Acoustooptic crystal and transducer bonding structure

A bonding structure and transducer technology, applied in instrumentation, optics, nonlinear optics, etc., can solve problems such as shortening device life, device failure and scrapping, and prolonging device manufacturing cycle, so as to achieve stable device performance and device thermal stress. reduced effect

Active Publication Date: 2017-06-30
CHINA ELECTRONICS TECH GRP NO 26 RES INST
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] ③After the device undergoes a thermal cycle, the cracking and adhesion problems of the transducer will deteriorate, and even the transducer will automatically fall off along the cracking direction, seriously affecting the performance of the device, or causing the device to fail and be scrapped
[0010] None of the above measures can...

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  • Acoustooptic crystal and transducer bonding structure
  • Acoustooptic crystal and transducer bonding structure
  • Acoustooptic crystal and transducer bonding structure

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] In order to ensure device reliability and environmental adaptability, the present invention adds a metal transition layer between the acousto-optic crystal and the bottom electrode (Cr) of the transducer and the welding layer. The metal transition layer meets the following requirements: ①High electrical conductivity and good electrical conductivity; ②Good adhesion between the bottom electrode layer Cr and the solder layer Sn; ③The addition of the metal transition layer effectively reduces the thermal stress at the interface between the crystal and the bottom electrode; ④Under the conditions of the first three items are met, the loss of the transducer will not be increased, and the bonding layer meets the acoustic impedance matching. Based on the above considerations, the material of the transition layer is Au (which can satisfy the fir...

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Abstract

The invention discloses an acoustooptic crystal and transducer bonding structure. A bottom electrode layer and a welding layer are sequentially plated on the surface of each of an acoustooptic crystal and a transducer; the welding layer of the acoustooptic crystal is bonded with the welding layer of the transducer together; metal transition layers are arranged between the bottom electrode layer and the welding layer of the acoustooptic crystal as well as between the bottom electrode layer and the welding layer of the transducer respectively; after each welding layer is adhered to the corresponding bottom electrode layer through the corresponding metal transition layer, the adhesive force between the bottom electrode layer and the acoustooptic crystal is larger than that between the bottom electrode layer and the acoustooptic crystal when the welding layer is directly adhered to the corresponding bottom electrode layer; and the thickness of each metal transition layer enables a bonding layer to meet the acoustic impedance matching requirement of a device wholly. As for the acoustooptic crystal and transducer bonding structure, after bonding, the surface of the transducer does not have the phenomenon of cracking any more, the strength and the adhesive force of the transducer are strengthened, and the thermal stress of the device is obviously lowered.

Description

technical field [0001] The invention relates to a bonding structure in the processing of an acousto-optic device, which is used to solve problems such as transducer cracking and falling off after bonding, thereby improving the environmental adaptability and reliability of the device, and belongs to the technical field of acousto-optic devices. Background technique [0002] Acousto-optic crystals (TeO 2 Mainly) and the piezoelectric transducer are bonded together through the diffusion of metal atoms by a bonding process. Several metal film layers need to be plated between the crystal and the transducer, collectively referred to as the bonding layer. Commonly used acousto-optic device bonding layer structure and bonding process such as figure 1 shown. First, the bonding layer is plated on the surface of the crystal and the transducer respectively. The bonding layer is composed of a bottom electrode layer and a welding layer. The material of the bottom electrode layer is usu...

Claims

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Application Information

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IPC IPC(8): G02F1/11
Inventor 陆川刘伟陈华志米佳张永川
Owner CHINA ELECTRONICS TECH GRP NO 26 RES INST
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