the chip body 1 passes through the through groove 36 and the heat collection groove 33, passes through the heat dissipation net 34, and is sucked into the mounting plate 3 by the button fan 4, and then is discharged from the heat dissipation holes 31 on all sides through the guide plate 32 at the bottom of the button fan 4. The utility model can effectively dissipate the heat from the bottom of the integrated circuit chip through the design, thereby preventing damage caused by untimely heat dissipation and avoiding unnecessary losses.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip, comprising a chip body (1), characterized in that: Pins (2) are symmetrically arranged on the two side surfaces of the chip body (1), a mounting plate (3) for isolation is arranged at the bottom of the chip body (1), two button fans (4) for heat dissipation are symmetrically arranged inside the mounting plate (3), and a plurality of feet (5) for raising the mounting plate (3) are arranged at the periphery of the bottom of the mounting plate (3).

2. An integrated circuit chip according to claim 1, characterized in that: The mounting plate (3) further comprises a plurality of heat dissipation holes (31) arranged around the mounting plate (3), and a guide plate (32) is arranged inside the mounting plate (3) to assist airflow in being discharged from the heat dissipation holes (31).

3. The integrated circuit chip according to claim 1, characterized in that: The mounting plate (3) further comprises a heat collecting groove (33) symmetrically opened at the top thereof for facilitating the entry of hot air into the interior of the mounting plate (3), and a heat dissipation net (34) is arranged inside the heat collecting groove (33) for accelerating the flow of hot air into the interior of the mounting plate (3).

4. The integrated circuit chip according to claim 1, characterized in that: The mounting sheet (3) further comprises a first connecting pad (35) arranged on the top thereof, and a through groove (36) is provided on the top of the first connecting pad (35) corresponding to the heat collecting groove (33), the first connecting pad (35) is bonded to the mounting sheet (3), and the other side of the first connecting pad (35) is bonded to the bottom of the chip body (1).

5. The integrated circuit chip according to claim 1, characterized in that: The pad foot (5) further comprises a second connection pad (51) arranged at the bottom thereof, the second connection pad (51) is bonded to the pad foot (5), and the bottom of the second connection pad (51) is bonded to the circuit board.

6. The integrated circuit chip according to claim 1, characterized in that: The button fan (4) is fixedly connected to the inside of the mounting plate (3), and the diameter of the button fan (4) is four centimeters.

Images