Distributed memory of stacked memory chips

Abstract

The utility model relates to the technical field of memories, in particular to a distributed memory of stacked memory chips, which comprises a memory shell, a fixed plate is fixed at one end of the memory shell, and a semiconductor chilling plate is adhered to the outer wall of the fixed plate. And the other end of the fixing plate is connected with six cold conduction plates penetrating through the outer wall of the memory shell, one side of each of the six cold conduction plates is provided with a memory chip body, and the outer surface of each memory chip body is provided with a temperature probe. According to the utility model, the temperature of the memory chip body is detected through the temperature probe, the detected data is sent to the single chip microcomputer, the single chip microcomputer processes the data, and when the temperature of the memory chip body is detected to be too high, the single chip microcomputer controls the semiconductor chilling plate to start and cool the cold guide plate, so that the temperature of the memory chip body is reduced. Therefore, the memory chip body on the cold conduction plate is indirectly cooled, and the memory does not need to be perforated for heat dissipation, so that external dust and impurities can be effectively prevented from entering the memory.

Description

Technical Field

[0001] The utility model relates to the technical field of memory, in particular to a distributed memory of stacked memory chips. Background Art

[0002] Memory is a memory device used to store information in modern information technology. Its concept is very broad and has many levels. In digital systems, anything that can store binary data can be a memory, such as RAM, FIFO, etc. In the system, a physical storage device is also called a memory, such as a memory stick, TF card, etc. In order to improve storage capacity, distributed memory has been developed. In order to meet the demand for high storage capacity, the current distributed memory is designed with more storage hard disks.

[0003] The patent specification with the announcement number CN207977113U discloses a distributed memory of stacked memory chips, which includes a memory body, wherein the inner center of the memory body is connected to a cooling fan through a micro-motor transmission, and the inner part of the memory body is located outside the micro-motor and embedded with memory chips at equal angles in a ring. It distributes multiple memory chips in a scattered manner around the cooling fan, so that all memory chips can be cooled by a cooling fan at the same time, effectively preventing the heat dissipation effect from causing the memory chips to heat up and be damaged, thereby extending the service life of the distributed memory of the stacked memory chips and improving its quality.

[0004] However, in the implementation of relevant technologies, it was found that the distributed storage device of a stacked storage chip designed as above has the following problems: in the above technical solution, multiple storage chips are scattered around the cooling fan, so that all the storage chips can be cooled by one cooling fan at the same time, effectively preventing the heat dissipation effect from causing the storage chips to heat up and be damaged. However, it uses a fan to ventilate the inside of the storage device, and no dust-proof structure is provided, which makes it easy for dust in the air to enter the storage device and cause damage to the storage chip. In view of this, a distributed storage device of a stacked storage chip is provided to overcome the above defects. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a distributed memory of stacked memory chips.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a distributed memory of stacked memory chips, comprising a memory shell, a fixing plate fixed at one end of the memory shell, a semiconductor cooling plate bonded to the outer wall of the fixing plate, six cold conduction plates penetrating the outer wall of the memory shell are connected to the other end of the fixing plate, a memory chip body is placed on one side of the six cold conduction plates, a temperature probe is installed on the outer surface of the memory chip body, a heat dissipation fin is fixed to the outer wall of the semiconductor cooling plate, and a heat dissipation fan is fixed to the right side of the heat dissipation fin.

[0007] As a further description of the above technical solution: two mounting bolts are installed inside the cooling fan, and the ends of the two mounting bolts are threadedly connected to fixing rods fixedly connected to the cooling fins. The cooling fins can absorb the heat generated during the operation of the semiconductor refrigeration plate, and the cooling fins are cooled by wind blowing through the cooling fan. By unscrewing the mounting bolts, the mounting bolts and the fixing rods are separated, and the cooling fan is released and can be disassembled.

[0008] As a further description of the above technical solution: the other end of the memory shell is connected to an adjustment head, and the inner wall of the adjustment head is telescopically connected to a connecting rod that runs through the inside of the memory shell. By manually rotating the adjustment head, the interface on the adjustment head is brought into contact with any data interface on the memory shell, so that the storage chip body corresponding to the data interface is used.

[0009] As a further description of the above technical solution: the end of the connecting rod is threadedly connected with a fixing bolt. By unscrewing the fixing bolt, the fixing of the connecting rod can be released, so that the adjustment head and the memory housing can be disassembled for easy maintenance.

[0010] As a further description of the above technical solution: six data interfaces electrically connected to the memory chip body are equidistantly arranged on the inner wall of one end of the memory housing and close to the adjustment head. Through the arranged adjustment head, multiple memory chip bodies can be connected and used.

[0011] As a further description of the above technical solution: a fixed bearing is fixed to the front end of the connecting rod, and a connecting plate is fixed to the outer surface of the fixed bearing. Since a fixed bearing is provided between the connecting rod and the connecting plate, the connecting rod will not be driven to rotate when the adjusting head rotates.

