Pollution-free semiconductor automobile air conditioner

Abstract

The utility model provides a pollution-free semiconductor automobile air conditioner which comprises an automobile air conditioner body, a plate frame and a refrigeration heat conduction mechanism, and an outer shell is arranged at the upper end of the automobile air conditioner body. A plurality of groups of semiconductor chilling plates are connected with an external power supply through wires, so that the side surface of one end, close to the center of the outer shell, of each semiconductor chilling plate performs refrigeration, a heat conduction fan in a refrigeration heat conduction mechanism mounted in a mounting groove is started, and the hot surfaces of the semiconductor chilling plates perform heat conduction through a plurality of groups of heat conduction holes, so that air entering an inner cavity is cooled; the induced draft fan in the cold air pipe introduces cold air into the inner side of the cold air pipe, the refrigeration effect and the pollution-free effect can be achieved, by additionally arranging the automobile air conditioner body, condensate water generated by the semiconductor refrigeration piece flows downwards into the water collecting hole through the drainage groove and then is guided into the main water collecting pipe through the branch water collecting pipe to fall into the water tank, and the condensate water is conveniently collected.

Description

Technical Field

[0001] The utility model belongs to the technical field of automobile air conditioners, and particularly relates to a pollution-free semiconductor automobile air conditioner. Background Art

[0002] Most of the refrigeration of automobile air conditioners is achieved through refrigerants. The refrigerants widely used in the early days, such as R12 (Freon-12), contain chlorine atoms, which have a significant destructive effect on the ozone layer. In the atmosphere, chlorine atoms catalyze the decomposition of ozone molecules, leading to ozone layer depletion, increasing the degree of ultraviolet radiation reaching the earth's surface, and posing a threat to biological health and ecosystems. Modern automobile air conditioning systems generally use R134a (tetrafluoroethane) as a refrigerant. It does not contain chlorine and has no direct destructive effect on the ozone layer, but its global warming potential (GWP) is high, that is, the impact of unit mass of R134a released into the atmosphere on global warming is greater than that of carbon dioxide. Although the impact of R134a on the environment has been reduced compared to R12, it still poses a certain pressure on global climate change. With the development of society and the increase in people's income and savings, people's demand for cars has gradually increased, and the number of cars has gradually increased, which has caused cars to gradually increase atmospheric pollution during the refrigeration process, causing certain harm to life on Earth. Most automobile air conditioning heating systems use the heat generated by the engine to provide warm air for the car.

[0003] In summary, there are some problems in the use of automobile air conditioners that generate pollution, so it is hoped to propose a new structure to solve the above technical problems. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a pollution-free semiconductor automobile air conditioner to solve the problems raised in the above-mentioned background technology.

[0005] The utility model is realized through the following technical scheme: a pollution-free semiconductor automobile air conditioner, comprising: an automobile air conditioner main body, a plate frame and a refrigeration and heat conduction mechanism, an outer shell is provided at the upper end of the automobile air conditioner main body, the left side of the outer shell is vertically penetrated to form an inner cavity, a plurality of groups of plate frames for installing semiconductor refrigeration sheets are provided at both left and right ends of the inner cavity, mounting grooves for installing the refrigeration and heat conduction mechanism are provided on the inner side surfaces of the left and right ends of the inner cavity, and a refrigeration and heat conduction mechanism for dissipating heat when the semiconductor refrigeration sheet is cooled is provided on the inner side of the mounting groove.

[0006] As a preferred embodiment, a refrigeration plate groove is opened on the side of one end of the plate frame near the center of the outer shell, and a plurality of groups of semiconductor refrigeration plates for providing a refrigeration effect are arranged on the inner side of the refrigeration plate groove. The refrigeration surface of the semiconductor refrigeration plates can be used for cooling to reduce the air temperature in the inner cavity.

