30 results about "Gunmetal" patented technology

The alloy wire comprises the following components in percentage by mass: 0.1 to 6.0 weight percent of Sn, 0.1 to 0.3 weight percent of Ag, 0.01 to 0.20 weight percent of Zr, 0.02 to 1.00 weight percent of Y, 0.02 to 2.00 weight percent of Ce, 0.01 to 0.80 weight percent of Eu, 0.01 to 0.50 weight percent of Rb, Y / (Ce + Eu + Rb) is more than or equal to 0.8 and less than or equal to 1.2, and the balance of Cu and inevitable impurities of which the total amount is less than or equal to 0.05 weight percent. According to the invention, Ag and Zr are added into the copper-tin alloy wire in component design, and composite rare earth elements are also added, so that the addition amount of each rare earth element is limited, and in order to further improve the processability and comprehensive performance of the alloy wire, the addition amount of each rare earth element is limited; and finally, the preparation process of vacuum melting-continuous casting technology-multi-pass drawing combined with on-line dynamic annealing process treatment is combined, so that work hardening and internal stress of the wire are eliminated, the machining precision, plasticity and conductivity of the wire are improved, the material performance is more uniform, and the subsequent deformation or cracking risk in use is reduced.

The invention relates to the field of diamond saw blades, and discloses a diamond saw blade and a preparation method thereof.The saw blade comprises a cutter body and a cutter bit, and the cutter bit is prepared from, by mass, 10-25 parts of diamond particles; 18 to 25 parts of cobalt powder; 15 to 28 parts of tungsten powder; 8 to 14 parts of nickel powder; 15 to 22 parts of copper powder; 8 to 14 parts of iron powder; 8 to 12 parts of copper-tin alloy; 2-5 parts of manganese powder; and 0.5-2 parts of a heat-resistant phase. The diamond particles are subjected to multi-particle-size grading matching, so that coarse particles guide cutting, fine particles fill gaps of the coarse particles, a compact structure is formed, and the effect of improving the density of the tool bit and the cutting stability is achieved. Compared with a formula only using single-particle-size diamond particles in the prior art, the problems of loose particle accumulation, stress concentration and easy cracking are solved.

The utility model discloses a container with sealing structure, including container body, copper ring and tin solder plug, the one side of container body is provided with the opening, is provided with copper ring in the opening, and the outer wall of copper ring is sealedly connected with the opening, and the middle of copper ring is provided with the injection hole, and tin solder plug sets up in the injection hole, and covers the outer surface of copper ring, this scheme sets up in the opening through copper ring, and carries out sealed and forms the injection hole, and cooperates with tin solder plug and realizes the injection hole sealing, utilizes the excellent wettability and metallurgical reaction of soldering tin to copper surface, forms the small dense alloy layer at interface, can improve the sealing effect, copper is strong inert metal as simultaneously, and its surface oxide layer is stable, and tin solder plug and copper tin alloy layer chemical property are mild, and all are not easy to have the corrosion, dissolution or component mutual solubility with organic phase change material, avoid the physicochemical reaction problem of traditional glue seal / block seal, further promote the sealing stability.

The application discloses a high-strength and high-conductivity copper-tin alloy wire capable of resisting high-temperature softening and a preparation process thereof, and the copper-tin alloy wire comprises the following raw materials in percentage by mass: Sn 0.25-0.35 wt.%; Zr 0.15-0.35 wt.%, and the balance of Cu and inevitable impurities. The Cu-Sn-Zr alloy wire has a tensile strength of more than 700 MPa, an electrical conductivity of more than 75% IACS, and a softening resistance temperature of more than 400 DEG C, and can meet the use requirements of the high-strength and high-conductivity Cu-Sn alloy wire at high temperature. After deformation heat treatment of the alloy rod is completed, the alloy rod is subjected to gradual cooling treatment through a special gradual cooling device, so that problems such as thermal cracks in the cooling process are avoided, and the quality of the alloy rod product is ensured.

