Cooling device for tin plating of welding strip

Abstract

The utility model discloses a solder strip tin plating cooling device which comprises a base, a cooling liquid pump, a liquid storage tank and a fixing seat are arranged on the base, a surrounding pipe is arranged in the fixing seat, the cooling liquid pump, the liquid storage tank and the surrounding pipe are sequentially communicated through a cooling liquid pipe, a heat transfer seat is arranged in the surrounding pipe, and a solder strip is arranged in the heat transfer seat. The solder strip tin-plating cooling device is simple in structure and convenient to use, liquid in the liquid storage tank enters the cooling liquid pipe after being cooled by the cooling liquid pump and circulates in the surrounding pipe, and therefore the water cooling effect on the solder strip is achieved, and tin liquid on the surface of the solder strip can be evenly coated on the surface of the solder strip.

Description

Technical Field

[0001] The utility model relates to the technical field of tin coating, in particular to a solder strip tin coating cooling device. Background Art

[0002] When cooling the solder strip in the industry, cold air is usually blown directly to the surface of the solder strip, which will cause uneven blowing of the cold air, so that the tin liquid on the surface of the solder strip cannot be evenly coated on the surface of the solder strip, resulting in unqualified solder strip quality.

[0003] Based on the above situation, the utility model proposes a solder strip tinning cooling device, which can effectively solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a solder strip tinning cooling device. The solder strip tinning cooling device of the utility model has a simple structure and is easy to use. The liquid in the liquid storage tank is cooled by a coolant pump, enters the coolant pipe, and circulates in the surrounding pipe, thereby achieving a water cooling effect on the solder strip, so that the tin liquid on the surface of the solder strip can be evenly coated on the surface of the solder strip.

[0005] The utility model is realized by the following technical solutions:

[0006] A solder strip tinning cooling device comprises a base, wherein a coolant pump, a liquid storage tank and a fixed seat are arranged on the base, a surrounding pipe is arranged in the fixed seat, the coolant pump, the liquid storage tank and the surrounding pipe are connected in sequence through the coolant pipe, a heat transfer seat is arranged in the surrounding pipe, and a solder strip is arranged in the heat transfer seat.

[0007] The purpose of the utility model is to provide a solder strip tinning cooling device. The solder strip tinning cooling device of the utility model has a simple structure and is easy to use. The liquid in the liquid storage tank is cooled by a coolant pump, enters the coolant pipe, and circulates in the surrounding pipe, thereby achieving a water cooling effect on the solder strip, so that the tin liquid on the surface of the solder strip can be evenly coated on the surface of the solder strip.

[0008] Preferably, a groove is provided in the heat transfer seat, and an adjusting roller is provided in the groove.

[0009] Preferably, the adjusting roller comprises an adjusting screw, a connecting plate and a roller, the roller is rotatably connected to the connecting plate, and the connecting plate is fixedly connected to the groove via the adjusting screw.

[0010] Preferably, an air guide cavity is provided in the heat transfer seat, a first fan is connected to the bottom of the heat transfer seat, ventilation holes are opened on both sides of the groove, the ventilation holes are connected to the air guide cavity, and an air guide plate is provided on the ventilation holes.

[0011] Preferably, a second fan is provided on the base.

[0012] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0013] The soldering strip tinning cooling device of the utility model has a simple structure and is easy to use. After the liquid in the liquid storage tank is cooled by the coolant pump, it enters the coolant pipe and circulates in the surrounding pipe, thereby achieving a water cooling effect on the soldering strip, so that the tin liquid on the surface of the soldering strip can be evenly coated on the surface of the soldering strip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 It is a structural schematic diagram of the fixing seat of the utility model;

[0016] Figure 3 It is a schematic cross-sectional structure diagram of the fixing base and the first fan of the utility model;

[0017] Figure 4 It is a structural schematic diagram of the regulating roller described in the utility model. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the technical solution of the utility model, the preferred implementation scheme of the utility model is described below in conjunction with specific embodiments. However, it should be understood that the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. In order to better illustrate this embodiment, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. The positional relationship described in the drawings is only used for illustrative purposes and cannot be understood as a limitation on this patent.

[0019] Embodiment 1:

[0020] like Figures 1 to 4 As shown, the utility model provides a solder strip tinning cooling device, including a base 21, on which a coolant pump 22, a liquid storage tank 23 and a fixed seat 24 are provided, and a surrounding pipe 25 is provided in the fixed seat 24, and the coolant pump 22, the liquid storage tank 23 and the surrounding pipe 25 are connected in sequence through a coolant pipe 26, and a heat transfer seat 27 is provided in the surrounding pipe 25, and a solder strip 3 is provided in the heat transfer seat 27.

