Computing device

Abstract

The embodiment of the utility model provides a computing device which comprises a shell, a first air duct, a second air duct, a first air inlet, a second air outlet, a first air inlet, a second air inlet and a second air outlet, the circuit board is arranged in the first air duct; the fan assembly is arranged in the first air channel and is located in the air direction in the first air channel, the circuit board is located in the upwind direction, the fan assembly is located in the downwind direction, the fan assembly comprises a drivable impeller, and the circuit board is located on one side of the impeller in the radial direction. According to the technical scheme, the problem of air channeling can be avoided, so that the heat dissipation performance of the computing equipment can be improved, the arrangement number of the air duct pieces in the first air duct can be reduced, and the structure is simpler.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a computing device. Background Art

[0002] In the related art, electronic devices such as computing devices are usually provided with air ducts. When wind flows through the air ducts, it can take away the heat generated by the working components inside the electronic device. However, when the wind flows in the air ducts, it is easy for wind to cross, thereby affecting the heat dissipation performance of the electronic device. Utility Model Content

[0003] The embodiments of the present application provide a computing device to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present application, the embodiment of the present application provides a computing device, including: a shell, a first air duct with a first air inlet and a first air outlet is defined in the shell; a circuit board is arranged in the first air duct; a fan assembly is arranged in the first air duct, and along the wind direction in the first air duct, the circuit board is located in the upwind direction and the fan assembly is located in the downwind direction, the fan assembly includes a drivable impeller, and the circuit board is located on one side of the impeller in the radial direction.

[0005] In one embodiment, the first air inlet is arranged on any side plate of the shell, and the first air outlet is arranged on the top plate of the shell.

[0006] In one embodiment, the shell includes a top plate and a bottom plate arranged opposite to each other, two first side plates arranged opposite to each other, and two second side plates arranged opposite to each other, the first side plate is located in the axial direction of the fan assembly, wherein the first air inlet is arranged on one of the two second side plates, and the first air outlet is arranged on the top plate.

[0007] In one embodiment, the fan assembly further includes a driver, which is drivingly connected to one axial end of the impeller.

[0008] In one embodiment, the fan assembly includes a fan housing, and a second air duct having a second air inlet and a second air outlet is defined in the fan housing. The second air inlet is arranged opposite to the circuit board, and the second air outlet is arranged opposite to the first air outlet.

[0009] In one embodiment, the fan assembly includes a fan housing, the impeller is located in the fan housing, and the driver is mounted on the fan housing.

[0010] In one embodiment, the computing device further includes: a control module electrically connected to the fan assembly and the circuit board, and the control module is disposed at one axial end of the fan assembly.

[0011] In one embodiment, a driver of the fan assembly is electrically connected to the control module.

[0012] In one embodiment, the control module includes a power connector, a reset controller and a switch controller; wherein the power connector corresponds to the power interface set on the shell, the reset controller corresponds to the reset interface set on the shell, and the switch controller corresponds to the switch interface set on the shell.

[0013] In one embodiment, the power interface, the reset interface and the switch interface are arranged on the top plate of the housing.

[0014] In one embodiment, the circuit board includes a first surface and a second surface that are arranged opposite to each other, and a plurality of heat-generating components are arranged in an array on the first surface.

[0015] In one embodiment, the areas of the plurality of heat-generating components are equal, and / or the device types of the plurality of heat-generating components are the same.

[0016] In one embodiment, the computing device further includes a heat sink, and the heat sink is disposed on the first surface and / or the second surface.

[0017] In one embodiment, the radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each heat dissipating fin is the same as the wind direction in the first air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.

[0018] In one embodiment, the heat sink includes a first heat sink and a second heat sink, the first heat sink is arranged on the first surface, and the second heat sink is arranged on the second surface, wherein along the arrangement direction of the plurality of heat sink fins, the size of the second heat sink is larger than the size of the first heat sink.

[0019] In one embodiment, the heat sink further includes a heat dissipation substrate, a plurality of heat dissipation fins are disposed on the heat dissipation substrate, and the heat dissipation substrate is connected to the circuit board.

[0020] In one embodiment, along the wind direction in the first air duct, the size of at least part of the first heat dissipation fins is smaller than the size of at least part of the remaining heat dissipation fins; the first heat dissipation fins are heat dissipation fins corresponding to the connection area between the heat dissipation substrate and the circuit board.

[0021] In one embodiment, the second heat sink is connected to the housing via fasteners.

[0022] In one embodiment, the second heat sink is used to support the weight of the circuit board and the first heat sink.

[0023] In one embodiment, the top of the first air inlet is flush with the top of the radiator, and the bottom of the first air inlet is flush with the bottom of the radiator.

[0024] In one embodiment, the distance between two adjacent heat dissipation fins is 3 mm to 6 mm.

