PCBA board card with good heat dissipation performance

Abstract

The utility model relates to the technical field of PCBA board cards, in particular to a PCBA board card with good heat dissipation performance. The problems that in the using process of a traditional PCBA board card, the temperature of the PCBA board card is increased, but due to the fact that the heat dissipation and cooling effect of the PCBA board card is poor, the service life of the PCBA board card is affected, and cooling and heat dissipation are inconvenient to achieve are solved. The utility model provides a PCBA board card with good heat dissipation performance. The PCBA board card comprises a heat dissipation assembly, a sliding assembly and a ventilation assembly. Compared with a traditional PCBA board card, in the using process of the traditional PCBA board card, the temperature of the PCBA board card is increased, but the service life of the PCBA board card is affected due to the fact that the heat dissipation and cooling effect of the PCBA board card is very poor, and therefore cooling and heat dissipation are inconvenient to achieve, the PCBA board card is provided with a heat dissipation structure and a ventilation structure, firstly, through the arrangement of the heat dissipation structure and the ventilation structure, the heat dissipation effect of the PCBA board card is improved, and the heat dissipation effect of the PCBA board card is improved. The heat dissipation box is slidably spliced with the fixing frame through the sliding structure, then the heat dissipation box is limited and fixed through the limiting structure, and the heat dissipation box is attached to the PCBA board card through the heat dissipation structure, so that the cooling and heat dissipation effects on the PCBA board card can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCBA boards, and in particular to a PCBA board with good heat dissipation performance. Background Art

[0002] PCBA, that is to say, the whole process of PCB blank board through SMT mounting or DIP plug-in, is referred to as PCBA. PCB, Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Since it is made by electronic printing, it is called "printed" circuit board. Printed circuit board is an important electronic component, a support for electronic components, and a provider of circuit connection of electronic components. The utility model relates to the technical field of PCBA board card. With the development of society, the PCBA board card industry is becoming more and more developed. PCBA board cards are also constantly improved to meet the needs of production. Most PCBA boards have the function of optimizing electrical layout, but the function of cooling and heat dissipation is not perfect enough. The long-term working and use of electrical components will cause the temperature of PCBA board cards to rise. However, since the heat dissipation and cooling effect of PCBA board cards is very poor, the service life of PCBA board cards will be affected, thereby inconvenient to achieve the problem of cooling and heat dissipation. Utility Model Content

[0003] In order to overcome the problem that the temperature of the PCBA board will rise when the electrical components are used for a long time during use, but the heat dissipation effect of the PCBA board is very poor, which will affect the service life of the PCBA board, making it inconvenient to achieve cooling and heat dissipation.

[0004] The technical scheme of the utility model is: a PCBA board with good heat dissipation performance, comprising a heat dissipation box, a fixing frame, a board body, a heat dissipation component, a sliding component, a ventilation component, a fixing component and a limit component; a fixing frame is arranged above the heat dissipation box, a board body is arranged inside the fixing frame, a sliding component is opened inside the fixing frame, a heat dissipation component with heat dissipation function is arranged inside the heat dissipation box, a ventilation component is arranged on a side wall of the heat dissipation box, and a limit component is arranged on the side wall of the heat dissipation box.

[0005] Preferably, first, the heat dissipation box is slidably spliced ​​with the fixed frame through a sliding component, and then, the heat dissipation box can be limited and fixed through the cooperation of the limiting components, and the heat dissipation component is fitted with the PCBA board, so that the PCBA board can achieve the effect of cooling and heat dissipation.

[0006] Preferably, the heat dissipation assembly includes a limit rod and a buffer cylinder; a limit rod is arranged inside the heat dissipation box, and multiple groups of limit rods are arranged; a buffer cylinder is arranged inside the heat dissipation box, and multiple groups of buffer cylinders are arranged; by setting multiple groups of limit rods, a limit support function can be achieved.

