Chip transfer mechanism for DFN packaging device processing

Abstract

The utility model belongs to the technical field of transfer mechanisms, and particularly relates to a chip transfer mechanism for DFN packaging device processing, which comprises an operation table, two connecting plates are fixedly arranged on the upper surface of the operation table, air cylinders are fixedly arranged on the sides, away from each other, of the two connecting plates, clamping plates are fixedly arranged at the piston ends of the two air cylinders, and the clamping plates are fixedly arranged on the upper surface of the operation table. According to the utility model, the storage cylinder, the rotating column, the upper separation sheet, the lower separation sheet and the like are arranged, the second servo motor drives the rotating column, the rotating column drives the upper separation sheet and the lower separation sheet to rotate, and when the lower separation sheet rotates to a certain position, a chip at the bottommost part falls onto a PCB from the upper surface of the lower separation sheet, so that the chip is separated from the PCB. And meanwhile, the upper separation sheet can be separated from the joint between the bottommost chip and the last but one chip, then the second servo motor continues to rotate until the chips fall onto the upper surface of the lower separation sheet from the upper surface of the upper separation sheet and wait for next feeding, and rotation can be stopped, so that the risk that the chips fall in the feeding process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of transfer mechanisms, in particular to a chip transfer mechanism used for processing DFN packaging devices. Background Art

[0002] DFN packaging is the latest surface mount packaging technology. It adopts a double-sided or square flat lead-free design and is suitable for fully automatic patch production. It can effectively improve production efficiency and reduce problems caused by manual intervention, thereby improving the overall stability of the product.

[0003] However, in existing equipment, DFN chips need to be transported to PCB boards, and most of them are transported using suction cups. However, the suction force of the suction cups is sometimes insufficient, and the chips are easily dropped and damaged during transportation. Therefore, a chip transfer mechanism for DFN packaging device processing is proposed. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a chip transfer mechanism for DFN packaging device processing.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a chip transfer mechanism for DFN packaging device processing, comprising an operating table, two connecting plates are fixedly provided on the upper surface of the operating table, cylinders are fixedly provided on the sides of the two connecting plates away from each other, clamps are fixedly provided on the piston ends of the two cylinders, a column is fixedly provided on the upper surface of the operating table, a cross column is fixedly provided on one side of the column, a movable groove is opened on one side of the cross column, a movable structure is provided in the movable groove, a material storage barrel is provided on one side of the cross column, a fixed plate is fixedly provided on the side of the material storage barrel, and a material conveying structure is provided on the fixed plate.

[0006] As a further description of the above technical solution:

[0007] The moving structure includes a sliding column slidably connected to the inside of the moving groove, a rack is fixedly provided on one side of the sliding column, a gear is rotatably connected inside the moving groove, the gear is meshed with the rack, a first servo motor is fixedly provided on one side of the cross column, the output shaft of the first servo motor is fixedly connected to one side of the gear, and the other side of the sliding column is fixedly connected to one side of the storage barrel.

[0008] As a further description of the above technical solution:

[0009] An observation groove is provided on the side of the material storage barrel, and two separation grooves are provided on the material storage barrel.

[0010] As a further description of the above technical solution:

[0011] The feeding structure includes a rotating column rotatably connected to the bottom of a fixed plate, an upper dividing plate and a lower dividing plate are fixedly provided on the rotating column, the upper dividing plate and the lower dividing plate are adapted to two separation grooves, a second servo motor is fixedly provided on the upper surface of the fixed plate, and an output shaft of the second servo motor is fixedly connected to one side of the rotating column.

[0012] As a further description of the above technical solution:

[0013] A fixed column is fixedly provided on one side of the storage barrel, a sliding groove is opened on one side of the fixed column, a sliding block is slidably connected in the sliding groove, a moving column is slidably connected inside the sliding block, a sliding plate is fixedly connected on one side of the moving column, a pressing plate is fixedly provided on the other side of the moving column, and a spring is movably connected to the moving column.

[0014] As a further description of the above technical solution:

[0015] The side of the sliding plate that is away from each other fits with the two sides of the inside of the observation slot. One end of the spring is fixedly connected to one side of the sliding block, and the other end is fixedly connected to one side of the pressing plate.

[0016] The utility model has the following beneficial effects:

[0017] 1. Compared with the prior art, the chip transfer mechanism for DFN packaging device processing is provided with a storage barrel, a rotating column, an upper separator and a lower separator, etc. The second servo motor drives the rotating column, and the rotating column drives the upper separator and the lower separator to rotate. When the lower separator rotates to a certain position, the bottom chip will fall from the upper surface of the lower separator onto the PCB board, and at the same time, the upper separator will be separated from the connection between the bottom and the second to last chip, and then the second servo motor continues to rotate until the chip falls from the upper surface of the upper separator to the upper surface of the lower separator and waits for the next loading, then the rotation can be stopped, thereby avoiding the risk of chip falling during the loading process.