[0025] In one embodiment, the housing includes a mounting location in which the display assembly is mounted.

[0026] In one embodiment, the first air outlet is connected to a heat recovery system.

[0027] The embodiment of the present application adopts the above-mentioned technical solution to avoid the problem of air leakage, thereby improving the heat dissipation performance of the computing device, and can reduce the number of air duct components arranged in the first air duct, making the structure simpler.

[0028] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0030] Figure 1 A schematic top view of a computing device according to an embodiment of the present application is shown;

[0031] Figure 2 Shown along Figure 1 Sectional view along line AA;

[0032] Figure 3 and Figure 4 An exploded diagram of a computing device according to an embodiment of the present application is shown;

[0033] Figure 5 A partial structural schematic diagram of a housing according to an embodiment of the present application is shown;

[0034] Figure 6 A schematic diagram showing a partial structure of a computing device according to an embodiment of the present application is shown;

[0035] Figure 7 Show Figure 6 An exploded diagram of the computing device shown in .

[0036] Description of reference numerals:

[0037] 10: Computing equipment;

[0038] 100: housing; 110: top plate; 111: first air outlet; 120: bottom plate; 130: first side plate; 140: second side plate; 141: first air inlet; 150: mounting hole; 160: pressure plate; 170: display component; 10a: power interface; 10b: reset interface; 10c: switch interface; 200: circuit board; 210: first surface; 211: heating components; 220: second surface; 300: fan assembly; 310: impeller; 320: driver; 330: fan housing; 331: second air inlet; 332: second air outlet; 400: radiator; 410: first radiator; 420: second radiator; 430: liquid cooling tube; 440: heat dissipation fins; 450: heat dissipation substrate; 500: control module; 510: power connector; 520: reset controller; 530: switch controller. DETAILED DESCRIPTION

[0039] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0040] Combine the following Figure 1-Figure 7 A computing device according to an embodiment of the present application is described.

[0041] Figure 1 A schematic top view of a computing device 10 according to an embodiment of the present application is shown; Figure 2 Shown along Figure 1 Sectional view along line AA; Figure 3 and Figure 4 FIG. 1 shows an exploded view of a computing device 10 according to an embodiment of the present application. Figure 1-Figure 4 As shown, the computing device 10 includes a housing 100 , a circuit board 200 , and a fan assembly 300 .

[0042] Specifically, a first air duct having a first air inlet 141 and a first air outlet 111 is defined in the housing 100. The circuit board 200 is disposed in the first air duct. The fan assembly 300 is disposed in the first air duct, and along the wind direction in the first air duct, the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction. The fan assembly 300 includes a drivable impeller 310, and the circuit board 200 is located on one side of the impeller 310 in the radial direction.

[0043] It should be noted that “along the wind direction in the first air duct, the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction” means that along the wind direction in the first air duct, the circuit board 200 is located in the upwind direction relative to the fan assembly 300, and the fan assembly 300 is located in the downwind direction relative to the circuit board 200. In other words, when the wind flows in the air duct, the wind passes through the circuit board 200 first, and then passes through the fan assembly 300.

[0044] Among them, "upwind direction" and "downwind direction" should be understood in a broad sense in this application, and "up" and "down" do not refer to "up" and "down" in physical orientation, but refer to the relative position relationship in the wind direction within the first air duct. For example: in the first air duct, if the wind flows from left to right, then the left side of the first air duct can be described as the upwind direction, and the right side of the first air duct is the downwind direction. At this time, "the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction" means that the circuit board 200 is located on the left side of the fan assembly 300, and the fan assembly 300 is located on the right side of the circuit board 200. If the wind flows from bottom to top, then the lower side of the first air duct can be described as the upwind direction, and the upper side of the air duct is the downwind direction. At this time, "the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction" means that the circuit board 200 is located on the lower side of the fan assembly 300, and the fan assembly 300 is located on the upper side of the circuit board 200.

[0045] Exemplarily, the fan assembly 300 may also include a driver 320, which is transmission-connected to one end of the impeller 310 in the axial direction, and is used to drive the impeller 310 to rotate. For example, the driver 320 may be a driving motor, in which case the driver 320 may include a driving body and a power output shaft disposed on the driving body, and the power output shaft may be rotatable relative to the driving body. The power output shaft may be transmission-connected to the impeller 310. Optionally, the material of the impeller 310 may be metal such as aluminum alloy, or may be plastic, which is not limited in this application. When the driver 320 is working, the driver 320 drives the impeller 310 to rotate. Under the action of the impeller 310, cold air enters the first air duct from the first air inlet 141, then flows through the circuit board 200, generates heat exchange with the circuit board 200, and takes away the heat generated during the operation of the circuit board 200. The hot air flowing through the circuit board 200 enters the fan assembly 300 from the air inlet of the fan assembly 300 , then flows from the air outlet of the fan assembly 300 to the first air outlet 111 , and finally flows out from the first air outlet 111 .