[0021] Embodiment 2:

[0022] like Figures 1 to 4As shown, the utility model provides a solder strip tinning cooling device, including a base 21, on which a coolant pump 22, a liquid storage tank 23 and a fixed seat 24 are provided, and a surrounding pipe 25 is provided in the fixed seat 24, and the coolant pump 22, the liquid storage tank 23 and the surrounding pipe 25 are connected in sequence through a coolant pipe 26, and a heat transfer seat 27 is provided in the surrounding pipe 25, and a solder strip 3 is provided in the heat transfer seat 27.

[0023] The heat transfer seat 27 is provided with a groove 271 , and an adjusting roller 272 is provided in the groove 271 .

[0024] The adjusting roller 272 can be provided to clamp the soldering ribbon 3 to prevent the soldering ribbon 3 from shaking during the cooling process.

[0025] Furthermore, in another embodiment, the adjusting roller 272 includes an adjusting screw 2721 , a connecting plate 2722 and a roller 2723 , the roller 2723 is rotatably connected to the connecting plate 2722 , and the connecting plate 2722 is fixedly connected to the groove 271 via the adjusting screw 2721 .

[0026] By tightening or loosening the adjusting screw 2721, the position of the connecting plate 2722 can be adjusted, thereby adjusting the width between the rollers 2723 on both sides to adapt to welding strips 3 of different widths.

[0027] Furthermore, in another embodiment, an air guide cavity 273 is provided in the heat transfer seat 27, a first fan 28 is connected to the bottom of the heat transfer seat 27, ventilation holes 2711 are provided on both sides of the groove 271, the ventilation holes 2711 are connected to the air guide cavity 273, and an air guide plate 2712 is provided on the ventilation holes 2711.

[0028] The wind blown out by the first fan 28 enters the wind guide cavity 273 and is then blown out from the ventilation holes 2711 . The wind cooling effect can be improved through the guiding effect of the wind guide plate 2712 .

[0029] Furthermore, in another embodiment, a second fan 29 is provided on the base 21 .

[0030] The second fan 29 can blow air to the surface of the welding strip 3, which can not only reduce the temperature but also blow away the dust.

[0031] The working principle of one embodiment of the utility model is as follows:

[0032] A solder strip tinning cooling device, wherein the liquid in the liquid storage tank 23 is cooled by a coolant pump 22, enters a coolant pipe 26, and flows in a surrounding pipe 25, thereby achieving a water cooling effect on the solder strip 3.

[0033] According to the description and drawings of the present invention, those skilled in the art can easily manufacture or use the solder strip tinning cooling device of the present invention, and can produce the positive effects recorded in the present invention.

[0034] Unless otherwise specified, in the present invention, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicating orientation or positional relationships are based on the orientation or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the orientation or positional relationship in the present invention are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood in conjunction with the drawings and according to specific circumstances.

[0035] Unless otherwise specified and limited, in the present invention, the terms "disposed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent changes made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A solder strip tinning cooling device, characterized in that: It includes a base, on which a coolant pump, a liquid storage tank and a fixed seat are arranged, a surrounding pipe is arranged in the fixed seat, the coolant pump, the liquid storage tank and the surrounding pipe are connected in sequence through the coolant pipe, a heat transfer seat is arranged in the surrounding pipe, and a welding belt is arranged in the heat transfer seat.

2. The solder strip tinning cooling device according to claim 1, characterized in that: A groove is arranged in the heat transfer seat, and an adjusting roller is arranged in the groove.

3. The solder strip tinning cooling device according to claim 2, characterized in that: The adjusting roller comprises an adjusting screw, a connecting plate and a roller, wherein the roller is rotatably connected to the connecting plate, and the connecting plate is fixedly connected to the groove via the adjusting screw.

4. The solder strip tinning cooling device according to claim 2, characterized in that: An air guide cavity is arranged in the heat transfer seat, a first fan is connected to the bottom of the heat transfer seat, ventilation holes are opened on both sides of the groove, the ventilation holes are connected to the air guide cavity, and an air guide plate is arranged on the ventilation holes.

5. The solder strip tinning cooling device according to claim 1, characterized in that: A second fan is arranged on the base.

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