12 results about "Gunmetal" patented technology

The application discloses a high-strength and high-conductivity copper-tin alloy wire capable of resisting high-temperature softening and a preparation process thereof, and the copper-tin alloy wire comprises the following raw materials in percentage by mass: Sn 0.25-0.35 wt.%; Zr 0.15-0.35 wt.%, and the balance of Cu and inevitable impurities. The Cu-Sn-Zr alloy wire has a tensile strength of more than 700 MPa, an electrical conductivity of more than 75% IACS, and a softening resistance temperature of more than 400 DEG C, and can meet the use requirements of the high-strength and high-conductivity Cu-Sn alloy wire at high temperature. After deformation heat treatment of the alloy rod is completed, the alloy rod is subjected to gradual cooling treatment through a special gradual cooling device, so that problems such as thermal cracks in the cooling process are avoided, and the quality of the alloy rod product is ensured.

The aim is to achieve both reduced insertion force and improved solder wettability in high-temperature, high-humidity environments. [Solution] The average thickness of the nickel layer is 0.15 mm or more and 4.0 mm or less, and the average thickness of the copper-tin alloy layer is 0.15 μm or more and 0.8 μm or less. In a cross section parallel to the rolling direction of the substrate, if the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and tin layer at the connection point is X%, and the area ratio of the tin layer to the total area of ​​the copper-tin alloy layer and tin layer at the soldering point is Y%, then X% is 21% or more and 50% or less, Y% is 31% or more and 90% or less, Y > X, and the difference between them is 10% or more.

This invention relates to the field of COF carrier technology, and more particularly to a COF carrier and its preparation method. The preparation method includes the following steps in sequence: coating, exposure, development, etching, micro-etching, first chemical tin plating, first baking, solder resist printing, second chemical tin plating, and second baking; wherein, the tin layer thickness of the first chemical tin plating is 0.05~0.08μm; the first baking makes the tin layer completely become a copper-tin alloy; solder resist printing uniformly prints a layer of ink on the non-lead area of ​​the carrier; and the second chemical tin plating is performed only on the lead area of ​​the carrier. This invention, by adjusting the production process and unfolding sequence of the COF carrier, and through the micro-etching process after desmearing and the second tin plating process, increases the copper content and reduces the amount of copper-tin alloy formed by the structural design of the COF carrier, thereby increasing the pure copper ratio of the circuit, improving the heat dissipation capacity of the COF carrier, and enhancing the packaging and testing efficiency of the COF carrier at the packaging and testing end.

In the present invention, the average thickness of a nickel layer is 0.15-4.0 mm, and the average thickness of a copper-tin alloy layer is 0.15-0.8 μm. In a cross section parallel to a rolling direction of a base material, when the area ratio of a tin layer to the total area of the copper-tin alloy layer and the tin layer of a connection part is taken as X% and the area ratio of the tin layer to the total area of the copper-tin alloy layer and the tin layer of a soldering part is taken as Y%, X % is 21%-50%, Y % is 31%-90%, Y > X, and a difference therebetween is 10% or more.

It can be applied to various copper-based substrates, suppressing void formation, reducing the coefficient of friction, and preventing film peeling under prolonged high-temperature conditions. [Solution] A film is formed on the surface of a substrate made of copper or a copper alloy, and the film has a nickel layer made of nickel or a nickel alloy formed on the surface of the substrate, a copper-tin alloy layer made of a copper and tin alloy formed on the nickel layer, and a tin layer made of tin or a tin alloy formed on the copper-tin alloy layer, the average thickness of the nickel layer is 0.15 μm or more and 3.00 μm or less, the average thickness of the copper-tin alloy layer is 0.2 μm or more and 1.0 μm or less, the average thickness of the tin layer is 0.1 μm or more and 2.0 μm or less, and the copper-tin alloy layer contains a Cu6Sn5 alloy, and the average GOS value of the Cu6Sn5 alloy in a cross section parallel to the rolling direction of the substrate is 0.48° or more and 0.70° or less.