The invention relates to a high-strength, high-conductivity and low-dislocation-density copper alloy wire for signal transmission and connection and a preparation method of the high-strength, high-conductivity and low-dislocation-density copper alloy wire. The fine control problems of uneven components and structures during casting, grain orientation / microdefects in the forming process and the like are solved, the wire has good machining performance, and the wire still has good mechanical and electrical properties after subsequent machining.

The invention belongs to the technical field of copper-tin alloy contact wire preparation, and relates to a casting process of a casting rod for a copper-tin alloy contact wire, the copper-tin alloy contact wire and a preparation process of the copper-tin alloy contact wire. The casting technology comprises the following steps that a cathode copper plate and a tin block are added into a smelting device to be smelted, in the smelting process, a refining agent is added, the surface of molten metal is covered with graphite, and a copper-tin alloy cast rod is cast; the refining agent comprises sodium chloride, borax, sodium carbonate and fluorite; the adding mass of the sodium chloride is 0.02%-0.05% of the weight of the cathode copper plate, the adding mass of the borax is 0.15%-0.20% of the weight of the cathode copper plate, the adding mass of the sodium carbonate is 0.02%-0.05% of the weight of the cathode copper plate, and the adding mass of the fluorite is 0.12%-0.25% of the weight of the cathode copper plate. Various refining agents are added, copper liquid is purified, harmful impurities are removed, and the problem that an existing copper-tin alloy contact wire cannot meet high strength and high conductivity at the same time is solved.

To provide a thermosensitive pellet type thermal fuse having a low risk of a short circuit or the like of a circuit caused by tin plating applied to a lead wire even when placed in a high temperature environment.SOLUTION: A case having an internal space; two lead wires provided at respective ends of said case and connected to a circuit; and a thermal pellet and an electrical contact provided in said internal space, said thermal pellet melting at a predetermined operating temperature or higher; A temperature fuse configured such that the electric contact is disconnected to interrupt a circuit, wherein at least one of the two lead wires includes a core material formed of copper or a copper alloy and a covering portion covering the core material, and the covering portion includes a tin layer formed as an outermost layer and a copper-tin alloy layer formed between the tin layer and the core material.SELECTED DRAWING: Figure 5

The aim is to achieve both reduced insertion force and improved solder wettability in high-temperature, high-humidity environments. [Solution] The average thickness of the nickel layer is 0.15 mm or more and 4.0 mm or less, and the average thickness of the copper-tin alloy layer is 0.15 μm or more and 0.8 μm or less. In a cross section parallel to the rolling direction of the substrate, if the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and tin layer at the connection point is X%, and the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and tin layer at the soldering point is Y%, then X% is 21% or more and 50% or less, Y% is 31% or more and 90% or less, Y > X, and the difference between them is 10% or more.

This invention relates to the field of COF carrier technology, and more particularly to a COF carrier and its preparation method. The preparation method includes the following steps in sequence: coating, exposure, development, etching, micro-etching, first chemical tin plating, first baking, solder resist printing, second chemical tin plating, and second baking; wherein, the tin layer thickness of the first chemical tin plating is 0.05~0.08μm; the first baking makes the tin layer completely become a copper-tin alloy; solder resist printing uniformly prints a layer of ink on the non-lead area of ​​the carrier; and the second chemical tin plating is performed only on the lead area of ​​the carrier. This invention, by adjusting the production process and unfolding sequence of the COF carrier, and through the micro-etching process after desmearing and the second tin plating process, increases the copper content and reduces the amount of copper-tin alloy formed by the structural design of the COF carrier, thereby increasing the pure copper ratio of the circuit, improving the heat dissipation capacity of the COF carrier, and enhancing the packaging and testing efficiency of the COF carrier at the packaging and testing end.

