Temperature control device and detection equipment

Abstract

The utility model discloses a temperature control device and detection equipment, the temperature control device comprises at least one semiconductor chilling plate, the semiconductor chilling plate comprises a first surface and a second surface, one of the first surface and the second surface is a heating surface, and the other one is a refrigerating surface; the temperature control platform is arranged on the first surface and is used for placing an object so as to cool or heat the object; and the wind power temperature controller is arranged on the second surface and is used for radiating or heating the semiconductor chilling plate. The semiconductor chilling plate is cooled or heated by arranging the wind power temperature controller, the device has the advantages of being simple in composition structure, small in occupied space, light in weight, convenient to maintain, low in device cost and the like, and the problem of leakage of cooling liquid can be avoided through wind power cooling or heating.

Description

Technical Field

[0001] The present application relates to the field of temperature control technology, and more specifically to a temperature control device and a detection equipment. Background Art

[0002] TEC (Thermo Electric Cooler) temperature control unit is usually used to solve the problems of complex structure, small temperature control range and poor stability of temperature management system in chip packaging and testing technology.

[0003] In the related art, the semiconductor refrigeration plate of the TEC temperature control unit adopts liquid cooling to dissipate heat. The liquid cooling method has problems such as complex structure and easy leakage.

[0004] In view of the above technical problems, the present invention provides a new temperature control device and detection equipment. Utility Model Content

[0005] The present application is proposed to solve at least one of the above problems. According to one aspect of the present application, a temperature control device is provided, the temperature control device comprising: at least one semiconductor refrigeration plate, the semiconductor refrigeration plate comprising a first surface and a second surface, one of the first surface and the second surface being a heating surface and the other being a cooling surface; a temperature control platform, arranged on the first surface, for placing an object to cool or heat the object; and a wind temperature controller, arranged on the second surface, for dissipating heat or heating the semiconductor refrigeration plate.

[0006] In some embodiments of the present application, there are multiple semiconductor cooling plates, and the multiple semiconductor cooling plates are arranged in an array.

[0007] In some embodiments of the present application, the temperature control device also includes: a first heat conductive layer arranged between the first surface of the semiconductor refrigeration plate and the temperature control platform, and / or a second heat conductive layer arranged between the second surface of the semiconductor refrigeration plate and the wind temperature controller.

[0008] In some embodiments of the present application, the wind-powered temperature controller includes a temperature controller body and at least one temperature control fan, wherein the temperature control fan is arranged inside the temperature controller body, the temperature controller body is used to dissipate heat or heat the semiconductor refrigeration plate, and the temperature control fan is used to dissipate heat or heat the temperature controller body.

[0009] In some embodiments of the present application, the temperature control device further includes a base, and the wind temperature controller is disposed on the base.

[0010] In some embodiments of the present application, at least one air outlet is provided on the side of the temperature controller body; the internal structure of the base is hollow, and a connecting port connected to the temperature control fan is provided on the surface of the base facing the temperature control fan, and at least one air inlet is provided on the side of the base.

[0011] In some embodiments of the present application, there are multiple air outlets, and the multiple air outlets are arranged along a first direction; there are multiple air inlets, and the multiple air inlets are arranged along a second direction; the first direction is different from the second direction.

[0012] In some embodiments of the present application, the temperature control device also includes: a control element, which is electrically connected to the semiconductor refrigeration plate and is used to control the first surface to be a cooling surface and the second surface to be a heating surface, or to control the first surface to be a heating surface and the second surface to be a cooling surface.

[0013] In some embodiments of the present application, the control element is also electrically connected to the wind power temperature controller, and the control element is used to control the heat dissipation power or heating power of the wind power temperature controller.

[0014] According to another aspect of the present application, a detection device is provided, comprising the temperature control device described in any one of the above.

[0015] According to the temperature control device and detection equipment of the embodiments of the present application, a wind temperature controller is provided to dissipate heat or heat the semiconductor refrigeration plate. The wind heat dissipation or heating has fewer components and has the advantages of simple structure, small space occupation, light weight, easy maintenance, and low device cost. In addition, wind heat dissipation or heating can avoid the problem of coolant leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 A schematic structural diagram of a temperature control device provided according to an embodiment of the present application is shown.

