Projection device and projector
By using dual front and rear heat dissipation components in the projection device, combining thermal conductors and heat exchangers, the problem of poor heat dissipation effect of digital micromirror devices in traditional projection devices is solved, and the device is fully cooled and stable, ensuring high brightness Light output.
Patent Information
- Application Number
- CN202421115786.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-05-20
AI Technical Summary
In the case of high brightness and high power, traditional projection devices cannot effectively heat the front end of the digital micromirror device by setting the heat dissipation component only through the back end, resulting in a large temperature difference between the front and rear ends, affecting the normal operation of the device.
A projection device is designed, adopting a dual heat dissipation assembly at the front and rear ends, including a heat conductor and a heat exchanger in which the first heat dissipation assembly is in direct contact with the front end, and a heat conductor and a heat exchanger in which the second heat dissipation assembly is in contact with the rear end, through heat conduction The components and heat exchangers are arranged on the outer side wall of the optical case, combined with the thermal insulation layer to achieve all-round heat dissipation of digital micromirror devices.
Effectively absorb and take away the front and rear end heat of the digital micromirror device, avoid heat accumulation, keep the device temperature stable, and ensure the stability of the projection device outputting high brightness light.
Smart Images
Figure CN222354267U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of projection equipment, in particular to a projection device and a projector. Background Art
[0002] In a DLP (Digital Light Processing) projector, the light generated by the light source enters the optical housing, is processed by optical components such as lenses and prisms, and then is incident on the reflection area at the front end of the digital micromirror device. The light is then reflected by the reflection area to the lens, and the lens then projects the light onto the screen to form an image.
[0003] When the digital micromirror device is working, a certain amount of heat will be generated when the internal electronic components at the front end control the flipping of the micromirrors on the reflection area. At the same time, the light projected on its reflection area will also generate a certain amount of heat, which can easily cause the digital micromirror device itself to accumulate a large amount of heat. Traditional projection devices only dissipate heat at the rear end by setting a heat dissipation component at the rear end, although the heat at the front end can be conducted to the rear end to be absorbed by the heat dissipation component. However, for high-brightness, high-power projection devices, only by setting a heat dissipation component at the rear end, the front end cannot be effectively dissipated, which can easily cause a large temperature difference between the front and rear ends of the digital micromirror device, affecting the normal operation of the digital micromirror device. Utility Model Content
[0004] The embodiments of the utility model aim to provide a projection device and a projector to solve the technical problem that the projection device has a poor heat dissipation effect on a digital micromirror device in the prior art.
[0005] On the one hand, an embodiment of the utility model provides a projection device, the projection device comprising:
[0006] A digital micromirror device having a front end and a back end;
[0007] A first heat dissipation component is disposed against the front end, and the first heat dissipation component is used to dissipate heat from the front end;
[0008] The second heat dissipation component is against the rear end, and is used for dissipating heat from the rear end.
[0009] In some embodiments, the front end has a front face and a front side face;
[0010] The first heat dissipation assembly includes a first heat conducting member and a first heat exchanger;
[0011] One end of the first heat conductor is provided with an abutment portion, which includes a first abutment surface and / or a second abutment surface. The first abutment surface abuts against the edge of the front end surface, and the second abutment surface abuts against the front side surface. The other end of the first heat conductor is connected to the first heat exchanger.
[0012] In some embodiments, the first abutting surface is extended along the edge contour of the front end surface, and the second abutting surface is extended along the circumference of the front side surface.
[0013] In some embodiments, the first heat conducting member is provided with an installation cavity, the installation cavity runs through two sides of the first heat conducting member, the digital micromirror device is accommodated in the installation cavity, and the abutting portion is provided at a cavity opening of the installation cavity.
[0014] In some embodiments, the first heat-conducting member includes a first heat-conducting pipe, a first heat-conducting plate, and a second heat-conducting plate;
[0015] The abutting portion and the mounting cavity are arranged on the first heat conducting plate;
[0016] One end of the first heat-conducting pipe is connected to the first heat-conducting plate, the other end of the first heat-conducting pipe is connected to the second heat-conducting plate, and the second heat-conducting plate is connected to the first heat exchanger.
[0017] In some embodiments, the first heat conducting plate is used to be mounted on the outer side wall of the optical housing;
[0018] The first heat dissipation component also includes a first heat insulation layer, and the first heat insulation layer is arranged between the first heat conduction plate and the outer side wall of the optical housing.