[0046] In this embodiment, since the circuit board 200 is located in the upwind direction and the fan assembly 300 is located in the downwind direction, the fan assembly 300 is of the exhaust type, which can avoid the problem of cross-flow, thereby improving the heat dissipation performance of the computing device 10, and can reduce the number of air duct components arranged in the first air duct, and the structure is simpler. In addition, since the circuit board 200 is located on one side of the impeller 310 in the radial direction, the hot air flowing through the circuit board 200 enters from the radial direction of the impeller 310, and the fan assembly 300 is a cross-flow fan. While ensuring that the fan assembly 300 is energy-efficient, silent, easy to maintain and install, there is no need to consider the limitation of the air outlet size of the fan assembly 300, thereby improving the space utilization of the computing device 10.

[0047] For example, the first air outlet 111 may be connected to a heat recovery system, so that the hot air outputted from the first air outlet 111 may be reused, thereby improving energy efficiency, reducing carbon emissions, and lowering energy costs.

[0048] Optionally, a rubber pad structure may be provided at the installation position of the fan assembly 300 to absorb vibration and impact generated during the operation of the fan assembly 300 .

[0049] For example, the first air outlet 111 can be connected to the indoor space or the vehicle interior space through a heat recovery system, so that the hot air output from the first air outlet 111 can be used to increase the indoor or vehicle interior air temperature to achieve a heating function. Compared with the method of using a heater for heating, it can save electricity, improve resource utilization efficiency, and reduce negative impacts on the environment.

[0050] It should be noted that the "heat recovery system" in this application should be understood in a broad sense, referring to a system for recovering heat energy. For example, when the first air outlet 111 is directly connected to the indoor space to use the hot air output from the first air outlet 111 for heating, the heat recovery system is the house.

[0051] In one embodiment, the first air inlet 141 can be disposed on any side panel of the housing 100, and the first air outlet 111 can be disposed on the top panel of the housing 100. Thus, when the hot air outputted from the first air outlet 111 is used for heating, the first air outlet 111 disposed on the top panel can avoid being blocked by furniture, curtains or other objects, thereby ensuring the circulation of hot air and fully meeting the heating needs of the user.

[0052] Figure 5 FIG. 1 is a schematic diagram showing a partial structure of a housing 100 according to an embodiment of the present application. Figure 2 , Figure 3 and Figure 5The housing 100 may include a top plate 110 and a bottom plate 120 that are arranged oppositely, two first side plates 130 that are arranged oppositely, and two second side plates 140 that are arranged oppositely, wherein the first side plate 130 is located in the axial direction of the fan assembly 300, wherein the first air inlet 141 is arranged at one of the two second side plates 140, and the first air outlet 111 is arranged at the top plate 110. Thus, the housing 100 has a simple structure, is easy to process, and can effectively improve the efficiency of assembly and disassembly.

[0053] For example, refer to Figure 2 , Figure 3 and Figure 5 The shell 100 can be roughly formed into a rectangular parallelepiped structure. The two first side panels 130 can be a first left side panel and a first right side panel, respectively. The two second side panels 140 can be a second front side panel and a second rear side panel, respectively. The fan assembly 300 is arranged close to the second front side panel, and the circuit board 200 is arranged close to the second rear side panel. The first air inlet 141 can be arranged on the second rear side panel. Among them, the top plate 110, the two first side panels 130 and the two second side panels 140 can be an integral structure of the upper shell to facilitate assembly and disassembly.

[0054] In one embodiment, Figure 2 and Figure 3 As shown, the fan assembly 300 may further include a fan housing 330, wherein a second air duct having a second air inlet 331 and a second air outlet 332 is defined in the fan housing 330, wherein the second air inlet 331 is arranged opposite to the circuit board 200, and the second air outlet 332 is arranged opposite to the first air outlet 111. The second air inlet 331 is the air inlet of the fan assembly 300, and the second air outlet 332 is the air outlet of the fan assembly 300.

[0055] In this embodiment, the fan housing 330 can define a second air duct, thereby playing an effective wind-guiding role, so that the hot air flowing through the circuit board 200 can enter from the second air inlet 331, flow along the second air duct, and finally flow from the second air outlet 332 to the first air outlet 111, effectively improving the efficiency of the fan assembly 300 and reducing energy waste.

[0056] In one embodiment, the fan assembly 300 may further include a fan housing 330, the impeller 310 is located in the fan housing 330, and the driver 320 is installed in the fan housing 330. Exemplarily, when the driver 320 is a driving motor, the driving body may be fixedly connected to the fan housing 330. When the driver 320 is working, the power output shaft drives the impeller 310 to rotate. Under the action of the impeller 310, the cold air enters the first air duct from the first air inlet 141, then flows through the circuit board 200, generates heat exchange with the circuit board 200, and takes away the heat generated during the operation of the circuit board 200. The hot air flowing through the circuit board 200 enters the second air duct from the second air inlet 331, then flows from the second air outlet 332 to the first air outlet 111, and finally flows out from the first air outlet 111.