The present application relates to the field of diamond tools, and specifically discloses a matrix material for diamond tool heads, a sharp diamond uniformly distributed saw blade, and a preparation process thereof. A matrix material for diamond tool heads comprises the following raw materials in weight percentage: 50-60% dendritic electrolytic copper powder, 20-40% copper-tin alloy, 0-5% cobalt powder, 0-15% tin powder, and 5-10% iron powder; the diamond saw blade comprises a disc-shaped base and a diamond tool head, and the circumference of the diamond tool head is concave inward; the diamond tool head is provided with two drainage grooves running through the surface of the diamond tool head, and the two drainage grooves intersect or are parallel to each other. When intersecting, the intersection point is located on the side of the diamond tool head close to the disc-shaped base, and a U-shaped groove is provided on the circumference of the diamond tool head away from the disc-shaped base. The matrix material of the present application has a high holding force on the diamond particles and can accurately position them; in addition, the diamond saw blade of the present application has high cutting efficiency, good sharpness and self-sharpening properties.

Tinned product, comprehensive: a base material (10) made of copper or a copper alloy; a copper-tin alloy layer (12) formed on the base material (10), and a tin layer (14) formed on the copper-tin alloy layer (12), wherein the tinned product has a luster of 0.3 to 0.7 and the outermost surface of the tinned product has a mean height Rc of 0.1 to 1.0 µm.

The invention belongs to the field of metallurgy, and particularly relates to a dispersion strengthened copper-tin alloy and a preparation method and application thereof. The method comprises the following steps: 1) preparing an aluminum-containing aqueous solution, putting copper oxide into the aluminum-containing aqueous solution, mixing, and continuously stirring until the mixture is pasty to obtain a pasty material; 2) oxidizing and calcining the pasty material to obtain a copper aluminum oxide mixture; and (3) the copper-aluminum oxide mixture is subjected to reduction calcination, aluminum oxide dispersion copper alloy powder is obtained, the aluminum oxide dispersion copper alloy powder and tin powder are mixed and then subjected to diffusion alloying treatment, and the dispersion strengthened copper-tin alloy is obtained. Micro-level combination of copper and aluminum is achieved through a special process, the copper-tin alloy can be effectively and flexibly constructed on the basis, and it is ensured that the copper-tin alloy has good physical and chemical properties.

In the present invention, the average thickness of a nickel layer is 0.15-4.0 mm, and the average thickness of a copper-tin alloy layer is 0.15-0.8 μm. In a cross section parallel to a rolling direction of a base material, when the area ratio of a tin layer to the total area of the copper-tin alloy layer and the tin layer of a connection part is taken as X% and the area ratio of the tin layer to the total area of the copper-tin alloy layer and the tin layer of a soldering part is taken as Y%, X % is 21%-50%, Y % is 31%-90%, Y > X, and a difference therebetween is 10% or more.

The application discloses a copper-tin alloy powder and a preparation method thereof. The copper-tin alloy powder is spherical and has 3-level pores, and the loose bulk density is 1.8-2.9 g / cm 3 The 3-level pores are as follows: the first-level pore size is 20-200 µm; the second-level pore size is 5-30 µm; and the third-level pore size is 0.5-10 µm. The strength of the powder compact prepared by the method is high. During the pressing process, the metal powder is deformed, and the powder is attached together. The lower the loose bulk density of the powder is, the larger the attached area is, and the better the strength of the green compact is. The strength of the bronze green compact prepared by the method is very high, and the strength of the green compact is 6-12 MPa.

It can be applied to various copper-based substrates, suppressing void formation, reducing the coefficient of friction, and preventing film peeling under prolonged high-temperature conditions. [Solution] A film is formed on the surface of a substrate made of copper or a copper alloy, and the film has a nickel layer made of nickel or a nickel alloy formed on the surface of the substrate, a copper-tin alloy layer made of a copper and tin alloy formed on the nickel layer, and a tin layer made of tin or a tin alloy formed on the copper-tin alloy layer, the average thickness of the nickel layer is 0.15 μm or more and 3.00 μm or less, the average thickness of the copper-tin alloy layer is 0.2 μm or more and 1.0 μm or less, the average thickness of the tin layer is 0.1 μm or more and 2.0 μm or less, and the copper-tin alloy layer contains a Cu6Sn5 alloy, and the average GOS value of the Cu6Sn5 alloy in a cross section parallel to the rolling direction of the substrate is 0.48° or more and 0.70° or less.

