This invention relates to the field of COF carrier technology, and more particularly to a COF carrier and its preparation method. The preparation method includes the following steps in sequence:
coating,
exposure, development,
etching, micro-
etching, first chemical
tin plating, first baking, solder
resist printing, second chemical
tin plating, and second baking; wherein, the
tin layer thickness of the first chemical
tin plating is 0.05~0.08μm; the first baking makes the tin layer completely become a
copper-tin
alloy; solder
resist printing uniformly prints a layer of ink on the non-lead area of the carrier; and the second chemical
tin plating is performed only on the lead area of the carrier. This invention, by adjusting the production process and unfolding sequence of the COF carrier, and through the micro-
etching process after desmearing and the second
tin plating process, increases the
copper content and reduces the amount of
copper-tin
alloy formed by the structural design of the COF carrier, thereby increasing the pure copper ratio of the circuit, improving the heat dissipation capacity of the COF carrier, and enhancing the packaging and testing efficiency of the COF carrier at the packaging and testing end.