Diode packaging structure

Abstract

The utility model relates to a diode packaging structure, which belongs to the technical field of diode packaging and comprises a lower packaging shell, an upper packaging shell, a chip arranged in the lower packaging shell and a pin fixedly mounted on one side of the chip and extending to the outside of the lower packaging shell. The other end of the connecting end is connected with a connecting column in an inserted mode, and the lower packaging shell and the upper packaging shell are each provided with a shielding structure for shielding the connecting column. The shielding structure comprises a lower cover plate, an upper cover plate and a butt joint rod fixedly installed outside the lower cover plate, a butt joint hole matched with the butt joint rod is formed in the upper cover plate, and the butt joint rod is connected with the butt joint hole in an inserted mode. The diode packaging structure is simple in structure and convenient to use, protection can be carried out on the premise that the pins are not disassembled and assembled, the connection stability of the connecting columns and the pins is improved, protection of the pins and the connecting columns can be achieved, and therefore the diode packaging structure has the advantages of being high in practicability, convenient to use and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of diode packaging, in particular to a diode packaging structure. Background Art

[0002] The diode packaging structure not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, but also connects the pins of the package shell through the contacts on the chip with wires, and these pins are connected to other devices through wires on the printed circuit board, thereby realizing the connection between the internal chip and the external circuit. After the existing diode is packaged, the length of the shell and the pins after packaging is relatively long. In the process of carrying or placing the diode, the pins cannot be removed and carried or placed separately. When the pins are accidentally subjected to external forces during the process of carrying or placing the diode, it is easy to cause the pins to break or bend at the connection with the shell.

[0003] After searching, Chinese patent CN219658696U discloses a diode packaging structure, including a shell and a chip, a heat-conducting silicone plate is arranged inside the shell, a heat sink is arranged on the surface of the shell for increasing the contact between the heat-conducting silicone plate and the outside air, a placement slot for placing the chip is opened inside the heat-conducting silicone plate, and two pin assemblies are detachably connected to the chip. Through the cooperation of the above structures, the utility model realizes that the end of the heat-dissipating copper column is exposed outside the shell, which is convenient for transferring the heat absorbed by the surface of the heat-conducting silicone plate to the outside of the shell, improving the heat dissipation efficiency inside the shell, and the pins can also be removed to carry the shell and the pins separately, avoiding the pins being accidentally stressed during the carrying process, which causes the pins to break or bend at the connection with the shell.

[0004] The diode packaging structure of the utility model disassembles and assembles the pins by means of a threaded connection. However, after being used many times, the threaded connection is prone to thread slippage and stripping. In addition, in order to improve the tightness of the pins, the connecting ends of the pins need to be set deeper or longer, which results in a longer subsequent disassembly and assembly time and cannot meet the use requirements. Therefore, a diode packaging structure is proposed to solve the above-mentioned problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a diode packaging structure, which has the advantages of strong practicality and ease of use, and solves the problem that thread slippage and tooth stripping easily occur in the threaded connection mode after repeated use.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a diode packaging structure, comprising a lower packaging shell, an upper packaging shell, a chip arranged inside the lower packaging shell, and a pin fixedly installed on one side of the chip and extending to the outside of the lower packaging shell, wherein one end of the pin away from the chip is fixedly connected to a connecting end, and the other end of the connecting end is plugged with a connecting column, and the lower packaging shell and the upper packaging shell are both provided with a shielding structure for shielding the connecting column;

[0007] The shielding structure comprises a lower cover plate, an upper cover plate and a docking rod fixedly mounted on the outside of the lower cover plate. A docking hole matching the docking rod is provided inside the upper cover plate, and the docking rod is plugged into the docking hole.

[0008] Furthermore, a connecting block is installed on one side of the lower cover plate and the upper cover plate, and a connecting groove adapted to the connecting block is opened inside one side of the lower packaging shell and the upper packaging shell, and a rotating shaft fixed to the inner wall on the side opposite to the connecting groove is rotatably installed inside the connecting block.

[0009] Furthermore, the lower cover plate and the upper cover plate are rotatably mounted on the outside of the lower packaging shell and the upper packaging shell respectively through the connecting block, the connecting groove and the rotating shaft.

[0010] Furthermore, a plug rod is installed on the side of the lower cover plate and the upper cover plate away from each other, and a slot adapted to the plug rod is opened inside the side of the lower packaging shell and the upper packaging shell away from each other, and the plug rod is plugged into the slot.

[0011] Furthermore, a heat-conducting silicone plate is fixedly mounted inside the lower packaging shell, and the chip is fixedly mounted on the upper surface of the heat-conducting silicone plate.