[0012] As a further description of the above technical solution: the inner wall of the connecting plate is fixed with a compression spring that is abutted against the inner wall of the memory shell. Under the action of the compression spring's own elasticity, the adjustment head can be pushed to fit tightly against the memory shell, ensuring that the interface on the memory shell and the data interface can be tightly connected, thereby reducing the possibility of data transmission interruption.

[0013] The utility model has the following beneficial effects:

[0014] The utility model designs a distributed memory of stacked memory chips. The temperature probe detects the temperature of the memory chip body, and the detected data is sent to the single-chip microcomputer, which processes the data. When it is detected that the temperature of the memory chip body is too high, the single-chip microcomputer controls the semiconductor refrigeration sheet to start, cools the cold plate, and thus indirectly cools the memory chip body on the cold plate. The memory does not need to open holes for heat dissipation, and can effectively reduce the entry of external dust and impurities.

[0015] The utility model designs a distributed memory of stacked memory chips, wherein heat dissipation fins can absorb heat generated during operation of semiconductor refrigeration plates, and heat is dissipated by blowing air from the heat dissipation fins through a heat dissipation fan. By unscrewing the mounting bolts, the mounting bolts and the fixing rods are separated, and the fixing of the heat dissipation fan is released so that the memory can be disassembled. By manually rotating the adjusting head, an interface on the adjusting head is brought into contact with any data interface on the memory housing, so that the memory chip body corresponding to the data interface can be used. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is a three-dimensional structural schematic diagram of the memory housing of the utility model;

[0018] Figure 3 It is a schematic diagram of the cross-sectional structure of the memory housing of the utility model;

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of the adjusting head of the utility model.

[0020] Legend:

[0021] 1. Memory housing; 2. Fixing plate; 3. Semiconductor cooling plate; 4. Cooling plate; 5. Memory chip body; 6. Temperature probe; 7. Heat sink fins; 8. Cooling fan; 9. Mounting bolts; 10. Fixing rod; 11. Adjusting head; 12. Connecting rod; 13. Fixing bolts; 14. Data interface; 15. Fixed bearing; 16. Connecting plate; 17. Compression spring. DETAILED DESCRIPTION

[0022] Reference Figure 1-Figure 4The utility model provides a distributed memory of stacked memory chips: it includes a memory shell 1, a fixing plate 2 is fixed at one end of the memory shell 1, a semiconductor cooling plate 3 is bonded to the outer wall of the fixing plate 2, and six cold conduction plates 4 penetrating the outer wall of the memory shell 1 are connected to the other end of the fixing plate 2, and a memory chip body 5 is arranged on one side of the six cold conduction plates 4, and a temperature probe 6 is installed on the outer surface of the memory chip body 5, a heat dissipation fin 7 is fixed to the outer wall of the semiconductor cooling plate 3, and a heat dissipation fan 8 is fixed to the right side of the heat dissipation fin 7, the temperature probe 6 detects the temperature of the memory chip body 5, and the detected data is sent to the single-chip microcomputer, and the single-chip microcomputer processes the data. When it is detected that the temperature of the memory chip body 5 is too high, the single-chip microcomputer controls the semiconductor cooling plate 3 to start, cools the cold conduction plate 4, thereby indirectly cooling the memory chip body 5 on the cold conduction plate 4, and the memory does not need to open holes for heat dissipation, which can effectively reduce the entry of external dust and impurities.

[0023] As a further implementation scheme of the above technical scheme: two mounting bolts 9 are installed inside the heat dissipation fan 8, and the ends of the two mounting bolts 9 are threadedly connected to the fixing rods 10 fixedly connected to the heat dissipation fins 7. The heat dissipation fins 7 can absorb the heat generated during the operation of the semiconductor refrigeration plate 3, and the heat dissipation of the heat dissipation fins 7 is carried out by blowing wind through the heat dissipation fan 8. By unscrewing the mounting bolts 9, the mounting bolts 9 and the fixing rods 10 are separated, and the heat dissipation fan 8 is released and can be disassembled.

[0024] As a further implementation scheme of the above technical scheme: the other end of the memory shell 1 is connected to an adjustment head 11, and the inner wall of the adjustment head 11 is telescopically connected to a connecting rod 12 that runs through the inside of the memory shell 1. By manually rotating the adjustment head 11, the interface on the adjustment head 11 is brought into contact with any data interface 14 on the memory shell 1, so that the memory chip body 5 corresponding to the data interface 14 is used.

[0025] As a further implementation scheme of the above technical scheme: the end of the connecting rod 12 is threadedly connected with a fixing bolt 13. By unscrewing the fixing bolt 13, the fixing of the connecting rod 12 can be released, so that the adjustment head 11 and the memory housing 1 can be disassembled for easy maintenance.