[0019] In some embodiments, the second heat dissipation assembly includes a second heat conductive member and a second heat exchanger. The second heat conductive member is provided with a protrusion, the protrusion abuts against the rear end surface, and the second heat exchanger is connected to the second heat conductive member.
[0020] In some embodiments, the second heat-conducting member includes a second heat-conducting pipe, a third heat-conducting plate, and a fourth heat-conducting plate;
[0021] The second heat conducting pipe is clamped between the third heat conducting plate and the fourth heat conducting plate, the protrusion is arranged on the third heat conducting plate, and the fourth heat conducting plate is connected to the second heat exchanger.
[0022] In some embodiments, the second heat dissipation assembly further includes a second heat insulation layer, which is used to block heat conduction between the third heat conducting plate and the circuit board, wherein the circuit board may be disposed between the rear end surface and the third heat conducting plate.
[0023] On the other hand, an embodiment of the present invention further provides a projector, which includes the projection device as described above.
[0024] Compared with the prior art, in the embodiment of the utility model, when the digital micromirror device is working, the first heat dissipation component can absorb the heat at the front end of the digital micromirror device in time, and the second heat dissipation component can absorb the heat at the rear end of the digital micromirror device in time, so that the front end and the rear end of the digital micromirror device can be effectively dissipated respectively, avoiding heat accumulation at the front end and the rear end of the digital micromirror device, and preventing a large temperature difference between the front end and the rear end of the digital micromirror device, thereby achieving effective cooling of the digital micromirror device as a whole, meeting the working temperature requirements of the digital micromirror device, ensuring the normal operation of the digital micromirror device, and allowing the projection device to stably output high-brightness light.
[0025] The projector provided by the embodiment of the utility model also has the above beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] One or several embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0027] Figure 1 is a three-dimensional diagram of a projection device provided by one embodiment of the utility model;
[0028] Figure 2 yes Figure 1 A three-dimensional diagram of a partial structure of the projection device shown;
[0029] Figure 3 yes Figure 1 An exploded view of a portion of the structure of the projection device shown;
[0030] Figure 4 yes Figure 2 A three-dimensional cross-sectional view of a digital micromirror device shown;
[0031] Figure 5 yes Figure 1 A structural exploded view of the first heat dissipation assembly shown;
[0032] Figure 6 yes Figure 2 A top view of a partial structure of the projection device shown;
[0033] Figure 7 yes Figure 6 A cross-sectional view of a portion of the structure of the projection device shown along the AA direction;
[0034] Figure 8 yes Figure 1 The structural exploded view of the second heat dissipation assembly is shown. DETAILED DESCRIPTION
[0035] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "connecting" another element, it can be directly on another element, or there can be one or more centered elements therebetween. The terms "upper", "lower", "left", "right", "upper end", "lower end", "top" and "bottom" used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", etc. can only describe the purpose, and cannot be understood as indicating or implying relative importance.
[0036] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0037] See also Figures 1 to 4 , Figure 1 is a three-dimensional diagram of a projection device 100 provided in one embodiment of the present invention. Figure 2 yes Figure 1 The perspective view of a part of the structure of the projection device 100 is shown. Figure 3 yes Figure 1 The exploded view of a part of the structure of the projection device 100 is shown. Figure 4 yes Figure 2 The three-dimensional cross-sectional view of the digital micromirror device 10 is shown. The embodiment of the utility model provides a projection device 100. The projection device 100 includes a digital micromirror device 10. The digital micromirror device 10 has a front end 11 and a rear end 12.
[0038] Among them, Figure 4 As shown, the front end 11 has a front face 101 and a front side face 102, and the rear end 12 has a rear face 103 and a rear side face 104. The front end face 101 and the rear end face 103 are opposite to each other, the front side face 102 and the rear side face 104 are located between the front end face 101 and the rear end face 103, the front side face 102 is adjacent to the front end face 101, and the rear side face 104 is adjacent to the rear end face 103. A plurality of micromirrors are arranged in the middle of the front end face 101, and the plurality of micromirrors are distributed in a matrix to form a reflection area, and the reflection area is used to reflect incident light.
[0039] When the digital micromirror device 10 is working, the heat it generates mainly comes from the heat generated when the electronic components inside the front end 11 control the flipping of the micromirror, and the heat generated by the light projected on its reflection area. The heat of the front end 11 can be diffused to the back end 12 by thermal diffusion.
