Power module device and electrical device having the same

Abstract

The utility model provides a power module device and electrical equipment with the same. The power module device comprises a module body; one side of the heat conduction substrate abuts against the module body; one side of the heat dissipation substrate abuts against the other side of the heat conduction substrate; the liquid cooling plate is provided with an open groove, the open groove is used for containing cooling liquid, part of the heat dissipation substrate is located in the open groove, the heat dissipation substrate makes contact with the cooling liquid, and the heat dissipation substrate and the liquid cooling plate are made of the same material; or the grooves are made of insulating resin materials, and the structure of the heat dissipation substrate except the grooves and the liquid cooling plate are made of the same material. Through the technical scheme provided by the invention, the problem that the heat dissipation substrate and the liquid cooling plate are extremely easy to chemically corrode in the cooling liquid in the prior art can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, and in particular to a power module device and an electrical equipment having the same. Background Art

[0002] Liquid cooling is an important technology in the field of power module heat dissipation, which can effectively improve heat dissipation efficiency and power density.

[0003] In the prior art, when the power module dissipates heat, it usually adopts a heat dissipation substrate and a liquid cooling plate to dissipate heat. Specifically, the heat dissipation substrate is arranged below the module body of the power module device, and the heat dissipation substrate is partially arranged in the slot of the liquid cooling plate, and the heat dissipation substrate contacts the cooling liquid in the slot to transfer the heat generated by the module body to the cooling liquid.

[0004] Among them, in order to ensure the heat dissipation effect and manufacturing cost of the power module device, the heat dissipation substrate usually uses a material with good thermal conductivity, and the liquid cooling plate usually uses a material with low cost. The heat dissipation substrate and the liquid cooling plate usually use different metal materials. This will cause the heat dissipation substrate and the liquid cooling plate to chemically corrode in the coolant, thereby reducing the service life of the heat dissipation substrate and the liquid cooling plate, and affecting the heat dissipation effect of the power module device. Utility Model Content

[0005] The utility model provides a power module device and an electrical device having the same, so as to solve the problem that a heat dissipation substrate and a liquid cooling plate in the prior art are very likely to be chemically corroded in the cooling liquid.

[0006] According to one aspect of the utility model, a power module device is provided, the power module device comprising: a module body; a heat conductive substrate, one side of the heat conductive substrate abuts against the module body; a heat dissipation substrate, one side of the heat dissipation substrate abuts against the other side of the heat conductive substrate; a liquid cooling plate, the liquid cooling plate is provided with a groove, the groove is used to accommodate a coolant, the heat dissipation substrate is partially located in the groove, and the heat dissipation substrate is in contact with the coolant, and the heat dissipation substrate and the liquid cooling plate are made of the same material; or the groove is made of an insulating resin material, and the structure of the heat dissipation substrate except the groove is made of the same material as the liquid cooling plate.

[0007] Furthermore, an insulating substrate is provided at the bottom of the module body, one side of the thermal conductive substrate is in contact with the insulating substrate, the thermal conductive substrate is made of copper, and the heat dissipation substrate is made of aluminum.

[0008] Furthermore, the thermally conductive substrate and the heat dissipating substrate are connected by welding, bonding or hot-melt rolling.

[0009] Furthermore, the heat dissipation substrate comprises a substrate body having a connection side and a heat dissipation side which are arranged opposite to each other, the connection side of the substrate body abuts against the heat conductive substrate, and the heat dissipation side of the substrate body is used to contact with the cooling liquid.

[0010] Furthermore, a plurality of heat sinks are provided on the heat dissipation side of the substrate body, and the plurality of heat sinks are used to contact with the cooling liquid.

[0011] Furthermore, a sealing member is provided between the heat dissipation substrate and the liquid cooling plate, and the sealing member is annularly arranged on the outer periphery of the groove.

[0012] Furthermore, the liquid cooling plate includes a receiving cavity and a groove which are independently arranged. The groove is arranged on the surface of the liquid cooling plate. A water inlet and a water outlet are arranged on the side wall of the groove. Both the water inlet and the water outlet are connected to the receiving cavity.

[0013] Furthermore, a snap-fit ​​structure is provided between the thermally conductive substrate and the heat dissipating substrate, and the thermally conductive substrate and the heat dissipating substrate are connected via the snap-fit ​​structure.

