Circuit board and electronic device

Abstract

The utility model provides a circuit board and an electronic device. The circuit board comprises a substrate, a coil and a heat dissipation module. The heat dissipation module is arranged in the area, corresponding to the coil, in the substrate, the N-type semiconductors and the P-type semiconductors in the heat dissipation module form the power-on loop, and when charges move from the N-type semiconductors with low energy levels to the P-type semiconductors with high energy levels, heat generated by heat sources such as the substrate and the coil can be absorbed; and heat is released when the charges move from the high-energy-level P-type semiconductor to the low-energy-level N-type semiconductor, so that the heat is quickly dissipated, and the heat dissipation efficiency is improved. And the heat dissipation module is embedded in the substrate, so that the space utilization rate is improved while the heat dissipation efficiency is improved. The circuit board also has the characteristics of being ultrathin and capable of being dynamically bent, and is suitable for a wireless charging technology of a folding screen mobile phone.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board and an electronic device. Background Art

[0002] With the upgrade of energy transmission methods, wireless charging technology has become one of the indispensable transmission methods for automotive electronics and consumer electronics, and has great potential for future development.

[0003] However, wireless charging has a large energy loss. For every 100 parts of charging energy used, one part is lost and converted into heat. Currently, wireless charging devices on the market generally use a heat sink or heat dissipation copper foil on the back of the wireless charging coil (circuit board) at the receiving end, and a fan at the wireless charging coil at the charging end to reduce the damage to electronic components caused by the heat generated by charging. However, the heat dissipation effect of the above method is limited. Utility Model Content

[0004] In view of this, the present application proposes a circuit board and an electronic device with improved heat dissipation effect.

[0005] One embodiment of the present application provides a circuit board, which includes a substrate, a coil and a heat dissipation module. The substrate includes at least one dielectric layer and a circuit layer arranged on the surface of the dielectric layer, and the circuit layer includes an electrical connection portion. Along the extension direction of the substrate, the substrate includes a first area and a second area. The electrical connection portion is located in the first area, and the second area is a bendable area. The coil is arranged on the surface of the first area. The heat dissipation module includes a first insulating layer, a second insulating layer and at least one pair of semiconductor components arranged between the first insulating layer and the second insulating layer. Each pair of semiconductor components includes an N-type semiconductor and a P-type semiconductor, and the first insulating layer is connected to the electrical connection portion.

[0006] In one embodiment, the heat dissipation module further includes a first metal layer, and the first metal layer is disposed between the first insulating layer and the semiconductor component.

[0007] In one embodiment, the heat dissipation module further includes a second metal layer, and the second metal layer is disposed between the second insulating layer and the semiconductor component.

[0008] In one embodiment, the heat dissipation module further includes a power supply, and the power supply is electrically connected to the semiconductor component.

[0009] In one embodiment, the substrate further includes a protective layer, the protective layer is disposed on the surface of the outermost circuit layer, and the electrical connection portion is exposed from the protective layer.

[0010] In one embodiment, the coil is disposed on a surface of the protective layer facing away from the circuit layer.

[0011] In one embodiment, the thickness of the substrate is 79 μm.

[0012] In one embodiment, the first insulating layer is a ceramic sheet.

[0013] In one embodiment, the second insulating layer is a ceramic sheet.

[0014] An embodiment of the present application provides an electronic device, which includes the circuit board as described above.

[0015] The present application sets a heat dissipation module in the area corresponding to the coil in the substrate. The N-type semiconductor and P-type semiconductor in the heat dissipation module form a power-on circuit. When the charge moves from the low-energy-level N-type semiconductor to the high-energy-level P-type semiconductor, it can absorb the heat generated by heat sources such as the substrate and the coil. When the charge moves from the high-energy-level P-type semiconductor to the low-energy-level N-type semiconductor, it releases heat, thereby quickly dissipating the heat and improving the heat dissipation efficiency. The heat dissipation module is embedded in the substrate, which improves the heat dissipation efficiency while also improving the space utilization. The circuit board of the present application also has the characteristics of being ultra-thin and dynamically bendable, and is suitable for the wireless charging technology of foldable screen mobile phones. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of a circuit board according to an embodiment of the present application.

[0017] Figure 2 for Figure 1 A cross-sectional view of a circuit board is shown.