[0040] In this embodiment, in order to achieve effective heat dissipation of the front and rear ends (11, 12) of the digital micromirror device 10, the projection device 100 further includes a first heat dissipation component 20 and a second heat dissipation component 30. The first heat dissipation component 20 abuts against the front end 11 of the digital micromirror device 10, and the first heat dissipation component 20 is used to dissipate heat from the front end 11 of the digital micromirror device 10; the second heat dissipation component 30 abuts against the front end 11 of the digital micromirror device 10, and the first heat dissipation component 20 is used to dissipate heat from the rear end 12 of the digital micromirror device 10.
[0041] When the digital micromirror device 10 is working, the first heat dissipation component 20 can absorb the heat of the front end 11 of the digital micromirror device 10 in time, and the second heat dissipation component 30 can absorb the heat of the rear end 12 of the digital micromirror device 10 in time, so that the front end 11 and the rear end 12 of the digital micromirror device 10 can be effectively dissipated respectively, avoiding heat accumulation at the front end 11 and the rear end 12 of the digital micromirror device 10, and preventing a large temperature difference between the front end 11 and the rear end 12 of the digital micromirror device 10, thereby achieving effective cooling of the digital micromirror device 10 as a whole, meeting the operating temperature requirements of the digital micromirror device 10, ensuring the normal operation of the digital micromirror device 10, and allowing the projection device 100 to stably output high-brightness light.
[0042] In order to achieve heat dissipation of the front end 11 of the digital micromirror device 10, a heat exchanger can be used to counteract the front end 11 of the digital micromirror device 10 to absorb and take away the heat of the front end 11 of the digital micromirror device 10. However, the volume of the heat exchanger is usually large, and the installation space of the digital micromirror device 10 is usually small. If the heat exchanger is directly installed at the front end 11 of the digital micromirror device 10, the heat exchanger will occupy the space where the front end 11 of the digital micromirror device 10 is located, affecting the structural assembly. Therefore, please refer to Figures 5 to 7 , Figure 5 yes Figure 1 The structural exploded view of the first heat dissipation assembly 20 is shown. Figure 6 yes Figure 2 The top view of a part of the structure of the projection device 100 is shown. Figure 7 yes Figure 6The cross-sectional view of a part of the structure of the projection device 100 shown is taken along the AA direction. In some embodiments, the first heat dissipation assembly 20 includes a first heat conducting member 21 and a first heat exchanger 22. An abutting portion 201 is provided at one end of the first heat conducting member 21. The abutting portion 201 includes a first abutting surface 2011 and / or a second abutting surface 2012. The first abutting surface 2011 abuts against the edge of the front end surface 101, and the second abutting surface 2012 abuts against the front side surface 102. The other end of the first heat conducting member 21 is connected to the first heat exchanger 22. The first heat conducting member 21 is used to conduct heat between the digital micromirror device 10 and the first heat exchanger 22. The first heat exchanger 22 is used to exchange heat with a cooling medium.
[0043] In this embodiment, by setting the first heat conductor 21 between the digital micromirror device 10 and the first heat exchanger 22, the first heat conductor 21 is transferred between the digital micromirror device 10 and the first heat exchanger 22, so that the first heat exchanger 22 does not need to be directly assembled with the digital micromirror device 10, allowing the first heat exchanger 22 to be set at a position away from the digital micromirror device 10, which can avoid the first heat exchanger 22 from occupying the space where the front end 11 of the digital micromirror device 10 is located.
[0044] When heat is generated in the middle of the front end 11, the heat is diffused to the surroundings by thermal diffusion, that is, after the heat is diffused to the front end face 101 and the front side face 102 of the front end 11, it can be conducted to the first heat conductor 21 through the first abutting surface 2011 and the second abutting surface 2012, thereby achieving effective heat dissipation of the front end 11 by the first heat dissipation component 20, and the abutting portion 201 only abuts against the edge of the front end face 101 and / or the front side face 102 of the front end 11, so that the abutting portion 201 can be avoided from blocking the reflective area of the front end face 101.
[0045] The cooling medium may be a cooling liquid or air.
