42 results about "Gunmetal" patented technology

The invention discloses a method for preparing a copper-tin alloy coating on the surface of steel through ultrahigh-speed laser cladding, which comprises the following steps of: S1, pretreating a steel substrate, and controlling the surface roughness Ra to be 2.5-3.2 microns; s2, spherical copper powder and flaky tin powder with the particle size of 15-53 microns are taken, and the copper powder is treated through microwave plasma, so that a nanoscale copper oxide layer is formed on the surface of the copper powder; s3, tin powder and the activated copper powder serve as coating raw materials, an airborne double-barrel powder feeder is adopted, laser is in a flat-top type circular light spot mode, a steel substrate moves relative to a laser cladding device according to a set track, the laser power is 3.5-4.5 kW, the laser scanning speed is 50-80 m / min, and the copper powder is molten into a liquid state to wrap the tin powder; and the temperature of the molten pool is monitored in real time, so that the temperature is stabilized at 1300-1400 DEG C, and finally the copper-tin alloy coating is prepared on the surface of the steel substrate. According to the method, efficient, high-precision and low-defect manufacturing of the copper-tin alloy coating is achieved through a light-powder-matrix coordinated regulation and control mechanism.

The alloy wire comprises the following components in percentage by mass: 0.1 to 6.0 weight percent of Sn, 0.1 to 0.3 weight percent of Ag, 0.01 to 0.20 weight percent of Zr, 0.02 to 1.00 weight percent of Y, 0.02 to 2.00 weight percent of Ce, 0.01 to 0.80 weight percent of Eu, 0.01 to 0.50 weight percent of Rb, Y / (Ce + Eu + Rb) is more than or equal to 0.8 and less than or equal to 1.2, and the balance of Cu and inevitable impurities of which the total amount is less than or equal to 0.05 weight percent. According to the invention, Ag and Zr are added into the copper-tin alloy wire in component design, and composite rare earth elements are also added, so that the addition amount of each rare earth element is limited, and in order to further improve the processability and comprehensive performance of the alloy wire, the addition amount of each rare earth element is limited; and finally, the preparation process of vacuum melting-continuous casting technology-multi-pass drawing combined with on-line dynamic annealing process treatment is combined, so that work hardening and internal stress of the wire are eliminated, the machining precision, plasticity and conductivity of the wire are improved, the material performance is more uniform, and the subsequent deformation or cracking risk in use is reduced.

The invention relates to the field of diamond saw blades, and discloses a diamond saw blade and a preparation method thereof.The saw blade comprises a cutter body and a cutter bit, and the cutter bit is prepared from, by mass, 10-25 parts of diamond particles; 18 to 25 parts of cobalt powder; 15 to 28 parts of tungsten powder; 8 to 14 parts of nickel powder; 15 to 22 parts of copper powder; 8 to 14 parts of iron powder; 8 to 12 parts of copper-tin alloy; 2-5 parts of manganese powder; and 0.5-2 parts of a heat-resistant phase. The diamond particles are subjected to multi-particle-size grading matching, so that coarse particles guide cutting, fine particles fill gaps of the coarse particles, a compact structure is formed, and the effect of improving the density of the tool bit and the cutting stability is achieved. Compared with a formula only using single-particle-size diamond particles in the prior art, the problems of loose particle accumulation, stress concentration and easy cracking are solved.

The utility model discloses a container with sealing structure, including container body, copper ring and tin solder plug, the one side of container body is provided with the opening, is provided with copper ring in the opening, and the outer wall of copper ring is sealedly connected with the opening, and the middle of copper ring is provided with the injection hole, and tin solder plug sets up in the injection hole, and covers the outer surface of copper ring, this scheme sets up in the opening through copper ring, and carries out sealed and forms the injection hole, and cooperates with tin solder plug and realizes the injection hole sealing, utilizes the excellent wettability and metallurgical reaction of soldering tin to copper surface, forms the small dense alloy layer at interface, can improve the sealing effect, copper is strong inert metal as simultaneously, and its surface oxide layer is stable, and tin solder plug and copper tin alloy layer chemical property are mild, and all are not easy to have the corrosion, dissolution or component mutual solubility with organic phase change material, avoid the physicochemical reaction problem of traditional glue seal / block seal, further promote the sealing stability.