[0018] Figure 3 for Figure 1 Schematic diagram of the heat dissipation module shown

[0019] Figure 4 A schematic diagram of the module composition of an electronic device provided in one embodiment of the present application.

[0020] Main component symbols

[0021] Circuit board 100

[0022] Substrate 10

[0023] Coil 20

[0024] Cooling module 30

[0025] First Area 11

[0026] Second Area 12

[0027] Dielectric layer 101

[0028] Circuit layer 102

[0029] Electrical connection portion 103

[0030] Protective layer 104

[0031] Conductive structure 105

[0032] Adhesive layer 1041

[0033] Base material layer 1042

[0034] First insulating layer 31

[0035] The second insulating layer 32

[0036] Semiconductor components 33

[0037] First metal layer 34

[0038] The second metal layer 35

[0039] Power Supply 36

[0040] N-type semiconductor 331

[0041] P-type semiconductor 332

[0042] Electronic device 200

[0043] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the technical field of the present application. The terms used herein are only for the purpose of describing specific implementation methods and are not intended to limit the present application embodiments.

[0045] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0046] It will be understood that when a layer is referred to as being “on” another layer, it can be directly on the other layer or intervening layers may be present therebetween. In contrast, when a layer is referred to as being “directly on” another layer, there are no intervening layers present.

[0047] Here, the embodiments of the present application are described with reference to the cross-sectional views, which are schematic diagrams of the idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes of the diagrams are different due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions illustrated here, but should include deviations in shapes such as those produced due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not intended to illustrate the actual shapes of the devices, and are not intended to limit the scope of the present application.

[0048] It should be noted that when a component is referred to as being "fixed to" or "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time.

[0049] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0050] See also Figure 1 and Figure 2 In a first aspect, the present application provides a circuit board 100 , which includes a substrate 10 , a coil 20 and a heat dissipation module 30 .

[0051] The substrate 10 is a circuit substrate formed with a conductive circuit layer, which includes at least one dielectric layer 101 and a circuit layer 102 disposed on the surface of the dielectric layer 101, and the circuit layer 102 includes an electrical connection portion 103. In this embodiment, the substrate 10 includes a dielectric layer 101 and circuit layers 102 respectively disposed on two opposite surfaces of the dielectric layer 101. In other embodiments, the number of dielectric layers 101 and circuit layers 102 can be increased, and each dielectric layer 101 is disposed between two adjacent circuit layers 102. The electrical connection portion 103 can be, but is not limited to, a pad.

[0052] Along the extension direction of the substrate 10 (which may be the length direction or the width direction), the substrate 10 includes a first region 11 and a second region 12. The electrical connection portion 103 is located in the first region 11, and the second region 12 is a bendable region. Furthermore, the material of the dielectric layer 101 may be, but is not limited to, flexible substrates such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate diformicacid glycol ester (PEN flexible), polydimethylsiloxane (PDMS), and liquid crystal polymer (LCP). In this embodiment, the material of the dielectric layer 101 is PI.

[0053] The coil 20 is disposed on the surface of the first area 11 of the substrate 10, and the electrical connection portion 103 may be exposed from the central area of ​​the coil 20. The coil 20 refers to a ring-shaped wire winding, which can generate a certain current through the principle of electromagnetic induction, thereby completing wireless charging of the electronic device.

[0054] See also Figure 2 and Figure 3 The heat dissipation module 30 includes a first insulating layer 31, a second insulating layer 32, and at least one pair of semiconductor components 33 disposed between the first insulating layer 31 and the second insulating layer 32, each pair of semiconductor components 33 includes an N-type semiconductor 331 and a P-type semiconductor 332. The first insulating layer 31 of the heat dissipation module 30 can be welded to the electrical connection portion 103 (that is, the heat dissipation module 30 roughly corresponds to the central area of ​​the coil 20) by SMT (surface mount technology), thereby completing the fixed connection between the substrate 10 and the heat dissipation module 30. The heat dissipation module 30 is embedded in the substrate 10, which improves the space utilization.