[0046] In some embodiments, the first abutment surface 2011 is arranged along the edge contour of the front end face 101, that is, the first abutment surface 2011 covers the four edges of the front end face 101, so that the four edges of the front end face 101 can all abut against the first abutment surface 2011; the second abutment surface 2012 is arranged along the circumferential extension of the front side surface 102, that is, the second abutment surface 2012 surrounds the four front side surfaces 102 of the front end 11, so that the four front side surfaces 102 of the front end 11 can all abut against the second abutment surface 2012.
[0047] Through the above arrangement, the abutment portion 201 can absorb and diffuse the heat to each edge position of the front end face 101 and each position of the front side face 102, so that the first heat conductor 21 has a better thermal conductivity efficiency for the front end 11, so as to efficiently transfer the heat of the front end 11 to the first heat exchanger 22, and the heat is dissipated by the first heat exchanger 22, thereby ensuring that the first heat dissipation component 20 has a better heat dissipation effect on the front end 11.
[0048] In some embodiments, a mounting cavity 202 is disposed at one end of the first heat conducting member 21 . The mounting cavity 202 passes through two sides of the first heat conducting member 21 . The digital micromirror device 10 is accommodated in the mounting cavity 202 . The abutting portion 201 is disposed at a cavity opening of the mounting cavity 202 .
[0049] Specifically, after the installation cavity 202 passes through both sides of the first heat conductive member 21, two cavity openings are formed on both sides of the first heat conductive member 21, so that after the digital micromirror device 10 is installed in the installation cavity 202 of the first heat conductive member 21, the front end face 101 and the rear end face 103 of the digital micromirror device 10 can be respectively exposed at the two cavity openings, the reflection area on the front end face 101 can reflect the incident light through one cavity opening, and the second heat dissipation component 30 can be against the rear end 12 through the other cavity opening.
[0050] In this embodiment, by providing a mounting cavity 202 for accommodating the digital micromirror device 10 on the first heat conductive member 21, the space occupied by the first heat conductive member 21 and the digital micromirror device 10 can be reduced, so that the structures of the first heat conductive member 21 and the digital micromirror device 10 are relatively compact. At the same time, after the heat on the digital micromirror device 10 diffuses to its surroundings, the inner side wall of the mounting cavity 202 can absorb part of the heat, thereby improving the thermal conductivity efficiency of the first heat conductive member 21 to the digital micromirror device 10.
[0051] Generally, the outer side wall of the digital micromirror device 10 is stepped. To improve the stability of the digital micromirror device 10 installed in the installation cavity 202, the inner side wall of the installation cavity 202 is stepped to match the outer side wall of the digital micromirror device 10, so that the structures of the installation cavity 202 and the digital micromirror device 10 are matched, so that the digital micromirror device 10 can be stably assembled on the first heat conducting plate 212.
[0052] In some embodiments, a fixing frame 13 is sleeved on the outer side of the rear end 12 , and the fixing frame 13 is fixedly connected to the first heat conducting member 21 , so that the digital micromirror device 10 is fixed to the mounting cavity 202 .
[0053] In some embodiments, the first heat conducting member 21 includes a first heat conducting pipe 211, a first heat conducting plate 212, and a second heat conducting plate 213. The above-mentioned abutting portion 201 and the mounting cavity 202 are both provided on the first heat conducting plate 212. One end of the first heat conducting pipe 211 is connected to the first heat conducting plate 212, the other end of the first heat conducting pipe 211 is connected to the second heat conducting plate 213, and the second heat conducting plate 213 is connected to the first heat exchanger 22, so that the heat of the front end 11 of the digital micromirror device 10 can be sequentially transferred to the first heat exchanger 22 through the first heat conducting plate 212, the first heat conducting pipe 211, and the second heat conducting plate 213.
[0054] In this embodiment, by providing the first heat conducting pipe 211 between the first heat conducting plate 212 and the second heat conducting plate 213, the structural flexibility of the first heat conducting member 21 can be improved. In the specific implementation process, the first heat conducting pipe 211 can be bent as needed, so that a preset angle is formed between the first heat conducting plate 212 and the second heat conducting plate 213, thereby optimizing the spatial layout of the first heat conducting member 21. In addition, by providing the first heat conducting plate 212 connected to the digital micromirror device 10 and providing the second heat conducting plate 213 connected to the first heat exchanger 22, a larger heat conduction area can be provided for the digital micromirror device 10 and the first heat exchanger 22, which helps to improve the heat dissipation efficiency.