[0057] In this embodiment, the fan housing 330 can play an effective protective role, preventing the impeller 310 from being damaged due to external objects or impurities entering the impeller 310, thereby extending the service life of the entire fan assembly 300. In addition, the fan housing 330 can also improve operational safety and reduce the noise generated when the impeller 310 rotates.

[0058] In one embodiment, the surfaces of the top plate 110, the bottom plate 120, the first side plate 130, and the second side plate 140 can all be planes. Here, "the surface is a plane" can be understood as the area on the surface where no parts and holes are set is a plane. For example: the surface of the top plate 110 is a plane means that the area on the surface of the top plate 110 where the first air outlet 111 is not set is a plane.

[0059] In this embodiment, the portion of the top plate 110 corresponding to the fan assembly 300 and the portion of the top plate 110 corresponding to the circuit board 200 can be flush with each other and located in the same plane; the portion of the bottom plate 120 corresponding to the fan assembly 300 and the portion of the bottom plate 120 corresponding to the circuit board 200 can be flush with each other and located in the same plane; the portion of the first side plate 130 corresponding to the fan assembly 300 and the portion of the first side plate 130 corresponding to the circuit board 200 can be flush with each other and located in the same plane; the portion of the second side plate 140 corresponding to the fan assembly 300 and the portion of the second side plate 140 corresponding to the circuit board 200 can be flush with each other and located in the same plane, which can avoid the formation of a step structure on the surfaces of the top plate 110, the bottom plate 120, the first side plate 130 and the second side plate 140, improve the flatness of the appearance and the space utilization of the shell 100, and thus improve the integrity of the computing device 10.

[0060] Figure 6 A partial structural schematic diagram of a computing device 10 according to an embodiment of the present application is shown; Figure 7 Show Figure 6 10 is an exploded view of the computing device 10 shown in FIG. Figure 2 , Figure 6 and Figure 7 As shown, the circuit board 200 may include a first surface 210 and a second surface 220 that are arranged opposite to each other, and a plurality of heat generating components 211 arranged in an array are arranged on the first surface 210 to implement the computing function of the computing device. Exemplarily, the areas of the plurality of heat generating components 211 may be equal, and / or the device types of the plurality of heat generating components 211 may be the same, so as to facilitate the arrangement of the heat generating components 211 on the circuit board 210. For example, the plurality of heat generating components 211 may all be chips.

[0061] In one embodiment, the computing device 10 may further include a heat sink 400. The heat sink 400 is disposed on the first surface 210 and / or the second surface 220. In other words, the heat sink 400 may be disposed on the first surface 210 of the circuit board 200, and the heat sink 400 may not be disposed on the second surface 220 of the circuit board 200; or the heat sink 400 may be disposed on the second surface 220 of the circuit board 200, and the heat sink 400 may not be disposed on the first surface 210 of the circuit board 200; or the heat sink 400 may be disposed on both the first surface 210 and the second surface 220 of the circuit board 200.

[0062] In this way, the heat generated by the heat generating components 211 on the circuit board 200 during operation can be conducted to the heat sink 400. When the fan assembly 300 is in operation, external cold air can flow from the first air inlet 141 into the first air duct, and then flow through the heat sink 400, thereby taking away the heat on the heat sink 400, effectively reducing the temperature of the circuit board 200, and achieving normal operation of the heat generating components 211.

[0063] Exemplarily, when there is one heat sink 400, the heat sink 400 may be disposed on the first surface 210 of the circuit board 200, or may be disposed on the second surface 220 of the circuit board 200. When there are multiple heat sinks 400, the multiple heat sinks 400 may all be disposed on the first surface 210 of the circuit board 200; or, the multiple heat sinks 400 may all be disposed on the second surface 220 of the circuit board 200; or, a portion of the multiple heat sinks 400 may be disposed on the first surface 210 of the circuit board 200, and another portion of the multiple heat sinks 400 may be disposed on the second surface 220 of the circuit board 200. When the heat sink 400 is disposed on the first surface 210 of the circuit board 200, the heat sink 400 may be in direct contact with the heat generating component 211, or may be in indirect contact with the heat generating component 211 through a heat conducting material (such as silicone grease). A riveted nut column may be disposed on the bottom plate 120, and the heat sink 400 may be fixedly connected to the riveted nut column by a fastener such as a bolt, thereby realizing the installation of the heat sink 400.