[0055] For the power-on circuit formed by the N-type semiconductor 331 and the P-type semiconductor 332, since the energy levels of the N-type semiconductor 331 and the P-type semiconductor 332 are different, when the charge moves from the low-energy-level N-type semiconductor 331 to the high-energy-level P-type semiconductor 332, heat is absorbed at one joint between the N-type semiconductor 331 and the P-type semiconductor 332 (i.e., the first insulating layer 31), and when the charge moves from the high-energy-level P-type semiconductor 332 to the low-energy-level N-type semiconductor 331, heat is released at the other joint between the N-type semiconductor 331 and the P-type semiconductor 332 (i.e., the second insulating layer 32), thereby quickly dissipating the generated heat.

[0056] In some embodiments, the N-type semiconductor 331 may be an N-type semiconductor block or an N-type semiconductor slice, and the P-type semiconductor 332 may be a P-type semiconductor block or a P-type semiconductor slice, which is not limited in the present application.

[0057] In some embodiments, the first insulating layer 31 may be, but not limited to, a ceramic sheet, and the second insulating layer 32 may be, but not limited to, a ceramic sheet. In other embodiments, the first insulating layer 31 and the second insulating layer 32 may also be other insulating sheets, which may be determined according to actual use requirements and are not limited in this application.

[0058] like Figure 2 As shown, in some embodiments, the substrate 10 further includes a protective layer 104. The protective layer 104 is disposed on the surface of the outermost circuit layer 102, and the electrical connection portion 103 may be exposed from the protective layer 104. In this embodiment, the protective layer 104 is a cover-lay (CVL), and in other embodiments, the protective layer 104 may also be a solder mask. In this embodiment, the protective layer 104 includes an adhesive layer 1041 and a base material layer 1042, and the adhesive layer 1041 is located between the base material layer 1042 and the circuit layer 102. The adhesive layer 1041 may be, but not limited to, acrylic hot melt adhesive (AD adhesive), and the base material layer 1042 may be, but not limited to, PI or PET.

[0059] like Figure 1 and 2 As shown, in some embodiments, the coil 20 is disposed on a surface of the protection layer 104 facing away from the circuit layer 102 .

[0060] In some embodiments, the substrate 10 is an ultra-thin substrate, and its thickness (thickness at the thickest point) may be 79 μm. Figure 2 As shown, the substrate 10 includes a dielectric layer 101, two circuit layers 102 and two protective layers 104. The thickness of the base material layer 1042 in each protective layer 104 is 7.5 μm, the thickness of the glue layer 1041 in each protective layer 104 is 10 μm, the thickness of the portion of the conductive structure 105 protruding from the surface of the circuit layer 102 is 12 μm, the thickness of each circuit layer 102 is 10 μm, and the thickness of the dielectric layer 101 is 12 μm.

[0061] In some embodiments, the substrate 10 may be formed by a flexible copper clad laminate (FCCL) through an image transfer process and an etching process. The flexible copper clad laminate (FCCL) may include a dielectric layer 101 and copper foil layers (not shown) formed on two opposite surfaces of the dielectric layer. Specifically, a plurality of blind holes (not shown) may be formed on the flexible copper clad laminate by mechanical drilling or laser drilling. The blind holes may penetrate the dielectric layer and one of the copper foil layers along the thickness direction and expose a portion of the surface of the other copper foil layer. Then, copper metal may be arranged in the blind holes and on their surfaces by chemical copper deposition, electroplating, and the like to form a conductive structure 105. Next, the two copper foil layers may be separately manufactured to form a circuit layer 102 by steps of lamination, exposure, development, etching, and film stripping. The circuit layer 102 includes an electrical connection portion 103. The lamination, exposure, development, etching, and film stripping steps are commonly used technical means in the art and will not be described in detail herein. Finally, a protective layer 104 may be arranged on the outer surface of the circuit layer 102 to obtain a conductive structure 105. Figure 2 The substrate 10 is shown.

[0062] like Figure 3 As shown, in some embodiments, the heat dissipation module 30 further includes a first metal layer 34. The first metal layer 34 is disposed between the first insulating layer 31 and the semiconductor component 33, and contacts both the first insulating layer 31 and the semiconductor component 33. The first metal layer 34 may be, but is not limited to, a copper sheet.

[0063] like Figure 3 As shown, in some embodiments, the heat dissipation module 30 further includes a second metal layer 35. The second metal layer 35 is disposed between the second insulating layer 32 and the semiconductor component 33, and is in contact with both the second insulating layer 32 and the semiconductor component 33. The second metal layer 35 may be, but is not limited to, a copper sheet.