[0055] The size of the preset angle can be set according to actual needs, for example, 90°. Accordingly, the first heat conducting pipe 211 is bent at 90°.
[0056] In some embodiments, both the first heat conducting plate 212 and the second heat conducting plate 213 are provided with grooves, and both ends of the first heat conducting pipe 211 are respectively embedded in the grooves on the first heat conducting plate 212 and the second heat conducting plate 213 .
[0057] Optionally, the first heat pipe 211 is a heat conduit, which is a high-efficiency heat transfer element. The heat conduit is filled with fluid (such as water or other low-boiling point liquid mixture) and operates in a vacuum or partial vacuum state, so that the fluid can quickly evaporate in the evaporation section and condense in the condensation section under a small temperature difference, and efficiently transfer heat through a continuous phase change cycle, thereby achieving efficient heat conduction between the first heat conductive plate 212 and the second heat conductive plate 213.
[0058] The first heat conducting plate 212 is used to be installed on the outer side wall of the optical housing 40 of the projection device 100, so that the digital micromirror device 10, the first heat dissipation assembly 20, the second heat dissipation assembly 30, etc. are fixed on the optical housing 40. It can be understood that if the first heat conducting plate 212 is in direct contact with the optical housing 40, then when the projection device 100 is working, the heat of the optical housing 40 will be sequentially transferred to the first heat exchanger 22 through the first heat conducting plate 212, the first heat conducting pipe 211 and the second heat conducting plate 213, so that the first heat exchanger 22 also needs to dissipate heat from the optical housing 40, which easily leads to overload of the first heat exchanger 22. Therefore, in some embodiments, the first heat dissipation component 20 also includes a first thermal insulation layer 23, and the first thermal insulation layer 23 is arranged between the first heat conducting plate 212 and the outer wall of the optical housing 40 to block the heat conduction between the optical housing 40 and the first heat conducting plate 212, reduce the heat source of the first heat exchanger 22, thereby avoiding overload of the first heat exchanger 22 and ensuring the stability of the operation of the first heat exchanger 22.
[0059] like Figure 5 As shown, in some embodiments, the first heat exchanger 22 includes a first water-cooled plate 221 and a first cooling fin 222. The first cooling fin 222 is disposed between the second heat conducting plate 213 and the first heat exchanger 22, the hot end of the first cooling fin 222 abuts against the first heat exchanger 22, the cold end of the first cooling fin 222 abuts against the second heat conducting plate 213, the cold end of the first cooling fin 222 can absorb the heat on the second heat conducting plate 213, and the hot end of the first cooling fin 222 can release heat to the first water-cooled plate 221.
[0060] The first water-cooling plate 221 has a water channel for the flow of coolant, and a water inlet and a water outlet are respectively provided at both ends of the water channel, and the two ends of the water channel are respectively connected to the water inlet and the water outlet. The coolant can enter the water channel through the water inlet and flow along the water channel to the water outlet. The coolant flowing in the water channel can absorb and take away the heat on the first water-cooling plate 221 and flow out from the water outlet.
[0061] In some other embodiments, the first heat exchanger 22 may also be other devices for exchanging heat with the cooling medium, such as heat dissipation fins, or a combination of heat dissipation fins and a fan.
[0062] Generally, the rear end face 103 of the digital micromirror device 10 needs to be electrically connected to the circuit board 50, and the circuit board 50 is used to control the operation of the digital micromirror device 10. If the heat exchanger is directly placed against the rear end 12 of the digital micromirror device 10, the heat exchanger will affect the connection between the rear end face 103 of the digital micromirror device 10 and the circuit board 50. Figure 7 and Figure 8As shown, in some embodiments, the second heat dissipation component 30 includes a second heat conductive member 31 and a second heat exchanger 32. The second heat conductive member 31 is provided with a protrusion 301, and the protrusion 301 abuts against the rear end surface 103 of the digital micromirror device. The second heat exchanger 32 is connected to the second heat conductive member 31. The second heat conductive member 31 is used to conduct heat between the digital micromirror device 10 and the second heat exchanger 32. The second heat exchanger 32 is used to exchange heat with the cooling medium.