The utility model relates to the technical field of mechanical equipment, in particular to a durable hydraulic prop which comprises a hydraulic prop body, a plating layer is arranged outside the hydraulic prop body, the plating layer is a composite plating layer of a copper-tin alloy plating layer and a chromium plating layer, and a passivation zinc plating layer is further arranged outside the chromium plating layer. A hard chromium plating layer is arranged between the chromium plating layer and the copper-tin alloy bottom layer; or a milky white hard chromium plating layer is arranged between the chromium plating layer and the copper-tin alloy bottom layer. The hydraulic prop has the advantages of being more durable and free of dust adhesion.

The application discloses a high-strength and high-conductivity copper-tin alloy wire capable of resisting high-temperature softening and a preparation process thereof, and the copper-tin alloy wire comprises the following raw materials in percentage by mass: Sn 0.25-0.35 wt.%; Zr 0.15-0.35 wt.%, and the balance of Cu and inevitable impurities. The Cu-Sn-Zr alloy wire has a tensile strength of more than 700 MPa, an electrical conductivity of more than 75% IACS, and a softening resistance temperature of more than 400 DEG C, and can meet the use requirements of the high-strength and high-conductivity Cu-Sn alloy wire at high temperature. After deformation heat treatment of the alloy rod is completed, the alloy rod is subjected to gradual cooling treatment through a special gradual cooling device, so that problems such as thermal cracks in the cooling process are avoided, and the quality of the alloy rod product is ensured.

The invention relates to a high-strength, high-conductivity and low-dislocation-density copper alloy wire for signal transmission and connection and a preparation method of the high-strength, high-conductivity and low-dislocation-density copper alloy wire. The fine control problems of uneven components and structures during casting, grain orientation / microdefects in the forming process and the like are solved, the wire has good machining performance, and the wire still has good mechanical and electrical properties after subsequent machining.

The invention belongs to the technical field of copper-tin alloy contact wire preparation, and relates to a casting process of a casting rod for a copper-tin alloy contact wire, the copper-tin alloy contact wire and a preparation process of the copper-tin alloy contact wire. The casting technology comprises the following steps that a cathode copper plate and a tin block are added into a smelting device to be smelted, in the smelting process, a refining agent is added, the surface of molten metal is covered with graphite, and a copper-tin alloy cast rod is cast; the refining agent comprises sodium chloride, borax, sodium carbonate and fluorite; the adding mass of the sodium chloride is 0.02%-0.05% of the weight of the cathode copper plate, the adding mass of the borax is 0.15%-0.20% of the weight of the cathode copper plate, the adding mass of the sodium carbonate is 0.02%-0.05% of the weight of the cathode copper plate, and the adding mass of the fluorite is 0.12%-0.25% of the weight of the cathode copper plate. Various refining agents are added, copper liquid is purified, harmful impurities are removed, and the problem that an existing copper-tin alloy contact wire cannot meet high strength and high conductivity at the same time is solved.

A tin-plated product, wherein a surface of a substrate (10) is plated with tin, the tin-plated product comprising: a substrate (10) made of copper or a copper alloy; a base (12) formed on a surface of the substrate (10), the base (12) being formed of nickel and / or a copper-nickel alloy; and an outermost layer formed on a surface of the base layer (12), the outermost layer being composed of a copper-tin alloy layer (14) and tin layers (16), the copper-tin alloy layer (14) being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers (16) being arranged in a corresponding one of depressed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on an outermost surface of the outermost layer, wherein an area ratio occupied by the tin layers (16) on the outermost surface is 20 to 80%, and a maximum thickness of the tin layers (16) is smaller than an average particle diameter of the crystal grains of the copper-tin alloy, and wherein the outermost surface has an arithmetic mean roughness Ra of 0.05 to 0.2 micrometers and a maximum roughness depth Ry of 0.3 to 1.5 micrometers.