[0026] During specific implementation, a temperature probe 6 is provided on the storage chip body 5, which can send the detected data to the single-chip microcomputer, which processes the data. When it is detected that the temperature of the storage chip body 5 is too high, the single-chip microcomputer controls the semiconductor refrigeration plate 3 to start, so that the semiconductor refrigeration plate 3 cools the fixed plate 2, and the fixed plate 2 cools the cold conduction plate 4, thereby indirectly cooling the storage chip body 5 on the cold conduction plate 4, and the memory does not need to open holes for heat dissipation, which can effectively reduce the entry of external dust and impurities, and improve the service life of the storage chip body 5. The heat dissipation fins 7 can absorb the heat generated by the semiconductor refrigeration plate 3 during operation, and the heat dissipation fins 7 are cooled by wind through the heat dissipation fan 8. By unscrewing the mounting bolts 9, the mounting bolts 9 and the fixing rod 10 are separated, and the fixing of the heat dissipation fan 8 is released, and the semiconductor refrigeration plate 3 and the fixing plate 2 are bonded and connected, so that the semiconductor refrigeration plate 3 can be disassembled, and the fixing bolts 13 are unscrewed to release the fixing of the connecting rod 12, thereby disassembling the adjustment head 11 and the memory housing 1 for easy maintenance.

[0027] As a further implementation scheme of the above technical scheme: six data interfaces 14 electrically connected to the memory chip body 5 are equidistantly arranged on the inner wall of one end of the memory housing 1 and close to the adjustment head 11. Through the arranged adjustment head 11, multiple memory chip bodies 5 can be connected and used.

[0028] As a further implementation scheme of the above technical scheme: a fixed bearing 15 is fixed to the front end of the connecting rod 12, and a connecting plate 16 is fixed to the outer surface of the fixed bearing 15. Since a fixed bearing 15 is provided between the connecting rod 12 and the connecting plate 16, the connecting rod 12 will not be driven to rotate when the adjusting head 11 rotates.

[0029] As a further implementation scheme of the above technical scheme: a compression spring 17 which is abutted against the inner wall of the memory housing 1 is fixed to the inner wall of the connecting plate 16. Under the action of the elasticity of the compression spring 17 itself, the adjustment head 11 can be pushed to fit tightly against the memory housing 1, ensuring that the interface on the memory housing 1 and the data interface 14 can be tightly connected, thereby reducing the possibility of data transmission interruption.

[0030] During the specific implementation, the adjusting head 11 is manually rotated. Since a fixed bearing 15 is provided between the connecting rod 12 and the connecting plate 16, the connecting rod 12 will not be driven to rotate when the adjusting head 11 is rotated. At this time, the interface on the adjusting head 11 is in contact with any data interface 14 on the memory housing 1, so that the memory chip body 5 corresponding to the data interface 14 is used. Under the action of the elasticity of the compression spring 17 itself, the adjusting head 11 can be pushed to fit tightly against the memory housing 1, ensuring that the interface on the memory housing 1 and the data interface 14 can be tightly connected, thereby reducing the possibility of data transmission interruption.

[0031] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A distributed memory of stacked memory chips, comprising a memory housing (1), characterized in that: A fixing plate (2) is fixed to one end of the memory housing (1), a semiconductor cooling plate (3) is bonded to the outer wall of the fixing plate (2), and the other end of the fixing plate (2) is connected to six cooling plates (4) that penetrate the outer wall of the memory housing (1), a memory chip body (5) is arranged on one side of the six cooling plates (4), a temperature probe (6) is installed on the outer surface of the memory chip body (5), a heat dissipation fin (7) is fixed to the outer wall of the semiconductor cooling plate (3), and a heat dissipation fan (8) is fixed to the right side of the heat dissipation fin (7).

2. The distributed memory of stacked memory chips according to claim 1, characterized in that: Two mounting bolts (9) are installed inside the heat dissipation fan (8), and the ends of the two mounting bolts (9) are threadedly connected to fixing rods (10) fixedly connected to the heat dissipation fins (7).

3. The distributed memory of stacked memory chips according to claim 1, characterized in that: The other end of the memory housing (1) is connected to an adjusting head (11), and the inner wall of the adjusting head (11) is telescopically connected to a connecting rod (12) that penetrates the interior of the memory housing (1).

4. The distributed memory of stacked memory chips according to claim 3, characterized in that: The end of the connecting rod (12) is threadedly connected with a fixing bolt (13).

5. The distributed memory of stacked memory chips according to claim 1, characterized in that: Six data interfaces (14) electrically connected to the storage chip body (5) are equidistantly arranged on the inner wall of one end of the storage housing (1) and close to the adjustment head (11).

6. The distributed memory of stacked memory chips according to claim 3, characterized in that: A fixed bearing (15) is fixed to the front end of the connecting rod (12), and a connecting plate (16) is fixed to the outer surface of the fixed bearing (15).

7. The distributed memory of stacked memory chips according to claim 6, characterized in that: A compression spring (17) is fixed to the inner wall of the connecting plate (16) and is abutted against the inner wall of the memory housing (1).

Images