[0007] Preferably, the heat dissipation assembly also includes a buffer spring, a buffer plate and a heat sink; a buffer spring is arranged inside the buffer cylinder, a buffer plate is arranged above the buffer spring, a heat sink is arranged above the buffer plate, and multiple groups of heat sinks are arranged; when the buffer plate is subjected to external extrusion force, it shrinks and adjusts according to the rebound force generated by the elastic deformation of the buffer spring, which can drive multiple groups of heat sinks to fit with the PCBA board, thereby achieving the effect of cooling and heat dissipation of the PCBA board.

[0008] Preferably, the sliding assembly includes a protruding block and a sliding groove; protruding blocks are arranged on the upper sides of the heat dissipation box, and a sliding groove is opened at the bottom of the fixed frame, and the protruding blocks can be slidably connected to the fixed frame through the sliding groove; first, through the cooperation of the protruding blocks and the sliding groove, the heat dissipation box and the fixed frame can be slidably spliced, thereby achieving the effect of preliminary installation.

[0009] Preferably, the ventilation component includes a ventilation plate and ventilation holes; a ventilation plate is arranged on the side wall of the heat dissipation box, ventilation holes are opened on the side wall of the ventilation plate, and multiple groups of ventilation holes are opened; through the arrangement of the ventilation plate and the ventilation holes, the heat inside the heat dissipation box can be ventilated and dissipated through the ventilation component.

[0010] Preferably, the fixing assembly includes fixing ears and fixing holes; fixing ears are arranged on the side walls of the fixing frame, and multiple groups of fixing ears are arranged, and fixing holes are opened inside the fixing ears; through the arrangement of the fixing ears and the fixing holes, the fixing frame can be fixedly installed inside the electronic device.

[0011] Preferably, the limiting assembly includes a limiting nut, a limiting bolt and a limiting block; a limiting block is arranged at one end of the protruding block, a limiting bolt is arranged inside the limiting block, a limiting nut is arranged on the side wall of the limiting bolt, and the limiting nut is threadedly connected with the limiting bolt; through the cooperation between the limiting bolt and the limiting nut, the heat dissipation box can be limited and fixed.

[0012] Beneficial effects of the utility model:

[0013] 1. Compared with the traditional PCBA board, the long-term use of electrical components will cause the temperature of the PCBA board to rise. However, due to the poor heat dissipation and cooling effect of the PCBA board, the service life of the PCBA board will be affected, making it inconvenient to achieve the problem of cooling and heat dissipation. The PCBA board is provided with a heat dissipation structure and a ventilation structure. First, the heat dissipation box is slidably spliced ​​with the fixed frame through a sliding structure, and then the heat dissipation box is limited and fixed by a limiting structure, and the heat dissipation structure is fitted with the PCBA board, so that the PCBA board can achieve the effect of cooling and heat dissipation;

[0014] 2. First, the heat sink box and the fixed frame can be slidably spliced ​​by the cooperation of the raised block and the sliding groove, so as to achieve the effect of preliminary installation. Then, the heat sink box can be limited and fixed by the cooperation of the limit bolt and the limit nut. Moreover, when the buffer plate is subjected to external extrusion force, it can be contracted and adjusted according to the rebound force generated by the elastic deformation of the buffer spring, which can drive multiple groups of heat sinks to fit with the PCBA board, so as to achieve the effect of cooling and heat dissipation of the PCBA board;

[0015] 3. By setting the fixing ears and the fixing holes, the fixing frame can be fixedly installed inside the electronic device, and by setting the ventilation plate and the ventilation holes, the heat inside the heat dissipation box can be ventilated and dissipated through the ventilation assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 What is shown is a schematic diagram of a first three-dimensional structure of a PCBA board with good heat dissipation performance of the utility model;

[0017] Figure 2 Shown is a schematic diagram of a first partial three-dimensional structure of a PCBA board with good heat dissipation performance of the utility model;

[0018] Figure 3 Shown is a schematic diagram of a second partial three-dimensional structure of a PCBA board with good heat dissipation performance of the utility model;

[0019] Figure 4 Shown is a schematic diagram of the third partial three-dimensional structure of a PCBA board with good heat dissipation performance of the utility model;