[0012] Furthermore, a plurality of heat sinks which are evenly distributed and extend into the lower surface of the lower packaging shell and contact the heat-conducting silicone plate are fixedly mounted on the lower surface of the lower packaging shell.

[0013] Furthermore, a through-hole is provided on one side of the lower packaging shell close to the lower cover plate, and the pins extend to the outside of the lower packaging shell through the through-hole. Mounting holes are provided at the four corners of the upper surface of the lower packaging shell, and mounting rods corresponding to the four mounting holes are installed at the four corners of the lower surface of the upper packaging shell.

[0014] Compared with the prior art, the utility model provides a diode packaging structure, which has the following beneficial effects:

[0015] 1. The diode packaging structure is simple and convenient, and can be protected without disassembling the pins. It not only improves the connection stability between the connecting column and the pin, but also protects the pin and the connecting column, thereby achieving the advantages of strong practicality and ease of use, and solves the problem of thread slippage and tooth stripping after repeated use of the threaded connection method.

[0016] 2. In the diode packaging structure, one end of the heat sink is in contact with the thermally conductive silicone plate, and the other end is exposed on the surface of the lower packaging shell. The heat sink can transfer the heat absorbed by the surface of the thermally conductive silicone plate to the outside of the lower packaging shell, thereby avoiding a large amount of heat accumulation inside the lower packaging shell and improving the heat dissipation efficiency inside the lower packaging shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0018] Figure 2 This is a top view of the structure of the lower packaging shell of the utility model;

[0019] Figure 3 It is a structural back view of the lower packaging shell of the utility model.

[0020] In the figure: 1. lower packaging shell; 2. upper packaging shell; 3. thermal conductive silicone plate; 4. chip; 5. pin; 6. connecting column; 7. connecting end; 8. lower cover plate; 9. upper cover plate; 10. docking rod; 11. docking hole; 12. plug-in rod; 13. slot; 14. mounting hole; 15. through-opening; 16. connecting block; 17. connecting groove; 18. heat sink. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-3 A diode packaging structure includes a lower packaging shell 1, an upper packaging shell 2, a chip 4 arranged inside the lower packaging shell 1, and a pin 5 fixedly installed on one side of the chip 4 and extending to the outside of the lower packaging shell 1, the end of the pin 5 away from the chip 4 is fixedly connected to a connection end 7, and the other end of the connection end 7 is plugged with a connection column 6, a thermal conductive silicone plate 3 is fixedly installed inside the lower packaging shell 1, and the chip 4 is fixedly installed on the upper surface of the thermal conductive silicone plate 3. The four corners of the upper surface of the lower packaging shell 1 are provided with mounting holes 14, and the four corners of the lower surface of the upper packaging shell 2 are provided with mounting rods corresponding to the four mounting holes 14. Through the connection of the mounting rods and the mounting holes 14, the packaging of the lower packaging shell 1 and the upper packaging shell 2 is fixed, so that the pin 5 is packaged.

[0023] Among them, a plurality of heat sinks 18 are fixedly installed on the lower surface of the lower packaging shell 1, which are evenly distributed and extend into the lower surface to contact the thermally conductive silicone plate 3. The heat sink 18 is a heat dissipation copper column, one end of which is in contact with the thermally conductive silicone plate 3, and the other end is exposed on the surface of the lower packaging shell 1. The heat dissipation copper column can transfer the heat absorbed by the surface of the thermally conductive silicone plate 3 to the outside of the lower packaging shell 1, avoiding a large amount of heat accumulation inside the lower packaging shell 1, and improving the heat dissipation efficiency inside the shell 1. A through hole 15 is provided on one side of the lower packaging shell 1 close to the lower cover plate 8, and the pin 5 extends to the outside of the lower packaging shell 1 through the through hole 15.

[0024] It should be noted that the thermally conductive silicone plate 3 and the heat sink 18 are both conventional technologies known to the public in the prior art, so their specific structural composition and working principle will not be described in detail in this article.

[0025] In this embodiment, a shielding structure for shielding the connecting column 6 is provided on both the lower packaging shell 1 and the upper packaging shell 2. The shielding structure of this embodiment includes a lower cover plate 8 and an upper cover plate 9, and a docking rod 10 fixedly installed on the outside of the lower cover plate 8, and a docking hole 11 adapted to the docking rod 10 is opened inside the upper cover plate 9, and the docking rod 10 is plugged into the docking hole 11.