The present application relates to the technical field of circuit board processing, and specifically discloses an environmentally friendly tin stripping water for stripping the copper-tin alloy layer of a printed circuit board, the tin stripping water comprising the following raw materials in weight percentage: 25-65% sulfuric acid, 2-10% hydrogen peroxide, 0.5-3% citric acid, 0.5-6% boric acid, 0.1-2% stabilizer, 0.1-2% copper protector, and the balance being deionized water; the tin stripping water provided in the present application has a scientific formula, a rigorous ratio, and is simple to prepare; the obtained tin stripping water has stable performance and can be used in a tin stripping process to achieve one-step stripping of excess tin layer and copper-tin alloy layer, with the advantages of high tin biting rate, large tin dissolving amount, low copper biting rate, fast copper-tin alloy layer stripping rate, thorough stripping without damaging the copper surface; the tin stripping water formula of the present application does not contain nitric acid with strong corrosiveness and irritation, and no strong irritating gas is generated during the production and tin stripping process; the obtained tin stripping waste liquid is convenient for recovering tin and copper, has low ammonia nitrogen and no total nitrogen, and is green and environmentally friendly.

A coating film is formed on the surface of a substrate comprising copper or a copper alloy, and the coating film comprises: a nickel layer formed on the surface of the substrate and comprising nickel or a nickel alloy; a copper-tin alloy layer formed on the nickel layer and composed of an alloy of copper and tin; and a tin layer formed on the copper-tin alloy layer and comprising tin or a tin alloy, in which the average thickness of the nickel layer is 0.05 [mu] m to 3.00 [mu] m, the arithmetic mean curvature (Spc) of the peak points on the surface of the copper-tin alloy layer is 700 mm-1 to 2200 mm-1, and the average thickness of the tin layer is 0.05 [mu] m to 2.00 [mu] m. And the average thickness of the copper-tin alloy layer is 0.15 [mu] m or more and 1.55 [mu] m or less.

The invention discloses a high-density copper-tin alloy powder metallurgy process in the field of powder metallurgy, which comprises the following steps: step 1, raw material preparation: weighing 90% of copper powder, 9.510.5% of tin powder and 0.1% of lubricant according to mass percent; through multi-dimensional innovation of raw material particle size matching (copper powder is 5-15 microns / tin powder is 3-8 microns), composite lubricant (zinc stearate: graphite = 1: 1) application, segmented sintering, high-pressure re-pressing (800-900 MPa) and aging treatment, the product density is improved to 8.2 or above (up to 8.42) from 7.2 of a traditional process, the tensile strength is improved to 410-435 MPa from 320 MPa, the Brinell hardness is improved to 82-88 HB from 65 HB, and the product quality is improved. Meanwhile, tin segregation and residual stress are eliminated through uniform powder mixing and aging treatment, the process stability and the product size precision are improved, special equipment does not need to be newly added, the product additional value is increased by 30% or above while the production cost is increased by 5% or less, and the requirements of high-end fields such as high-speed rails and deep sea equipment can be met; the core problems of low density, poor performance and short service life of the traditional copper-tin alloy are effectively solved.

This invention relates to the field of industrial waste resource utilization technology, specifically to a method for recycling copper-tin alloy-clad steel waste, comprising the following steps: placing the copper-tin alloy-clad steel waste into an ammonia leaching reactor for stirring and leaching to obtain leaching residue and leachate; washing the leaching residue to obtain iron and a cleaning solution; pumping the leachate and the cleaning solution together into a filter press for filter pressing to obtain filter residue and filter liquid; washing the filter residue to obtain tin mud; sending the filter liquid into an electrowinning copper tank to obtain copper and a copper-lean electrolyte; and pumping the copper-lean electrolyte back into the ammonia leaching reactor for subsequent copper-tin alloy-clad steel waste leaching processes. This invention's method for recycling copper-tin alloy-clad steel waste can separately recover metallic copper, tin, and residual iron from the copper-tin alloy-clad steel waste, achieving high recovery efficiency and low pollution.