[0020] Explanation of the accompanying drawings: 1. heat dissipation assembly; 2. sliding assembly; 3. ventilation assembly; 4. fixing assembly; 5. limiting assembly; 6. fixing frame; 7. heat dissipation box; 8. board body; 101. limiting rod; 102. buffer cylinder; 103. buffer spring; 104. buffer plate; 105. heat sink; 201. protrusion; 202. sliding groove; 301. ventilation plate; 302. ventilation hole; 401. fixing ear; 402. fixing hole; 501. limiting block; 502. limiting bolt; 503. limiting nut. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1 The utility model provides an embodiment: a PCBA board with good heat dissipation performance, including a heat dissipation box 7, a fixed frame 6, a board body 8, a heat dissipation component 1, a sliding component 2, a ventilation component 3, a fixed component 4 and a limit component 5; a fixed frame 6 is arranged above the heat dissipation box 7, a board body 8 is arranged inside the fixed frame 6, a sliding component 2 is opened inside the fixed frame 6, a heat dissipation component 1 with heat dissipation function is arranged inside the heat dissipation box 7, a ventilation component 3 is arranged on the side wall of the heat dissipation box 7, and a limit component 5 is arranged on the side wall of the heat dissipation box 7.

[0023] See also Figure 2 The heat dissipation assembly 1 includes a limit rod 101 and a buffer cylinder 102; a limit rod 101 is arranged inside the heat dissipation box 7, and the limit rod 101 is arranged in multiple groups, and a buffer cylinder 102 is arranged inside the heat dissipation box 7, and the buffer cylinder 102 is arranged in multiple groups; the setting of multiple groups of limit rods 101 can play a role of limit support; the heat dissipation assembly 1 also includes a buffer spring 103, a buffer plate 104 and a heat sink 105; a buffer spring 103 is arranged inside the buffer cylinder 102, a buffer plate 104 is arranged above the buffer spring 103, a heat sink 105 is arranged above the buffer plate 104, and the heat sink 105 is arranged in multiple groups; when the buffer plate 104 is affected The external extrusion pressure is contracted and adjusted according to the rebound force generated by the elastic deformation of the buffer spring 103, which can drive multiple groups of heat sinks 105 to fit with the PCBA board, so as to achieve the effect of cooling and heat dissipation of the PCBA board; the sliding component 2 includes a protruding block 201 and a sliding groove 202; protruding blocks 201 are arranged on the upper sides of the heat dissipation box 7, and a sliding groove 202 is opened at the bottom of the fixed frame 6, and the protruding block 201 can be slidably connected with the fixed frame 6 through the sliding groove 202; firstly, through the cooperation of the protruding block 201 and the sliding groove 202, the heat dissipation box 7 and the fixed frame 6 can be slidably spliced, so as to achieve the effect of preliminary installation.

[0024] See also Figure 3-4In this embodiment, the ventilation assembly 3 includes a ventilation plate 301 and ventilation holes 302; a ventilation plate 301 is provided on the side wall of the heat dissipation box 7, and ventilation holes 302 are provided on the side wall of the ventilation plate 301, and multiple groups of ventilation holes 302 are provided; through the arrangement of the ventilation plate 301 and the ventilation holes 302, the heat inside the heat dissipation box 7 can be ventilated and dissipated through the ventilation assembly 3; the fixing assembly 4 includes a fixing ear 401 and a fixing hole 402; a fixing ear 401 is provided on the side wall of the fixing frame 6, and multiple groups of fixing ears 401 are provided, and a fixing ear 401 is provided inside Fixed hole 402; by setting the fixing ear 401 and the fixing hole 402, the fixing frame 6 can be fixedly installed inside the electronic device; the limiting component 5 includes a limiting nut 503, a limiting bolt 502 and a limiting block 501; a limiting block 501 is set at one end of the protruding block 201, a limiting bolt 502 is set inside the limiting block 501, a limiting nut 503 is set on the side wall of the limiting bolt 502, and the limiting nut 503 is threadedly connected with the limiting bolt 502; the limiting bolt 502 and the limiting nut 503 cooperate with each other, so that the heat dissipation box 7 can be limited and fixed.

