Multi-layer mixed-compression circuit board with good stability

Abstract

A multilayer mixed compression circuit board with good stability comprises a circuit board main body part, a mounting rack and a heat dissipation device, the circuit board main body part comprises a first circuit board, a second circuit board and a heat dissipation layer arranged between the first circuit board and the second circuit board, and the heat dissipation layer is provided with a plurality of heat conduction holes penetrating up and down. The heat dissipation layer is further provided with a plurality of heat dissipation holes penetrating left and right, and the heat conduction holes are communicated with the heat dissipation holes. The left end and the right end of the heat dissipation layer extend out of the outer sides of the first circuit board and the second circuit board, and positioning holes are formed in the upper side and the lower side of the heat dissipation holes in the two ends of the heat dissipation layer; the mounting frame comprises two side brackets which are oppositely arranged, and the side brackets are respectively arranged on the left side and the right side of the heat dissipation layer; the heat dissipation device comprises a fan assembly and a heat dissipation piece, and the fan assembly and the heat dissipation piece are arranged on the left side and the right side of the heat dissipation layer respectively and correspond to the heat dissipation holes. The circuit board provided by the utility model is good in heat dissipation performance and strong in practicability.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a multi-layer mixed-pressure circuit board with good stability. Background Art

[0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, and improve the level of automation and production labor rate. Multilayer printed circuit boards are made by combining printed circuit boards. Multilayer circuit boards have high assembly density and small size. As the size of electronic products becomes smaller and smaller, higher requirements are placed on the functions of circuit boards, and the demand for multilayer circuit boards is also increasing. However, since multilayer circuit boards do not have a good heat dissipation structure, when multilayer circuit boards are used, the layers of circuit boards conduct heat to each other, which will affect the stability of the connection between the lines and the service life of the circuit boards. Utility Model Content

[0003] Based on this, it is necessary to provide a multi-layer hybrid circuit board with good stability in view of the deficiencies in the prior art.

[0004] A multilayer hybrid circuit board with good stability, comprising a circuit board main body, a mounting frame and a heat dissipation device, wherein the circuit board main body comprises a first circuit board, a second circuit board and a heat dissipation layer arranged between the first circuit board and the second circuit board, the heat dissipation layer is provided with a plurality of heat conduction holes penetrating vertically, the heat dissipation layer is also provided with a plurality of heat dissipation holes penetrating horizontally, and the heat conduction holes are connected with the heat dissipation holes; the left and right ends of the heat dissipation layer both extend out of the outside of the first circuit board and the second circuit board, and the two ends of the heat dissipation layer are also provided with positioning holes on the upper and lower sides of the heat dissipation holes; the mounting frame comprises two oppositely arranged side brackets, and the side brackets are respectively arranged on the left and right sides of the heat dissipation layer; the heat dissipation device comprises a fan assembly and a heat dissipation element, and the fan assembly and the heat dissipation element are respectively installed on the left and right sides of the heat dissipation layer, and are both arranged corresponding to the heat dissipation holes, and the inner ends of the fan assembly and the heat dissipation element are both provided with guide pillars, and the guide pillars are installed in the positioning holes of the heat dissipation layer.

[0005] Furthermore, the side bracket includes two columns, and the columns are provided with long holes extending in the up-down direction; the heat sink and the fan assembly are respectively mounted on the two columns on the same side.

[0006] Furthermore, a heat conducting member is arranged between the heat dissipation layer and the first circuit board and the second circuit board. The heat conducting member is arranged in a hollow tubular shape and is connected to the first circuit board and the heat dissipation layer, and to the second circuit board and the heat dissipation layer.

[0007] Furthermore, mounting holes are provided on the bottom surface of the first circuit board and the top surface of the second circuit board, one end of the heat conducting member is connected to the mounting hole, and the other end extends into the corresponding heat conducting hole.

[0008] Furthermore, a bottom plate is provided at the bottom end of the side bracket, and a fixing hole is provided on the bottom plate.

[0009] Furthermore, the fan assembly includes a fan and an air guide tube arranged on one side of the fan, one end of the air guide tube is installed on the air outlet of the fan, and the other end surface is installed on the end surface of the heat dissipation layer.

[0010] Furthermore, a bearing plate is provided at the bottom of the inner side of the air guide tube, and the bearing plate extends to the bottom end of the heat dissipation layer.

[0011] Furthermore, mounting parts are provided on both outer sides of the fan, and the mounting parts are mounted in the long holes of the side bracket by bolts.

[0012] Furthermore, the heat sink comprises a base plate and a plurality of heat sink fins arranged in sequence on the outer side of the base plate; the base plate is provided with through holes penetrating inside and outside, and the through holes are arranged in a one-to-one correspondence with the heat sink holes.

[0013] Furthermore, a bearing plate is also disposed on the inner side surface of the heat sink, and the bearing plate is supported on the bottom end of the heat dissipation layer.