[0018] Figure 2 An exploded schematic diagram of a temperature control device provided according to an embodiment of the present application is shown.

[0019] Figure 3 A front view of a temperature control device provided according to an embodiment of the present application is shown.

[0020] Figure 4 A top view of a temperature control device provided according to an embodiment of the present application is shown.

[0021] In the attached figure:

[0022] 100 Temperature control device;

[0023] 110 temperature control platform;

[0024] 120 semiconductor refrigeration chip;

[0025] 131 thermostat body;

[0026] 1311 air outlet;

[0027] 132 Temperature control fan;

[0028] 140 control elements;

[0029] 151 first heat conducting layer;

[0030] 152 second heat conducting layer;

[0031] 160 base;

[0032] 161 communication port;

[0033] 162 air inlet;

[0034] 170 Side panels. DETAILED DESCRIPTION

[0035] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0036] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0037] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0038] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0039] TEC (Thermo Electric Cooler) temperature control unit is usually used to solve the problems of complex structure, small temperature control range and poor stability of temperature management system in chip packaging and testing technology.

[0040] In the related art, the semiconductor cooling chip of the TEC temperature control unit adopts liquid cooling to dissipate heat. Liquid cooling generally consists of a liquid cooling plate, a joint nozzle, a water pipe, a heat exchanger, a water pump and other components, which has at least the following problems:

[0041] 1. Liquid cooling has many components, which have the disadvantages of complex structure, large space occupation, heavy weight, inconvenient maintenance and high installation cost;

[0042] 2. Liquid cooling requires additional components such as water pumps, which increases the power consumption of the device;

[0043] 3. The various components of liquid cooling are connected in series. If one component fails or coolant leaks, the normal operation of the entire device will be affected;

[0044] 4. The test of liquid cooling is relatively complicated. During the test, the pipes need to be connected and plugged repeatedly, which can easily cause leakage of the coolant.

[0045] In order to solve at least one of the above problems, the present application provides a temperature control device, which includes: at least one semiconductor refrigeration plate, the semiconductor refrigeration plate includes a first surface and a second surface, one of the first surface and the second surface is a heating surface, and the other is a cooling surface; a temperature control platform, arranged on the first surface, for placing an object to cool or heat the object; a wind temperature controller, arranged on the second surface, for dissipating heat or heating the semiconductor refrigeration plate.

[0046] According to the temperature control device of the present application, a wind temperature controller is provided to dissipate heat or heat the semiconductor refrigeration plate, and the wind heat dissipation or heating components are few, and it has the advantages of simple structure, small space occupation, light weight, easy maintenance, and low device cost.

[0047] Moreover, wind cooling or heating does not require additional components such as water pumps, which can reduce the power consumption of the temperature control device, and wind cooling or heating can avoid the problem of coolant leakage.

[0048] In order to thoroughly understand the present application, a detailed structure will be presented in the following description to illustrate the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail as follows, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0049] The embodiments of the present application do not specifically limit the specific application scenarios of the temperature control device. For example, it can be applied to the fields of chip packaging and testing, nucleic acid testing, drug testing, biological culture, and medical preservation. Of course, the present application does not limit the application of the temperature control device to other fields. The objects placed on the temperature control device are also different according to the different fields of application. Taking the application in the field of chip detection as an example, the object placed on the temperature control device can be a semiconductor chip. Taking the application in the field of nucleic acid detection as an example, the object placed on the temperature control device can be a nucleic acid sample. Taking the application in the field of drug testing and medical preservation as an example, the object placed on the temperature control device can be a drug. Taking the application in the field of biological culture as an example, the object placed on the temperature control device can be a biological culture medium.

[0050] In order to help those skilled in the art better understand the technical solution provided in the embodiments of the present application, the following is an introduction using the application of a temperature control device in the field of chip packaging and testing as an example.