To provide a thermosensitive pellet type thermal fuse having a low risk of a short circuit or the like of a circuit caused by tin plating applied to a lead wire even when placed in a high temperature environment.SOLUTION: A case having an internal space; two lead wires provided at respective ends of said case and connected to a circuit; and a thermal pellet and an electrical contact provided in said internal space, said thermal pellet melting at a predetermined operating temperature or higher; A temperature fuse configured such that the electric contact is disconnected to interrupt a circuit, wherein at least one of the two lead wires includes a core material formed of copper or a copper alloy and a covering portion covering the core material, and the covering portion includes a tin layer formed as an outermost layer and a copper-tin alloy layer formed between the tin layer and the core material.SELECTED DRAWING: Figure 5

The aim is to achieve both reduced insertion force and improved solder wettability in high-temperature, high-humidity environments. [Solution] The average thickness of the nickel layer is 0.15 mm or more and 4.0 mm or less, and the average thickness of the copper-tin alloy layer is 0.15 μm or more and 0.8 μm or less. In a cross section parallel to the rolling direction of the substrate, if the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and tin layer at the connection point is X%, and the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and tin layer at the soldering point is Y%, then X% is 21% or more and 50% or less, Y% is 31% or more and 90% or less, Y > X, and the difference between them is 10% or more.

The invention discloses a magnesium alloy gold plating method with triple electrochemical protection effects and a plating layer structure. The process comprises the following steps: sequentially preparing a chemical zinc deposition layer, a cyanide-free copper-tin alloy plating layer, a cyanide-free copper-zinc alloy plating layer, a bright nickel-copper alloy plating layer, a nickel-phosphorus alloy plating layer, a gold plating layer and an anti-discoloration protective film on a magnesium alloy substrate. According to the cyanide-free copper-tin alloy plating process, 18-24 g / L of polycuprous thiocyanate, 0.2-0.6 g / L of stannous oxalate, 130-170 g / L of polysodium thiocyanate, 20-30 g / L of sodium 1-hydroxyethylidene-1, 1-diphosphonate and 8-12 mL / L of a copper-tin alloy plating brightener are adopted, the pH value of a plating solution is 12-13, the temperature of a plating tank is 30-40 DEG C, the cathode current density is 0.5-1.5 A / dm < 2 >, the cathode movement speed is 3-5 m / min, oxygen-free electrolytic copper particles serve as an anode, the copper particles are loaded into a titanium anode basket, the area ratio of the anode to the cathode is larger than 3: 1, and the anode movement speed is 3-5 m / min. And the surface of a plated part is not rusted after the plated part is subjected to an acetate mist test for 200 hours according to the GB / T 10125-2021 standard.

This invention relates to the field of COF carrier technology, and more particularly to a COF carrier and its preparation method. The preparation method includes the following steps in sequence: coating, exposure, development, etching, micro-etching, first chemical tin plating, first baking, solder resist printing, second chemical tin plating, and second baking; wherein, the tin layer thickness of the first chemical tin plating is 0.05~0.08μm; the first baking makes the tin layer completely become a copper-tin alloy; solder resist printing uniformly prints a layer of ink on the non-lead area of ​​the carrier; and the second chemical tin plating is performed only on the lead area of ​​the carrier. This invention, by adjusting the production process and unfolding sequence of the COF carrier, and through the micro-etching process after desmearing and the second tin plating process, increases the copper content and reduces the amount of copper-tin alloy formed by the structural design of the COF carrier, thereby increasing the pure copper ratio of the circuit, improving the heat dissipation capacity of the COF carrier, and enhancing the packaging and testing efficiency of the COF carrier at the packaging and testing end.