[0014] In summary, the utility model is provided with two side brackets, a heat sink and a fan assembly installed on the side brackets, and a circuit board main body installed between the heat sink and the fan assembly. The heat dissipation layer of the circuit board main body can dissipate heat inside the circuit board main body, thereby avoiding heat conduction between the first circuit board and the second circuit board, which causes excessive heat. The heat dissipation layer is dissipated in a targeted manner by the fan and the heat sink, and the heat dissipation efficiency is high. In addition, when installing, the circuit board can be adjusted up and down according to actual needs, and has high flexibility. The utility model is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural schematic diagram of a multi-layer mixed-pressure circuit board with good stability according to the utility model;

[0016] Figure 2 for Figure 1 Schematic diagram of the structure of the heat dissipation layer;

[0017] Figure 3 for Figure 1 A schematic diagram of the connection structure between the middle heat dissipation layer and the first circuit board;

[0018] Figure 4 for Figure 1A schematic diagram of the structure of the middle heat sink and the side bracket;

[0019] Figure 5 is a schematic diagram of the structure of a fan assembly;

[0020] Figure 6 It is a partial structural schematic diagram of the heat sink and the main body of the circuit board. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] like Figures 1 to 6 As shown, it is a multilayer hybrid circuit board with good stability provided by the utility model. The multilayer hybrid circuit board with good stability includes a circuit board main body 10, a mounting frame 20 and a heat dissipation device 30, and the circuit board main body 10 and the heat dissipation device 30 are both installed on the mounting frame 20.

[0023] The circuit board body 10 includes a first circuit board 11, a second circuit board 12, and a heat dissipation layer 13 disposed between the first circuit board 11 and the second circuit board 12. It is understandable that the circuit board body 10 may also include more than three circuit boards, and the heat dissipation layer 13 is disposed between the circuit boards. The heat dissipation layer 13 is provided with a plurality of heat conduction holes 131 penetrating from top to bottom, and the heat dissipation layer 13 is also provided with a plurality of heat dissipation holes 132 penetrating from left to right, and the heat conduction holes 131 are connected to the heat dissipation holes 132. A heat conducting member 40 is also disposed between the heat dissipation layer 13 and the first circuit board 11 and the second circuit board 12. The heat conducting member 40 is arranged in a hollow tubular shape, and is connected to the first circuit board 11 and the heat dissipation layer 13, and to the second circuit board 12 and the heat dissipation layer 13.

[0024] Specifically, mounting holes are provided on the bottom surface of the first circuit board 11 and the top surface of the second circuit board 12, one end of the heat conductive member 40 is connected to the mounting hole, and the other end extends into the corresponding heat conductive hole 131. The heat conductive member 40 is an existing material with good thermal conductivity. The provision of the heat conductive member 40 can not only improve the thermal conductivity, but also play a certain degree of connection and positioning role between the first circuit board 11, the second circuit board 12 and the heat dissipation layer 13. The left and right ends of the heat dissipation layer 13 extend out of the outside of the first circuit board 11 and the second circuit board 12, and the two ends of the heat dissipation layer 13 are also provided with positioning holes 133 on the upper and lower sides of the heat dissipation hole 132.

[0025] The mounting frame 20 includes two side brackets 21 arranged opposite to each other, and the side bracket 21 includes two columns 211, and the columns 211 are provided with long holes 212 extending in the up-down direction. A bottom plate 213 is provided at the bottom end of the side bracket 21, and the bottom plate 213 is provided with fixing holes for easy installation by bolts. The heat dissipation device 30 includes a fan assembly 31 and a heat dissipation element 32, and the fan assembly 31 and the heat dissipation element 32 are respectively installed on the left and right sides of the heat dissipation layer 13, and are both arranged corresponding to the heat dissipation holes 132. The fan assembly 31 includes a fan 311 and an air guide tube 312 arranged on one side of the fan 311. One end of the air guide tube 312 is installed on the air outlet of the fan 311, and a plurality of guide pillars 313 are arranged on the other end surface. The guide pillars 313 are embedded in the positioning holes 133 of the heat dissipation layer 13, and the inner end outlet of the air guide tube 312 is consistent with the end surface size of the heat dissipation layer 13, so that wind can blow into all the heat dissipation holes 132.

[0026] The inner bottom end of the air guide tube 312 is also provided with a bearing plate 314, and the bearing plate 314 extends to the bottom end of the heat dissipation layer 13 to further support the heat dissipation layer 31. The fan 311 is provided with mounting parts on both sides, and the mounting parts are installed in the long hole 212 of the side bracket 21 by bolts. The long hole 212 is provided so that the fan can be installed by moving up and down. In this embodiment, the heat dissipation element 32 is installed on the side bracket 21 in the same manner as the fan 31, and is also installed in the long hole 212 by bolts.

[0027] The heat sink 32 includes a bottom plate 321 and a plurality of heat sink fins 322 arranged in sequence on the outer side of the bottom plate 321; the bottom plate 321 is provided with through holes 323 that penetrate inside and outside, and the through holes 323 are arranged in a one-to-one correspondence with the heat sink holes 132. The inner side of the heat sink 32 is also provided with guide posts 324 and a supporting plate 325, the guide posts 324 are installed in the positioning holes 133 of the heat sink layer 13, and the supporting plate 325 is supported at the bottom end of the heat sink layer 13.