[0007] As a preferred embodiment, drainage grooves are provided on the inner sides of the front and rear ends of the cooling plate groove, the front and rear ends of the semiconductor cooling plate are embedded in the inner side of the drainage grooves, and the plate frame is vertically penetrated through the side of one end away from the center of the outer shell to form a plurality of groups of heat conduction holes.

[0008] As a preferred embodiment, a plurality of groups of the semiconductor cooling sheets are electrically connected to an external power supply through wires, and a frame body is provided outside the cooling and heat conducting mechanism;

[0009] The left side surface of the frame body and the four corners of the side surface of the mounting groove away from the center of the outer shell are all provided with mounting threaded holes, and the mounting threaded holes are provided with screws to fix the refrigeration and heat conduction mechanism.

[0010] As a preferred embodiment, a group of heat-conducting fans are provided at both the front and rear ends of the inner side of the frame body, a dust-proof net is provided at the end of the heat-conducting fan away from the center of the outer shell, a cold air duct is provided on the rear side of the outer shell, and a group of exhaust fans are provided on the inside of the cold air duct. Starting the heat-conducting fans can extract the heat generated by the hot surface of the semiconductor refrigeration plate, thereby improving the cooling effect.

[0011] As a preferred embodiment, a water collecting hole is opened at the lower end of the refrigeration plate groove, and a group of water collecting pipes is provided at the lower end of each group of water collecting holes.

[0012] As a preferred embodiment, a main water collecting pipe is provided at the lower end of the branch water collecting pipe and the branch water collecting pipe is connected to the main water collecting pipe. A water tank is provided under the outer shell. The condensed water generated by the semiconductor refrigeration plate flows down through the drainage groove to the water collection hole, and then is introduced into the main water collecting pipe through the branch water collecting pipe and falls into the water tank, so as to facilitate the collection of the condensed water.

[0013] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: by adding the main body of the automobile air conditioner and the refrigeration and heat conduction mechanism, several groups of semiconductor refrigeration plates are connected to the external power supply using wires to make them close to the side of one end of the center of the outer shell for cooling, and the heat conduction fan installed in the refrigeration and heat conduction mechanism in the installation groove is started, and the hot surface of the semiconductor refrigeration plate conducts heat through several groups of heat conduction holes to cool the air entering the inner cavity, and the induced fan in the cold air duct introduces cold air into the inner side of the cold air duct, which can achieve a cooling effect without pollution. By adding the main body of the automobile air conditioner, the condensed water generated by the semiconductor refrigeration plate flows down through the drainage groove to the water collection hole, and then is introduced into the main water collection pipe through the sub-collection pipe and falls into the water tank, which is convenient for collecting the condensed water. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 The utility model is a partial structural schematic diagram of a pollution-free semiconductor automobile air conditioner.

[0016] Figure 2 The utility model is a partial structural schematic diagram of an automobile air-conditioning main body in a pollution-free semiconductor automobile air-conditioning.

[0017] Figure 3 The utility model is a partial structural schematic diagram of a pollution-free semiconductor automobile air conditioner in which a water tank is removed from an automobile air conditioner main body.

[0018] Figure 4 The utility model is a partial cross-sectional schematic diagram of an automobile air-conditioning main body in a pollution-free semiconductor automobile air-conditioning.

[0019] Figure 5 The utility model is a schematic structural diagram of a refrigeration and heat conduction mechanism in a pollution-free semiconductor automobile air conditioner.