To provide a film coated copper terminal material in which the insertion / extraction force is stably reduced by chiefly preventing adhesion from occurring when the material is used for a connector.SOLUTION: A base material made of copper or a copper alloy is coated with a film that is laminated with a nickel layer made of nickel or a nickel alloy, a copper-tin alloy layer, and a tin layer made of tin or a tin alloy in this order. The copper tin alloy layer includes a primary component of Cu6Sn5 alloy layer. The Cu6Sn5 alloy layer is an alloy layer having a compound in which a part of the copper is replaced by nickel, a part of the layer is exposed onto the surface of the tin layer and the exposure area ratio of the copper tin alloy layer exposed onto the surface of the tin layer is 1% or more and 60% or less. The tin layer has the average thickness of 0.2 μm or more and 1.2 μm or less. The nickel layer has the average thickness of 0.05 μm or more and 2.0 μm or less. The arithmetic average curvature Spc of peak points on the film surface is more than 70 mm-1 and 200 mm-1 or less, and the Spc standard deviation / average value is 30% or lower at the time of 10 visual field measurement.SELECTED DRAWING: Figure 1

A combination of: a substrate (1) made of aluminium, an aluminium alloy, steel, chrome-plated steel or stainless steel and a color-imparting layer system on at least one surface of the substrate (1), wherein the color-imparting layer system comprises: - an adhesive layer (2) with a layer thickness of 2 to 30 nm made of metallic chromium, molybdenum, tungsten, platinum, aluminium, titanium, zirconium, nickel or an alloy of two or more of these elements, which is applied to at least one surface of the substrate (1) by means of a PVD process, - a color-imparting layer (3) of copper, titanium, stainless steel, a Cu-Zn alloy, a Cu-Sn alloy, a Ni-Cu-Sn alloy, a non-ferromagnetic nickel alloy, CrN x , where 0.5 ≤ x ≤ 1.0, provided that the color-giving layer (3) is only made of CrN x is formed when the layer (4) described below is present, CrO y , where 0 < y < 1.5, as cermet, (Al n Cr 1-n )N x , where 0 < n < 1 and 0.5 ≤ x ≤ 1.0, or (Al n Cr 1-n )N x C z , where 0 < n < 1; 0 < x < 1.5; 0 < z < 1.0 and 0.5 < (x + z) < 1.5, which is applied to the adhesive layer (2) by means of a PVD process, - optionally an additional color-imparting layer (4) made of CrN x O y , where 0 < x < 1.0, 0 < y < 1.5 and 0.5 < y + x < 1.5, , (Al n Cr 1-n )N x , where 0 < n < 1 and 0.5 ≤ x ≤ 1.0, (Al n Cr 1-n )N x C z , where 0 < n < 1; 0 < x < 1.5; 0 < z < 1.0 and 0.5 < (x + z) < 1.5, TiO r N t , where 0 < r < 2 and 0 < t ≤ 1, titanium aluminum nitride or ZrO r N t, where 0 < r < 2 and 0 < t ≤ 1, which is applied to layer (3) by means of a PVD process, with the proviso that if layer (3) and (4) are made of (Al n Cr 1-n )N x or (Al n Cr 1-n )N x C z are formed, the ratio of Cr to Al of layer (4) differs from the ratio of Cr to Al of layer (3), and - a dielectric protective and adhesive layer (5) of Cr2O3, ZrO2, ZrO2 in which up to 20% of the Zr is replaced by Si or Ta, SiO2, SiO2 in which up to 20% of the Si is replaced by Al, Al2O3, Si3N4 or Nb2O5, which is applied to layer (3) or layer (4) by means of a PVD process or by means of a PECVD process, wherein layers (2), (3) and (5) and the optional layer (4) form the color-imparting layer system, where the total thickness of the color-imparting layer system is 400 nm or less.