[0051] Reference below Figure 1 to Figure 4 A temperature control device 100 according to an embodiment of the present application is described.

[0052] The temperature control device 100 provided in the embodiment of the present application includes: at least one semiconductor refrigeration plate 120, the semiconductor refrigeration plate 120 includes a first surface and a second surface, one of the first surface and the second surface is a heating surface, and the other is a cooling surface; a temperature control platform 110, which is arranged on the first surface and is used to place an object to cool down or heat up the object; and a wind temperature controller, which is arranged on the second surface and is used to dissipate heat or heat the semiconductor refrigeration plate 120.

[0053] Among them, the semiconductor cooling sheet 120 is a device made by utilizing the Peltier effect of semiconductors. When current passes through a loop composed of different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release phenomena will occur at the joints of different conductors depending on the direction of the current.

[0054] Taking the first surface of the semiconductor refrigeration plate 120 as the cooling surface and the second surface as the heating surface as an example, after the semiconductor chip to be tested is placed on the temperature control platform 110, the first surface of the semiconductor refrigeration plate 120 cools down the temperature control platform 110, thereby reducing the temperature of the semiconductor chip on the temperature control platform 110.

[0055] At the same time, the temperature of the second surface of the semiconductor refrigeration chip 120 rises. The wind temperature controller arranged on the second surface of the semiconductor refrigeration chip 120 can dissipate heat from the second surface of the semiconductor refrigeration chip 120 to keep the temperature of the second surface of the semiconductor refrigeration chip 120 within a reasonable range, thereby preventing the semiconductor refrigeration chip 120 from being overheated and damaged.

[0056] Taking the example that the first surface of the semiconductor refrigeration plate 120 is the heating surface and the second surface is the cooling surface, after the semiconductor chip to be tested is placed on the temperature control platform 110, the first surface of the semiconductor refrigeration plate 120 heats up the temperature control platform 110, thereby increasing the temperature of the semiconductor chip on the temperature control platform 110.

[0057] At the same time, the temperature of the second surface of the semiconductor refrigeration film 120 drops. The wind temperature controller arranged on the second surface of the semiconductor refrigeration film 120 can heat the second surface of the semiconductor refrigeration film 120 to keep the temperature of the second surface of the semiconductor refrigeration film 120 within a reasonable range, thereby preventing the semiconductor refrigeration film 120 from being damaged by overcooling.

[0058] Based on this, the present application provides a temperature control device 100 for wind cooling or heating a semiconductor cooling sheet 120. According to the temperature control device 100 of the present application, a wind temperature controller is provided to dissipate heat for the semiconductor cooling sheet 120, and there are fewer parts for wind cooling or heating, which has the advantages of simple structure, less occupied space, light weight, convenient maintenance, low device cost, etc., and wind cooling or heating can avoid the problem of coolant leakage.

[0059] In addition, wind cooling or heating does not require additional components such as a water pump, which can reduce the power consumption of the temperature control device 100.

[0060] It should be noted that the present application can design the wind power temperature controller in the temperature control device 100 by means of simulation calculation, so that the heat dissipation power of the wind power temperature controller is greater than or equal to the heating power of all semiconductor refrigeration sheets 120, that is, the heat dissipation power of the wind power temperature controller matches the heating power of the semiconductor refrigeration sheets 120, so as to ensure that the heat dissipation power of the wind power temperature controller can always meet the heating power of the semiconductor refrigeration sheets 120; or make the heating power of the wind power temperature controller greater than or equal to the cooling power of all semiconductor refrigeration sheets 120, that is, the heating power of the wind power temperature controller matches the cooling power of the semiconductor refrigeration sheets 120, so as to ensure that the heating power of the wind power temperature controller can always meet the cooling power of the semiconductor refrigeration sheets 120.

[0061] In addition, it is worth noting that when the temperature control device 100 heats up the semiconductor chip, if the temperature of the second surface of the semiconductor refrigeration plate 120 is within a reasonable range, there is no need to dissipate heat from the second surface of the semiconductor refrigeration plate 120, and the wind temperature controller can be in a closed state.

