High-performance metallic bond, grinding wheel comprising high-performance metallic bond and preparation method of grinding wheel

A metal bond and high-performance technology, which is applied in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc., can solve the problem of the decrease of metal bond's holding force on diamond, the decrease of thermal conductivity of diamond grinding wheel, and the easy falling off of diamond abrasive grains and other problems, to achieve the effect of uniform hardness, good sharpness, and good grip

Pending Publication Date: 2021-06-11
上海橄榄精密工具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to its good retention, the metal bond has a wider application range, especially the sharp-edged diamond grinding wheel, which is used for slotting applications such as saw blades and hard alloys. Due to the high requirements for sharp corner retention, metal bonds are often used The bond can improve its retention of sharp corners, but the use of metal bonds will lead to a decrease in the thermal conductivity of the diamond grinding wheel, and if the grinding tempe

Method used

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  • High-performance metallic bond, grinding wheel comprising high-performance metallic bond and preparation method of grinding wheel
  • High-performance metallic bond, grinding wheel comprising high-performance metallic bond and preparation method of grinding wheel

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[0031] Another aspect of the present invention provides, a kind of grinding wheel, described grinding wheel comprises high-performance metal bonding agent, and the preparation method of described grinding wheel comprises the following steps:

[0032] Step 1: Mix the metal bond and diamond with a high-speed mixer for 12-24 hours;

[0033] Step 2: Using a mold, sintering the mixture of metal powder and diamond abrasive grains at a temperature of 500-1500°C and a pressure of 1-20T, and then demoulding to obtain a grinding wheel containing a high-performance metal bond.

[0034] In some preferred technical solutions, the mass ratio of the diamond to the metal bond in Step 1 is 1:(4-6).

[0035] The holding force of the metal bond of the present invention on diamond abrasive grains mainly includes three types: van der Waals force, metallurgical force between bond and diamond, and mechanical wrapping effect of bond on diamond. In the metal bond diamond grinding wheel, the mechanica...

Embodiment 1

[0044] This embodiment provides on the one hand a high-performance metal bond, the raw materials for the preparation of the metal bond in parts by mass include: 60 parts of copper-tin alloy powder, 10 parts of nickel powder, 15 parts of cobalt powder, silicon dioxide powder 10 parts, 10 parts of iron powder, 10 parts of silver powder, and 3 parts of aluminum oxide powder; on the other hand, this embodiment provides a preparation method of a grinding wheel comprising the high-performance metal bond, the preparation method comprising the following steps:

[0045] Step 1: Mix the metal bond with the diamond for 24 hours using a high-speed mixer;

[0046] Step 2: Using a mold, sintering the mixture of the metal powder and the diamond abrasive grains under the conditions of a temperature of 780° C. and a pressure of 100 T to prepare a grinding wheel containing a high-performance metal bond.

[0047] The mass ratio of copper to tin in the copper-tin alloy powder is 12:1;

[0048] T...

Embodiment 2

[0053] This embodiment provides, on the one hand, a high-performance metal bond. The raw materials for the preparation of the metal bond include: 60 parts of copper-tin alloy powder, 10 parts of nickel powder, 10 parts of silicon dioxide powder, iron powder 10 parts, 10 parts of silver powder, 3 parts of aluminum oxide powder; on the other hand, this embodiment provides a preparation method of a grinding wheel comprising the high-performance metal bond, the preparation method comprising the following steps:

[0054] Step 1: Mix the metal bond with the diamond for 24 hours using a high-speed mixer;

[0055] Step 2: Using a mold, sintering the mixture of the metal powder and the diamond abrasive grains under the conditions of a temperature of 780° C. and a pressure of 100 T to prepare a grinding wheel containing a high-performance metal bond.

[0056] The mass ratio of copper to tin in the copper-tin alloy powder is 12:1;

[0057] The average particle size of the metal binder i...

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Abstract

The invention belongs to the technical field of grinding materials and grinding tools, and particularly relates to a high-performance metallic bond, a grinding wheel comprising the metallic bond and a preparation method of the grinding wheel. The metallic bond is prepared from the materials in parts by weight: 30-70 parts of copper-tin alloy powder, 5-15 parts of nickel powder, 1-10 parts of silver powder, 5-15 parts of iron powder and 1-5 parts of aluminum oxide powder. The metallic bond further comprises 1-10 wt% of silicon dioxide powder and 10-25 wt% of cobalt powder. The preparation method of the grinding wheel containing the high-performance metallic bond includes the steps that the metallic bond and diamond are mixed for 12-24 h through a high-speed mixing machine; and the mixture of the metal powder and diamond abrasive particles are sintered under the conditions that the temperature is 500-1500 DEG C and the pressure is 1-20 T by using a mold, and demolding is conducted to obtain the grinding wheel containing the high-performance metallic bond. The metallic bond is good in holding performance, the service life of the grinding wheel is long, the bond is good in sharpness, good in heat conductivity and good in heat resistance, and the grinding wheel is uniform in hardness and stable in quality by adopting a heating and pressurizing method.

Description

technical field [0001] The invention belongs to the technical field of abrasive abrasives, and in particular relates to a high-performance metal bond, a grinding wheel containing the same and a preparation method of the grinding wheel. Background technique [0002] Due to its high hardness and strong cutting force, diamond grinding wheels are widely used in the processing of cemented carbide, ceramics, glass and other materials. Due to its good retention, the metal bond has a wider application range, especially the sharp-edged diamond grinding wheel, which is used for slotting applications such as saw blades and hard alloys. Due to the high requirements for sharp corner retention, metal bonds are often used The bond can improve its retention of sharp corners, but the use of metal bonds will lead to a decrease in the thermal conductivity of the diamond grinding wheel, and if the grinding temperature rises too fast, the holding force of the metal bond to the diamond will decre...

Claims

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Application Information

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IPC IPC(8): B24D3/06B24D18/00
CPCB24D3/06B24D18/0009Y02P70/10
Inventor 印鹏
Owner 上海橄榄精密工具有限公司
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