The invention discloses a method for preparing a composite blank for a Ni3Sn superconducting wire based on copper-tin alloy powder. The method comprises the following specific steps: preparing Cu-Sn-Ti alloy powder by adopting a gas atomization method; carrying out surface treatment on the plurality of pure niobium rods; the Cu-Sn-Ti alloy powder and the pure niobium rod are assembled in a mold, and a Cu-Sn-Ti / Nb rod combined blank is obtained; and the Cu-Sn-Ti / Nb rod combined blank is placed in a vacuum rapid hot pressing furnace to be subjected to heat-force-electricity synergistic sintering and cooled, and a CuSnTi / Nb composite blank is obtained. The plasticity of the composite blank for the Nb3Sn superconducting wire obtained by the method is improved, and cracking in the subsequent multi-pass drawing process is avoided.

The present application relates to the field of diamond tools, and specifically discloses a matrix material for diamond tool heads, a sharp diamond uniformly distributed saw blade, and a preparation process thereof. A matrix material for diamond tool heads comprises the following raw materials in weight percentage: 50-60% dendritic electrolytic copper powder, 20-40% copper-tin alloy, 0-5% cobalt powder, 0-15% tin powder, and 5-10% iron powder; the diamond saw blade comprises a disc-shaped base and a diamond tool head, and the circumference of the diamond tool head is concave inward; the diamond tool head is provided with two drainage grooves running through the surface of the diamond tool head, and the two drainage grooves intersect or are parallel to each other. When intersecting, the intersection point is located on the side of the diamond tool head close to the disc-shaped base, and a U-shaped groove is provided on the circumference of the diamond tool head away from the disc-shaped base. The matrix material of the present application has a high holding force on the diamond particles and can accurately position them; in addition, the diamond saw blade of the present application has high cutting efficiency, good sharpness and self-sharpening properties.

Tinned product, comprehensive: a base material (10) made of copper or a copper alloy; a copper-tin alloy layer (12) formed on the base material (10), and a tin layer (14) formed on the copper-tin alloy layer (12), wherein the tinned product has a luster of 0.3 to 0.7 and the outermost surface of the tinned product has a mean height Rc of 0.1 to 1.0 µm.

The invention belongs to the field of metallurgy, and particularly relates to a dispersion strengthened copper-tin alloy and a preparation method and application thereof. The method comprises the following steps: 1) preparing an aluminum-containing aqueous solution, putting copper oxide into the aluminum-containing aqueous solution, mixing, and continuously stirring until the mixture is pasty to obtain a pasty material; 2) oxidizing and calcining the pasty material to obtain a copper aluminum oxide mixture; and (3) the copper-aluminum oxide mixture is subjected to reduction calcination, aluminum oxide dispersion copper alloy powder is obtained, the aluminum oxide dispersion copper alloy powder and tin powder are mixed and then subjected to diffusion alloying treatment, and the dispersion strengthened copper-tin alloy is obtained. Micro-level combination of copper and aluminum is achieved through a special process, the copper-tin alloy can be effectively and flexibly constructed on the basis, and it is ensured that the copper-tin alloy has good physical and chemical properties.

In the present invention, the average thickness of a nickel layer is 0.15-4.0 mm, and the average thickness of a copper-tin alloy layer is 0.15-0.8 μm. In a cross section parallel to a rolling direction of a base material, when the area ratio of a tin layer to the total area of the copper-tin alloy layer and the tin layer of a connection part is taken as X% and the area ratio of the tin layer to the total area of the copper-tin alloy layer and the tin layer of a soldering part is taken as Y%, X % is 21%-50%, Y % is 31%-90%, Y > X, and a difference therebetween is 10% or more.