[0028] During installation, first install the brackets 21 on both sides according to the size of the circuit board body 10, then install the corresponding fan assembly 31 or heat sink 32 on one side of the bracket 21, then snap the circuit board body 10 onto the installed fan assembly 31 or heat sink 32, then snap the heat sink 32 or fan assembly 31 on the other side onto the heat dissipation layer 13 of the circuit board body 10, and then lock the heat sink 32 or fan assembly 31 onto the side bracket 21. During use, the heat conducting member 40 can quickly conduct the heat on the first circuit board 11 and the second circuit board 12 to the heat dissipation layer 13, and then transfer it to the heat dissipation hole 132 through the heat conducting hole 131 of the heat dissipation layer 13, and the fan 311 blows the hot air from the heat dissipation hole 132 to one side of the heat dissipation member 32 for rapid heat dissipation. The wind blown by the fan 311 will drive the wind flow in the heat conducting member 40 and the heat conducting hole 131, thereby further improving the heat dissipation efficiency.

[0029] In summary, the utility model is provided with two side brackets 21, a heat sink 32 and a fan assembly 31 installed on the side brackets 21, and a circuit board main body 10 installed between the heat sink 32 and the fan assembly 31. The heat dissipation layer 13 of the circuit board main body 10 can dissipate heat inside the circuit board main body 10, thereby avoiding heat conduction between the first circuit board 11 and the second circuit board 12, which causes excessive heat. The heat dissipation layer 13 is dissipated in a targeted manner by the fan 311 and the heat sink 32, and the heat dissipation efficiency is high. In addition, when installing, the circuit board can be adjusted up and down according to actual needs, and the flexibility is high. The utility model is highly practical and has a strong promotion significance.

[0030] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A multi-layer mixed-pressure circuit board with good stability, characterized in that: The invention comprises a circuit board main body, a mounting frame and a heat dissipation device, wherein the circuit board main body comprises a first circuit board, a second circuit board and a heat dissipation layer arranged between the first circuit board and the second circuit board, the heat dissipation layer is provided with a plurality of heat conduction holes penetrating vertically, the heat dissipation layer is also provided with a plurality of heat dissipation holes penetrating horizontally, and the heat conduction holes are communicated with the heat dissipation holes; the left and right ends of the heat dissipation layer extend out of the outside of the first circuit board and the second circuit board, and the two ends of the heat dissipation layer are also provided with positioning holes on the upper and lower sides of the heat dissipation holes; the mounting frame comprises two oppositely arranged side brackets, and the side brackets are respectively arranged on the left and right sides of the heat dissipation layer; the heat dissipation device comprises a fan assembly and a heat dissipation member, and the fan assembly and the heat dissipation member are respectively installed on the left and right sides of the heat dissipation layer, and are both arranged corresponding to the heat dissipation holes, and the inner ends of the fan assembly and the heat dissipation member are provided with guide pillars, and the guide pillars are installed in the positioning holes of the heat dissipation layer.

2. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: The side bracket comprises two columns, and the columns are provided with long holes extending in the up-down direction; the heat sink and the fan assembly are respectively mounted on the two columns on the same side.

3. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: A heat conducting member is further arranged between the heat dissipation layer and the first circuit board and the second circuit board. The heat conducting member is arranged in a hollow tubular shape and is connected to the first circuit board and the heat dissipation layer, and to the second circuit board and the heat dissipation layer.

4. A multi-layer hybrid circuit board with good stability as claimed in claim 3, characterized in that: The bottom surface of the first circuit board and the top surface of the second circuit board are both provided with mounting holes, one end of the heat conducting member is connected to the mounting hole, and the other end extends into the corresponding heat conducting hole.

5. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: A bottom plate is disposed at the bottom end of the side bracket, and a fixing hole is disposed on the bottom plate.

6. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: The fan assembly comprises a fan and an air guide tube arranged on one side of the fan, one end of the air guide tube is installed on the air outlet of the fan, and the other end surface is installed on the end surface of the heat dissipation layer.

7. A multi-layer hybrid circuit board with good stability as claimed in claim 6, characterized in that: A bearing plate is also provided at the bottom of the inner side of the air guide tube, and the bearing plate extends to the bottom end of the heat dissipation layer.

8. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: Mounting parts are arranged on both outer sides of the fan, and the mounting parts are mounted in the long holes of the side bracket by bolts.

9. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: The heat sink comprises a bottom plate and a plurality of heat sink fins arranged in sequence on the outer side of the bottom plate; the bottom plate is provided with through holes penetrating inside and outside, and the through holes are arranged in a one-to-one correspondence with the heat sink holes.

10. A multi-layer hybrid circuit board with good stability as claimed in claim 1, characterized in that: The inner side surface of the heat sink also has a bearing plate, and the bearing plate is supported on the bottom end of the heat sink layer.

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