[0014] Furthermore, a mortise and tenon structure is provided between the thermally conductive substrate and the heat dissipating substrate, and the thermally conductive substrate and the heat dissipating substrate are connected via the mortise and tenon structure.

[0015] According to another aspect of the utility model, an electrical device is provided, the electrical device comprising the power module device provided above, the electrical device comprising a plurality of module bodies of the power module devices, a plurality of thermally conductive substrates of the power module devices, a plurality of heat dissipation substrates of the power module devices and a liquid cooling plate of the power module devices, the plurality of module bodies being arranged in a one-to-one correspondence with the plurality of thermally conductive substrates, and the plurality of thermally conductive substrates being arranged in a one-to-one correspondence with the plurality of heat dissipation substrates.

[0016] Furthermore, the plurality of module bodies, the plurality of heat-conducting substrates and the plurality of heat-dissipating substrates are arranged on the same liquid cooling plate, and the liquid cooling plate is provided with at least one slot.

[0017] Furthermore, the electrical device includes a plurality of liquid cooling plates of the power module devices, the plurality of liquid cooling plates are arranged in one-to-one correspondence with the plurality of heat dissipation substrates, and two adjacent liquid cooling plates are connected to each other.

[0018] Using the technical solution of the utility model, the thermal conductive substrate is arranged below the module body, the heat dissipation substrate is arranged below the thermal conductive substrate, and the heat dissipation substrate contacts the coolant in the slot, the heat dissipation substrate and the liquid cooling plate are made of the same material, or the slot is made of insulating resin material, and except for the slot, the heat dissipation substrate and the liquid cooling plate are made of the same material. The thermal conductive substrate can be made of a material with good thermal conductivity, and both the thermal conductive substrate and the heat dissipation substrate are made of metal. Such an arrangement can simultaneously ensure the heat dissipation effect and manufacturing cost of the power module device, and can avoid chemical corrosion of the heat dissipation substrate and the liquid cooling plate in the coolant, thereby increasing the service life of the heat dissipation substrate and the liquid cooling plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0020] Figure 1 A schematic diagram of the structure of a power module device provided in Embodiment 1 of the present utility model is shown;

[0021] Figure 2 A schematic diagram of the structure of a power module device provided in the second embodiment of the present utility model is shown;

[0022] Figure 3 Shows Figure 2 A partial enlarged view of the middle A;

[0023] Figure 4 The structure diagram of the power module device provided in the third embodiment of the present utility model is shown;

[0024] Figure 5 A cross-sectional view of a power module device provided in Embodiment 3 of the present utility model is shown;

[0025] Figure 6 Shows Figure 5 A partial enlarged view of point B in the middle.

[0026] The above drawings include the following reference numerals:

[0027] 10. Module body; 11. Insulating substrate;

[0028] 20. Thermally conductive substrate; 21. Connecting structure;

[0029] 211, connecting piece; 2111, plane structure; 2112, arc structure; 2113, guide section; 2114, transition section; 2115, limit section;

[0030] 22. a second through hole;

[0031] 30. heat dissipation substrate; 31. substrate body; 311. first through hole; 312. third through hole; 32. heat dissipation element;

[0032] 40. Liquid cooling plate; 41. Slot; 411. Water outlet; 42. Liquid inlet;

[0033] 50. Connecting column. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0035] like Figure 1 As shown, the first embodiment of the utility model provides a power module device, which includes a module body 10, a thermally conductive substrate 20, a heat dissipation substrate 30 and a liquid cooling plate 40. One side of the thermally conductive substrate 20 abuts against the module body 10. One side of the heat dissipation substrate 30 abuts against the other side of the thermally conductive substrate 20. A groove 41 is provided on the liquid cooling plate 40, and the groove 41 is used to accommodate the coolant. The heat dissipation substrate 30 is partially located in the groove 41, and the heat dissipation substrate 30 is in contact with the coolant. The heat dissipation substrate 30 and the liquid cooling plate 40 are made of the same material. Alternatively, the groove 41 is made of insulating resin material, but except for the groove 41, the other structures of the heat dissipation substrate 30 and the liquid cooling plate 40 are made of the same material.