This invention relates to the field of industrial waste resource utilization technology, specifically to a method for recycling copper-tin alloy-clad steel waste, comprising the following steps: placing the copper-tin alloy-clad steel waste into an ammonia leaching reactor for stirring and leaching to obtain leaching residue and leachate; washing the leaching residue to obtain iron and a cleaning solution; pumping the leachate and the cleaning solution together into a filter press for filter pressing to obtain filter residue and filter liquid; washing the filter residue to obtain tin mud; sending the filter liquid into an electrowinning copper tank to obtain copper and a copper-lean electrolyte; and pumping the copper-lean electrolyte back into the ammonia leaching reactor for subsequent copper-tin alloy-clad steel waste leaching processes. This invention's method for recycling copper-tin alloy-clad steel waste can separately recover metallic copper, tin, and residual iron from the copper-tin alloy-clad steel waste, achieving high recovery efficiency and low pollution.

A combination of: a substrate (1) made of aluminium, an aluminium alloy, steel, chrome-plated steel or stainless steel and a color-imparting layer system on at least one surface of the substrate (1), wherein the color-imparting layer system comprises: - an adhesive layer (2) with a layer thickness of 2 to 30 nm made of metallic chromium, molybdenum, tungsten, platinum, aluminium, titanium, zirconium, nickel or an alloy of two or more of these elements, which is applied to at least one surface of the substrate (1) by means of a PVD process, - a color-imparting layer (3) of copper, titanium, stainless steel, a Cu-Zn alloy, a Cu-Sn alloy, a Ni-Cu-Sn alloy, a non-ferromagnetic nickel alloy, CrN x , where 0.5 ≤ x ≤ 1.0, provided that the color-giving layer (3) is only made of CrN x is formed when the layer (4) described below is present, CrO y , where 0 < y < 1.5, as cermet, (Al n Cr 1-n )N x , where 0 < n < 1 and 0.5 ≤ x ≤ 1.0, or (Al n Cr 1-n )N x C z , where 0 < n < 1; 0 < x < 1.5; 0 < z < 1.0 and 0.5 < (x + z) < 1.5, which is applied to the adhesive layer (2) by means of a PVD process, - optionally an additional color-imparting layer (4) made of CrN x O y , where 0 < x < 1.0, 0 < y < 1.5 and 0.5 < y + x < 1.5, , (Al n Cr 1-n )N x , where 0 < n < 1 and 0.5 ≤ x ≤ 1.0, (Al n Cr 1-n )N x C z , where 0 < n < 1; 0 < x < 1.5; 0 < z < 1.0 and 0.5 < (x + z) < 1.5, TiO r N t , where 0 < r < 2 and 0 < t ≤ 1, titanium aluminum nitride or ZrO r N t, where 0 < r < 2 and 0 < t ≤ 1, which is applied to layer (3) by means of a PVD process, with the proviso that if layer (3) and (4) are made of (Al n Cr 1-n )N x or (Al n Cr 1-n )N x C z are formed, the ratio of Cr to Al of layer (4) differs from the ratio of Cr to Al of layer (3), and - a dielectric protective and adhesive layer (5) of Cr2O3, ZrO2, ZrO2 in which up to 20% of the Zr is replaced by Si or Ta, SiO2, SiO2 in which up to 20% of the Si is replaced by Al, Al2O3, Si3N4 or Nb2O5, which is applied to layer (3) or layer (4) by means of a PVD process or by means of a PECVD process, wherein layers (2), (3) and (5) and the optional layer (4) form the color-imparting layer system, where the total thickness of the color-imparting layer system is 400 nm or less.

The application discloses a kind of high-performance copper-based composite material for extreme environment and preparation method thereof, it is related to metal material technical field, the composite material includes: a) copper matrix, the copper matrix includes pure copper or copper alloy, copper alloy further includes copper-nickel, copper-beryllium, copper-zinc, copper-tin alloy;B) reinforcing phase material;C) one or more alloying elements;D) additive, the additive includes yttrium, lanthanum;In the technical scheme provided in the application, by adding appropriate amount of nickel, phosphorus, iron, manganese, cobalt, titanium, beryllium, zirconium and other alloying elements, the strength, toughness and wear resistance of the composite material are improved, so that the material can withstand greater stress without damage in extreme environment. Yttrium, lanthanum and other additives are used to optimize the microstructure of the material, and a dense protective layer is formed on the surface of the material through surface treatment technology, greatly improving the corrosion resistance of the material.