[0064] In one embodiment, reference Figure 2, Figure 6 and Figure 7 The radiator 400 includes a liquid cooling tube 430 and a plurality of heat dissipating fins 440 arranged at intervals, the extension direction of each heat dissipating fin 440 is the same as the wind direction in the first air duct, and the liquid cooling tube 430 is arranged through the plurality of heat dissipating fins 440 along the arrangement direction of the plurality of heat dissipating fins 440. In the description of this application, "plurality" means two or more.

[0065] Exemplarily, the heat dissipation fins 440 may be perpendicular to the first surface 210 and the second surface 220 of the circuit board 200. A heat dissipation channel may be defined between two adjacent heat dissipation fins 440. Since the extension direction of each heat dissipation fin 440 is the same as the wind direction in the first air duct, the extension direction of the heat dissipation channel is the same as the wind direction in the first air duct. A coolant such as water is provided in the liquid cooling tube 430. The heat generated during the operation of the heat generating component 211 may be conducted to the heat dissipation fins 440. Since the liquid cooling tube 430 is provided through a plurality of heat dissipation fins 440, the heat dissipation fins 440 may conduct part of the heat to the coolant in the liquid cooling tube 430, thereby exchanging heat with the coolant. When the fan assembly 300 is working, the external cold air may flow from the first air inlet 141 into the first air duct, and then flow through the heat dissipation channel, thereby realizing heat exchange with the radiator 400, reducing the temperature of the radiator 400 and the circuit board 200, and realizing the normal operation of the heat generating component 211. The hot air after heat exchange can flow out from the first air outlet 111 under the action of the fan assembly 300 .

[0066] In this embodiment, since the extension direction of the heat dissipation fins 440 is the same as the wind direction in the first air duct, the cold air can better take away the heat when passing through the heat dissipation fins 440, effectively improving the heat dissipation efficiency. Moreover, by providing the liquid cooling tube 430, the coolant in the liquid cooling tube 430 has good thermal conductivity, which can absorb and transfer heat more quickly, further improving the heat dissipation efficiency. By making the circuit board 200 and the fan assembly 300 both located in the air duct, the internal structure of the computing device 10 is made more compact, the space utilization rate in the housing 100 is improved, and the appearance of the computing device 10 is made more regular, and the safety of the user's heating can be improved.

[0067] In one embodiment, in combination Figure 2 , Figure 6 and Figure 7 The heat sink 400 includes a first heat sink 410 and a second heat sink 420. The first heat sink 410 is disposed on the first surface 210, and the second heat sink 420 is disposed on the second surface 220. In the arrangement direction of the plurality of heat sink fins 440, the size of the second heat sink 420 is larger than the size of the first heat sink 410. Exemplarily, Figure 6 and Figure 7Two heat sinks 400 are shown, namely a first heat sink 410 and a second heat sink 420 .

[0068] In this embodiment, by providing the above-mentioned first heat sink 410 and second heat sink 420, the heat of the first surface 210 of the circuit board 200 can be effectively transferred to the first heat sink 410, and the heat of the second surface 220 of the circuit board 200 can be effectively transferred to the second heat sink 420. In the process of wind blowing from the first air inlet 141 of the first air duct to the first air outlet 111, the heat of the first heat sink 410 and the second heat sink 420 can be effectively taken away, thereby achieving effective heat dissipation of the circuit board 200. In addition, since a functional module (such as a sensor, etc.) with a relatively large height is usually provided on the first surface 210 of the circuit board 200, by making the size of the second heat sink 420 larger than the size of the first heat sink 410, the first heat sink 410 with a smaller size can play an effective avoidance role, which is beneficial to the overall installation of the computing device 10; at the same time, the second heat sink 420 with a larger size has a better heat dissipation effect, thereby effectively reducing the temperature of the heat-generating component 211, ensuring the normal operation of the heat-generating component 211, and extending the service life.

[0069] In one embodiment, reference Figure 2 , Figure 6 and Figure 7 The radiator 400 may further include a heat dissipation substrate 450, a plurality of heat dissipation fins 440 are arranged on the heat dissipation substrate 450, and the heat dissipation substrate 450 is connected to the circuit board 200; wherein, along the wind direction in the first air duct, the size of at least part of the first heat dissipation fins 440 is smaller than the size of at least part of the remaining heat dissipation fins 440; the first heat dissipation fins 440 are the heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200.

[0070] It should be noted that “the heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200 ” refers to the heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200 in the wind direction in the first air duct.

[0071] Among them, the above-mentioned "the size of at least part of the first heat dissipation fins 440 is smaller than the size of at least part of the remaining heat dissipation fins 440" may include the following four situations: the first: the size of each first heat dissipation fin 440 is smaller than the size of all other heat dissipation fins 440; the second: the size of each first heat dissipation fin 440 is smaller than the size of the remaining heat dissipation fins 440; the second: the size of some first heat dissipation fins 440 is smaller than the size of all other heat dissipation fins 440; the fourth: the size of some first heat dissipation fins 440 is smaller than the size of the remaining heat dissipation fins 440.