[0020] In the figure, 100-automobile air conditioner body, 101-outer shell, 102-inner cavity, 103-plate frame, 104-heat conduction hole, 105-refrigeration plate groove, 106-semiconductor refrigeration plate, 107-water collection hole, 108-sub-collection pipe, 109-main collection pipe, 110-cold air pipe, 111-installation slot, 112-water tank;

[0021] 200-cooling heat conduction mechanism, 201-frame body, 202-heat conduction fan, 203-dustproof net, 204-installation threaded hole;

[0022] 300-Screws. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figures 1 to 5The utility model provides a technical solution: a pollution-free semiconductor automobile air conditioner, comprising: an automobile air conditioner main body 100, a plate frame 103 and a refrigeration and heat conduction mechanism 200, and an outer shell 101 is provided at the upper end of the automobile air conditioner main body 100;

[0025] The left side of the outer shell 101 is vertically penetrated to form an inner cavity 102. Both left and right ends of the inner cavity 102 are provided with a plurality of sets of plate racks 103 for installing semiconductor cooling sheets 106. Both left and right inner sides of the inner cavity 102 are provided with installation grooves 111 for installing the cooling and heat conducting mechanism 200.

[0026] A cooling and heat-conducting mechanism 200 for dissipating heat when the semiconductor cooling plate 106 is cooled is disposed inside the mounting groove 111 .

[0027] A cooling plate groove 105 is provided on the side of one end of the plate frame 103 near the center of the outer shell 101, and a plurality of groups of linearly equally distributed semiconductor cooling plates 106 for providing a cooling effect are provided inside the cooling plate groove 105. The cooling surface of the semiconductor cooling plates 106 can be used to cool down the air temperature of the inner cavity 102.

[0028] Drainage grooves are provided on the inner sides of both ends of the cooling plate groove 105, and the front and rear ends of the semiconductor cooling plate 106 are embedded in the inner side of the drainage grooves. The side of the plate frame 103 away from the center of the outer shell 101 is vertically penetrated to form a plurality of groups of heat conduction holes 104.

[0029] A plurality of groups of semiconductor cooling sheets 106 are electrically connected to an external power supply through wires, and a frame body 201 is provided outside the cooling and heat conducting mechanism 200;

[0030] The left side of the frame body 201 and the four corners of the side of the mounting groove 111 away from the center of the outer shell 101 are provided with mounting threaded holes 204, and the mounting threaded holes 204 are provided with screws 300 to fix the cooling and heat conducting mechanism 200.

[0031] A group of heat-conducting fans 202 are provided at both the front and rear ends of the inner side of the frame body 201. A dust-proof net 203 is provided at the end of the heat-conducting fan 202 away from the center of the outer shell 101. A cold air duct 110 is provided on the rear side of the outer shell 101. A group of exhaust fans are provided on the inner side of the cold air duct 110. Starting the heat-conducting fan 202 can extract the heat generated by the hot surface of the semiconductor cooling plate 106, thereby improving the cooling effect.

[0032] See also Figure 1-Figure 5As the first embodiment of the utility model: first, several groups of semiconductor refrigeration sheets 106 are connected to an external power supply using wires to make them close to the refrigeration surface at one end of the center of the outer shell 101 for refrigeration. Secondly, the refrigeration heat conduction mechanism 200 is screwed into the mounting threaded hole 204 using a screw 300 and installed to the mounting groove 111. Starting the heat conduction fan 202 can lead the heat generated by the hot surface of the semiconductor refrigeration sheet 106 through several groups of heat conduction holes 104 for heat conduction, so that the air entering the inner cavity 102 is cooled. The user can start the induced draft fan in the cold air duct 110 to introduce cold air into the inner side of the cold air duct 110, thereby achieving a refrigeration effect without pollution.

[0033] A water collecting hole 107 is provided at the lower end of the cooling plate slot 105 , and a group of water collecting pipes 108 is provided at the lower end of each group of water collecting holes 107 .

[0034] A main water collecting pipe 109 is provided at the lower end of the sub-collecting pipe 108 and the sub-collecting pipe 108 and the main water collecting pipe 109 are interconnected. A water tank 112 is provided under the outer shell 101. The condensed water generated by the semiconductor refrigeration plate 106 flows down through the drainage groove to the water collecting hole 107, and then is introduced into the main water collecting pipe 109 through the sub-collecting pipe 108 and falls into the water tank 112, so as to collect the condensed water.