[0036] Using the technical solution of the present application, the thermally conductive substrate 20 is arranged below the module body 10, the heat dissipation substrate 30 is arranged below the thermally conductive substrate 20, and the heat dissipation substrate 30 is in contact with the coolant in the slot 41, the heat dissipation substrate 30 and the liquid cooling plate 40 are made of the same material, or the slot 41 is made of insulating resin material, and except for the slot 41, the heat dissipation substrate 30 and the liquid cooling plate 40 are made of the same material. The thermally conductive substrate 20 can be made of a material with good thermal conductivity, and both the thermally conductive substrate 20 and the heat dissipation substrate 30 are made of metal. Such an arrangement can simultaneously ensure the heat dissipation effect and manufacturing cost of the power module device, and can avoid chemical corrosion of the heat dissipation substrate 30 and the liquid cooling plate 40 in the coolant, thereby increasing the service life of the heat dissipation substrate 30 and the liquid cooling plate 40.

[0037] Among them, an insulating substrate 11 is arranged at the bottom of the module body 10, one side of the heat-conducting substrate 20 is in contact with the insulating substrate 11, the heat-conducting substrate 20 is made of copper, and the heat-dissipating substrate 30 is made of aluminum. In this way, the copper material has good thermal conductivity, and the thermal expansion coefficients of the copper material and the insulating substrate 11 are close, which can ensure the heat-conducting effect of the heat-conducting substrate 20 and improve the reliability of the power module device; the aluminum material has a low cost, which can reduce the manufacturing cost of the heat-dissipating substrate 30 and the liquid cooling plate 40. In addition, during the operation of the heat-conducting substrate 20 and the heat-dissipating substrate 30, the heat-conducting substrate 20 can also dissipate heat while transferring heat to the heat-dissipating substrate 30, and the heat-dissipating substrate 30 can also dissipate heat while transferring heat to the cooling liquid.

[0038] Furthermore, the staff can select the size of the thermally conductive substrate 20 according to the size of the insulating substrate 11, as long as the insulating substrate 11 is located within the edge of the thermally conductive substrate 20. This can reduce the cost of the thermally conductive substrate 20 and the weight of the power module device while ensuring the thermal conductivity of the thermally conductive substrate 20 and the reliability brought by the similar thermal expansion coefficients of the thermally conductive substrate 20 and the insulating substrate 11.

[0039] Specifically, the heat-conducting substrate 20 and the heat-dissipating substrate 30 are connected by welding, bonding or hot-melt rolling. Such a configuration facilitates the connection of the heat-conducting substrate 20 and the heat-dissipating substrate 30, and only requires the surfaces of the heat-conducting substrate 20 and the heat-dissipating substrate 30 to be attached, thereby improving the flexibility of the connection between the heat-conducting substrate 20 and the heat-dissipating substrate 30.

[0040] Furthermore, the heat dissipation substrate 30 includes a substrate body 31, the substrate body 31 has a connection side and a heat dissipation side that are arranged opposite to each other, the connection side of the substrate body 31 abuts against the heat conductive substrate 20, and the heat dissipation side of the substrate body 31 is used to contact the coolant. Such an arrangement has a simple structure and is convenient for processing the heat dissipation substrate 30.

[0041] Furthermore, a plurality of heat sinks 32 are provided on the heat dissipation side of the substrate body 31, and the plurality of heat sinks 32 are used to contact the coolant. With such a configuration, while ensuring that the heat dissipation substrate 30 is in contact with the heat conductive substrate 20, it is convenient for the heat dissipation substrate 30 to contact the coolant, and the structure is simple, which facilitates the processing of the heat dissipation structure. Moreover, with such a configuration, the heat dissipation effect of the heat dissipation substrate 30 can be improved.

[0042] When the heat dissipation substrate 30 includes the heat dissipation element 32 , the heat dissipation side of the substrate body 31 may or may not be in contact with the cooling liquid.

[0043] Optionally, the heat sink 32 is a columnar structure, and a plurality of heat sinks 32 are evenly spaced and distributed on the substrate body 31. This arrangement can reduce the weight of the heat sink 30, while ensuring the uniformity of heat conduction of the heat sink 30, thereby improving the heat dissipation efficiency of the power module device and facilitating the processing and manufacturing of the heat sink 30.

[0044] Optionally, the heat sink 32 is a fin structure, and a plurality of fin structures are evenly spaced and distributed on the substrate body 31, and the fin structure extends along the extension direction of the substrate body 31. Such an arrangement can reduce the number of processing times of the heat sink 30 while ensuring the thermal conductivity of the heat sink 30, and facilitate the processing and manufacturing of the heat sink 30.