[0072] For example, the computing device 10 may further include a first fastener such as a bolt. The first fastener may pass through the heat dissipation substrate 450 of the first heat sink 410 and the circuit board 200 in sequence and then be connected to the heat dissipation substrate 450 of the second heat sink 420, or pass through the heat dissipation substrate 450 of the first heat sink 410, the circuit board 200, and the heat dissipation substrate 450 of the second heat sink 420 in sequence and then be connected to the second fastener. The second fastener may be a nut.

[0073] In this embodiment, by making the size of at least part of the first heat dissipating fins 440 smaller than the size of at least part of the remaining heat dissipating fins 440 along the wind direction in the first air duct, the first heat dissipating fins 440 can play an effective avoidance role, so that the connection area between the heat dissipating substrate 450 and the circuit board 200 can be used for arranging fasteners, thereby realizing the assembly of the first heat sink 410, the circuit board 200 and the second heat sink 420.

[0074] In one embodiment, the second radiator 420 can be connected to the housing 100 by fasteners. In this way, the second radiator 420 can be used to support the weight of the circuit board 200 and the first radiator 410. Since the size of the second radiator 420 is larger than the size of the first radiator 410, the second radiator 420 has a larger support area, which helps to disperse the weight of the circuit board 200 and the first radiator 410, achieve uniform distribution of loads, reduce the risk of single-point concentration, and help improve the load-bearing capacity and vibration resistance of the entire computing device 10. Moreover, since the second radiator 420 is usually made of solid metal or other high-strength materials, it can provide better structural stability when used as a support structure. In addition, the second radiator 420 used as a support structure can effectively reduce the stress of the circuit board 200 when it is subjected to mechanical shock or vibration, reduce its force burden, and thus extend the service life of the circuit board 200.

[0075] In one embodiment, the top of the first air inlet 141 is flush with the top of the radiator 400, and the bottom of the first air inlet 141 is flush with the bottom of the radiator 400. For example, the top of the first air inlet 141 can be flush with the top of the first radiator 410, and the bottom of the first air inlet 141 can be flush with the bottom of the second radiator 420. In this way, it is ensured that the wind from the first air inlet 141 to the first air outlet 111 can flow through the radiator 220, achieving effective heat dissipation of the circuit board 200, and at the same time, the risk of wind flowing to the gap between the radiator 220 and the housing 100 can be reduced to avoid air leakage and cross-flow.

[0076] It should be noted that in the above scheme, flush refers to a situation with a significant height difference, for example, the height difference between the two surfaces is more than 2 cm. The flush here can be understood as: the top of the first air inlet 141 and the top of the radiator 400 are in the same plane or have a certain deviation distance, but the visual effect is almost flush, and the bottom of the first air inlet 141 and the bottom of the radiator 400 are in the same plane or have a certain deviation distance, but the visual effect is almost flush; those skilled in the art can understand that the first air inlet 141 and the radiator 400 in the above scheme may not be strictly flush due to screws, protective layer structures, reinforcement structures or paint, but as long as they are basically flush, they belong to the protection scope defined by "flush with each other" in this application.

[0077] In an optional embodiment, the distance between two adjacent heat sink fins 440 may be 3 mm to 6 mm (including the endpoint values). Exemplarily, the distance between two adjacent heat sink fins 440 may be 3 mm or 6 mm, but is not limited thereto. Specifically, for example, when the distance between two adjacent heat sink fins 440 is less than 3 mm, the distance between two adjacent heat sink fins 440 is too small, making the density of the heat sink fins 440 too large, the heat dissipation space between two adjacent heat sink fins 440 too small, the wind resistance is too large, and the dust accumulation is serious; when the distance between two adjacent heat sink fins 440 is greater than 6 mm, the distance between two adjacent heat sink fins 440 is too large, reducing the total surface area of ​​the heat sink fins 440, affecting the heat dissipation effect.

[0078] In this embodiment, by making the distance between two adjacent heat dissipation fins 440 3mm to 6mm, wind resistance can be reduced, ventilation volume can be increased, dust accumulation can be improved, and the heat dissipation area of ​​the heat dissipation fins 440 can be relatively large, thereby effectively dissipating the heat generated by multiple heat-generating components 211 during operation.

[0079] In one embodiment, Figure 3 , Figure 6 and Figure 7 As shown, the computing device 10 may further include a control module 500, which is electrically connected to the fan assembly 300 and the circuit board 200, and is disposed at one end of the fan assembly 300 in the axial direction. Exemplarily, during installation, the control module 500 may first be connected to the fan assembly 300 by fasteners such as screws, and then the heat sink 400 may be connected to the bottom plate 120 by fasteners such as screws, and the fan assembly 300 may be connected to the bottom plate 120 by fasteners such as screws. Finally, the overall structure of the upper shell is installed by fasteners such as screws.