[0063] In this embodiment, by providing a protrusion 301 on the second heat conductor 31 that abuts against the rear end surface 103, a certain space can be reserved between the second heat conductor 31 and the digital micromirror device 10 to accommodate the circuit board 50, thereby avoiding affecting the electrical connection between the rear end surface 103 and the circuit board 50, thereby allowing the circuit board 50 to be arranged on the rear end surface 103 and electrically connected to the pins on the rear end surface 103, so that the structure of the digital micromirror device 10, the second heat dissipation assembly 30 and the circuit board 50 is relatively compact.
[0064] The circuit board 50 is provided with a first through hole, and the protrusion 301 on the second heat conducting member 31 passes through the first through hole and abuts against the rear end surface 103 of the digital micromirror device 10 .
[0065] The cooling medium may be a cooling liquid or air.
[0066] In some embodiments, the second heat conducting member 31 includes a second heat conducting pipe 311, a third heat conducting plate 312, and a fourth heat conducting plate 313. The second heat conducting pipe 311 is sandwiched between the third heat conducting plate 312 and the fourth heat conducting plate 313, the protrusion 301 is provided on the third heat conducting plate 312, and the fourth heat conducting plate 313 is connected to the second heat exchanger 32, so that the heat of the rear end 12 of the digital micromirror device 10 can be sequentially transferred to the second heat exchanger 32 through the third heat conducting plate 312, the second heat conducting pipe 311, and the fourth heat conducting plate 313.
[0067] In some embodiments, the fourth heat conducting plate 313 is provided with a groove, and the second heat conducting pipe 311 is embedded in the groove on the fourth heat conducting plate 313 .
[0068] Optionally, the second heat conducting pipe 311 is a heat pipe to achieve efficient heat conduction between the third heat conducting plate 312 and the fourth heat conducting plate 313 .
[0069] In some embodiments, the second heat dissipation assembly 30 further includes a second heat insulation layer 33, and the second heat insulation layer 33 is used to block the heat conduction between the third heat conducting plate 312 and the circuit board 50, wherein the circuit board 50 can be arranged between the rear end surface 103 and the third heat conducting plate 312. Through the above arrangement, it is possible to prevent the heat on the third heat conducting plate 312 from being transferred to the circuit board 50, so that the heat on the third heat conducting plate 312 is only conducted to the second heat conducting pipe 311, the fourth heat conducting plate 313 and the second heat exchanger 32 in sequence through the third heat conducting plate 312, and at the same time, the second heat insulation layer 33 can also play a certain electrical isolation role on the side of the circuit board 50 that is away from the digital micromirror device 10.
[0070] In some embodiments, the second heat dissipation assembly 30 further includes a fixing bracket 34 for fixing the second heat conductor 31 to the second heat exchanger 32 , and the fixing bracket 34 is fixed to the first heat conducting plate 212 to fix the first heat dissipation assembly 20 to the second heat dissipation assembly 30 .
[0071] In some embodiments, the second heat exchanger 32 includes a second water-cooled plate 321 and a second cooling fin 322. The second cooling fin 322 is disposed between the fourth heat conducting plate 313 and the second heat exchanger 32, the hot end of the second cooling fin 322 abuts against the second heat exchanger 32, the cold end of the second cooling fin 322 abuts against the fourth heat conducting plate 313, the cold end of the second cooling fin 322 can absorb the heat on the fourth heat conducting plate 313, and the hot end of the second cooling fin 322 can release heat to the second water-cooled plate 321.
[0072] The second water-cooling plate 321 has a water channel for the flow of coolant inside, and a water inlet and a water outlet are respectively provided at both ends of the water channel, and the two ends of the water channel are respectively connected to the water inlet and the water outlet. The coolant can enter the water channel through the water inlet and flow along the water channel to the water outlet. The coolant flowing in the water channel can absorb and take away the heat on the second water-cooling plate 321 and flow out from the water outlet.
[0073] In some other embodiments, the second heat exchanger 32 may also be other devices for exchanging heat with the cooling medium, such as heat dissipation fins, or a combination of heat dissipation fins and a fan.
[0074] Please refer to Figure 1 In some embodiments, the projection device 100 further includes an optical housing 40 , a circuit board 50 , a lens 60 and a light source 70 .
[0075] The first heat conducting plate 212 of the first heat dissipation assembly 20 is fixed to the outer wall of the optical housing 40 , so that the digital micromirror device 10 , the first heat dissipation assembly 20 and the second heat dissipation assembly 30 are installed on the optical housing 40 .