[0018] 2. Compared with the prior art, the chip transfer mechanism used for DFN packaging device processing is equipped with a fixed column, a sliding block, a moving column, a spring and a sliding plate. The staff moves the sliding block upward, and the sliding block drives the sliding plate to move upward to the highest point, and then pushes the pressing plate to make the moving column push the sliding plate from the observation slot to the inside of the storage barrel. Then the staff stacks the chips one by one and puts them on the sliding plate inside the storage barrel, and moves the sliding block downward while placing the chips. When the sliding block moves to the bottom, the pressing plate can be released to retract the sliding plate and let the chip fall on the lower separator to avoid the risk of directly putting in the chip and causing the chip to fall directly and be damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a schematic diagram of a first-view stereoscopic structure of a chip transfer mechanism for DFN packaged device processing proposed by the utility model;

[0020] Figure 2 This is a schematic diagram of the third perspective structure of a chip transfer mechanism for DFN packaging device processing proposed by the utility model;

[0021] Figure 3 This is a plan view of a chip transfer mechanism for DFN packaging device processing proposed by the utility model;

[0022] Figure 4 A schematic diagram of a moving structure and a material storage barrel of a chip transfer mechanism for DFN packaged device processing proposed by the utility model;

[0023] Figure 5 A schematic diagram of a material conveying structure and a material storage barrel of a chip transfer mechanism for processing DFN packaged devices proposed by the utility model;

[0024] Figure 6 This is an exploded diagram of a material conveying structure and a material storage barrel of a chip transfer mechanism for DFN packaging device processing proposed by the utility model;

[0025] Figure 7 The utility model proposes a chip transfer mechanism for DFN packaging device processing Figure 6 -Enlarged view of part A.

[0026] Legend:

[0027] 1. Operating table; 2. Connecting plate; 3. Cylinder; 4. Clamp; 5. Vertical column; 6. Horizontal column; 7. Moving structure; 701. Sliding column; 702. Rack; 703. Gear; 704. First servo motor; 8. Storage barrel; 801. Observation slot; 802. Separation slot; 9. Fixed plate; 10. Feeding structure; 101. Second servo motor; 102. Rotating column; 103. Upper separator; 104. Lower separator; 11. Fixed column; 12. Sliding block; 13. Moving column; 14. Spring; 15. Sliding plate; 16. Sliding slot. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Reference Figures 1 to 7The utility model provides a chip transfer mechanism for DFN packaging device processing: it includes an operating table 1, two connecting plates 2 are fixedly provided on the upper surface of the operating table 1, cylinders 3 are fixedly provided on the sides of the two connecting plates 2 that are far away from each other, and clamps 4 are fixedly provided on the piston ends of the two cylinders 3, a column 5 is fixedly provided on the upper surface of the operating table 1, a horizontal column 6 is fixedly provided on one side of the column 5, a movable groove is provided on one side of the horizontal column 6, a movable structure 7 is provided in the movable groove, a storage barrel 8 is provided on one side of the horizontal column 6, an observation groove 801 is provided on the side of the storage barrel 8, and the staff can observe the number of chips inside the storage barrel 8 through the observation groove 801, and can prepare to replenish chips in advance, and the storage barrel 8 is provided with two separation grooves 802, a fixed column 11 is fixedly provided on one side of the storage barrel 8, a sliding groove 16 is provided on one side of the fixed column 11, and a sliding structure 7 is slidably connected in the sliding groove 16 The sliding block 12 is slidably connected with a moving column 13 inside, and a sliding plate 15 is fixedly connected to one side of the moving column 13. The side of the sliding plate 15 that is away from the other side fits with the two sides of the inside of the observation groove 801. A pressing plate is fixedly provided on the other side of the moving column 13. A spring 14 is movably connected to the moving column 13. One end of the spring 14 is fixedly connected to one side of the sliding block 12, and the other end is fixedly connected to one side of the pressing plate. The staff stacks the chips one by one and puts them on the sliding plate 15 inside the storage barrel 8. While placing the chips, the sliding block 12 is moved downward until the sliding block 12 moves to the bottom to release the pressing plate, so that the sliding plate 15 retracts and the chip falls on the lower partition sheet 104 to avoid directly putting in the chip. The risk of the chip falling directly and causing damage is avoided. A fixed plate 9 is fixedly provided on the side of the storage barrel 8, and a feeding structure 10 is provided on the fixed plate 9.

[0030] The moving structure 7 includes a sliding column 701 slidably connected to the inside of the moving groove, a rack 702 is fixedly provided on one side of the sliding column 701, a gear 703 is rotatably connected inside the moving groove, the gear 703 is meshed and connected with the rack 702, a first servo motor 704 is fixedly provided on one side of the cross column 6, the output shaft of the first servo motor 704 is fixedly connected to one side of the gear 703, and the other side of the sliding column 701 is fixedly connected to one side of the storage barrel 8;

[0031] The feeding structure 10 includes a rotating column 102 rotatably connected to the bottom of the fixed plate 9, and an upper dividing plate 103 and a lower dividing plate 104 are fixedly provided on the rotating column 102. The upper dividing plate 103 and the lower dividing plate 104 are adapted to the two separation grooves 802. A second servo motor 101 is fixedly provided on the upper surface of the fixed plate 9, and the output shaft of the second servo motor 101 is fixedly connected to one side of the rotating column 102.