[0080] In this embodiment, by setting the above-mentioned control module 500, the control module 500 can control the circuit board 200 and the fan assembly 300 to work, thereby ensuring the heat dissipation effect while realizing the computing function, and improving the reliability and long-term stability of the computing device 10. In addition, by setting the control module 500 at one end of the fan assembly 300 in the axial direction, the arrangement of the control module 500 is more reasonable, so that the distance between the control module 500 and the fan assembly 300 and the circuit board 200 is closer, which facilitates the routing between the control module 500 and the fan assembly 300 and between the control module 500 and the circuit board 200.

[0081] In one embodiment, the driver 320 of the fan assembly 300 is electrically connected to the control module 500. In this way, the control module 500 can control the driver 320 to work, so that the driver 320 drives the impeller 310 to rotate, so that the wind can flow in the direction from the first air inlet 141 to the first air outlet 111. Exemplarily, the control module 500 may include a fan interface, and the fan interface is connected to the fan assembly 300 so that the control board can control the operation of the fan assembly 300. For example: the fan interface can be connected to the driver 320 of the fan assembly 300. A first signal socket may be provided on the circuit board 200, and the control module 500 may include a second signal socket, and the first signal socket is connected to the second signal socket, so that the control module 500 can control the operation of the circuit board 200.

[0082] In one embodiment, Figure 3 and Figure 4 As shown, the control module 500 may include a power connector 510, a reset controller 520 and a switch controller 530. Among them, the power connector 510 corresponds to the power interface 10a set on the housing 100, the reset controller 520 corresponds to the reset interface 10b set on the housing 100, and the switch controller 530 corresponds to the switch interface 10c set on the housing 100. In this way, the user can control the reset controller 520 through the reset interface 10b on the housing 100, so as to control the reset of the computing device 10 and ensure the normal operation of the computing device 10. Similarly, the user can control the switch controller 530 through the switch interface 10c on the housing 100, so as to turn on the computing device 10 when the computing device 10 is turned off, and turn off the computing device 10 when the computing device 10 is turned on. In addition, the user can also connect the power connector 510 through the power interface 10a, so as to realize the transmission of electric energy. Exemplarily, the power connector 510 can be a Type-C interface, but is not limited thereto.

[0083] In one embodiment, the power interface 10a, the reset interface 10b and the switch interface 10c can be arranged on the top plate of the housing 100. In this way, the user can directly find and perform corresponding operations on the top plate, for example, it is more convenient to plug and unplug the power cord through the power interface 10a, perform the reset operation through the reset interface 10b, and control the switch of the computing device 10 through the switch interface 10c, saving time and energy. Moreover, arranging the power interface 10a, the reset interface 10b and the switch interface 10c on the top plate of the housing 100 can reduce the risk of misoperation, so that the user can more clearly observe the position of the power interface 10a, the reset interface 10b and the switch interface 10c, and avoid inserting fingers or other objects into the wrong position by mistake, thereby improving the safety and reliability of the computing device 10. In addition, arranging the power interface 10a, the reset interface 10b and the switch interface 10c on the top plate helps to improve the aesthetic appearance of the computing device 10.

[0084] In one embodiment, the housing 100 may further include a mounting position, in which the display assembly 170 is mounted.

[0085] For example, the display component 170 can be used to loop and play information such as Internet Protocol (IP), air inlet temperature, air outlet temperature, computing power, power consumption, etc. The pressing plate 160 can be in a long strip shape.

[0086] In one example, combining Figure 4 and Figure 5 The mounting position may be a through mounting hole 150, through which the display assembly 170 is exposed, so that the user can observe the image information or text information displayed on the display assembly 170 from the outside. For example, the mounting hole 150 may penetrate the top plate of the housing 100 along the wall thickness direction of the housing 100. At least a portion of the display assembly 170 is located in the first air duct.

[0087] In another example, the mounting position may also be a mounting groove (not shown), and the display assembly 170 is located in the mounting groove. In this case, the user can also observe the image information or text information displayed on the display assembly 170 from the outside. For example, the mounting groove may be formed by a portion of the housing 100 being recessed inward. The display assembly 170 may be located outside the first air duct.

[0088] In one embodiment, the computing device 10 may further include a pressure plate 160, the pressure plate 160 is fixedly connected to the housing 100, and the display assembly 170 is pressed between the pressure plate 160 and the inner wall of the housing 100. For example, the pressure plate 160 may be formed into a runway-shaped structure. The computing device 10 may include a third fastener. During installation, the third fastener may pass through the pressure plate 160 and be fixedly connected to the top plate of the housing 100. Furthermore, there may be two third fasteners, and the two third fasteners may be respectively located at both ends of the pressure plate 160. In this embodiment, through the above arrangement, while ensuring that the user can observe the information displayed by the display assembly 170 from the outside, the structural stability and reliability of the display assembly 170 can also be ensured.