To provide a conductive material that possesses sufficient heat resistance while enabling sufficiently low contact resistance under low contact pressure (<2 N).SOLUTION: A conductive material having a base material made of copper or a copper alloy, one or more ground layers each composed of one or more elements selected from the group consisting of Ni, Co, and Fe, a Cu-Sn alloy layer, and a Sn layer in the given order where the skewness evaluated with a cutoff value of 25 μm in a 250 μm square area containing 50% or more of the Sn layer on the Sn layer side surface of the conductive material is -3.50 to 3.50.SELECTED DRAWING: Figure 1A

The invention discloses a magnesium alloy nickel plating process with triple electrochemical protection effects and a plating layer structure. The process comprises the step of sequentially preparing a chemical zinc deposition layer, a cyanide-free copper plating layer, a cyanide-free copper-tin alloy plating layer, a cyanide-free copper-zinc alloy plating layer, a bright nickel plating layer and an anti-discoloration protective film on a magnesium alloy matrix. According to the cyanide-free copper-tin alloy plating process, 18-24 g / L of polycuprous thiocyanate, 0.2-0.6 g / L of stannous oxalate, 130-170 g / L of polysodium thiocyanate, 20-30 g / L of disodium 1-hydroxyethylidene-1, 1-diphosphonate and 8-12 mL / L of a copper-tin alloy plating brightener are adopted, the pH value of a plating solution is 12-13, the temperature of a plating tank is 30-40 DEG C, the cathode current density is 0.5-1.5 A / dm < 2 >, the cathode movement speed is 3-5 m / min, oxygen-free electrolytic copper particles serve as an anode, the copper particles are loaded into a titanium anode basket, the area ratio of the anode to the cathode is larger than 3: 1, and the anode movement speed is 3-5 m / min. And the surface of a plated part is not rusted after the plated part is subjected to an acetate mist test for 96 hours according to the GB / T 10125-2021 standard.

The application discloses a copper-tin alloy powder and a preparation method thereof. The copper-tin alloy powder is spherical and has 3-level pores, and the loose bulk density is 1.8-2.9 g / cm 3 The 3-level pores are as follows: the first-level pore size is 20-200 µm; the second-level pore size is 5-30 µm; and the third-level pore size is 0.5-10 µm. The strength of the powder compact prepared by the method is high. During the pressing process, the metal powder is deformed, and the powder is attached together. The lower the loose bulk density of the powder is, the larger the attached area is, and the better the strength of the green compact is. The strength of the bronze green compact prepared by the method is very high, and the strength of the green compact is 6-12 MPa.

It can be applied to various copper-based substrates, suppressing void formation, reducing the coefficient of friction, and preventing film peeling under prolonged high-temperature conditions. [Solution] A film is formed on the surface of a substrate made of copper or a copper alloy, and the film has a nickel layer made of nickel or a nickel alloy formed on the surface of the substrate, a copper-tin alloy layer made of a copper and tin alloy formed on the nickel layer, and a tin layer made of tin or a tin alloy formed on the copper-tin alloy layer, the average thickness of the nickel layer is 0.15 μm or more and 3.00 μm or less, the average thickness of the copper-tin alloy layer is 0.2 μm or more and 1.0 μm or less, the average thickness of the tin layer is 0.1 μm or more and 2.0 μm or less, and the copper-tin alloy layer contains a Cu6Sn5 alloy, and the average GOS value of the Cu6Sn5 alloy in a cross section parallel to the rolling direction of the substrate is 0.48° or more and 0.70° or less.

The present application relates to the technical field of circuit board processing, and specifically discloses an environmentally friendly tin stripping water for stripping the copper-tin alloy layer of a printed circuit board, the tin stripping water comprising the following raw materials in weight percentage: 25-65% sulfuric acid, 2-10% hydrogen peroxide, 0.5-3% citric acid, 0.5-6% boric acid, 0.1-2% stabilizer, 0.1-2% copper protector, and the balance being deionized water; the tin stripping water provided in the present application has a scientific formula, a rigorous ratio, and is simple to prepare; the obtained tin stripping water has stable performance and can be used in a tin stripping process to achieve one-step stripping of excess tin layer and copper-tin alloy layer, with the advantages of high tin biting rate, large tin dissolving amount, low copper biting rate, fast copper-tin alloy layer stripping rate, thorough stripping without damaging the copper surface; the tin stripping water formula of the present application does not contain nitric acid with strong corrosiveness and irritation, and no strong irritating gas is generated during the production and tin stripping process; the obtained tin stripping waste liquid is convenient for recovering tin and copper, has low ammonia nitrogen and no total nitrogen, and is green and environmentally friendly.