[0062] In one example, if Figure 1 and Figure 2 As shown, the temperature control device 100 may include a control element 140, which is electrically connected to the semiconductor refrigeration plate 120. The polarity of the current flowing through the semiconductor refrigeration plate 120 is switched by the control element 140, so that the first surface of the semiconductor refrigeration plate 120 is switched between cooling and heating, and correspondingly, the second surface of the semiconductor refrigeration plate 120 is also switched between heating and cooling.

[0063] For example, when the semiconductor chip on the temperature control platform 110 needs to be cooled, the control element 140 can control the polarity of the current flowing through the semiconductor refrigeration plate 120 so that the first surface of the semiconductor chip is the cooling surface and the second surface is the heating surface. The first surface cools the temperature control platform 110 to reduce the temperature of the semiconductor chip.

[0064] When the temperature of the semiconductor chip on the temperature control platform 110 needs to be increased, the control element 140 can control the polarity of the current flowing through the semiconductor refrigeration plate 120 to switch, so that the first surface is the heating surface and the second surface is the cooling surface. The first surface heats the temperature control platform 110 to increase the temperature of the semiconductor chip.

[0065] It can be seen that the control element 140 can realize rapid switching between the heating surface and the cooling surface of the semiconductor refrigeration plate 120, so that the temperature of the temperature control device 100 can be rapidly increased to a predetermined temperature / rapidly decreased to a predetermined temperature.

[0066] In one example, the control element 140 is also electrically connected to a wind power thermostat, and the control element 140 can control the heat dissipation power or heating power of the wind power thermostat.

[0067] Exemplarily, when cooling the semiconductor chip on the temperature control platform 110, the second surface of the semiconductor cooling sheet 120 is a heating surface, and the control element 140 can control the operation of the wind temperature controller to dissipate heat from the semiconductor cooling sheet 120 through the wind temperature controller. During the heat dissipation process, the control element 140 can also control the heat dissipation power of the wind temperature controller according to the heat generation power of the second surface of the semiconductor cooling sheet 120, so that the heat dissipation power of the wind temperature controller is always not less than the heat generation power of the second surface of the semiconductor cooling sheet 120.

[0068] When the temperature of the semiconductor chip on the temperature control platform 110 is increased, the second surface of the semiconductor refrigeration sheet 120 is a cooling surface. At this time, the control element 140 can control the operation of the wind temperature controller to heat the semiconductor refrigeration sheet 120 through the wind temperature controller. During the heating process, the control element 140 can also control the heating power of the wind temperature controller according to the cooling power of the second surface of the semiconductor refrigeration sheet 120, so that the heating power of the wind temperature controller always meets the cooling power of the second surface of the semiconductor refrigeration sheet 120. Of course, if the temperature of the second surface of the semiconductor refrigeration sheet 120 is higher than the reasonable temperature range, the control element 140 can still control the operation of the wind temperature controller to dissipate heat from the second surface of the semiconductor refrigeration sheet 120, and control the heat dissipation power of the wind temperature controller during the heat dissipation process.

[0069] It can be understood that the specific type of the control element 140 can be selected according to actual conditions, such as PLC (Programmable Logic Controller), DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), etc., without limitation.

[0070] It should be noted that the semiconductor refrigeration sheet 120 and the wind-powered thermostat can be powered separately, that is, the semiconductor refrigeration sheet 120 and the wind-powered thermostat are connected to different power supplies respectively; or the semiconductor refrigeration sheet 120 and the wind-powered thermostat can also be powered together, that is, the semiconductor refrigeration sheet 120 and the wind-powered thermostat can be connected to the same power supply. When powered together, the control element 140 can independently control the switching state of the semiconductor refrigeration sheet 120 and the wind-powered thermostat.

[0071] In one example, there are multiple semiconductor cooling fins 120 .

[0072] In one example, the plurality of semiconductor cooling sheets 120 may be arranged in an array. By providing the plurality of semiconductor cooling sheets 120 arranged in an array, the heating and / or cooling efficiency of the temperature control device 100 may be improved, thereby improving the heating and / or cooling efficiency of the semiconductor chip on the temperature control platform 110.