[0026] Among them, a connection block 16 is installed on one side of the lower cover plate 8 and the upper cover plate 9, and a connection groove 17 adapted to the connection block 16 is opened inside one side of the lower packaging shell 1 and the upper packaging shell 2, and a rotating shaft fixed to the inner wall on the side opposite to the connection groove 17 is rotatably installed inside the connection block 16. The lower cover plate 8 and the upper cover plate 9 are rotatably installed on the outside of the lower packaging shell 1 and the upper packaging shell 2 respectively through the connection block 16, the connection groove 17 and the rotating shaft. When it is necessary to shield the pin 5, open the lower cover plate 8 and the upper cover plate 9, connect the docking rod 10 with the docking hole 11, and connect and fix the lower cover plate 8 and the upper cover plate 9, so that the pin 5 and the connecting column 6 can be shielded, reducing the number of times the connecting column 6 and the pin 5 are disassembled and assembled.

[0027] In addition, a plug rod 12 is installed on the side where the lower cover plate 8 and the upper cover plate 9 are separated, and a slot 13 adapted to the plug rod 12 is opened inside the side where the lower packaging shell 1 and the upper packaging shell 2 are separated, and the plug rod 12 is plugged into the slot 13. Through the connection between the plug rod 12 and the slot 13, the lower cover plate 8 and the upper cover plate 9 can be installed and fixed respectively, so as to prevent the lower cover plate 8 and the upper cover plate 9 from being easily moved.

[0028] The working principle of the above embodiment is:

[0029] When in use, open the lower cover 8 and the upper cover 9, connect the docking rod 10 with the docking hole 11, and connect and fix the lower cover 8 and the upper cover 9 to shield the pins 5 and the connecting columns 6, reduce the number of times the connecting columns 6 and the pins 5 are disassembled and assembled, and greatly improve the connection strength between the connecting columns 6 and the pins 5.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode packaging structure, comprising a lower packaging shell (1), an upper packaging shell (2), a chip (4) arranged inside the lower packaging shell (1), and a pin (5) fixedly mounted on one side of the chip (4) and extending to the outside of the lower packaging shell (1), characterized in that: One end of the pin (5) away from the chip (4) is fixedly connected to a connection end (7), and the other end of the connection end (7) is plugged with a connection column (6), and both the lower packaging shell (1) and the upper packaging shell (2) are provided with a shielding structure for shielding the connection column (6); The shielding structure comprises a lower cover plate (8), an upper cover plate (9), and a docking rod (10) fixedly mounted on the outside of the lower cover plate (8); a docking hole (11) matching the docking rod (10) is provided inside the upper cover plate (9), and the docking rod (10) is plugged into the docking hole (11).

2. A diode packaging structure according to claim 1, characterized in that: A connecting block (16) is installed on one side of the lower cover plate (8) and the upper cover plate (9); a connecting groove (17) adapted to the connecting block (16) is provided inside one side of the lower packaging shell (1) and the upper packaging shell (2); and a rotating shaft fixed to the inner wall on the side opposite to the connecting groove (17) is rotatably installed inside the connecting block (16).

3. A diode packaging structure according to claim 2, characterized in that: The lower cover plate (8) and the upper cover plate (9) are rotatably mounted on the outside of the lower packaging shell (1) and the upper packaging shell (2) respectively through a connecting block (16), a connecting groove (17) and a rotating shaft.

4. The diode packaging structure according to claim 1, characterized in that: An insertion rod (12) is installed on the side where the lower cover plate (8) and the upper cover plate (9) are separated, and a slot (13) adapted to the insertion rod (12) is provided inside the side where the lower packaging shell (1) and the upper packaging shell (2) are separated, and the insertion rod (12) is plugged into the slot (13).

5. The diode packaging structure according to claim 1, characterized in that: A heat-conducting silicone plate (3) is fixedly mounted inside the lower packaging shell (1), and the chip (4) is fixedly mounted on the upper surface of the heat-conducting silicone plate (3).

6. The diode packaging structure according to claim 5, characterized in that: A plurality of heat sinks (18) which are evenly distributed and extend into the lower surface of the lower packaging shell (1) and are in contact with the heat-conducting silicone plate (3) are fixedly mounted on the lower surface of the lower packaging shell (1).

7. The diode packaging structure according to claim 1, characterized in that: A through-hole (15) is provided on one side of the lower packaging shell (1) close to the lower cover plate (8), and the pin (5) extends to the outside of the lower packaging shell (1) through the through-hole (15). Four corners of the upper surface of the lower packaging shell (1) are provided with mounting holes (14), and mounting rods corresponding to the four mounting holes (14) are installed at the four corners of the lower surface of the upper packaging shell (2).

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