[0032] Working principle: put the PCB board on the operating table 1, and then the two cylinders 3 drive the clamping plate 4 to clamp and fix the PCB board, and then the staff moves the sliding block 12 upwards, and the sliding block 12 drives the sliding plate 15 to move upwards to the highest point, and then pushes the pressing plate, so that the moving column 13 pushes the sliding plate 15 from the observation slot 801 to the inside of the storage barrel 8, and then the staff stacks the chips one by one and puts them on the sliding plate 15 inside the storage barrel 8, and moves the sliding block 12 downwards while placing the chips, until the sliding block 12 moves to the bottom, then release the pressing plate, so that the sliding plate 15 retracts, and the chip falls on the upper partition plate 103, to avoid directly putting in the chip, the chip will fall directly and cause the risk of damage, and then the first servo motor 704 drives the sliding column 701 to move through the gear 703 and the rack 702, and the sliding column 701 drives the storage barrel 8 to move, so that the bottom of the storage barrel 8 fits with the upper surface of the PCB board, Then the second servo motor 101 drives the rotating column 102, and the rotating column 102 drives the upper partition plate 103 and the lower partition plate 104 to rotate, so that the chip on the upper surface of the upper partition plate 103 falls on the upper surface of the lower partition plate 104. When the lower partition plate 104 rotates to a certain position, the bottom chip will fall from the upper surface of the lower partition plate 104 onto the PCB board, and at the same time, the upper partition plate 103 will be separated from the connection between the bottom and the second to last chip, and then the second servo motor 101 continues to rotate until the chip falls from the upper surface of the upper partition plate 103 to the upper surface of the lower partition plate 104 and waits for the next loading and then stops rotating. After the first chip is loaded, the first servo motor 704 is used to move the storage barrel 8 upward, waiting for the next loading, to avoid the risk of chips falling during the loading process. The staff can observe the number of chips inside the storage barrel 8 through the observation slot 801 and prepare additional chips in advance.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip transfer mechanism for processing DFN packaged devices, comprising an operating table (1), characterized in that: Two connecting plates (2) are fixedly provided on the upper surface of the operating table (1), and cylinders (3) are fixedly provided on the sides of the two connecting plates (2) that are away from each other, and clamping plates (4) are fixedly provided on the piston ends of the two cylinders (3). A column (5) is fixedly provided on the upper surface of the operating table (1), and a cross column (6) is fixedly provided on one side of the column (5). A movable groove is provided on one side of the cross column (6), and a movable structure (7) is provided in the movable groove. A material storage barrel (8) is provided on one side of the cross column (6), and a fixed plate (9) is fixedly provided on the side of the material storage barrel (8), and a material conveying structure (10) is provided on the fixed plate (9).

2. A chip transfer mechanism for DFN packaging device processing according to claim 1, characterized in that: The movable structure (7) comprises a sliding column (701) slidably connected inside the movable groove, a rack (702) is fixedly provided on one side of the sliding column (701), a gear (703) is rotatably connected inside the movable groove, the gear (703) is meshingly connected with the rack (702), a first servo motor (704) is fixedly provided on one side of the cross column (6), an output shaft of the first servo motor (704) is fixedly connected to one side of the gear (703), and the other side of the sliding column (701) is fixedly connected to one side of the storage barrel (8).

3. A chip transfer mechanism for DFN packaging device processing according to claim 2, characterized in that: An observation slot (801) is provided on the side of the material storage barrel (8), and two separation slots (802) are provided on the material storage barrel (8).

4. The chip transfer mechanism for DFN packaging device processing according to claim 3 is characterized in that: The feeding structure (10) comprises a rotating column (102) rotatably connected to the bottom of a fixed plate (9), an upper separator (103) and a lower separator (104) are fixedly provided on the rotating column (102), the upper separator (103) and the lower separator (104) are adapted to the two separation grooves (802), a second servo motor (101) is fixedly provided on the upper surface of the fixed plate (9), and an output shaft of the second servo motor (101) is fixedly connected to one side of the rotating column (102).

5. The chip transfer mechanism for DFN packaging device processing according to claim 3 is characterized in that: A fixed column (11) is fixedly provided on one side of the material storage barrel (8), a sliding groove (16) is opened on one side of the fixed column (11), a sliding block (12) is slidably connected in the sliding groove (16), a moving column (13) is slidably connected in the sliding block (12), a sliding plate (15) is fixedly connected on one side of the moving column (13), a pressing plate is fixedly provided on the other side of the moving column (13), and a spring (14) is movably connected to the moving column (13).

6. The chip transfer mechanism for DFN packaging device processing according to claim 5, characterized in that: The side of the sliding plate (15) that is away from each other fits with the two sides of the inside of the observation slot (801), and one end of the spring (14) is fixedly connected to one side of the sliding block (12), and the other end is fixedly connected to one side of the pressing plate.

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