Preparation method of copper-tin alloy with high tin content and high density

A copper-tin alloy, high-density technology, applied in the field of powder metallurgy, can solve the problem of low hardness of copper-tin alloy

Active Publication Date: 2020-07-07
XIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a high-tin content high-density copper-tin alloy, which solves the problem th...

Method used

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  • Preparation method of copper-tin alloy with high tin content and high density
  • Preparation method of copper-tin alloy with high tin content and high density
  • Preparation method of copper-tin alloy with high tin content and high density

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preparation example Construction

[0022] A preparation method of a high-tin content high-density copper-tin alloy, specifically carried out according to the following steps:

[0023] Step 1: Weigh 83.2-84.3wt.% of Cu powder, 15.4-16.5% of Sn powder, and 0.3% of Ti powder according to mass percentage, and use a ball mill to mix the components evenly to obtain a mixed powder;

[0024] Step 2: cold pressing the mixed powder in step 1 to obtain a cold compact, and placing the cold compact in an atomization deposition furnace for atomization deposition to obtain a pre-alloyed powder;

[0025] Step 3: Sieve the pre-alloyed powder in step 2 to obtain a powder, add alcohol and stir the powder and perform secondary cold pressing to obtain a secondary cold compact, and put the secondary cold compact into an atmosphere sintering furnace In the middle, pass inert gas, heat up the atmosphere sintering furnace to 540-570°C and start to pressurize the cold compact, and keep the pressure when the temperature of the atmosphere...

Embodiment 1

[0034] Weigh 83.7% of Cu powder, 16% of Sn powder, and 0.3% of Ti powder, and use a planetary ball mill to mix them evenly. Pour the powder into a pressing mold, and use a cold press to form a cold compact. Finally, put the cold-pressed embryo into the atomization deposition furnace, and vacuum the furnace body to 10 -3 After Pa, the argon gas of 0.01MPa is introduced, and then the furnace temperature is heated to 1200°C. When the cold compact is completely melted, the nitrogen valve is opened, the display is adjusted to 4.5MPa, and the nitrogen gas is continuously injected for atomization deposition. Pre-alloyed powder.

[0035] Sieve the obtained alloy powder, vibrate for 2 minutes, select a powder with a particle size of 75 μm, add an appropriate amount of alcohol to the powder, stir it evenly, pour it into a pressing mold, and press it on a cold press to form a cold compact.

[0036] Spread two layers of graphite paper on the bottom of the graphite crucible, put it into ...

Embodiment 2

[0038] Weigh 83.5% of Cu powder, 16.2% of Sn powder, and 0.3% of Ti powder, and use a planetary ball mill to mix them evenly. Pour the powder into a pressing mold, and use a cold press to form a cold compact. Finally, put the cold-pressed embryo into the atomization deposition furnace, and vacuum the furnace body to 10 -4 After Pa, argon gas of 0.02MPa was introduced, and then the furnace temperature was heated to 1280°C. When the cold compact was completely melted, the nitrogen valve was opened, and the reading was adjusted to 5.5MPa, and nitrogen gas was continuously injected for atomization deposition, and obtained Pre-alloyed powder.

[0039]Sieve the obtained alloy powder, vibrate for 2 minutes, select a powder with a particle size of 90 μm, add an appropriate amount of alcohol to the powder, stir it evenly, pour it into a pressing mold, and press it on a cold press to form a cold compact.

[0040] Spread two layers of graphite paper on the bottom of the graphite crucib...

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Abstract

The invention discloses a preparation method of copper-tin alloy with high tin content and high density. The preparation method comprises the following steps of step 1, weighing 83.2-84.3wt% of Cu powder, 15.4-16.5% of Sn powder and 0.3% of Ti powder according to the mass percentage, uniformly mixing the components by a ball grinding mill, and thus obtaining mixed powder; step 2, cold-pressing themixed powder in the step 1 to obtain a cold pressed billet, and putting the cold pressed billet into a spray deposition furnace for spray deposition, and obtaining pre-alloyed powder; and step 3, sieving the pre-alloyed powder in the step 2, conducting secondary cold pressing to obtain a secondary cold pressed billet, then putting the secondary cold pressed billet into an atmosphere sintering furnace, introducing inert gas into the furnace, heating and pressurizing the atmosphere sintering furnace, holding temperature for a while, finally decreasing temperature and reducing pressure of the atmosphere sintering furnace, and thus obtaining the copper-tin alloy. The preparation method increases the content of tin in the copper-tin alloy, the distribution of tin is more uniform, and the density and hardness of the copper-tin alloy are ensured.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy, and in particular relates to a method for preparing a copper-tin alloy with high tin content and high density. Background technique [0002] At present, the preparation of copper-tin alloys for superconductivity is mostly realized by casting, but serious reverse segregation phenomenon is very easy to occur during the cooling process of the ingot, and the solute tin in the liquid phase will flow back to the surface of the casting and completely solidify After that, the silver-white tin element appears, which will lead to a significant reduction in the tin content in the copper-tin alloy matrix and uneven distribution, which will further affect the preparation of Nb by the bronze method. 3 Critical current density of Sn superconducting wires. [0003] In order to solve the problem of insufficient tin content, the present invention uses a certain proportion of Cu powder, Sn powder, and Ti...

Claims

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Application Information

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IPC IPC(8): C22C9/02C22C1/04
CPCC22C1/0425C22C9/02
Inventor 邹军涛王宇轩石林石浩梁淑华
Owner XIAN UNIV OF TECH
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