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Acidic cyanide-free copper-tin alloy electroplating bath

A copper-tin alloy and electroplating solution technology, which is applied in the field of surface treatment, can solve the problems of long-term electroplating, narrow operating range, and low current efficiency, and achieve uniform and bright appearance, wide range of current density, and improved current efficiency.

Active Publication Date: 2013-07-24
江门市瑞期精细化学工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The newly emerging copper-tin alloy of pyrophosphate system that can replace the cyanide system is unable to completely replace the cyanide process for the time being due to its low current efficiency and high cost, which affect its added value, and its narrow operating range and long-term plating exposure.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment １

[0029] A kind of acid cyanide-free copper-tin alloy electroplating solution, its formula is as follows:

[0030] Hydrochloric acid 50g / L

[0031] Copper chloride 10 g / L

[0032] Stannous chloride 10 g / L

[0033] OP-9 2.5g / L

[0034] p-Chlorobenzaldehyde 0.5 g / L

[0035] Preparation method: Dissolve cupric chloride and tin protochloride in hydrochloric acid aqueous solution, add dispersant and gloss agent under stirring, stir until completely dissolved, add water to constant volume.

[0036] Electroplating operation: the cathode is a copper sheet, the anode is a phosphor copper plate, the pH is less than 1, and the current density is 1A / dm 2 , the temperature is 30°C, and after electroplating for 2 minutes, a uniform and bright copper-tin alloy is plated on the copper sheet, with a thickness of 1 μm and a hardness of 380HV. The appearance of the coating is bright, and the coating is baked at 120°C for 60 minutes without blistering.

Embodiment 2

[0038] A kind of acid cyanide-free copper-tin alloy electroplating solution, its formula is as follows:

[0039] Hydrochloric acid 75g / L

[0040] Copper chloride 20 g / L

[0041] Stannous chloride 20 g / L

[0042] OP-10 5g / L

[0043] p-Chlorobenzaldehyde 0.5 g / L

[0044] See Example 1 for the preparation method.

[0045] Electroplating operation: the cathode is a copper sheet, the anode is a phosphor copper plate, the pH is less than 1, and the current density is 0.5A / dm 2 , the temperature is 40°C, and after electroplating for 5 minutes, a uniform and bright copper-tin alloy is plated on the copper sheet, with a thickness of 3 μm and a hardness of 380HV. The appearance of the coating is bright, and the coating is baked at 120°C for 60 minutes without blistering.

Embodiment 3

[0047] A kind of acid cyanide-free copper-tin alloy electroplating solution, its formula is as follows:

[0048] Hydrochloric acid 100g / L

[0049] Copper Chloride 15 g / L

[0050] Stannous chloride 15 g / L

[0051] O-20 5g / L

[0052] Piperonal 0.5 g / L

[0053] See Example 1 for the preparation method.

[0054] Electroplating operation: the cathode is a copper sheet, the anode is a phosphor copper plate, the pH is less than 1, and the current density is 2A / dm 2 , the temperature is 20 ℃, and after electroplating for 10 minutes, a uniform and bright copper-tin alloy is plated on the copper sheet, with a thickness of 5 μm and a hardness of 380HV. The appearance of the coating is bright, and the coating is baked at 120°C for 60 minutes without blistering.

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Abstract

The invention discloses an acidic cyanide-free copper-tin alloy electroplating bath. The electroplating bath is an acidic system and adopts inorganic salt as the main salt, a dispersing agent and a gloss agent are added and used in the electroplating bath, and the system can be used for effectively increasing the current efficiency of a process, thus the deposition velocity of an electroplating layer is increased, and the defect that an alkali cyanide-free copper-tin alloy electroplating layer is thinner is overcome. The electroplating bath disclosed by the invention is simple in operation, low in cost and wide in current density range; and the prepared electroplating layer is uniform and bright in appearance, good in binding force and high in corrosion resistance. The electroplating bath disclosed by the invention contains no cyanide and lead and no other heavy metal additives and organic complexing agents, so that the electroplating bath is safe and environment-friendly, the damage of the electroplating bath to the ecological environment is effectively avoided, and the wastewater treatment cost is effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, in particular to a cyanide-free copper-tin alloy electroplating solution. Background technique [0002] Some people have allergic reactions to nickel, which can cause dermatitis or macular rash after exposure. Therefore, in recent years, Europe and the United States have restricted nickel products, such as sanitary ware and lighting. Therefore, developing new nickel-free or nickel-substituted products has become a new research direction in the industry. The traditional nickel substitution process includes cyanide system and pyrophosphate system. Cyanide system copper-tin alloy is an old technology with a mature formula, but it is highly toxic and will cause great damage to the health of on-site operators. At the same time, the exhaust gas and sewage discharged are not conducive to environmental protection. Therefore, the country promulgated the "Clean Production Promotion Law" and th...

Claims

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Application Information

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IPC IPC(8): C25D3/56
Inventor 洪条民
Owner 江门市瑞期精细化学工程有限公司
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