The invention discloses a magnesium alloy nickel-tin alloy plating technology with triple electrochemical protection effects and a combined plating layer. The technology comprises the steps that a micro-arc oxidation film, a chemical nickel plating layer, a cyanide-free copper-tin alloy plating layer, a cyanide-free copper-zinc alloy plating layer, a bright nickel-copper alloy plating layer, a nickel-tin alloy plating layer and a rare earth electrolysis protection film are sequentially prepared on a magnesium alloy matrix. According to the cyanide-free copper-tin alloy plating process, 18-24 g / L of polycuprous thiocyanate, 0.2-0.6 g / L of stannous oxalate, 130-170 g / L of polysodium thiocyanate, 20-30 g / L of disodium 1-hydroxyethylidene-1, 1-diphosphonate and 8-12 mL / L of a copper-tin alloy plating brightener are adopted, the pH value of a plating solution is 12-13, the temperature of a plating tank is 30-40 DEG C, the cathode current density is 0.5-1.5 A / dm < 2 >, the cathode movement speed is 3-5 m / min, oxygen-free electrolytic copper particles serve as an anode, the copper particles are loaded into a titanium anode basket, the area ratio of the anode to the cathode is larger than 3: 1, and the anode movement speed is 3-5 m / min. And the surface of a plated part is not rusted after the plated part is subjected to an acetate mist test for 126h according to the GB / T 10125-2021 standard.

A coating film is formed on the surface of a substrate comprising copper or a copper alloy, and the coating film comprises: a nickel layer formed on the surface of the substrate and comprising nickel or a nickel alloy; a copper-tin alloy layer formed on the nickel layer and composed of an alloy of copper and tin; and a tin layer formed on the copper-tin alloy layer and comprising tin or a tin alloy, in which the average thickness of the nickel layer is 0.05 [mu] m to 3.00 [mu] m, the arithmetic mean curvature (Spc) of the peak points on the surface of the copper-tin alloy layer is 700 mm-1 to 2200 mm-1, and the average thickness of the tin layer is 0.05 [mu] m to 2.00 [mu] m. And the average thickness of the copper-tin alloy layer is 0.15 [mu] m or more and 1.55 [mu] m or less.

The invention discloses a high-density copper-tin alloy powder metallurgy process in the field of powder metallurgy, which comprises the following steps: step 1, raw material preparation: weighing 90% of copper powder, 9.510.5% of tin powder and 0.1% of lubricant according to mass percent; through multi-dimensional innovation of raw material particle size matching (copper powder is 5-15 microns / tin powder is 3-8 microns), composite lubricant (zinc stearate: graphite = 1: 1) application, segmented sintering, high-pressure re-pressing (800-900 MPa) and aging treatment, the product density is improved to 8.2 or above (up to 8.42) from 7.2 of a traditional process, the tensile strength is improved to 410-435 MPa from 320 MPa, the Brinell hardness is improved to 82-88 HB from 65 HB, and the product quality is improved. Meanwhile, tin segregation and residual stress are eliminated through uniform powder mixing and aging treatment, the process stability and the product size precision are improved, special equipment does not need to be newly added, the product additional value is increased by 30% or above while the production cost is increased by 5% or less, and the requirements of high-end fields such as high-speed rails and deep sea equipment can be met; the core problems of low density, poor performance and short service life of the traditional copper-tin alloy are effectively solved.

This invention relates to the field of industrial waste resource utilization technology, specifically to a method for recycling copper-tin alloy-clad steel waste, comprising the following steps: placing the copper-tin alloy-clad steel waste into an ammonia leaching reactor for stirring and leaching to obtain leaching residue and leachate; washing the leaching residue to obtain iron and a cleaning solution; pumping the leachate and the cleaning solution together into a filter press for filter pressing to obtain filter residue and filter liquid; washing the filter residue to obtain tin mud; sending the filter liquid into an electrowinning copper tank to obtain copper and a copper-lean electrolyte; and pumping the copper-lean electrolyte back into the ammonia leaching reactor for subsequent copper-tin alloy-clad steel waste leaching processes. This invention's method for recycling copper-tin alloy-clad steel waste can separately recover metallic copper, tin, and residual iron from the copper-tin alloy-clad steel waste, achieving high recovery efficiency and low pollution.