[0045] Optionally, the heat sink 32 may also be in a diamond-shaped, teardrop-shaped, elliptical, wavy, or other shaped structures.

[0046] Furthermore, a seal is provided between the heat dissipation substrate 30 and the liquid cooling plate 40, and the seal is annularly arranged on the outer periphery of the slot 41. Such arrangement can prevent the coolant from overflowing from the slot 41, thereby preventing the coolant from contaminating other components of the power module device, and ensuring the normal operation of the power module device.

[0047] Optionally, the liquid cooling plate 40 can be fixed to the heat dissipation substrate 30 by welding. In this case, no sealing member is required between the liquid cooling plate 40 and the heat dissipation substrate 30 .

[0048] Specifically, the liquid cooling plate 40 includes a receiving cavity and a slot 41 which are independently arranged. The slot 41 is arranged on the surface of the liquid cooling plate 40. A water inlet and a water outlet 411 are arranged on the side wall of the slot 41. The water inlet and the water outlet 411 are both connected to the receiving cavity. Among them, the water inlet and the water outlet 411 can also be arranged at the bottom of the slot 41. Such an arrangement facilitates the processing of the liquid cooling plate 40 and has a simple structure. At the same time, a liquid inlet 42 and a liquid outlet are arranged on the liquid cooling plate 40. The liquid inlet 42 and the liquid outlet are respectively arranged at both ends of the liquid cooling plate 40. The liquid inlet 42 and the liquid outlet are both connected to the receiving cavity. When the coolant dissipates heat, it first enters the receiving cavity through the liquid inlet 42, then enters the slot 41 through the water inlet, and then flows into the receiving cavity through the water outlet 411, and finally flows out through the liquid outlet.

[0049] like Figure 2 and Figure 3 As shown, the second embodiment of the utility model provides a power module device, which is different from the first embodiment in that a buckle structure is provided between the thermal conductive substrate 20 and the heat dissipation substrate 30, and the thermal conductive substrate 20 and the heat dissipation substrate 30 are connected by the buckle structure. In this way, the buckle structure can process the thermal conductive substrate 20 and the heat dissipation substrate 30, further avoiding looseness between the thermal conductive substrate 20 and the heat dissipation substrate 30, thereby further ensuring the heat conduction and heat dissipation effects of the thermal conductive substrate 20 and the heat dissipation substrate 30.

[0050] Specifically, in the present application, a connection structure 21 is provided on the heat-conducting substrate 20, and the connection structure 21 includes two connecting members 211, and the connecting member 211 includes a plane structure 2111 and an arc structure 2112. The plane structures 2111 of the two connecting members 211 are arranged opposite to each other, and there is a gap between the two connecting members 211. The connecting member 211 includes a guide section 2113, a transition section 2114 and a limit section 2115 connected in sequence, the guide section 2113 is located at the top of the connecting member 211, and the limit section 2115 is connected to the heat-conducting substrate 20. Among them, the diameter of the guide section 2113 gradually decreases in the direction away from the heat-conducting substrate 20, there is a step surface between the transition section 2114 and the limit section 2115, and the diameter of the transition section 2114 is greater than the diameter of the limit section 2115. And the connecting member 211 has a certain elasticity.

[0051] The heat dissipation substrate 30 is provided with a first through hole 311, that is, the substrate body 31 is provided with a first through hole 311, and the first through hole 311 is engaged with the stepped surface, so as to realize the connection between the thermal conductive substrate 20 and the heat dissipation substrate 30. The first through hole 311 cooperates with the connection structure 21 to form a snap structure. With such a configuration, the structure is simple and it is convenient to connect the thermal conductive substrate 20 and the heat dissipation substrate 30. In addition, the guide section 2113 can play a guiding role, so that the connection piece 211 is convenient to be inserted into the first through hole 311, which is convenient for the staff to operate and reduces the labor intensity of the staff.

[0052] Further, a plurality of connection structures 21 are provided on the thermally conductive substrate 20, and the plurality of connection structures 21 are provided in an annular shape on the thermally conductive substrate 20, and a plurality of first through holes 311 are provided on the heat dissipation substrate 30, and the plurality of connection structures 21 and the plurality of first through holes 311 are provided in a one-to-one correspondence. In the present application, four connection structures 21 are provided on the thermally conductive substrate 20, and four first through holes 311 are provided on the heat dissipation substrate 30.