[0073] For example, Figure 2 As shown, there are 4 semiconductor cooling sheets 120, which are arranged in a 2*2 rectangular array. Of course, the present application does not exclude that the number and array arrangement of the semiconductor cooling sheets 120 may exist in other situations.

[0074] In one example, if Figure 2 As shown, the temperature control device 100 further includes a first heat conducting layer 151 disposed between the first surface of the semiconductor cooling sheet 120 and the temperature control platform 110. The first heat conducting layer 151 can fill the gap between the first surface of the semiconductor cooling sheet 120 and the temperature control platform 110, thereby improving the heat conduction efficiency between the semiconductor cooling sheet 120 and the temperature control platform 110.

[0075] In one example, if Figure 2 As shown, the temperature control device 100 further includes a second heat conducting layer 152 disposed between the second surface of the semiconductor cooling sheet 120 and the wind temperature controller. The second heat conducting layer 152 can fill the gap between the second surface of the semiconductor cooling sheet 120 and the wind temperature controller, thereby improving the heat conduction efficiency between the semiconductor cooling sheet 120 and the wind temperature controller.

[0076] It can be understood that the first thermal conductive layer 151 and the second thermal conductive layer 152 can be of various types, such as silicone thermal conductive layer, graphene thermal conductive layer, metal thermal conductive layer, polymer material thermal conductive layer, composite material thermal conductive layer, etc., which can be selected according to actual needs and are not limited to this.

[0077] In one example, if Figure 1 and Figure 2As shown, the wind-powered temperature controller includes a temperature controller body 131 and a temperature control fan 132 . The temperature control fan 132 is arranged inside the temperature controller body 131 . The temperature controller body 131 is used to dissipate heat or heat the semiconductor cooling plate 120 . The temperature control fan 132 is used to dissipate heat or heat the temperature controller body 131 .

[0078] Specifically, taking the semiconductor cooling chip 120 cooling the semiconductor chip on the temperature control platform 110 as an example, the second surface of the semiconductor cooling chip 120 is a heating surface, the temperature controller body 131 can absorb the heat of the second surface to dissipate the heat from the second surface, and the temperature control fan 132 can dissipate the heat from the temperature controller body 131 through air flow. The process of the semiconductor cooling chip 120 heating the semiconductor chip on the temperature control platform 110 can be analogous to the above description, and will not be repeated here.

[0079] In one example, if Figure 1 and Figure 2 As shown, the temperature control device 100 further includes a base 160 , and the wind temperature controller is disposed on the base 160 .

[0080] For example, corresponding bolt holes may be provided on the upper surface of the base 160 and the lower surface of the wind temperature controller, and the wind temperature controller may be fixed to the base 160 by bolt connection. Of course, there may be other fixing methods between the base 160 and the wind temperature controller, which is not limited thereto.

[0081] In one example, if Figure 1 and Figure 2 As shown, at least one air outlet 1311 is provided on the side of the temperature controller body 131, the interior of the base 160 can be constructed to be hollow, and a connecting port 161 connected to the temperature control fan 132 is provided on the surface of the base 160 facing the temperature control fan 132, and at least one air inlet 162 is provided on the side of the base 160.

[0082] Taking the wind temperature controller to dissipate heat for the semiconductor cooling sheet 120 as an example, when the temperature control fan 132 is working, cold air flows into the base 160 from the air inlet 162 on the side of the base 160, and then enters the temperature control fan 132 through the connecting port 161, and the temperature control fan 132 drives the cold air to dissipate heat for the semiconductor cooling sheet 120. The cold air absorbs the heat of the semiconductor cooling sheet 120 and heats up to hot air. The hot air then flows out of the temperature control device 100 from the side air outlet 1311 of the temperature controller body 131 driven by the temperature control fan 132, thereby completing the heat dissipation process. The process of the wind temperature controller heating the semiconductor cooling sheet 120 can be compared to the above description, and will not be repeated here.