The utility model provides a bronze pot which comprises a pot body, the pot body is made of copper-tin alloy, a plurality of heating holes which are distributed at equal intervals and are the same in size are formed in the bottom of the pot body, inner ribs are arranged on the inner wall of the pot body, partition plates are arranged on the inner sides of the inner ribs, the left side and the right side of the pot body are fixedly connected with pot handles, and the pot handles are fixedly connected with the pot body. And the heated hole and the pot body are in a non-penetrating state. Through the arrangement of the heated holes, the heat efficiency can be improved, heat distribution is uniform, heat transfer is accelerated, the energy-saving and environment-friendly effects are achieved, the overall firm durability, abrasion resistance and corrosion resistance of the pot body can be enhanced, and the overall service life is prolonged. The pot body is integrally cast into a cone by adopting a mechanical structure, so that the pot body is firmer and more durable and is not easy to deform or damage, and the pot body is made of bronze, so that the pot body can be used for supplementing copper elements and tin elements for a human body, improving the common anemia phenomenon of people, has a special sterilization effect and prevents the generation of microorganisms.

This invention discloses a rare earth modified trivalent chromium plating process and coating structure for magnesium alloys. The process includes sequentially preparing a chemical zinc plating layer, a cyanide-free copper plating layer, a cyanide-free copper-tin alloy plating layer, a bright nickel-copper alloy plating layer, a bright nickel-cobalt alloy plating layer, a rare earth modified trivalent chromium plating layer, and an anti-discoloration protective film on a magnesium alloy substrate. The rare earth-modified trivalent chromium plating process is as follows: 80-140 g / L chromium chloride hexahydrate, 90-160 g / L potassium chloride, 90-160 g / L ammonium chloride, 16-30 g / L ammonium bromide, 40-60 g / L ammonium formate, 45-65 g / L boric acid, 8-12 mL / L rare earth additives, 2-4 mL / L leveling agent, 1-3 mL / L accelerator, pH of the plating solution 2.5-3.2, plating tank temperature 25-35℃, cathode current density 8-16 A / dm², using an inert graphite rod as the anode, and moderate air agitation. The rare earth additives have a synergistic effect on improving the performance of the trivalent chromium plating solution. The plated parts undergo a neutral salt spray test for 140 hours according to GB / T 10125–2021, and no surface corrosion is observed.

A conductive material includes a base material composed of copper or a copper alloy; an underlayer being one or more layers composed of one or more selected from the group consisting of Ni, Co and Fe; a Cu—Sn alloy layer; and a Sn layer in this order. A part of the Cu—Sn alloy layer is exposed on a Sn layer-side surface of the conductive material, and an arithmetic mean height evaluated with a cut-off value of 25 μm is 0.03 μm or more in a 250 μm square region containing 50 area % or more of the Sn layer in the Sn layer-side surface of the conductive material.

The invention discloses an electroplating method for replacing nickel with copper-tin alloy. The electroplating method for replacing nickel with copper-tin alloy comprises the following steps: S1, pretreatment: carrying out oil removal, hot water washing, acid pickling activation and water washing on a plated part; s2, cyanide-free copper-tin alloy electroplating; s3, washing with water; s4, passivation is conducted, specifically, the plated part is passivated in a trivalent chromium passivation solution, the temperature is set to be 50-55 DEG C, the passivation time is set to be 45-60 s, and slight air stirring is adopted in a stirring mode; s5, washing with water; s6, sealing is conducted, specifically, the plated part is sealed through a water-based sealing agent, the sealing temperature is set to be 85-90 DEG C, the sealing time is set to be 2-3 minutes, and centrifugal spin-drying is conducted after dripping drying (the rotating speed is 800-1000 rpm); s7, drying; and S8, inspecting. According to the electroplating method for replacing nickel with the copper-tin alloy, a manager is refined through a pulsed power supply, a plating piece is electroplated with a copper-tin-containing plating solution with the high tin ratio (the molar ratio of Sn to Cu gt, 3) to form a copper-tin alloy plating layer, and it is guaranteed that the surface gloss of the plating piece is close to the metallic gloss of nickel while a nickel plating layer is replaced.