[0076] A first opening, a second opening and a third opening are respectively provided on both sides of the optical housing 40. The first opening, the second opening and the third opening are all connected to the interior of the optical housing 40. The front end face 101 of the digital micromirror device 10 faces the first opening. The lens 60 is installed at the second opening. The light source 70 is connected to the interior of the optical housing 40 through the third opening.
[0077] Among them, optical elements such as lenses and prisms for processing light can be arranged inside the optical housing 40.
[0078] When the projection device is working, the light emitted by the light source 70 passes through the third opening and enters the interior of the optical housing 40. The light is then processed by optical elements such as lenses and prisms and passes through the first opening to be projected onto the reflection area on the front end surface 101 of the digital micromirror device 10. The reflection area reflects the incident light. The reflection area can reflect the light to the lens 60, and the lens 60 then projects the light onto the screen to form an image.
[0079] The embodiment of the utility model further provides a projector, and the projector includes the projection device 100 as described above.
[0080] The projector of the embodiment of the present invention also has the advantages of the projection device 100 described above, which will not be described in detail here.
[0081] It should be particularly noted that the projector provided in the embodiment of the utility model only shows the part related to the technical problem to be solved by the embodiment of the utility model. It can be understood that the projector provided in the embodiment of the utility model also includes other structures for realizing the functions of the projector, including but not limited to a water circulation system, etc.
[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention is described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the various embodiments of the present invention.
Claims
1. A projection device, characterized in that: include: A digital micromirror device having a front end and a back end; A first heat dissipation component is disposed against the front end, and the first heat dissipation component is used to dissipate heat from the front end; A second heat dissipation component is disposed against the rear end, and the second heat dissipation component is used to dissipate heat from the rear end.
2. The projection device according to claim 1, characterized in that: The front end has a front face and a front side face; The first heat dissipation assembly includes a first heat conducting member and a first heat exchanger; One end of the first heat conductor is provided with an abutment portion, the abutment portion includes a first abutment surface and / or a second abutment surface, the first abutment surface abuts against the edge of the front end surface, the second abutment surface abuts against the front side surface, and the other end of the first heat conductor is connected to the first heat exchanger.
3. The projection device according to claim 2, characterized in that: The first abutting surface is extended along the edge contour of the front end surface, and the second abutting surface is extended along the circumference of the front side surface.
4. The projection device according to claim 3, characterized in that: The first heat conducting member is provided with an installation cavity, the installation cavity passes through two sides of the first heat conducting member, the digital micromirror device is accommodated in the installation cavity, and the abutting portion is arranged at a cavity opening of the installation cavity.
5. The projection device according to claim 4, characterized in that: The first heat-conducting member includes a first heat-conducting pipe, a first heat-conducting plate, and a second heat-conducting plate; The abutting portion and the mounting cavity are provided on the first heat conducting plate; One end of the first heat-conducting pipe is connected to the first heat-conducting plate, the other end of the first heat-conducting pipe is connected to the second heat-conducting plate, and the second heat-conducting plate is connected to the first heat exchanger.
6. The projection device according to claim 5, characterized in that: The first heat conducting plate is used to be installed on the outer side wall of the optical housing; The first heat dissipation component further includes a first heat insulation layer, and the first heat insulation layer is arranged between the first heat conducting plate and the outer side wall of the optical housing.
7. The projection device according to claim 1, characterized in that: The second heat dissipation component includes a second heat conducting member and a second heat exchanger. The second heat conducting member is provided with a protrusion, the protrusion abuts against the rear end surface, and the second heat exchanger is connected to the second heat conducting member.
8. The projection device according to claim 7, characterized in that: The second heat-conducting member includes a second heat-conducting pipe, a third heat-conducting plate and a fourth heat-conducting plate; The second heat-conducting tube is sandwiched between the third heat-conducting plate and the fourth heat-conducting plate, the protrusion is arranged on the third heat-conducting plate, and the fourth heat-conducting plate is connected to the second heat exchanger.
9. The projection device according to claim 8, characterized in that: The second heat dissipation component further includes a second heat insulation layer, which is used to block heat conduction between the third heat conducting plate and the circuit board, wherein the circuit board can be arranged between the rear end surface and the third heat conducting plate.
10. A projector, characterized in that: The invention comprises a projection device as claimed in any one of claims 1 to 9.