[0083] It should be noted that, in the above structure, the air outlet 1311 is arranged on the side of the thermostat body 131, and the air inlet 162 is arranged on the side of the base 160, and the air outlet 1311 and the air inlet 162 are physically isolated, so that the air duct corresponding to the air outlet 1311 and the air duct corresponding to the air inlet 162 are independent of each other and do not interfere with each other, which can prevent hot air and cold air from crosstalking and affecting the heat dissipation efficiency or heating efficiency.

[0084] In one example, there are multiple air outlets 1311, and the multiple air outlets 1311 are arranged along a first direction; there are multiple air inlets 162, and the multiple air inlets 162 are arranged along a second direction; the first direction is different from the second direction.

[0085] Among them, the heat dissipation efficiency or heating efficiency of the wind temperature controller can be improved by providing multiple air outlets 1311 and multiple air inlets 162.

[0086] Secondly, if Figure 1 As shown, multiple air outlets 1311 are arranged in the up-down direction, and multiple air inlets 162 are arranged in the left-right direction. The up-down direction and the left-right direction are perpendicular, that is, the air duct corresponding to the air outlet 1311 and the air duct corresponding to the air inlet 162 are vertically crossed, so that the air duct corresponding to the air outlet 1311 and the air duct corresponding to the air inlet 162 have the largest crossing interval with each other, which can minimize the crosstalk between hot air and cold air.

[0087] Of course, in addition to the vertical crossing arrangement, there may be other crossing angles between the first direction and the second direction, which is not limited.

[0088] It should also be noted that the multiple air inlets 162 can be disposed on the same side of the base 160, or on two opposite sides of the base 160 (eg, Figure 1 As shown), accordingly, the plurality of air outlets 1311 can be arranged on the same side of the thermostat body 131, or on two sides of the thermostat body 131 (as shown in FIG. Figure 1 shown).

[0089] In one example, the temperature control device 100 may further include a side panel 170 , the side of which is disposed between the temperature control platform 110 and the base 160 , and the base 160 and the temperature control platform 110 are fixedly connected via the base 160 .

[0090] For example, Figure 2 As shown, there are two side panels 170 , which are arranged on two opposite sides, and the side where the side panels 170 are located avoids the side where the air outlet 1311 is located, and a space for forming an air duct for the air outlet 1311 can be enclosed between the two side panels.

[0091] The following describes the testing process of the temperature control device 100 of the embodiment of the present application:

[0092] 1. First, establish the temperature monitoring points of the wind temperature controller and the temperature control device 100;

[0093] 2. Connect the power supply of the wind thermostat and the wind thermostat starts to work;

[0094] 3. Turn on the power of the semiconductor refrigeration sheet 120, and the control element 140 controls the first surface of the semiconductor refrigeration sheet 120 to be a heating surface and the second surface to be a cooling surface. The first surface heats up the temperature control platform 110 at room temperature. After the temperature of the temperature control platform 110 rises to a first preset temperature, the semiconductor refrigeration sheet 120 is powered off and stops working, and the time T1 required for the temperature of the temperature control platform 110 to rise from room temperature to the first preset temperature is recorded;

[0095] 4. After the temperature of the temperature control platform 110 is lower than the first preset temperature, the semiconductor refrigeration sheet 120 starts working again, and stops working again after the temperature of the temperature control platform 110 reaches the first preset temperature, so that the temperature of the temperature control platform 110 is maintained at a constant first preset temperature;

[0096] 5. The control element 140 switches the polarity of the current flowing through the semiconductor refrigeration sheet 120, so that the first surface of the semiconductor refrigeration sheet 120 is a cooling surface and the second surface is a heating surface. The semiconductor refrigeration sheet 120 works again, and the first surface cools down the temperature control platform 110 at the first preset temperature. After the temperature of the temperature control platform 110 drops to the second preset temperature, the semiconductor refrigeration sheet 120 is powered off and stops working, and the time T2 required for the temperature of the temperature control platform 110 to drop from the first preset temperature to the second preset temperature is recorded;

[0097] 6. Use the TEC temperature control unit using liquid cooling to perform the above steps and obtain T1' and T2'. It can be seen that compared with T1' and T2', the time of T1 and T2 obtained by the temperature control device 100 of the embodiment of the present application is shorter, that is, the temperature response speed of the temperature control device 100 of the embodiment of the present application is more agile.