[0053] like Figures 4 to 6 As shown, the third embodiment of the present invention provides a power module device, which is different from the first embodiment in that a mortise and tenon structure is provided between the thermal conductive substrate 20 and the heat dissipation substrate 30, and the thermal conductive substrate 20 and the heat dissipation substrate 30 are connected by the mortise and tenon structure. In this way, the mortise and tenon structure can process the thermal conductive substrate 20 and the heat dissipation substrate 30, further avoiding looseness between the thermal conductive substrate 20 and the heat dissipation substrate 30, thereby further ensuring the heat conduction and heat dissipation effects of the thermal conductive substrate 20 and the heat dissipation substrate 30.

[0054] Specifically, the thermal conductive substrate 20 is provided with a second through hole 22, and the heat dissipation substrate 30 is provided with a third through hole 312, that is, the substrate body 31 is provided with a third through hole 312, and the second through hole 22 and the third through hole 312 are provided correspondingly. The diameter of the second through hole 22 gradually decreases in the direction approaching the heat dissipation substrate 30, and the third through hole 312 gradually decreases in the direction away from the thermal conductive substrate 20, and the diameter of the third through hole 312 is smaller than the diameter of the second through hole 22. The second through hole 22 and the third through hole 312 are connected by a connecting column 50, and the diameter of the connecting column 50 is adapted to the diameter of the second through hole 22 and the third through hole 312. The second through hole 22, the third through hole 312 and the connecting column 50 cooperate to form a mortise and tenon structure.

[0055] Further, a plurality of second through holes 22 are provided on the thermally conductive substrate 20, and the plurality of second through holes 22 are provided in an annular shape on the thermally conductive substrate 20, and a plurality of third through holes 312 are provided on the heat dissipation substrate 30, and the plurality of second through holes 22 and the plurality of third through holes 312 are provided in a one-to-one correspondence. In the present application, four second through holes 22 are provided on the thermally conductive substrate 20, and four third through holes 312 are provided on the heat dissipation substrate 30.

[0056] The fourth embodiment of the utility model provides an electrical device, the electrical device includes the power module device provided above, the electrical device includes a plurality of module bodies 10 of the power module devices, a plurality of heat-conducting substrates 20 of the power module devices, a plurality of heat-dissipating substrates 30 of the power module devices, and a liquid cooling plate 40 of the power module devices, the plurality of module bodies 10 are arranged in a one-to-one correspondence with the plurality of heat-conducting substrates 20, the plurality of heat-conducting substrates 20 are arranged in a one-to-one correspondence with the plurality of heat-dissipating substrates 30, and the liquid cooling plate 40 can cool the plurality of module bodies 10. Such an arrangement can avoid chemical corrosion of the heat-dissipating substrate 30 and the liquid cooling plate 40 in the electrical device in the coolant, thereby increasing the service life of the heat-dissipating substrate 30 and the liquid cooling plate 40.

[0057] Specifically, multiple module bodies 10, multiple heat-conducting substrates 20 and multiple heat-dissipating substrates 30 are arranged on the same liquid cooling plate 40, and at least one slot 41 is arranged on the liquid cooling plate 40. When there is one slot 41 on the liquid cooling plate 40, multiple heat-dissipating substrates 30 are arranged on the same slot 41. When multiple slots 41 are arranged on the liquid cooling plate 40, two adjacent slots 41 are connected to each other. Optionally, multiple slots 41 are arranged one-to-one with multiple heat-dissipating substrates 30; or, one heat-dissipating substrate 30 is arranged on some of the slots 41, and multiple heat-dissipating substrates 30 are arranged on some of the slots 41. Such an arrangement can reduce the number of liquid cooling plates 40, and facilitate the assembly of multiple module bodies 10, multiple heat-conducting substrates 20 and multiple heat-dissipating substrates 30. Among them, in the present application, a channel is arranged in the liquid cooling plate 40 to connect two adjacent slots 41.

[0058] The fifth embodiment of the present utility model provides a power module device, which is different from the fourth embodiment in that the electrical device includes a plurality of liquid cooling plates 40 of the power module device, and the plurality of liquid cooling plates 40 are arranged one by one with the plurality of heat dissipation substrates 30, and two adjacent liquid cooling plates 40 are connected to each other. Such an arrangement can reduce the difficulty of processing the liquid cooling plates 40. In this application, two adjacent liquid cooling plates 40 are connected by pipelines.