In the present invention, a coating film is formed on a substrate made of copper or a copper-tin alloy, the coating film being a laminate in which a nickel layer made of nickel or a nickel alloy, a copper-tin alloy layer, and a tin layer made of tin or a tin alloy are layered in this order. The copper-tin alloy layer is composed mainly of a Cu6Sn5 alloy layer. The Cu6Sn5 alloy layer is an ally layer having a compound in which a part of the copper is substituted with nickel, and a part of the alloy layer is exposed on the surface of the tin layer. The exposed area ratio of the copper-tin alloy layer exposed on the surface of the tin layer is 1-60%. The tin layer has an average thickness of 0.20-1.20 μm, and the nickel layer has an average thickness of 0.05-2.00 μm. The arithmetic average curve Spc of the crest point on the surface of the coating film exceeds 70 mm-1 but does not exceed 200 mm-1, and the standard deviation / average value of Spc found when visual field measurement is performed 10 times is 30% or less.

The application discloses a kind of high-performance copper-based composite material for extreme environment and preparation method thereof, it is related to metal material technical field, the composite material includes: a) copper matrix, the copper matrix includes pure copper or copper alloy, copper alloy further includes copper-nickel, copper-beryllium, copper-zinc, copper-tin alloy;B) reinforcing phase material;C) one or more alloying elements;D) additive, the additive includes yttrium, lanthanum;In the technical scheme provided in the application, by adding appropriate amount of nickel, phosphorus, iron, manganese, cobalt, titanium, beryllium, zirconium and other alloying elements, the strength, toughness and wear resistance of the composite material are improved, so that the material can withstand greater stress without damage in extreme environment. Yttrium, lanthanum and other additives are used to optimize the microstructure of the material, and a dense protective layer is formed on the surface of the material through surface treatment technology, greatly improving the corrosion resistance of the material.

The aim is to achieve both a reduction in insertion force and improved solder wettability in high-temperature, high-humidity environments. [Solution] The average thickness of the nickel layer is 0.15 mm or more and 4.0 mm or less, and the average thickness of the copper-tin alloy layer is 0.15 μm or more and 0.8 μm or less. In a cross section parallel to the rolling direction of the substrate, if the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and the tin layer at the connection portion is X%, and the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and the tin layer at the soldered portion is Y%, X% is 21% or more and 50% or less, Y% is 31% or more and 90% or less, Y>X, and the difference is 10% or more.

The utility model provides a bronze pot which comprises a pot body, the pot body is made of copper-tin alloy, a plurality of heating holes which are distributed at equal intervals and are the same in size are formed in the bottom of the pot body, inner ribs are arranged on the inner wall of the pot body, partition plates are arranged on the inner sides of the inner ribs, the left side and the right side of the pot body are fixedly connected with pot handles, and the pot handles are fixedly connected with the pot body. And the heated hole and the pot body are in a non-penetrating state. Through the arrangement of the heated holes, the heat efficiency can be improved, heat distribution is uniform, heat transfer is accelerated, the energy-saving and environment-friendly effects are achieved, the overall firm durability, abrasion resistance and corrosion resistance of the pot body can be enhanced, and the overall service life is prolonged. The pot body is integrally cast into a cone by adopting a mechanical structure, so that the pot body is firmer and more durable and is not easy to deform or damage, and the pot body is made of bronze, so that the pot body can be used for supplementing copper elements and tin elements for a human body, improving the common anemia phenomenon of people, has a special sterilization effect and prevents the generation of microorganisms.