[0035] See also Figure 1-Figure 4 , as the second embodiment of the utility model: based on the above-mentioned first embodiment, a water collecting hole 107 is opened at the lower end of the refrigeration plate groove 105, and a group of water collecting holes 107 are provided at the lower end of each group of water collecting holes 107. A main collecting pipe 109 is provided at the lower end of the branch collecting pipe 108, and the branch collecting pipe 108 is connected with the main collecting pipe 109. A water tank 112 is provided under the outer shell 101. The condensed water generated by the semiconductor refrigeration plate 106 flows down through the drainage groove to the water collecting hole 107, and then is introduced into the main collecting pipe 109 through the branch collecting pipe 108 and falls into the water tank 112, so that the condensed water can be collected easily.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A pollution-free semiconductor automobile air conditioner, comprising: An automobile air conditioner main body (100), a plate frame (103) and a refrigeration and heat conduction mechanism (200), characterized in that: an outer shell (101) is provided at the upper end of the automobile air conditioner main body (100); The left side of the outer shell (101) is vertically penetrated to form an inner cavity (102), and the left and right ends of the inner cavity (102) are provided with a plurality of sets of plate frames (103) for installing semiconductor cooling sheets (106), and the inner side surfaces of the left and right ends of the inner cavity (102) are provided with installation grooves (111) for installing a cooling and heat conducting mechanism (200); A refrigeration heat conduction mechanism (200) for dissipating heat when the semiconductor refrigeration sheet (106) is cooled is provided on the inner side of the installation groove (111).

2. A pollution-free semiconductor automobile air conditioner as claimed in claim 1, characterized in that: A refrigeration plate groove (105) is provided on the side of one end of the plate frame (103) close to the center of the outer shell (101), and a plurality of groups of semiconductor refrigeration plates (106) for providing a refrigeration effect are provided inside the refrigeration plate groove (105) and are linearly and equally distributed.

3. A pollution-free semiconductor automobile air conditioner as claimed in claim 2, characterized in that: Drainage grooves are provided on the inner side surfaces of both the front and rear ends of the cooling plate groove (105), and the front and rear ends of the semiconductor cooling plate (106) are embedded in the inner side of the drainage grooves. The plate frame (103) is vertically penetrated through the side surface at one end away from the center of the outer shell (101) to form a plurality of groups of heat conduction holes (104).

4. A pollution-free semiconductor automobile air conditioner as claimed in claim 3, characterized in that: A plurality of groups of semiconductor cooling sheets (106) are electrically connected to an external power supply via wires, and a frame body (201) is provided outside the cooling and heat conducting mechanism (200); The left side surface of the frame body (201) and the four corners of the side surface of the mounting groove (111) away from the center of the outer shell (101) are provided with mounting threaded holes (204), and the mounting threaded holes (204) are provided with screws (300) to fix the cooling and heat conduction mechanism (200).

5. A pollution-free semiconductor automobile air conditioner as claimed in claim 4, characterized in that: A group of heat-conducting fans (202) are provided at both the front and rear ends of the inner side of the frame body (201); a dust-proof net (203) is provided at one end of the heat-conducting fan (202) away from the center of the outer shell (101); a cold air duct (110) is provided at the rear side of the outer shell (101); and a group of exhaust fans are provided on the inner side of the cold air duct (110).

6. A pollution-free semiconductor automobile air conditioner as claimed in claim 2, characterized in that: The lower end of the refrigeration plate groove (105) is provided with a water collecting hole (107), and the lower end of each group of water collecting holes (107) is provided with a group of water collecting pipes (108).

7. A pollution-free semiconductor automobile air conditioner as claimed in claim 6, characterized in that: A main water collecting pipe (109) is provided at the lower end of the sub-collecting pipe (108), and the sub-collecting pipe (108) and the main water collecting pipe (109) are communicated with each other. A water tank (112) is provided below the outer shell (101).

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