[0025] When working, first, the heat dissipation box 7 and the fixed frame 6 can be slidably spliced ​​by the cooperation of the protruding block 201 and the sliding groove 202, so as to achieve the effect of preliminary installation;

[0026] Then, the heat dissipation box 7 can be fixed in a limited position by the cooperation between the limiting bolt 502 and the limiting nut 503;

[0027] Furthermore, when the buffer plate 104 is subjected to external extrusion force, it shrinks and adjusts according to the resilience force generated by the elastic deformation of the buffer spring 103, which can drive the multiple groups of heat sinks 105 to fit with the PCBA board, thereby achieving the effect of cooling and dissipating the PCBA board;

[0028] At the same time, through the arrangement of the ventilation plate 301 and the ventilation holes 302 , the heat inside the heat dissipation box 7 can be ventilated and dissipated through the ventilation component 3 .

[0029] Through the above steps, first, the heat dissipation box 7 is slidably spliced ​​with the fixed frame 6 through the sliding component 2, and then, the heat dissipation box 7 can be limited and fixed through the cooperation of the limiting components 5, and the heat dissipation component 1 is fitted with the PCBA board, so that the effect of cooling and heat dissipation of the PCBA board can be achieved.

[0030] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A PCBA card with good heat dissipation performance, comprising a heat dissipation box (7); characterized in that: The invention also comprises a fixing frame (6), a board body (8), a heat dissipation component (1), a sliding component (2), a ventilation component (3), a fixing component (4) and a limiting component (5); the fixing frame (6) is arranged above the heat dissipation box (7), the board body (8) is arranged inside the fixing frame (6), the sliding component (2) is provided inside the fixing frame (6), the heat dissipation component (1) with heat dissipation function is arranged inside the heat dissipation box (7), the ventilation component (3) is arranged on the side wall of the heat dissipation box (7), and the limiting component (5) is arranged on the side wall of the heat dissipation box (7).

2. A PCBA card with good heat dissipation performance according to claim 1, characterized in that: The heat dissipation assembly (1) comprises a limit rod (101) and a buffer cylinder (102); the limit rod (101) is arranged inside the heat dissipation box (7), and a plurality of groups of the limit rods (101) are arranged; the buffer cylinder (102) is arranged inside the heat dissipation box (7), and a plurality of groups of the buffer cylinder (102) are arranged.

3. A PCBA card with good heat dissipation performance according to claim 2, characterized in that: The heat dissipation assembly (1) also includes a buffer spring (103), a buffer plate (104) and a heat sink (105); the buffer spring (103) is arranged inside the buffer cylinder (102), the buffer plate (104) is arranged above the buffer spring (103), the heat sink (105) is arranged above the buffer plate (104), and the heat sink (105) is arranged in multiple groups.

4. A PCBA card with good heat dissipation performance according to claim 1, characterized in that: The sliding assembly (2) comprises a protruding block (201) and a sliding groove (202); the protruding blocks (201) are arranged above both sides of the heat dissipation box (7), and the sliding groove (202) is opened below the fixed frame (6); the protruding block (201) can be slidably connected to the fixed frame (6) through the sliding groove (202).

5. A PCBA card with good heat dissipation performance according to claim 1, characterized in that: The ventilation assembly (3) comprises a ventilation plate (301) and ventilation holes (302); the ventilation plate (301) is arranged on the side wall of the heat dissipation box (7), the ventilation holes (302) are opened on the side wall of the ventilation plate (301), and the ventilation holes (302) are opened in multiple groups.

6. A PCBA card with good heat dissipation performance according to claim 1, characterized in that: The fixing assembly (4) comprises a fixing ear (401) and a fixing hole (402); the fixing ear (401) is arranged on the side wall of the fixing frame (6), a plurality of groups of the fixing ears (401) are arranged, and the fixing hole (402) is opened inside the fixing ear (401).

7. A PCBA card with good heat dissipation performance according to claim 5, characterized in that: The limiting assembly (5) comprises a limiting nut (503), a limiting bolt (502) and a limiting block (501); a limiting block (501) is arranged at one end of the protruding block (201), a limiting bolt (502) is arranged inside the limiting block (501), a limiting nut (503) is arranged on the side wall of the limiting bolt (502), and the limiting nut (503) is threadedly connected to the limiting bolt (502).

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