This invention discloses a rare earth modified trivalent chromium plating process and coating structure for magnesium alloys. The process includes sequentially preparing a chemical zinc plating layer, a cyanide-free copper plating layer, a cyanide-free copper-tin alloy plating layer, a bright nickel-copper alloy plating layer, a bright nickel-cobalt alloy plating layer, a rare earth modified trivalent chromium plating layer, and an anti-discoloration protective film on a magnesium alloy substrate. The rare earth-modified trivalent chromium plating process is as follows: 80-140 g / L chromium chloride hexahydrate, 90-160 g / L potassium chloride, 90-160 g / L ammonium chloride, 16-30 g / L ammonium bromide, 40-60 g / L ammonium formate, 45-65 g / L boric acid, 8-12 mL / L rare earth additives, 2-4 mL / L leveling agent, 1-3 mL / L accelerator, pH of the plating solution 2.5-3.2, plating tank temperature 25-35℃, cathode current density 8-16 A / dm², using an inert graphite rod as the anode, and moderate air agitation. The rare earth additives have a synergistic effect on improving the performance of the trivalent chromium plating solution. The plated parts undergo a neutral salt spray test for 140 hours according to GB / T 10125–2021, and no surface corrosion is observed.

A conductive material includes a base material composed of copper or a copper alloy; an underlayer being one or more layers composed of one or more selected from the group consisting of Ni, Co and Fe; a Cu—Sn alloy layer; and a Sn layer in this order. A part of the Cu—Sn alloy layer is exposed on a Sn layer-side surface of the conductive material, and an arithmetic mean height evaluated with a cut-off value of 25 μm is 0.03 μm or more in a 250 μm square region containing 50 area % or more of the Sn layer in the Sn layer-side surface of the conductive material.

The application relates to a preparation method of an alloy hollow micro-lattice material with gradient component proportion, and relates to the technical field of metal hollow micro-lattice preparation. The method comprises the following steps: performing surface pretreatment on a template of a metal hollow micro-lattice material, depositing a metal pre-plating layer on product A by adopting a surface deposition technology to obtain product B; preparing a multilayer metal layer with multilayer gradient deposition on the surface of product B, and removing product A to obtain product C; and performing heat diffusion alloy treatment on product C to obtain an alloy hollow micro-lattice material with gradient component proportion, wherein the alloy hollow micro-lattice material is a copper-tin alloy hollow micro-lattice material or a NiFeCuCo alloy hollow micro-lattice material. The application can obtain a preparation method of an alloy hollow micro-lattice material with gradient component proportion.

The invention discloses an electroplating method for replacing nickel with copper-tin alloy. The electroplating method for replacing nickel with copper-tin alloy comprises the following steps: S1, pretreatment: carrying out oil removal, hot water washing, acid pickling activation and water washing on a plated part; s2, cyanide-free copper-tin alloy electroplating; s3, washing with water; s4, passivation is conducted, specifically, the plated part is passivated in a trivalent chromium passivation solution, the temperature is set to be 50-55 DEG C, the passivation time is set to be 45-60 s, and slight air stirring is adopted in a stirring mode; s5, washing with water; s6, sealing is conducted, specifically, the plated part is sealed through a water-based sealing agent, the sealing temperature is set to be 85-90 DEG C, the sealing time is set to be 2-3 minutes, and centrifugal spin-drying is conducted after dripping drying (the rotating speed is 800-1000 rpm); s7, drying; and S8, inspecting. According to the electroplating method for replacing nickel with the copper-tin alloy, a manager is refined through a pulsed power supply, a plating piece is electroplated with a copper-tin-containing plating solution with the high tin ratio (the molar ratio of Sn to Cu gt, 3) to form a copper-tin alloy plating layer, and it is guaranteed that the surface gloss of the plating piece is close to the metallic gloss of nickel while a nickel plating layer is replaced.

Provided is a brazing filler metal which is inexpensive in terms of material cost, and which enables good brazing between ceramic members and metal members.　This brazing powder is characterized by comprising a mixed powder of 80.0 to 99.7 % by mass of a Cu-Sn alloy powder and 0.3 to 20.0 % by mass of at least one type of active metal component powder, wherein the Cu-Sn alloy powder contains 18.0 to 37.0 % by mass of Sn, with the remainder being Cu and unavoidable impurities. A paste composition containing 75.0 to 92.0 % by mass of the brazing powder and 8.0 to 25.0 % by mass of an organic varnish is suitable for joining ceramic members and metal members. The active metal component powder may be a powder having at least one element selected from Ti, Zr, Hf, and Nb as a main component.