[0098] According to another aspect of the present application, a detection device is provided, and the detection device includes a temperature control device.

[0099] Among them, the temperature control device can be implemented as the temperature control device 100 mentioned above, and reference can be made to the introduction above, which will not be repeated here.

[0100] It should be noted that the temperature control device can be applied to a variety of testing equipment, such as chip packaging and testing equipment, nucleic acid testing equipment, drug testing equipment, biological testing equipment, medical storage equipment, etc., without limitation.

[0101] To summarize, according to the temperature control device and detection equipment of the embodiments of the present application, a wind temperature controller is provided to dissipate heat or heat the semiconductor refrigeration plate, and there are fewer components for wind heat dissipation or heating. It has the advantages of simple structure, small space occupation, light weight, easy maintenance, and low device cost.

[0102] Moreover, wind cooling or heating does not require additional components such as water pumps, which can reduce the power consumption of the temperature control device, and wind cooling or heating can avoid the problem of coolant leakage.

[0103] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0104] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, the application point is that the corresponding technical problem can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0105] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0106] It should be noted that the above embodiments illustrate rather than limit the present application, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets should not be construed as a limitation to the claims. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names.

Claims

1. A temperature control device, characterized in that: The temperature control device comprises: At least one semiconductor refrigeration sheet, the semiconductor refrigeration sheet comprising a first surface and a second surface, one of the first surface and the second surface is a heating surface, and the other is a cooling surface; A temperature control platform, disposed on the first surface, for placing an object to cool or heat the object; A wind temperature controller is arranged on the second surface and is used to dissipate heat or heat the semiconductor refrigeration plate.

2. The temperature control device according to claim 1, characterized in that: There are multiple semiconductor cooling plates, and the multiple semiconductor cooling plates are arranged in an array.

3. The temperature control device according to claim 1, characterized in that: The temperature control device also includes: A first heat-conducting layer is arranged between the first surface of the semiconductor refrigeration plate and the temperature control platform, and / or a second heat-conducting layer is arranged between the second surface of the semiconductor refrigeration plate and the wind temperature controller.

4. The temperature control device according to claim 1, characterized in that: The wind-powered temperature controller includes a temperature controller body and at least one temperature control fan, wherein the temperature control fan is arranged inside the temperature controller body, the temperature controller body is used to dissipate heat or heat the semiconductor refrigeration plate, and the temperature control fan is used to dissipate heat or heat the temperature controller body.

5. The temperature control device according to claim 4, characterized in that: The temperature control device also includes a base, and the wind temperature controller is arranged on the base.

6. The temperature control device according to claim 5, characterized in that: At least one air outlet is provided on the side of the thermostat body; The inner structure of the base is hollow, a surface of the base facing the temperature-control fan is provided with a communication port connected with the temperature-control fan, and at least one air inlet is provided on a side surface of the base.

7. The temperature control device according to claim 6, characterized in that: There are multiple air outlets, and the multiple air outlets are arranged along the first direction; There are multiple air inlets, and the multiple air inlets are arranged along the second direction; The first direction is different from the second direction.

8. The temperature control device according to claim 1, characterized in that: The temperature control device also includes: A control element is electrically connected to the semiconductor refrigeration sheet and is used to control the first surface to be a cooling surface and the second surface to be a heating surface, or to control the first surface to be a heating surface and the second surface to be a cooling surface.

9. The temperature control device according to claim 8, characterized in that: The control element is also electrically connected to the wind power temperature controller, and the control element is used to control the heat dissipation power or heating power of the wind power temperature controller.

10. A detection device, characterized in that: The invention comprises a temperature control device as claimed in any one of claims 1 to 9.

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