To provide a film coated copper terminal material in which the insertion / extraction force is stably reduced by chiefly preventing adhesion from occurring when the material is used for a connector.SOLUTION: A base material made of copper or a copper alloy is coated with a film that is laminated with a nickel layer made of nickel or a nickel alloy, a copper-tin alloy layer, and a tin layer made of tin or a tin alloy in this order. The copper tin alloy layer includes a primary component of Cu6Sn5 alloy layer. The Cu6Sn5 alloy layer is an alloy layer having a compound in which a part of the copper is replaced by nickel, a part of the layer is exposed onto the surface of the tin layer and the exposure area ratio of the copper tin alloy layer exposed onto the surface of the tin layer is 1% or more and 60% or less. The tin layer has the average thickness of 0.2 μm or more and 1.2 μm or less. The nickel layer has the average thickness of 0.05 μm or more and 2.0 μm or less. The arithmetic average curvature Spc of peak points on the film surface is more than 70 mm-1 and 200 mm-1 or less, and the Spc standard deviation / average value is 30% or lower at the time of 10 visual field measurement.SELECTED DRAWING: Figure 1

A two-step method for recovering tin and copper resources from copper slag using a gas-phase oxidation-reduction roasting process relates to the field of secondary resource recycling. First, the copper slag is ground and mixed with a slagging agent, and then fed into a smelting furnace for selective oxidation smelting. This allows the gaseous oxidant to undergo a selective oxidation reaction with the tin, lead, copper, arsenic, and sulfur phases in the copper slag. Tin, arsenic, and copper enter the slag phase, while most of the lead is distributed in the crude lead phase. Sulfur is oxidized to sulfur dioxide and enters the gas phase, achieving selective oxidation slag formation and efficient separation of tin and copper. The smelting slag and the reducing agent are then evenly mixed in a certain proportion and fed into a rotary kiln for reduction roasting. Tin, arsenic, copper, and other components in the smelting slag undergo simultaneous reduction reactions. Arsenic is reduced to arsenic oxide, which volatilizes and enriches in the smoke, while tin and copper remain in the roasting slag. Reduction smelting produces a copper-tin alloy, achieving efficient recovery of tin and copper resources from the copper slag. The method of the present invention has the advantages of simple operation and low cost, and has good prospects for promotion and application.

The invention discloses a low-element segregation copper-nickel-tin alloy and a supergravity preparation method thereof. The low-element segregation copper-nickel-tin alloy is mainly prepared by mixing electrolytic copper, a copper-nickel alloy and a copper-tin alloy, and the method comprises the steps that the electrolytic copper, the copper-nickel alloy and the copper-tin alloy are placed in a smelting furnace to be subjected to vacuum smelting, a cast ingot is sequentially subjected to linear cutting, mechanical grinding, ultrasonic cleaning and constant-temperature drying, and a copper-nickel-tin raw material is obtained; processing the copper-nickel-tin raw material into a plurality of block cast ingots, and placing the cast ingots in a crucible; and then through high-vacuum heating and heat preservation treatment, the crucible containing the cast ingot is put into a heat preservation hanging cup of a centrifugal machine to be subjected to high-speed centrifugal rotation treatment, and after the crucible is completely cooled to the room temperature, the cast ingot subjected to supergravity solidification is taken out. According to the method, the high-gravity field is applied on the basis of constant-gravity solidification of the Cu-Ni-Sn alloy, and the strength, the plasticity, the toughness and the electrochemical corrosion resistance of the as-cast copper alloy are remarkably optimized only by adjusting the strength of the high-gravity field.