[0059] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0060] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0061] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0062] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0063] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0064] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A power module device, characterized in that: The power module device comprises: Module body (10); A heat-conducting substrate (20), one side of the heat-conducting substrate (20) being in contact with the module body (10); a heat dissipation substrate (30), one side of the heat dissipation substrate (30) abutting against the other side of the heat conductive substrate (20); A liquid cooling plate (40), wherein a groove (41) is provided on the liquid cooling plate (40), wherein the groove (41) is used to accommodate a cooling liquid, wherein a portion of the heat dissipation substrate (30) is located in the groove (41), and the heat dissipation substrate (30) is in contact with the cooling liquid, and the heat dissipation substrate (30) and the liquid cooling plate (40) are made of the same material; or the groove (41) is made of an insulating resin material, and the structure of the heat dissipation substrate (30) other than the groove (41) is made of the same material as the liquid cooling plate (40).

2. The power module device according to claim 1, characterized in that: An insulating substrate (11) is provided at the bottom of the module body (10), one side of the heat-conducting substrate (20) is in contact with the insulating substrate (11), the heat-conducting substrate (20) is made of copper, and the heat-dissipating substrate (30) is made of aluminum.

3. The power module device according to claim 1, characterized in that: The heat-conducting substrate (20) and the heat-dissipating substrate (30) are connected by welding, bonding or hot-melt rolling.

4. The power module device according to claim 1, characterized in that: The heat dissipation substrate (30) comprises a substrate body (31), wherein the substrate body (31) has a connection side and a heat dissipation side which are arranged opposite to each other, the connection side of the substrate body (31) abuts against the heat conductive substrate (20), and the heat dissipation side of the substrate body (31) is used to contact with the cooling liquid.

5. The power module device according to claim 4, characterized in that: A plurality of heat dissipation elements (32) are provided on the heat dissipation side of the substrate body (31), and the plurality of heat dissipation elements (32) are used to contact the cooling liquid.

6. The power module device according to claim 1, characterized in that: A sealing member is provided between the heat dissipation substrate (30) and the liquid cooling plate (40), and the sealing member is arranged in an annular shape on the outer periphery of the slot (41).

7. The power module device according to claim 1, characterized in that: The liquid cooling plate (40) comprises a receiving cavity and the groove (41) which are independently arranged from each other, the groove (41) is arranged on the surface of the liquid cooling plate (40), a water inlet and a water outlet (411) are arranged on the side wall of the groove (41), and the water inlet and the water outlet (411) are both connected to the receiving cavity.

8. The power module device according to claim 1, characterized in that: A snap-fit ​​structure is provided between the heat-conducting substrate (20) and the heat-dissipating substrate (30), and the heat-conducting substrate (20) and the heat-dissipating substrate (30) are connected via the snap-fit ​​structure.

9. The power module device according to claim 1, characterized in that: A mortise and tenon structure is provided between the heat-conducting substrate (20) and the heat-dissipating substrate (30), and the heat-conducting substrate (20) and the heat-dissipating substrate (30) are connected via the mortise and tenon structure.

10. An electrical device, characterized in that: The electrical equipment comprises a power module device according to any one of claims 1 to 9, the electrical equipment comprises a plurality of module bodies (10) of the power module devices, a plurality of thermally conductive substrates (20) of the power module devices, a plurality of heat dissipation substrates (30) of the power module devices, and a liquid cooling plate (40) of the power module devices, wherein the plurality of module bodies (10) and the plurality of thermally conductive substrates (20) are arranged in a one-to-one correspondence, and the plurality of thermally conductive substrates (20) and the plurality of heat dissipation substrates (30) are arranged in a one-to-one correspondence.

11. The electrical device according to claim 10, characterized in that A plurality of the module bodies (10), a plurality of the heat-conducting substrates (20) and a plurality of the heat-dissipating substrates (30) are arranged on the same liquid cooling plate (40), and the liquid cooling plate (40) is provided with at least one slot (41).

12. The electrical device according to claim 10, characterized in that The electrical equipment comprises a plurality of liquid cooling plates (40) of the power module device, the plurality of liquid cooling plates (40) are arranged in one-to-one correspondence with the plurality of heat dissipation substrates (30), and two adjacent liquid cooling plates (40) are connected to each other.

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