[0089] In this embodiment, through the above arrangement, while ensuring that the user can observe the information displayed by the display component 170 from the outside, the structure of the display component 170 is made more stable and reliable.

[0090] Other components of the computing device 10 in the above embodiment may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0091] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0092] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0093] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0094] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0095] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0096] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A computing device, characterized in that: include: A housing, wherein a first air duct having a first air inlet and a first air outlet is defined in the housing; A circuit board is arranged in the first air duct; The fan assembly is arranged in the first air duct, and along the wind direction in the first air duct, the circuit board is located in the upwind direction, the fan assembly is located in the downwind direction, the fan assembly includes a drivable impeller, and the circuit board is located on one side of the impeller in the radial direction.

2. The computing device according to claim 1, wherein: The first air inlet is arranged on any side plate of the shell, and the first air outlet is arranged on the top plate of the shell.

3. The computing device according to claim 2, characterized in that The shell includes a top plate and a bottom plate arranged opposite to each other, two first side plates arranged opposite to each other, and two second side plates arranged opposite to each other, wherein the first side plates are located in the axial direction of the fan assembly, wherein the first air inlet is arranged at one of the two second side plates, and the first air outlet is arranged at the top plate.

4. The computing device according to claim 1, wherein: The fan assembly also includes a driver, which is transmission-connected to one axial end of the impeller.

5. The computing device of claim 1, wherein: The fan assembly includes a fan housing, and a second air duct having a second air inlet and a second air outlet is defined in the fan housing. The second air inlet is arranged opposite to the circuit board, and the second air outlet is arranged opposite to the first air outlet.

6. The computing device according to claim 4, characterized in that The fan assembly comprises a fan housing, the impeller is located in the fan housing, and the driver is installed on the fan housing.

7. The computing device according to claim 1, wherein: Also includes: The control module is electrically connected to the fan assembly and the circuit board, and the control module is arranged at one axial end of the fan assembly.

8. The computing device according to claim 7, characterized in that The driver of the fan assembly is electrically connected to the control module.

9. The computing device according to claim 7, characterized in that The control module includes a power connector, a reset controller and a switch controller; wherein the power connector corresponds to the power interface set on the shell, the reset controller corresponds to the reset interface set on the shell, and the switch controller corresponds to the switch interface set on the shell.

10. The computing device according to claim 9, characterized in that The power interface, the reset interface and the switch interface are arranged on the top plate of the housing.

11. The computing device according to claim 1, wherein: The circuit board comprises a first surface and a second surface which are arranged opposite to each other, and a plurality of heat generating components are arranged in an array on the first surface.

12. The computing device according to claim 11, characterized in that The areas of the multiple heat-generating components are equal, and / or the device types of the multiple heat-generating components are the same.

13. The computing device according to claim 11, characterized in that The computing device further includes a heat sink disposed on the first surface and / or the second surface.

14. The computing device according to claim 13, characterized in that The radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each of the heat dissipating fins is the same as the wind direction in the first air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.

15. The computing device according to claim 14, characterized in that The heat sink includes a first heat sink and a second heat sink, wherein the first heat sink is disposed on a first surface, and the second heat sink is disposed on a second surface, wherein along an arrangement direction of the plurality of heat sink fins, a size of the second heat sink is larger than a size of the first heat sink.

16. The computing device according to claim 15, characterized in that The heat sink further comprises a heat dissipation substrate, the plurality of heat dissipation fins are arranged on the heat dissipation substrate, and the heat dissipation substrate is connected to the circuit board.

17. The computing device according to claim 16, characterized in that in, Along the wind direction in the first air duct, the size of at least part of the first heat dissipation fins is smaller than the size of at least part of the remaining heat dissipation fins; the first heat dissipation fins are heat dissipation fins corresponding to the connection area between the heat dissipation substrate and the circuit board.

18. The computing device according to claim 15, characterized in that The second heat sink is connected to the housing via fasteners.

19. The computing device according to claim 18, characterized in that The second heat sink is used to support the weight of the circuit board and the first heat sink.

20. The computing device of claim 13, wherein: The top of the first air inlet is flush with the top of the radiator, and the bottom of the first air inlet is flush with the bottom of the radiator.

21. The computing device of claim 14, wherein: The distance between two adjacent heat dissipation fins is 3 mm to 6 mm.

22. The computing device of claim 1, wherein: The housing comprises a mounting position in which a display assembly is mounted.

23. The computing device according to any one of claims 1 to 22, characterized in that: The first air outlet is communicated with a heat recovery system.

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