[0064] like Figure 3 As shown, in some embodiments, the heat dissipation module 30 further includes a power supply 36. The power supply 36 is electrically connected to the semiconductor component 33, and the power supply 36 can be a direct current power supply.

[0065] like Figure 3 As shown, in some embodiments, multiple pairs of semiconductor components 33 are provided between the first insulating layer 31 and the second insulating layer 32. The multiple pairs of semiconductor components 33 can be connected to a power supply 36, that is, the semiconductor components 33 can form a power-on circuit. Further, the multiple pairs of semiconductor components 33 can be connected in series, in parallel, and in mixed connection. In other embodiments, each pair of semiconductor components 33 of the multiple pairs of semiconductor components 33 can be connected to a power supply 36, that is, the multiple pairs of semiconductor components 33 can form multiple independent power-on circuits.

[0066] See also Figure 4In a second aspect, the present application further provides an electronic device 200 including the above-mentioned circuit board 100. The electronic device 200 may be, but is not limited to, a mobile phone, and the mobile phone may be, but is not limited to, a folding screen mobile phone. The circuit board 100 may be used for wireless charging of the mobile phone. The heat dissipation module 30 of the circuit board 100 may be arranged toward the back cover of the mobile phone (not shown), and thermal conductive silicone grease may be arranged between the heat dissipation module 30 and the back cover of the mobile phone to further improve the heat dissipation efficiency.

[0067] The present application sets a heat dissipation module 30 in the area corresponding to the coil 20 in the substrate 10. The N-type semiconductor 331 and the P-type semiconductor 332 in the heat dissipation module 30 form a power-on circuit. When the charge moves from the low-energy-level N-type semiconductor 331 to the high-energy-level P-type semiconductor 332, it can absorb the heat generated by heat sources such as the substrate 10 and the coil 20, and when the charge moves from the high-energy-level P-type semiconductor 332 to the low-energy-level N-type semiconductor 331, it releases heat, thereby quickly dissipating the heat and improving the heat dissipation efficiency. The heat dissipation module 30 is embedded in the substrate 10, which improves the heat dissipation efficiency while also improving the space utilization. The circuit board 100 of the present application also has the characteristics of being ultra-thin and dynamically bendable, and is suitable for the wireless charging technology of foldable screen mobile phones.

[0068] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A circuit board, characterized in that: include: A substrate, comprising at least one dielectric layer and a circuit layer disposed on a surface of the dielectric layer, wherein the circuit layer comprises an electrical connection portion; along an extension direction of the substrate, the substrate comprises a first region and a second region, wherein the electrical connection portion is located in the first region, and the second region is a bendable region; a coil disposed on a surface of the first region; and The heat dissipation module comprises a first insulating layer, a second insulating layer and at least one pair of semiconductor components arranged between the first insulating layer and the second insulating layer, each pair of semiconductor components comprises an N-type semiconductor and a P-type semiconductor, and the first insulating layer is connected to the electrical connection portion.

2. The circuit board according to claim 1, characterized in that The heat dissipation module further includes a first metal layer, which is disposed between the first insulating layer and the semiconductor component.

3. The circuit board according to claim 1, characterized in that: The heat dissipation module further includes a second metal layer, and the second metal layer is arranged between the second insulating layer and the semiconductor component.

4. The circuit board according to claim 1, characterized in that: The heat dissipation module also includes a power supply, which is electrically connected to the semiconductor component.

5. The circuit board according to claim 1, wherein: The substrate further comprises a protective layer, which is arranged on the surface of the outermost circuit layer, and the electrical connection portion is exposed from the protective layer.

6. The circuit board according to claim 5, characterized in that: The coil is arranged on a surface of the protection layer away from the circuit layer.

7. The circuit board according to claim 1, characterized in that: The thickness of the substrate is 79 μm.

8. The circuit board according to claim 1, wherein: The first insulating layer is a ceramic sheet.

9. The circuit board according to claim 1, characterized in that: The second insulating layer is a ceramic sheet.

10. An electronic device, characterized in that: Comprising the circuit board as claimed in any one of claims 1 to 9.

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